JPH0590107A - Method of forming outer electrode conductor of electronic parts - Google Patents

Method of forming outer electrode conductor of electronic parts

Info

Publication number
JPH0590107A
JPH0590107A JP3278452A JP27845291A JPH0590107A JP H0590107 A JPH0590107 A JP H0590107A JP 3278452 A JP3278452 A JP 3278452A JP 27845291 A JP27845291 A JP 27845291A JP H0590107 A JPH0590107 A JP H0590107A
Authority
JP
Japan
Prior art keywords
elastic body
conductive paste
electronic component
face
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3278452A
Other languages
Japanese (ja)
Other versions
JP3007204B2 (en
Inventor
Masahiro Tanaka
巨浩 田中
Tokuji Fukazawa
徳治 深沢
Hiroyuki Moriya
裕之 森谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP3278452A priority Critical patent/JP3007204B2/en
Publication of JPH0590107A publication Critical patent/JPH0590107A/en
Application granted granted Critical
Publication of JP3007204B2 publication Critical patent/JP3007204B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To improve coating position precision, and realize uniform belt type coating on the end surface of a parts element and the surface linking to the end surface, in a method wherein a plurality of trenches are arranged, and conductive paste is spread so as to permeate into an adjacent surface from a surface of the electronic parts element. CONSTITUTION:On a hard flat plate elastic body 1, a pair of plate type bodies 2 which have elastic force softer than the body 1 are arranged and fixed in parallel to each other at a specified interval. Facing surfaces of the plate type bodies 2 are inclined. These inclined surfaces and the flat plate elastic body 1 constitute a recessed part, in which a plurality of trenches 3 are formed. After the trenches 3 are filled with conductive paste, the end surface of each parts element is inserted into the recessed part, and pressed against the flat plate elastic body 1. Thereby the conductive paste is transferred to the end surface of the parts and the side surface linking to the end surface.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、インダクタアレイ、L
Cフィルタ等の、外部接続用端子が素体の1つの端面か
らそれに連なる面にまたがり連続して帯状に形成された
電子部品の外部接続用端子(導体)の形成方法に関す
る。
The present invention relates to an inductor array, L
The present invention relates to a method for forming an external connection terminal (conductor) of an electronic component which is formed in a continuous strip shape such that a terminal for external connection such as a C filter extends from one end face of an element body to a surface continuous with it.

【0002】[0002]

【従来の技術】電子部品素体の1つの端面から少なくと
も1つの隣接する面にまたがり連続して帯状に外部電極
端子を形成する方法については、 (1)平板弾性体に形成された複数の溝に導電性ペース
トを充填し、該弾性体に電子部品素体の端面を押し付け
て塗布する方法(特開平2−33908号公報参照)、
あるいは (2)形成すべき電極の幅に応じた幅のスリットが形成
されたスリット板を導電性ペースト浴上に設置し、該ペ
ースト浴の液面を上昇させてスリット板の上に置いた電
子部品素体の端面に塗布する方法(特開平2−2562
25)などが知られている。
2. Description of the Related Art A method for continuously forming strip-shaped external electrode terminals from one end face of an electronic component body to at least one adjacent face is as follows: (1) A plurality of grooves formed in a flat plate elastic body A conductive paste is filled in and the end face of the electronic component element body is pressed against the elastic body to apply the paste (see JP-A-2-33908),
Alternatively, (2) an electron is provided by placing a slit plate having a slit having a width corresponding to the width of an electrode to be formed on a conductive paste bath, raising the liquid level of the paste bath, and placing the liquid on the slit plate. A method of applying to the end face of the component body (Japanese Patent Laid-Open No. 25662/1990)
25) and the like are known.

【0003】比較的操作が簡便である上記(1)の特開
平2−33908号公報に開示されている方法は概要以
下の通りである。
The method disclosed in Japanese Patent Application Laid-Open No. 2-33908 (1), which is relatively easy to operate, is as follows.

【0004】すなわち、図4の斜視図に示すように、平
板弾性体1に平行な複数の溝3を形成した凹版を用意
し、これら溝の溝幅および溝ピッチを電子部品素体6の
側面に形成すべき外部端子電極の幅、配列間隔に対応さ
せ、凹版の溝にスキージングにより導電性ペースト4を
充填し、電子部品の外部電極を形成しようとする端面と
上記溝との相対的位置を合わせ、該端面を弾性体に押し
あて、さらに端面に連なる面(側面)まで導電性ペース
トが回り込むように押し込み、その後電子部品素体6を
引き上げることにより、所定の外部電極を形成してい
る。
That is, as shown in the perspective view of FIG. 4, an intaglio having a plurality of grooves 3 formed in parallel with the flat elastic body 1 is prepared, and the groove width and groove pitch of these grooves are set to the side surface of the electronic component body 6. Corresponding to the width and arrangement interval of the external terminal electrodes to be formed, the groove of the intaglio is filled with the conductive paste 4 by squeezing, and the relative position of the end surface to form the external electrode of the electronic component and the groove. And press the end face against the elastic body so that the conductive paste wraps around to the surface (side face) continuous with the end face, and then pull up the electronic component element body 6 to form a predetermined external electrode. .

【0005】[0005]

【発明が解決しようとする課題】しかしながら、弾性体
を用いる上記特開平2−33908号公報に開示されて
いる方法には、以下のような改善すべき課題がある。
However, the method disclosed in JP-A-2-33908, which uses an elastic body, has the following problems to be improved.

【0006】(1)電子部品素体の端面に連なる面(側
面)に外部電極として導電性ペーストが塗布される量は
該素体の弾性体への押し込み量によっている。したがっ
て該素子は導電性ペーストに対し強くあたるところ(端
面)と弱くあたるところ(側面)ができるので、該ペー
ストが均一に塗布できず、その結果、完成した端子電極
が薄い部分では強度が出ない。また押し込み量の設定が
難しく、このため調整に時間を要する。
(1) The amount of conductive paste applied as an external electrode to the surface (side surface) connected to the end face of the electronic component element body depends on the amount of the element body pressed into the elastic body. Therefore, since the element can be applied to the conductive paste strongly (end face) and weakly (side), the paste cannot be applied uniformly, and as a result, strength cannot be obtained in the thin portion of the completed terminal electrode. . Further, it is difficult to set the pushing amount, and therefore it takes time to adjust.

【0007】各チップ部品の大きさにバラツキがあるの
で、多数のチップ部品等を一括処理することが困難であ
る。
Since the chip parts vary in size, it is difficult to collectively process a large number of chip parts and the like.

【0008】(2)電子部品素体の外部電極端子を形成
すべき位置が弾性体に形成された溝の位置に対し角度的
にズレをもったまま素体が弾性体に接していても、その
まま導電体が塗布されてしまい塗布位置の精度が上がら
ない。
(2) Even if the element body is in contact with the elastic body while the position of the external electrode terminal of the electronic component element body is angularly displaced from the position of the groove formed in the elastic body, The conductor is applied as it is, and the accuracy of the application position cannot be improved.

【0009】したがって、本発明の目的は、上記の課題
を解決して、チップ部品等を一括処理するとしても塗布
位置の精度がよく、かつ外部電極端子用のペーストが均
一に電子部品素体の端面とそれに連なる面にまたがって
帯状に塗布され得る方法を提供することにある。
Therefore, an object of the present invention is to solve the above-mentioned problems, and even if chip parts and the like are collectively processed, the application position is accurate and the paste for external electrode terminals is uniformly applied to the electronic part body. It is an object of the present invention to provide a method capable of being applied in a strip shape over the end surface and the surface continuous with the end surface.

【0010】[0010]

【課題を解決するための手段】本発明者らは、上記目的
を達成すべく研究の結果、必要に応じ部品素体の端面に
接する弾性体の硬度と端面に連なる側面に接する弾性体
の硬度に差を設けて後者の硬度を前者よりも低くするこ
とにより、換言すれば必要に応じ硬軟2種類の弾性体を
用いて、前者の平板弾性体の上に後者の一対の板条体を
所定の間隔で固定配置した治具を用いることにより、電
子部品素体の端面の押し込みに際し、導電性ペーストの
塗布が均一となるようにし得ることを見出し本発明に到
達した。
As a result of research to achieve the above object, the inventors of the present invention have found that the hardness of an elastic body in contact with the end face of a component element body and the hardness of an elastic body in contact with a side face continuous with the end face as necessary. By making a difference in the latter to make the hardness of the latter lower than that of the former, in other words, by using two kinds of elastic bodies of hard and soft, the pair of plate-shaped bodies of the latter is prescribed on the former plate elastic body as required. The inventors have found that the use of the jigs fixedly arranged at the intervals allows the application of the conductive paste to be uniform when the end faces of the electronic component element body are pushed in, and has reached the present invention.

【0011】したがって本発明は、電子部品素体の1つ
の端面から隣接する側面に回り込む如く導電性ペースト
を塗布し焼き付けて複数の帯状外部電極端子を形成する
電子部品の外部電極導体形成方法において、(イ)堅い
弾力を有する平板弾性体上に、該平板弾性体と同等の弾
力または必要に応じそれより柔らかい弾力を有する一対
の板条体を、電子部品素体の外部電極端子を形成しよう
とする端面の長さに対応する所定の間隔で平行に固定配
置し、(ロ)前記一対の固定配置板条体の対向する面は
傾斜面とし、これら対向傾斜面と前記平板弾性体とにま
たがり連続する溝を複数本形成し、(ハ)これらの溝に
導電性ペーストをスキージで充填し、電子部品の端面を
前記溝に押し付けて該端面とそれに連なる側面に連続し
て導電性ペーストを転写、塗布することを特徴とする電
子部品の外部電極導体形成方法と記すことができる。
Therefore, the present invention provides a method for forming an external electrode conductor of an electronic component, which comprises forming a plurality of strip-shaped external electrode terminals by applying and baking a conductive paste so as to wrap around from one end face to an adjacent side face of the electronic component body. (A) To form an external electrode terminal of an electronic component element, on a plate elastic body having a firm elasticity, a pair of plate strips having elasticity equal to that of the plate elastic body or softer than that if necessary. Fixedly arranged in parallel at a predetermined interval corresponding to the length of the end face, and (b) the opposed surfaces of the pair of fixedly arranged plate strips are inclined surfaces, and straddle the opposed inclined surfaces and the flat plate elastic body. Forming a plurality of continuous grooves, (c) filling the grooves with a conductive paste with a squeegee, pressing the end faces of the electronic component into the grooves, and continuously forming the conductive paste on the end faces and the side surfaces continuous with the end faces. Transfer, can be referred to as outer electrode conductor forming method of the electronic component, characterized in that the coating.

【0012】[0012]

【作用】本発明の方法においては、(1)電子部品素体
の端面を平板弾性体に押し付けることによって平板弾性
体に形成された溝内の導電性ペーストが該素体端面に転
写され、一方、(2)素体の側面は、板条体と平板弾性
体とにまたがり連続的に形成された溝に導電性ペースト
が充填されたときには、電子部品素体の端面が平板弾性
体に押し付けらると電子部品素体の側面は必要に応じ選
ばれた柔らかい弾力の板条体に抗して板条体を押しの
け、その部分のペーストが素体の側面に転写される。
In the method of the present invention, (1) by pressing the end face of the electronic component element body against the flat plate elastic body, the conductive paste in the groove formed in the flat plate elastic body is transferred to the end face of the element body. (2) The side surface of the element body is such that the end face of the electronic component element body is not pressed against the flat plate elastic body when the conductive paste is filled in the groove formed continuously across the plate body and the flat plate elastic body. Then, the side surface of the electronic component body pushes the plate body against the soft elastic plate body selected as necessary, and the paste in that portion is transferred to the side surface of the body.

【0013】したがって押し付けただけで部品素体の端
面と側面に導電性ペーストが一様な厚さで転写される。
なお、一対の板条体の対向する面を傾斜面にする理由
は、電子部品素体を左右に移動させて柔らかい弾力に抗
して導電性ペーストを転写できるようにするためであ
り、(3)チップ部品の素体は、保持体として用いられ
る円筒状の穴のあいた弾性体で保持されているので、該
部品素体が板条体と平板弾性体で形成する凹部に挿入さ
れる際、溝と素体とが相対的に多少ねじれていても、部
品素体が凹部に沿って回転しセルフアラインメントの動
作をし、また、部品素子が平板弾性体にあたるまで押し
下げられ、あたってからは該素子と保持体にすべりが発
生し、そのため部品素体の高さが多少バラついても、全
品押しあて可能となる等の作用がある。
Therefore, the conductive paste is transferred to the end surface and the side surface of the component body with a uniform thickness just by pressing.
The reason why the opposing surfaces of the pair of plate members are inclined is that the electronic component element body can be moved to the left and right to transfer the conductive paste against the soft elasticity. ) Since the element body of the chip component is held by an elastic body having a cylindrical hole used as a holding body, when the component body is inserted into the recess formed by the plate body and the plate elastic body, Even if the groove and the element body are twisted relative to each other, the component element body rotates along with the recess to perform self-alignment operation, and the component element is pushed down until it hits the flat plate elastic body, and after that, Slip occurs between the element and the holding body, so that even if the height of the component body varies to some extent, all the products can be pressed against each other.

【0014】[0014]

【実施例】図1は本実施例に用いられる2種の組合せ弾
性体が、これら両弾性体にわたって連続的に形成された
導電性ペースト充填用溝を有している状態を示し、図2
は図1の組合せ弾性体の溝にスキージでペーストを充填
した状態を示すいずれも斜視図であって、これらを参照
して以下説明する。
EXAMPLE FIG. 1 shows a state in which two kinds of combined elastic bodies used in the present example have a conductive paste filling groove formed continuously over both elastic bodies.
3A and 3B are perspective views showing a state where the groove of the combined elastic body of FIG. 1 is filled with a squeegee, which will be described below with reference to these drawings.

【0015】まず、図1に示すように、堅い弾力を有す
る平板弾性体1の上に、これよりも柔らかい弾力を有す
る一対の板条体2を外部電極端子を形成しようとする端
面の寸法に合わせた所定の間隔で平行に配置して固定
し、その際、この板条体の対向する面が傾斜面となるよ
うにする。
First, as shown in FIG. 1, a pair of plate strips 2 having a softer elasticity than the flat elastic body 1 having a hard elasticity are set to the dimensions of the end faces where the external electrode terminals are to be formed. The plates are arranged parallel to each other at a predetermined interval and fixed, and at this time, the opposing surfaces of the strips are inclined surfaces.

【0016】次いで、板条体2と平板弾性体1とにわた
って設けられた所定の溝3にスキージ5で導電性ペース
ト4を充填する(図2)。
Then, a conductive paste 4 is filled with a squeegee 5 into a predetermined groove 3 provided between the plate strip 2 and the flat plate elastic body 1 (FIG. 2).

【0017】一方、チップ部品素体を多数の円筒状の穴
のあいた弾性体でできた保持用プレートで方向を揃えて
保持し、一括して上記組合せ弾性体により構成される凹
部が多数設けられたペースト充填用治具の各凹部に部品
素体各々の下端部が挿入されるように、各部品素体の端
面を平板弾性体に接触させた後引き上げる。
On the other hand, the chip component body is held in a uniform direction by a holding plate made of an elastic body having a large number of cylindrical holes, and a large number of concave portions constituted by the combined elastic body are collectively provided. The end face of each component body is brought into contact with the flat plate elastic body and then pulled up so that the lower end of each component body is inserted into each recess of the paste filling jig.

【0018】上記挿入の際、各チップ部品素体はバレル
研磨で素体の角が丸くなっているので部品素体が、挿入
される凹部に対して多少の角度ズレを有していても上記
保持用プレートと素体との間ですべりが生じて素体の角
度が矯正され、凹部にならって挿入される。
At the time of the above insertion, each chip component body is barrel-polished so that the corners of the body are rounded. Therefore, even if the component body has a slight angle deviation with respect to the concave portion to be inserted, A slip occurs between the holding plate and the element body, the angle of the element body is corrected, and the element is inserted following the recess.

【0019】また、部品素体が押し下げられて平板弾性
体に当たると、該素体と保持用プレートとの間で縦方向
のすべりをも起こすので、多数の部品素体を保持体に入
れ、高さ方向にバラツキがあっても弾性体のレベルを基
準にしてスタンプ面が揃うのでバラツキが吸収できる。
Further, when the component body is pushed down and hits the flat plate elastic body, vertical slippage is also caused between the component body and the holding plate. Even if there are variations in the depth direction, the stamp surfaces are aligned with the level of the elastic body as a reference, so the variations can be absorbed.

【0020】以上の作用により、精度よく所定の外部電
極を塗布できる。
With the above operation, the predetermined external electrode can be applied accurately.

【0021】図3(A)はこのようにして導電性ペース
ト4が塗布された電子部品素体6の斜視図、同図(B)
はその側面図である。
FIG. 3 (A) is a perspective view of the electronic component element body 6 to which the conductive paste 4 is applied in this manner, and FIG. 3 (B).
Is a side view thereof.

【0022】[0022]

【発明の効果】以上説明したように、本発明の方法によ
れば、多数のチップ素体を一括処理して精度よく、かつ
外部電極端子用導電性ペーストを均一に該素体の端面と
それに連なる面にまたがって帯状に塗布することができ
る。
As described above, according to the method of the present invention, a large number of chip elements are collectively processed with high accuracy, and the conductive paste for external electrode terminals is uniformly applied to the end surface of the element and the same. It can be applied in a strip shape over the continuous surface.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に用いられた2種の組合せ弾
性体とこれらにわたって形成された導電性ペースト充填
用溝とを示す斜視図である。
FIG. 1 is a perspective view showing two kinds of combined elastic bodies used in an embodiment of the present invention and a conductive paste filling groove formed over them.

【図2】図1の弾性体において、スキージで導電性ペー
ストを溝に充填した状態を示す斜視図である。
FIG. 2 is a perspective view showing a state in which a conductive paste is filled in a groove with a squeegee in the elastic body of FIG.

【図3】本発明の方法により導電性ペーストが塗布され
た電子部品素体の斜視図および側面図である。
FIG. 3 is a perspective view and a side view of an electronic component element body coated with a conductive paste by the method of the present invention.

【図4】弾性体を用いた従来の外部電極端子の形成方法
の例を示した斜視図である。
FIG. 4 is a perspective view showing an example of a conventional method of forming an external electrode terminal using an elastic body.

【符号の説明】[Explanation of symbols]

1 平板弾性体 2 板条体 3 溝 4 導電性ペースト 5 スキージ 6 電子部品素体 DESCRIPTION OF SYMBOLS 1 Flat elastic body 2 Plate strip 3 Groove 4 Conductive paste 5 Squeegee 6 Electronic component body

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 電子部品素体の1つの端面から隣接する
側面に回り込む如く導電性ペーストを塗布し焼き付けて
複数の帯状外部電極端子を形成する電子部品の外部電極
導体形成方法において、(イ)堅い弾力を有する平板弾
性体上に、該平板弾性体と同等の弾力または必要に応じ
それより柔らかい弾力を有する一対の板条体を、電子部
品素体の外部電極端子を形成しようとする端面の長さに
対応する所定の間隔で平行に固定配置し、(ロ)前記一
対の固定配置板条体の対向する面は傾斜面とし、これら
対向傾斜面と前記平板弾性体とにまたがり連続する溝を
複数本形成し、(ハ)これらの溝に導電性ペーストをス
キージで充填し、電子部品の端面を前記溝に押し付けて
該端面とそれに連なる側面に連続して導電性ペーストを
転写、塗布することを特徴とする電子部品の外部電極導
体形成方法。
1. A method of forming an external electrode conductor of an electronic component, comprising forming a plurality of strip-shaped external electrode terminals by applying and baking a conductive paste so as to wrap around from one end face of an electronic component element body to an adjacent side face thereof. On a flat elastic body having a firm elasticity, a pair of plate-like bodies having elasticity equal to or softer than that of the flat elastic body is formed on an end surface of the electronic component body for forming external electrode terminals. Fixedly arranged parallel to each other at a predetermined interval corresponding to the length, and (b) facing surfaces of the pair of fixedly arranged plate members are inclined surfaces, and a groove continuous between the opposed inclined surfaces and the flat plate elastic body. (C) Filling these grooves with a conductive paste with a squeegee, pressing the end face of the electronic component into the groove, and transferring and applying the conductive paste continuously to the end face and the side surface connected to it. thing A method for forming an external electrode conductor of an electronic component, comprising:
JP3278452A 1991-09-30 1991-09-30 Method for forming external electrode conductor of electronic component Expired - Lifetime JP3007204B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3278452A JP3007204B2 (en) 1991-09-30 1991-09-30 Method for forming external electrode conductor of electronic component

Applications Claiming Priority (1)

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JP3278452A JP3007204B2 (en) 1991-09-30 1991-09-30 Method for forming external electrode conductor of electronic component

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JPH0590107A true JPH0590107A (en) 1993-04-09
JP3007204B2 JP3007204B2 (en) 2000-02-07

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7673382B2 (en) 2006-01-16 2010-03-09 Tdk Corporation External electrode forming method
KR101396782B1 (en) * 2012-11-16 2014-05-20 (주)지텍 Device for forming the external electrode and external electrode forming method using the same
WO2014077562A1 (en) * 2012-11-16 2014-05-22 (주)지텍 Device for forming external electrode, and method for forming external electrode using same
KR101416217B1 (en) * 2013-12-09 2014-08-06 (주)지텍 Device for Forming the External Electrode
WO2022220087A1 (en) * 2021-04-16 2022-10-20 株式会社クリエイティブコーティングス Intaglio jig for manufacturing electronic component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7673382B2 (en) 2006-01-16 2010-03-09 Tdk Corporation External electrode forming method
US8181340B2 (en) 2006-01-16 2012-05-22 Tdk Corporation External electrode forming method
KR101396782B1 (en) * 2012-11-16 2014-05-20 (주)지텍 Device for forming the external electrode and external electrode forming method using the same
WO2014077562A1 (en) * 2012-11-16 2014-05-22 (주)지텍 Device for forming external electrode, and method for forming external electrode using same
KR101416217B1 (en) * 2013-12-09 2014-08-06 (주)지텍 Device for Forming the External Electrode
WO2022220087A1 (en) * 2021-04-16 2022-10-20 株式会社クリエイティブコーティングス Intaglio jig for manufacturing electronic component

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