JPH0588677B2 - - Google Patents
Info
- Publication number
- JPH0588677B2 JPH0588677B2 JP6300088A JP6300088A JPH0588677B2 JP H0588677 B2 JPH0588677 B2 JP H0588677B2 JP 6300088 A JP6300088 A JP 6300088A JP 6300088 A JP6300088 A JP 6300088A JP H0588677 B2 JPH0588677 B2 JP H0588677B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- base material
- ionizing radiation
- release base
- uneven pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 84
- 239000010410 layer Substances 0.000 claims description 56
- 230000005865 ionizing radiation Effects 0.000 claims description 49
- 229920005989 resin Polymers 0.000 claims description 46
- 239000011347 resin Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 7
- 229920000742 Cotton Polymers 0.000 claims description 3
- 230000007261 regionalization Effects 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 33
- 230000000694 effects Effects 0.000 description 14
- 239000003973 paint Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000000049 pigment Substances 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 239000001042 pigment based ink Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Printing Methods (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、凹凸模様形成体の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing an uneven pattern forming body.
従来、例えば平滑な表面に設けた絵柄に立体感
を持たせるために、模様自体に厚みを持たせるこ
とが行われているが、模様に厚みを持たせるため
には特殊な印刷方法を必要とする上、シヤープな
盛り上がりを形成することが困難であり、美麗な
立体模様を容易に形成できないという問題があつ
た。また、当然のことながら得られる立体模様の
形成物は、特に立体模様自体がシヤープさや立体
感に欠けるものであつた。
Conventionally, for example, in order to give a three-dimensional effect to a pattern on a smooth surface, the pattern itself has been made thicker, but in order to give the pattern thickness, a special printing method is required. Moreover, there was a problem in that it was difficult to form sharp bulges, and beautiful three-dimensional patterns could not be easily formed. Moreover, as a matter of course, the resulting three-dimensional patterned product lacked sharpness and three-dimensional effect, especially in the three-dimensional pattern itself.
本発明は上記の点に鑑みなされたもので、シヤ
ープで美麗な立体感が発現される凹凸模様形成体
を容易に製造することができる凹凸模様の製造方
法を提供することを目的とする。 The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing an uneven pattern that can easily produce an uneven pattern forming body that exhibits a sharp and beautiful three-dimensional effect.
本発明の凹凸模様形成体の製造方法は、下記各
工程を順に行うことを特徴とするものである。
The method for manufacturing a concavo-convex pattern formed body of the present invention is characterized by sequentially performing the following steps.
(a) 表面が剥離性を有する電離放射線透過性剥離
基材の表裏いずれかの面に電離放射線遮蔽性模
様を設ける工程、
(b) 凹凸模様形成用基材と剥離基材とを、電離放
射線硬化性樹脂層を介して重ね合わせる工程、
(c) 剥離基材側より電離放射線を照射して電離放
射線遮蔽性模様のない部分に相当する電離放射
線硬化性樹脂層を硬化させる工程、
(d) 剥離基材を剥がして電離放射線硬化性樹脂層
の未硬化部の樹脂の一部を剥離基材に付着させ
て除去し、電離放射線遮蔽模様に対応する凹部
を形成する工程。(a) A step of providing an ionizing radiation-shielding pattern on either the front or back surface of an ionizing radiation-transparent release base material whose surface is releasable; (c) a step of curing the ionizing radiation-curable resin layer corresponding to the portion without the ionizing radiation-shielding pattern by irradiating ionizing radiation from the release base material side; (d) A step of peeling off the release base material and attaching a portion of the uncured resin of the ionizing radiation curable resin layer to the release base material and removing it to form a recess corresponding to the ionizing radiation shielding pattern.
(e) 工程(d)にて形成された凹凸模様上に溶剤を塗
布した後、ブラシ或いは綿のバフイングローラ
ーを使用してバフ研磨することにより、該凹凸
模様の凹部に残存する未硬化の電離放射線硬化
性樹脂を除去する工程、
(f) 工程(e)にて形成された凹凸模様の全表面にワ
ンピングインキを塗布し、その直後に該凹凸模
様の凸部上に存在するインキをかき取ることに
より、凹部のみにワイピングインキを残存させ
る工程。(e) After applying a solvent on the uneven pattern formed in step (d), buffing is performed using a brush or a cotton buffing roller to remove uncured material remaining in the recesses of the uneven pattern. (f) Applying wamping ink to the entire surface of the uneven pattern formed in step (e), and immediately after that, removing the ink present on the convex parts of the uneven pattern. A process in which the wiping ink remains only in the recesses by scraping it off.
また本発明の製造方法は、剥離基材上に模様層
を設け、剥離基材の剥離により凹凸模様の凸部上
に該模様層を転写形成したり、更に剥離基材を剥
離した後、凹凸模様の全面若しくは凸部上のみに
保護層を塗布形成するものである。 Further, the manufacturing method of the present invention provides a pattern layer on a release base material, transfers and forms the pattern layer on the convex portion of the uneven pattern by peeling off the release base material, and further peels off the release base material, and then transfers the pattern layer onto the uneven pattern. A protective layer is coated on the entire surface of the pattern or only on the convex portions.
本発明によれば、電離放射線遮蔽性模様のある
部分では凹凸模様形成用基材上の電離放射線硬化
性樹脂が硬化せずに剥離基材の剥離によつて除去
され、電離放射線遮蔽性模様のない部分では電離
放射線硬化性樹脂が硬化して残ることから凹凸模
様が形成され、その後、凹部に残存する未硬化の
電離放射線硬化性樹脂が除去され、さらに凹部の
みにワンピングインキが存在せしめられる。その
結果、凹凸模様形成用基材上に立体感に優れシヤ
ープで美麗な凹凸模様を有する凹凸模様形成体が
得られる。
According to the present invention, the ionizing radiation-curable resin on the base material for forming the concavo-convex pattern is removed by peeling off the peeling base material without curing in the area where the ionizing radiation-shielding pattern is present. The ionizing radiation-curable resin hardens and remains in the areas where there is no ink, forming an uneven pattern.Then, the uncured ionizing radiation-curable resin remaining in the recesses is removed, and wamping ink is left only in the recesses. . As a result, a concavo-convex pattern forming body having a sharp and beautiful concavo-convex pattern with excellent three-dimensional effect is obtained on the concavo-convex pattern forming substrate.
以下、本発明の一実施例を図面に基き説明す
る。
Hereinafter, one embodiment of the present invention will be described based on the drawings.
本発明製造方法はまず、第１図に示すように表
裏いずれかの面に電離放射線遮蔽性模様１１を設
けた剥離基材１２を準備する。 In the manufacturing method of the present invention, first, as shown in FIG. 1, a release base material 12 having an ionizing radiation shielding pattern 11 provided on either the front or back surface is prepared.
剥離基材１２は電離放射線透過性を有するシー
ト又はフイルムよりなり、電離放射線が紫外線の
場合には、例えばポリエステル、ポリアミド（ナ
イロン等）、ポリプロピレン、フツ素系樹脂のシ
ート又はフイルム等が挙げられるが、紫外線透過
性に影響のある顔料等を含まないものが好まし
い。電離放射線が電子線の場合には、電子線の透
過性が高いのであまり制約がなく、上記した紫外
線を透過する性質のあるシート又はフイルムは原
則的に使用でき、更に紙等も使用できる。また剥
離基材１２の少なくとも電離放射線硬化性樹脂層
１３（第３図）と接する側の表面は剥離性である
必要があり、素材自体が剥離性を有さない場合に
は剥離性の樹脂もしくは組成物を塗布する等して
表面剥離性として使用する。基材１２の厚みは５
〜200μｍ、特に25〜100μｍが好ましい。電離放
射線遮蔽性模様１１は、剥離基材上面側から電離
放射線を照射した際に電離放射線を遮蔽するため
のものであり、該模様１１を設ける位置は、第１
図に示すように剥離基材１２の下面側でも、また
特に図示しないが剥離基材１２の上面側でもよ
く、剥離基材１２に必要に応じて後述する模様層
等を設けた場合には該模様層等の上に設けてもよ
い。 The release base material 12 is made of a sheet or film that is transparent to ionizing radiation, and when the ionizing radiation is ultraviolet rays, examples thereof include sheets or films of polyester, polyamide (such as nylon), polypropylene, and fluorine resin. , those containing no pigments or the like that affect ultraviolet transmittance are preferred. When the ionizing radiation is an electron beam, there are no restrictions because the electron beam has high transparency, and in principle, the above-mentioned sheets or films that transmit ultraviolet rays can be used, and paper and the like can also be used. In addition, at least the surface of the release base material 12 that comes into contact with the ionizing radiation curable resin layer 13 (FIG. 3) must be releasable, and if the material itself does not have releasability, a releasable resin or It is used as a surface removable material by applying a composition or the like. The thickness of the base material 12 is 5
~200 μm, particularly 25-100 μm is preferred. The ionizing radiation shielding pattern 11 is for shielding ionizing radiation when ionizing radiation is irradiated from the upper surface side of the release base material, and the pattern 11 is provided at the first position.
As shown in the figure, it may be on the lower surface side of the release base material 12, or it may be on the upper surface side of the release base material 12 although not particularly shown. It may be provided on a pattern layer or the like.
電離放射線遮蔽性模様１１を形成する材料とし
ては、電離放射線が紫外線であるときは、紫外線
を反射して遮蔽する物質、例えば酸化チタン、硫
酸カリウム、炭酸カルシウム等の充填剤、または
粒径が0.3〜10μｍ程度で隠蔽力の大きい顔料を含
有するインキ、紫外線を吸収する物質、例えばベ
ンゾフエノール系、サリチレート系、ベンゾトリ
アゾール系、アクリロニトリル系等の紫外線吸収
剤、光吸収性の顔料、カーボンブラツクまたは無
機物とともにクエンチヤー（例えば金属錯塩系も
しくはヒンダードアミン系等）を含有するインキ
等が挙げられる。また電離放射線が電子線である
ときは、上記したインキや他の顔料系のものを含
有するインキが挙げられる。電離放射線遮蔽性模
様１１はこれらのインキを用いて通常の印刷法に
より形成することができる。 When the ionizing radiation is ultraviolet rays, the material forming the ionizing radiation shielding pattern 11 may be a substance that reflects and shields ultraviolet rays, such as a filler such as titanium oxide, potassium sulfate, or calcium carbonate, or a particle size of 0.3 Ink containing pigments with large hiding power at ~10 μm, substances that absorb ultraviolet rays, such as ultraviolet absorbers such as benzophenol, salicylate, benzotriazole, and acrylonitrile, light-absorbing pigments, carbon black, or inorganic substances. In addition, inks containing a quencher (for example, a metal complex salt type or a hindered amine type) can be mentioned. When the ionizing radiation is an electron beam, examples include the above-mentioned inks and inks containing other pigment-based inks. The ionizing radiation shielding pattern 11 can be formed using these inks by a normal printing method.
次いで、本発明方法では電離放射線透過性模様
１１を設けた剥離基材１２を、第２図に示すよう
に別に準備した電離放射線硬化性樹脂層１３を塗
布して設けた凹凸模様形成用基材２の樹脂層１３
側に重ね合わせて密着させる（第３図）が、剥離
基材１２を枠に張つて用いると、剥離基材１２の
繰り返し使用が可能となり好ましい。電離放射線
硬化性樹脂層１３は凹凸模様形成用基材２に塗布
して設ける場合の他、剥離基材１２に塗布して設
けても、凹凸模様形成用基材２と剥離基材１２の
両方に塗布して設けてもよい。 Next, in the method of the present invention, the release base material 12 provided with the ionizing radiation-transparent pattern 11 is converted into a base material for forming an uneven pattern by coating a separately prepared ionizing radiation-curable resin layer 13 as shown in FIG. 2 resin layer 13
It is preferable to overlap the sides of the release base material 12 in close contact with each other (FIG. 3), but it is preferable to use the release base material 12 by stretching it over a frame, as this allows the release base material 12 to be used repeatedly. The ionizing radiation curable resin layer 13 may be provided by coating it on the base material 2 for forming an uneven pattern, or may be provided by coating it on the release base material 12. It may also be provided by applying it to the surface.
凹凸模様形成用基材２としては、どのようなも
のでもよいが、例えばステンレス鋼、鋼、アル
ミニウム、もしくは銅等の金属の板または成形
品、ガラス、大理石、陶磁器、石膏ボード、石
綿セメント板、珪酸カルシウム板、GRC（ガラス
繊維強化セメント）等の無機質の板または成形
品、ポリエステル、メラミン、ポリ塩化ビニ
ル、ジアリルフタレート等の有機ポリマーの板、
成形品、あるいはこれらのシート、フイルム、
木、合板、パーチクルボード等の木質の板または
成形品、薄葉紙、晒クラフト紙、チタン紙、リ
ンター紙、板紙、石こうボード紙等の紙；ポリエ
チレンフイルム、ポリプロピレンフイルム、ポリ
塩化ビニルフイルム、ポリ塩化ビニリデンフイル
ム、ポリビニルアルコールフイルム、ポリエチレ
ンテレフタレートフイルム、ポリカーボネートフ
イルム、ナイロンフイルム、ポリスチレンフイル
ム、エチレン酢酸ビニル共重合体フイルム、エチ
レンビニルアルコール共重合体フイルム、アイオ
ノマー等のプラスチツクフイルム；鉄、アルミニ
ウム、銅等の金属箔若しくはシート；並びに以上
の各素材の複合体、等が例示される。これら凹凸
模様形成用基材２には、目止め処理やプライマー
処理等の下地処理や接着性向上のための処理等を
行つてもよい。 The base material 2 for forming the uneven pattern may be of any material, such as a plate or molded product of metal such as stainless steel, steel, aluminum, or copper, glass, marble, ceramics, gypsum board, asbestos cement board, Calcium silicate plates, inorganic plates or molded products such as GRC (glass fiber reinforced cement), organic polymer plates such as polyester, melamine, polyvinyl chloride, diallyl phthalate, etc.
molded products, or these sheets, films,
Wooden boards or molded products such as wood, plywood, particle board, paper such as tissue paper, bleached kraft paper, titanium paper, linter paper, paperboard, gypsum board paper; polyethylene film, polypropylene film, polyvinyl chloride film, polyvinylidene chloride film , polyvinyl alcohol film, polyethylene terephthalate film, polycarbonate film, nylon film, polystyrene film, ethylene vinyl acetate copolymer film, ethylene vinyl alcohol copolymer film, ionomer, and other plastic films; metal foils such as iron, aluminum, copper, etc. Examples include sheets; and composites of the above materials. These base materials 2 for forming an uneven pattern may be subjected to surface treatment such as sealing treatment or primer treatment, treatment for improving adhesiveness, and the like.
電離放射線硬化性樹脂層１３は、構造中にラジ
カル重合性の二重結合を有するポリマー、オリゴ
マー、モノマー等を主成分とし、光重合開始剤や
増感剤、そのほか必要に応じて非反応性のポリマ
ー、有機溶剤、ワツクスその他の添加剤を含有す
るもので、種々のグレードのものが市場に容易に
入手でき、本発明に使用できる。また、電離放射
線硬化性樹脂層１３に難燃剤、導電性材料等を混
入して難燃化、導電化等の機能を付与することも
できる。更に、該樹脂層１３は透明又は半透明な
層であることが好ましい。電離放射線硬化性樹脂
層１３はグラビアコート、ロールコート、フロー
コートもしくはスプレーコート等の公知の方法に
より形成することができる。樹脂層１３の厚さは
3μｍ〜１mm、特に30〜200μｍが好ましい。 The ionizing radiation curable resin layer 13 is mainly composed of polymers, oligomers, monomers, etc. that have radically polymerizable double bonds in their structure, and contains photopolymerization initiators, sensitizers, and other non-reactive substances as necessary. It contains polymers, organic solvents, waxes, and other additives, and various grades of it are readily available on the market and can be used in the present invention. Moreover, a flame retardant, a conductive material, etc. can be mixed into the ionizing radiation-curable resin layer 13 to impart functions such as flame retardancy and conductivity. Further, the resin layer 13 is preferably a transparent or semitransparent layer. The ionizing radiation-curable resin layer 13 can be formed by a known method such as gravure coating, roll coating, flow coating, or spray coating. The thickness of the resin layer 13 is
3 μm to 1 mm, particularly 30 to 200 μm is preferred.
次いで、剥離基材１２と凹凸模様形成用基材２
とを電離放射線硬化性樹脂層１３を介して重ね合
わせて両者を密着させた後、剥離基材１２側より
電離放射線１４を照射する（第３図）。電離放射
線１４の代表的なものは紫外線と電子線である
が、その他のものも利用できる。電離放射線１４
の照射により、電離放射線遮蔽性模様１１のない
部分では電離放射線硬化性樹脂層１３は硬化し、
また電離放射線遮蔽性模様１１のある部分では電
離放射線硬化性樹脂層１３が未硬化のままに置か
れる。 Next, the release base material 12 and the uneven pattern forming base material 2
After overlapping them with the ionizing radiation-curable resin layer 13 interposed therebetween to bring them into close contact, ionizing radiation 14 is irradiated from the release base material 12 side (FIG. 3). Typical examples of ionizing radiation 14 are ultraviolet light and electron beams, but other radiation can also be used. ionizing radiation 14
By the irradiation, the ionizing radiation curable resin layer 13 is cured in the areas where the ionizing radiation shielding pattern 11 is not provided.
Further, in a portion where the ionizing radiation shielding pattern 11 is present, the ionizing radiation curable resin layer 13 is left uncured.
電離放射線１４の照射後に剥離基材１２を剥離
すると、第４図に示すように電離放射線硬化性樹
脂層１３の未硬化部分では、未硬化の電離放射線
硬化性樹脂が剥離基材１２に付着して基材１２の
剥離とともに付着した分が除去され、結果とし
て、少量の未硬化の電離放射線硬化性樹脂が残留
した凹部６と、硬化した電離放射線硬化性樹脂よ
りなる凸部４とが形成される。これにより、基材
２上に凹部６と凸部４とからなる凹凸模様３が形
成される。 When the release base material 12 is peeled off after irradiation with the ionizing radiation 14, uncured ionizing radiation-curable resin adheres to the release base material 12 in the uncured portions of the ionizing radiation-curable resin layer 13, as shown in FIG. When the base material 12 is peeled off, the adhered portion is removed, and as a result, a recess 6 in which a small amount of uncured ionizing radiation curable resin remains and a convex portion 4 made of the cured ionizing radiation curable resin are formed. Ru. As a result, a concave-convex pattern 3 consisting of concave portions 6 and convex portions 4 is formed on the base material 2.
次いで、本発明方法は上記凹部６に残つた未硬
化の電離放射線硬化性樹脂１３ａを適宜量除去す
る。このとき未硬化の樹脂１３ａは第５図に示す
ように全て除去してしまう場合に限定されず、そ
の一部を所定量除去してもよい。この未硬化樹脂
１３ａを除去するには、種々の物理的除去方法、
化学式除去方法があるが、残留した未硬化の部分
の溶剤に対する溶解性が高いことを利用し、適宜
な溶剤を使用して、未硬化の電離放射線硬化性樹
脂を溶解除去する化学的除去方法を採用すること
が好ましい。溶解除去させるための溶剤として
は、酢酸エチル、酢酸ｎ−ブチル等のエステル
類；メチルエチルケトン、メチルイソブチルケト
ン、シクロヘキサノン等のケトン類；エタノー
ル、イソプロパノール、ｎ−ブタノール等のアル
コール類等があり、使用した電離放射線硬化性樹
脂の種類に合わせて選択し、使用する。これら溶
剤による溶解除去は、かけ流しの浸漬のみによつ
ても行えるが、本発明では形成された凹凸模様上
に溶剤を塗布した後、ブラシ或いは綿のバフイン
グローラーを使用してバフ研磨する方法を採用す
る。この未硬化樹脂の除去工程後、なお残存する
未硬化樹脂は所定時期に硬化せしめることが好ま
しい。 Next, in the method of the present invention, an appropriate amount of the uncured ionizing radiation curable resin 13a remaining in the recess 6 is removed. At this time, the uncured resin 13a is not limited to being completely removed as shown in FIG. 5, but a predetermined amount of a portion thereof may be removed. To remove this uncured resin 13a, various physical removal methods,
There is a chemical removal method, but there is a chemical removal method that takes advantage of the high solubility of the remaining uncured portion in solvents and uses an appropriate solvent to dissolve and remove the uncured ionizing radiation curable resin. It is preferable to adopt it. Solvents used for dissolution and removal include esters such as ethyl acetate and n-butyl acetate; ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; and alcohols such as ethanol, isopropanol, and n-butanol. Select and use according to the type of ionizing radiation-curable resin. Removal by dissolution with these solvents can also be carried out by dipping alone, but in the present invention, after applying the solvent to the formed uneven pattern, the method involves buffing using a brush or cotton buffing roller. Adopt. After this step of removing the uncured resin, the remaining uncured resin is preferably cured at a predetermined time.
上記凹部６における未硬化樹脂の除去を行つた
後、本発明では該凹部にワンピングインキ層７を
塗布形成する。この塗布形成は通常のワイピング
インキを凹凸模様３の全表面に塗布し、その直後
に、凹凸模様の凸部上に存在するインキのみをド
クターブレードにてかき取ることによつて行い、
結果的に、凹部６のみにワイピングインキを残存
せしめるものである。このワイピングインキ層７
を設けることにより凹部模様に同調した意匠効果
が得られる。 After removing the uncured resin in the recesses 6, in the present invention, a wamping ink layer 7 is applied to the recesses. This coating formation is performed by applying normal wiping ink to the entire surface of the uneven pattern 3, and immediately thereafter scraping off only the ink existing on the convex parts of the uneven pattern with a doctor blade.
As a result, the wiping ink remains only in the recess 6. This wiping ink layer 7
By providing this, a design effect that matches the concave pattern can be obtained.
以上の如き工程を経て基本的に、本発明製造方
法による例えば第６図に示すような凹凸模様形成
体１が得られる。 Through the above steps, basically, an uneven pattern formed body 1 as shown in FIG. 6, for example, is obtained by the manufacturing method of the present invention.
本発明方法では剥離基材１２上に模様層５を設
けておくことにより、該基材１２の剥離によつて
第７図に示すように凹凸模様３の凸部４上に模様
層５を転写形成することができる。この模様層５
は用途に応じて種々の塗料若しくはインキを使用
して形成される。模様層５は電離放射線を透過さ
せて電離放射線硬化性樹脂層を硬化させる必要
上、電離放射線透過性である。電離放射線が紫外
線であるときは紫外線透過性を確保するために、
紫外線透過性を妨げる顔料、充填剤の多用は避け
た方がよく、染料により着色するか、粒子径の極
めて小さい顔料を使用するとよい。模様層５は均
一な層（いわゆるベタ層）として形成しても、或
いは模様状に設けてもよい。模様層は１色の印刷
層であつても２色以上の印刷層であつてもよい。
この模様層５を設けることにより凸部模様に同調
した意匠効果が得られる。 In the method of the present invention, by providing the pattern layer 5 on a peelable base material 12, the pattern layer 5 is transferred onto the convex portions 4 of the uneven pattern 3 by peeling off the base material 12, as shown in FIG. can be formed. This pattern layer 5
are formed using various paints or inks depending on the purpose. The pattern layer 5 is transparent to ionizing radiation because it is necessary to transmit ionizing radiation to cure the ionizing radiation-curable resin layer. When the ionizing radiation is ultraviolet radiation, to ensure ultraviolet transparency,
It is better to avoid using too many pigments and fillers that impede ultraviolet transmittance, and it is better to color with dyes or use pigments with extremely small particle sizes. The pattern layer 5 may be formed as a uniform layer (so-called solid layer) or may be provided in a pattern. The pattern layer may be a printed layer of one color or a printed layer of two or more colors.
By providing this pattern layer 5, a design effect matching the convex pattern can be obtained.
また、本発明では剥離基材１２を剥離後、凹凸
模様３上の所定箇所に該模様３等の表面保護を図
るために保護層８を塗布形成する。保護層８は凹
凸模様の凸部４上のみに形成しても或いは凹凸模
様３の全面に形成してもよい（第７図）。また保
護層は前記と同様の電離放射線硬化性樹脂により
形成することもできるが、熱硬化性樹脂により形
成してもよい。 Further, in the present invention, after the release base material 12 is peeled off, a protective layer 8 is coated on predetermined locations on the uneven pattern 3 in order to protect the surface of the pattern 3 and the like. The protective layer 8 may be formed only on the convex portions 4 of the uneven pattern, or may be formed on the entire surface of the uneven pattern 3 (FIG. 7). Further, the protective layer may be formed of the same ionizing radiation-curable resin as described above, but may also be formed of a thermosetting resin.
更に、本発明では凹凸模様形成用基材２として
必要に応じて第７図に示すような着色模様層９を
設けたものや、凹凸表面を有するものを使用する
ことができる。着色模様層９は着色層又は模様層
か、或いは両層を組み合わせたものであり、基材
２の全面に設けても一部に設けてもよい。また着
色模様層９を設けるパターンは電離放射線遮蔽性
模様１１のパターンと同調するパターンに設けて
もよいが、必ずしも両者が同調するように形成す
る必要はない。着色模様層９は通常のインキ、塗
料等を用いて公知の印刷法によつて形成すること
ができるが、その他に着色模様自体を基材２に転
写したり或いは着色模様を設けたシートをラミネ
ートしたりして形成することもできる。また着色
模様層９は通常、凹凸模様形成用基材２の電離放
射線硬化性樹脂層１３が設ける側（上面側）に設
けるが、基材２が透明な材質よりなる場合には該
基材２の下面側に設けることもできる。凹凸表面
を有する凹凸模様形成用基材２を使用する場合、
凹凸模様３はその凹凸表面に追従した状態とな
る。また、その凹凸自体は基材２表面の一部に存
在するものであつてもよい。 Furthermore, in the present invention, as the base material 2 for forming an uneven pattern, one provided with a colored pattern layer 9 as shown in FIG. 7 or one having an uneven surface can be used, if necessary. The colored pattern layer 9 is a colored layer, a patterned layer, or a combination of both layers, and may be provided on the entire surface of the base material 2 or on a part thereof. Further, the pattern in which the colored pattern layer 9 is provided may be provided in a pattern that is synchronized with the pattern of the ionizing radiation shielding pattern 11, but it is not necessarily necessary to form the both so that they are synchronized. The colored pattern layer 9 can be formed by a known printing method using ordinary ink, paint, etc., but it is also possible to transfer the colored pattern itself onto the base material 2 or laminate a sheet provided with a colored pattern. It can also be formed by Further, the colored pattern layer 9 is normally provided on the side (top side) on which the ionizing radiation curable resin layer 13 of the base material 2 for forming an uneven pattern is provided, but when the base material 2 is made of a transparent material, the base material 2 It can also be provided on the lower surface side. When using the uneven pattern forming base material 2 having an uneven surface,
The uneven pattern 3 follows the uneven surface. Moreover, the unevenness itself may exist in a part of the surface of the base material 2.
尚、上記実施例では剥離基材側に電離放射線遮
蔽性模様を設けて電離放射線を剥離基材側より照
射する場合について説明したが、凹凸模様形成用
基材が電離放射線透過性の場合、凹凸模様形成用
基材に電離放射線遮蔽性模様を設け、凹凸模様形
成用基材側より電離放射線を照射することもでき
る。また電離放射線遮蔽性模様は剥離基材とは別
のシートに形成して剥離基材と重ね合わせて用い
ることもできる。 In the above example, an ionizing radiation shielding pattern is provided on the release base material side and ionizing radiation is irradiated from the release base material side. However, when the base material for forming the uneven pattern is transparent to ionizing radiation, It is also possible to provide a pattern-forming substrate with an ionizing radiation-shielding pattern and irradiate the ionizing radiation from the uneven pattern-forming substrate side. The ionizing radiation shielding pattern can also be formed on a sheet separate from the release base material and used by overlapping the release base material.
本発明方法により得られる凹凸模様形成体１は
いかなる用途に対しても適用可能であるが、化粧
材として用いることが最も好ましい。 Although the uneven pattern formed body 1 obtained by the method of the present invention can be applied to any purpose, it is most preferably used as a decorative material.
以下、具体的な実施例を挙げて本発明を更に詳
細に説明する。 Hereinafter, the present invention will be explained in more detail by giving specific examples.
実施例 １
ポリエステルフイルム（東レ(株)製）を剥離基材
とし、この表面に紫外線遮蔽性の白色インキ（諸
星インキ(株)製）により、版深60μｍのグラビア版
を用いて抽象柄を印刷した。Example 1 A polyester film (manufactured by Toray Industries, Inc.) was used as a release base material, and an abstract pattern was printed on the surface using ultraviolet-shielding white ink (manufactured by Moroboshi Ink Co., Ltd.) using a gravure plate with a plate depth of 60 μm. did.
一方、塩化ビニル板（厚さ５mm）の片面に透明
着色した紫外線硬化性塗料（日本ペイント(株)製）
を厚みが100μｍとなるようにフローコートした。 On the other hand, a transparent colored ultraviolet curable paint (manufactured by Nippon Paint Co., Ltd.) was applied to one side of a vinyl chloride plate (thickness 5 mm).
was flow coated to a thickness of 100 μm.
次いで、紫外線硬化性塗料を塗布した面に前記
剥離基材の非印刷面が接するように重ね合わせ、
剥離基材側より出力80w／cmのオゾンレス型紫外
線ランプを５灯設置した照射装置中を20ｍ／分の
速度で通過させながら照射し、照射後、剥離基材
を剥離した。 Next, overlap the release base material so that the non-printed surface is in contact with the surface coated with the ultraviolet curable paint,
Irradiation was carried out from the release base material side while passing through an irradiation device equipped with five ozone-less ultraviolet lamps with an output of 80 W/cm at a speed of 20 m/min, and after irradiation, the release base material was peeled off.
この剥離基材の剥離により、剥離基材に設けた
白色インキによる模様部のない部分に相当する紫
外線硬化性塗料が硬化して紫外線硬化性塗料によ
る凸部が形成され、白色インキによる模様のある
部分に相当する部分では未硬化の紫外線硬化性塗
料の一部が剥離基材に付着して剥離基材の剥離の
際に除去されて凹部が形成された。 Due to this peeling of the release base material, the UV-curable paint corresponding to the part without the white ink pattern provided on the release base material is cured, forming convex parts with the UV-curable paint, and the part with the white ink pattern is cured. In the corresponding portion, a portion of the uncured ultraviolet curable paint adhered to the release base material and was removed when the release base material was peeled off, forming a recessed portion.
剥離基材剥離後、凹凸面の凹部に一部残留した
未硬化の紫外線硬化性塗料をトルエン、酢酸エチ
ルを主成分とする溶剤を用いて回転ブラシによる
バフ研磨を行つて除去した。 After the peeling base material was peeled off, the uncured ultraviolet curable paint partially remaining in the recesses of the uneven surface was removed by buffing with a rotating brush using a solvent containing toluene and ethyl acetate as main components.
次いで、凹凸面に着色インキ（昭和インク製：
Ｗ−141）を用いてワイピング塗装を行い、更に
全面に紫外線硬化性塗料（日本ペイント製）を厚
みが50μｍとなるようにフローコート法にて塗布
し、硬化させた。 Next, colored ink (manufactured by Showa Ink:
W-141) was used for wiping painting, and then an ultraviolet curable paint (manufactured by Nippon Paint) was applied to the entire surface using a flow coating method to a thickness of 50 μm and cured.
得られた凹凸模様形成体は、凹凸模様がシヤー
プであり、凹部に着色インキが充填されているた
め凹凸感が強調されている。またこの形成体を化
粧材として使用したところ、塗装感（深み）に富
むものであつた。 The resulting concavo-convex pattern formed body has a sharp concave-convex pattern, and the concavities and convexities are filled with colored ink, so that the concavo-convex pattern is emphasized. When this formed product was used as a decorative material, it had a rich coating feel (depth).
以上説明したように、本発明の製造方法は凹凸
模様形成用基材と、電離放射線遮蔽性模様を有す
る剥離基材を電離放射線硬化性樹脂層を介して重
ね合わせて電離放射線を照射し、次いで剥離基材
を剥離して未硬化の電離放射線硬化性樹脂を剥離
基材に付着せしめて除去して凹部を形成し、該凹
部と硬化した電離放射線硬化性樹脂よりなる凸部
とからなる凹凸模様を形成し、しかる後、該凹凸
模様の凹部に残存する未硬化の電離放射線硬化性
樹脂を溶剤塗布後にバフ研磨して除去し、更に、
その凹部のみにワイピングインキを塗布形成する
ものであるため、最終的に、シヤープで立体感に
優れ、しかも凹部のワイピングインキ層により凹
部模様に同調した意匠効果が得られる美麗な凹凸
模様を有する凹凸模様形成体を容易に製造するこ
とができる。
As explained above, in the manufacturing method of the present invention, a base material for forming an uneven pattern and a release base material having an ionizing radiation shielding pattern are stacked together via an ionizing radiation curable resin layer, and then ionizing radiation is irradiated. An uneven pattern consisting of a recessed portion and a convex portion made of the cured ionizing radiation-curable resin, which is formed by peeling off a release base material, adhering an uncured ionizing radiation-curable resin to the release base material, and removing it to form a recessed portion. After that, the uncured ionizing radiation curable resin remaining in the concave portions of the uneven pattern is removed by buffing after coating with a solvent, and further,
Since the wiping ink is applied only to the concave portions, the final result is a concavo-convex pattern with a beautiful concavo-convex pattern that is sharp and has an excellent three-dimensional effect, and the wiping ink layer on the concave portions provides a design effect that is in tune with the concave pattern. A pattern-forming body can be easily produced.
また本発明方法では凹部に残存する未硬化樹脂
を除去するため、剥離基材を剥離しただけで得ら
れる凹部に比べ、凹部の深さ、凹部エツジのシヤ
ープさ等がより優れたシヤープで立体感に富む凹
凸模様が得られる。しかも、凹部に残存する未硬
化樹脂を除去した後に、液状インキであるワイピ
ングインキを凹凸模様全面に塗布した後凸部上に
あるインキのみをかき取つて凹部のみに上記イン
キを塗布するため、きわめて微小な凹部にもワイ
ピングインキを良好に充填塗布することが可能で
ある。これは、例えば凹部として木目の導管溝状
の凹部のような細かい凹部形状を形成した場合、
その凹部にワイピングインキを確実に充填塗布す
ることができ、もつて微小な凹部においてもワイ
ピングインキによる意匠効果が充分に得られ、有
益となる。 In addition, since the method of the present invention removes the uncured resin remaining in the recesses, the depth of the recesses and the sharpness of the edges of the recesses are better than those obtained by simply peeling off the release base material, giving a three-dimensional effect. A textured pattern rich in texture is obtained. Furthermore, after removing the uncured resin remaining in the recesses, wiping ink, which is a liquid ink, is applied to the entire surface of the uneven pattern, and then only the ink on the projections is scraped off and the ink is applied only to the recesses. It is possible to satisfactorily fill and apply the wiping ink even to minute recesses. For example, if a fine concave shape such as a conduit groove in the wood grain is formed as a concave part,
The wiping ink can be reliably filled and applied to the recessed portion, and the design effect of the wiping ink can be sufficiently obtained even in the minute recessed portion, which is beneficial.
更に本発明方法では剥離基材として模様層を設
けたものを使用すれば、その基材の剥離により凹
凸模様の凸部上に該模様層を転写形成することが
でき、その模様層により凸部模様に同調する意匠
効果のある凹凸模様を得ることができる。また剥
離基材を剥離した後に保護層を凹凸模様の全面若
しくは凸部上のみに保護層を形成すれば、耐久性
等に優れた凹凸模様を得ることができる。 Furthermore, in the method of the present invention, if a material provided with a pattern layer is used as a release base material, the pattern layer can be transferred and formed on the convex portions of the uneven pattern by peeling off the base material, and the pattern layer can be used to form the pattern layer on the convex portions of the uneven pattern. It is possible to obtain an uneven pattern with a design effect that matches the pattern. Further, by forming a protective layer on the entire surface of the uneven pattern or only on the convex portions after peeling off the release base material, it is possible to obtain an uneven pattern with excellent durability.
このようにシヤープで立体感に優れた上、意匠
性、耐久性等に優れた凹凸模様を有する本発明製
造方法により得られる凹凸模様形成体は、化粧材
として用いた場合、特に実益大である。 As described above, the uneven pattern formed body obtained by the production method of the present invention, which has an uneven pattern that is sharp and has an excellent three-dimensional effect, and has excellent design properties and durability, is particularly useful when used as a decorative material. .
第１図〜第５図は本発明製造方法の一実施例を
示す各工程の縦断面図、第６図及び第７図は本発
明により得られる凹凸模様形成体の代表例を示す
縦断面図である。
１……凹凸模様形成体、２……凹凸模様形成用
基材、３……凹凸模様、４……凸部、５……模様
層、６……凹部、７……ワイピングインキ層、８
……保護層、１１……電離放射線遮蔽性模様、１
２……剥離基材、１３……電離放射線硬化性樹脂
層、１４……電離放射線。
FIGS. 1 to 5 are longitudinal cross-sectional views of each step showing an example of the manufacturing method of the present invention, and FIGS. 6 and 7 are longitudinal cross-sectional views showing representative examples of the uneven pattern formed body obtained by the present invention. It is. DESCRIPTION OF SYMBOLS 1... Uneven pattern formation body, 2... Substrate for uneven pattern formation, 3... Uneven pattern, 4... Convex part, 5... Pattern layer, 6... Concave part, 7... Wiping ink layer, 8
... Protective layer, 11 ... Ionizing radiation shielding pattern, 1
2... Release base material, 13... Ionizing radiation curable resin layer, 14... Ionizing radiation.
Claims (1)
模様形成体の製造方法。 (a) 表面が剥離性を有する電離放射線透過性剥離
基材の表裏いずれかの面に電離放射線遮蔽性模
様を設ける工程、 (b) 凹凸模様形成用基材と剥離基材とを、電離放
射線硬化性樹脂層を介して重ね合わせる工程、 (c) 剥離基材側より電離放射線を照射して電離放
射線遮蔽性模様のない部分に相当する電離放射
線硬化性樹脂層を硬化させる工程、 (d) 剥離基材を剥がして電離放射線硬化性樹脂層
の未硬化部の樹脂の一部を剥離基材に付着させ
て除去し、電離放射線遮蔽模様に対応する凹部
を形成する工程。 (e) 工程(d)にて形成された凹凸模様上に溶剤を塗
布した後、ブラシ或いは綿のバフイングローラ
ーを使用してバフ研磨することにより、該凹凸
模様の凹部に残存する未硬化の電離放射線硬化
性樹脂を除去する工程、 (f) 工程(e)にて形成された凹凸模様の全表面にワ
ンピングインキを塗布し、その直後に該凹凸模
様の凸部上に存在するインキをかき取ることに
より、凹部のみにワイピングインキを残存させ
る工程。 ２ 剥離基材上に模様層を設け、剥離基材の剥離
により凹凸模様の凸部上に該模様層を転写形成す
る請求項１記載の凹凸模様形成体の製造方法。 ３ 剥離基材を剥離した後、凹凸模様の全面若し
くは凸部上のみに保護層を塗布形成する請求項１
又は２記載の凹凸模様形成体の製造方法。[Scope of Claims] 1. A method for producing an uneven pattern formed body, characterized by performing the following steps in order. (a) A step of providing an ionizing radiation-shielding pattern on either the front or back surface of an ionizing radiation-transparent release base material whose surface is releasable; (c) a step of curing the ionizing radiation-curable resin layer corresponding to the portion without the ionizing radiation-shielding pattern by irradiating ionizing radiation from the release base material side; (d) A step of peeling off the release base material and attaching a portion of the uncured resin of the ionizing radiation curable resin layer to the release base material and removing it to form a recess corresponding to the ionizing radiation shielding pattern. (e) After applying a solvent on the uneven pattern formed in step (d), buffing is performed using a brush or a cotton buffing roller to remove uncured material remaining in the recesses of the uneven pattern. (f) Applying wamping ink to the entire surface of the uneven pattern formed in step (e), and immediately after that, removing the ink present on the convex parts of the uneven pattern. A process in which the wiping ink remains only in the recesses by scraping it off. 2. The method for producing an uneven pattern formed body according to claim 1, wherein a pattern layer is provided on a release base material, and the pattern layer is transferred and formed on the convex portions of the uneven pattern by peeling off the release base material. 3. Claim 1, wherein after the release base material is peeled off, a protective layer is coated on the entire surface of the uneven pattern or only on the convex portions.
Or the manufacturing method of the uneven|corrugated pattern formation object of 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-325740 | 1987-12-23 | ||
| JP32574087 | 1987-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01253449A JPH01253449A (en) | 1989-10-09 |
| JPH0588677B2 true JPH0588677B2 (en) | 1993-12-24 |
Family
ID=18180129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6300088A Granted JPH01253449A (en) | 1987-12-23 | 1988-03-16 | Relief-patterned material and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01253449A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3532229B2 (en) * | 1993-06-04 | 2004-05-31 | 大日本印刷株式会社 | Simultaneous molding sheet |
| JP2007245727A (en) * | 2007-04-27 | 2007-09-27 | Dainippon Printing Co Ltd | Manufacturing method of decorative sheet |
| JP5558722B2 (en) * | 2009-01-16 | 2014-07-23 | 大日本印刷株式会社 | Printed materials and containers |
-
1988
- 1988-03-16 JP JP6300088A patent/JPH01253449A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01253449A (en) | 1989-10-09 |
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