JPH0590756A - Production of rigid/flexible board - Google Patents
Production of rigid/flexible boardInfo
- Publication number
- JPH0590756A JPH0590756A JP27665491A JP27665491A JPH0590756A JP H0590756 A JPH0590756 A JP H0590756A JP 27665491 A JP27665491 A JP 27665491A JP 27665491 A JP27665491 A JP 27665491A JP H0590756 A JPH0590756 A JP H0590756A
- Authority
- JP
- Japan
- Prior art keywords
- rigid
- substrate
- groove
- flexible
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はリジッドフレキ基板の製
造方法に関し、詳しくは可撓性を有するフレキシブル基
板に可撓性を有さないリジッド基板を積層し、リジッド
基板に部分的に窓空部を明けてフレキシブル基板を露出
させることにより、部分的に可撓性を有させたリジッド
フレキ基板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a rigid flexible substrate, and more specifically, a rigid flexible substrate is laminated on a flexible substrate, and a window vacant part is partially formed on the rigid substrate. The present invention relates to a method of manufacturing a rigid-flexible substrate that is partially flexible by exposing the flexible substrate after opening.
【０００２】[0002]
【従来の技術】従来、片面、両面、多層の各種プリント
配線板が産業機器あるいは民生機器の分野で広く使用さ
れている。１つのこれら電子機器には１枚のプリント配
線板だけが使用されていることは少なく、たとえば機能
別に分けて複数のプリント配線板が使用されるのが一般
的である。そして、複数の基板間は各種コネクタで接続
される。一方、電子機器は軽薄短小を指向しており、特
に近年のビデオカメラやノートブック型パソコンには軽
薄短小を代表する高密度実装プリント配線板が組み込ま
れている。そして、これらの電子機器では、小さい空間
に複数のプリント配線板をコンパクトに組み込む必要が
あるため、それらの基板間の接続をコネクタで行うこと
はもはや難しくなっている。即ち、コネクタを使用する
と嵩張ってしまうからである。2. Description of the Related Art Conventionally, various one-sided, double-sided, and multilayer printed wiring boards have been widely used in the field of industrial equipment or consumer equipment. Only one printed wiring board is rarely used in one of these electronic devices. For example, a plurality of printed wiring boards are generally used for each function. Then, the plurality of substrates are connected by various connectors. On the other hand, electronic devices are aimed at lightness, thinness, shortness, and in particular, recent video cameras and notebook type personal computers incorporate high-density packaging printed wiring boards that are representative of lightness, thinness, and smallness. Further, in these electronic devices, it is necessary to compactly incorporate a plurality of printed wiring boards in a small space, so it is no longer possible to connect the boards with a connector. That is, if the connector is used, it becomes bulky.
【０００３】そこで近年、図５に示したような、リジッ
ドフレキ基板が検討されている。これは、フレキシブル
基板を部分的にリジッド基板から露出させてその部分を
折り曲げ可能にしようとしたもので、リジッド基板上に
形成した導体回路に電子部品を実装し、また異なったリ
ジッド基板上の導体回路との間はフレキシブル基板上の
導体回路によって互いに接続しようとしたものである。
またその製造方法は従来、可撓性を有するポリイミド等
のフレキシブル基板に、部分的に、可撓性を有さないガ
ラスエポキシ等のリジッド基板を積層し、適宜穴明、メ
ッキ、マスク、エッチング等を施すことによって試みら
れた。しかし、この製造方法は次のような問題を有して
いた。この従来の製造方法にあっては、リジッド基板を
部分的にフレキシブル基板に積層したため、リジッド基
板上に導体回路を形成したり、リジッド基板上の導体回
路とフレキシブル基板上の導体回路をスルーホール接続
するためにスルーホールメッキをする際、フレキシブル
基板が直接外側へ露出していたため、フレキシブル基板
がメッキ液等に侵されて腐蝕したり、メッキ後の洗浄で
メッキ汚れ等が残ったりして不良を作ったのである。こ
れを改善するために、メッキ等の前に、フレキシブル基
板の上を液状樹脂等で覆って保護することも試みられた
が、メッキ液に耐える適当な液状樹脂がなくまたこの液
状樹脂を剥離する際の洗浄が不十分となるため採用には
到らなかった。Therefore, in recent years, a rigid flexible substrate as shown in FIG. 5 has been studied. This is an attempt to partially expose the flexible board from the rigid board so that it can be bent.Electronic components are mounted on the conductor circuit formed on the rigid board, and conductors on different rigid boards are mounted. The circuit is intended to be connected to each other by a conductor circuit on a flexible substrate.
In addition, the manufacturing method thereof is conventionally such that a rigid substrate such as a glass epoxy which does not have flexibility is partially laminated on a flexible substrate such as a flexible polyimide, and appropriate holes, plating, masks, etching, etc. It was tried by giving. However, this manufacturing method has the following problems. In this conventional manufacturing method, since the rigid board is partially laminated on the flexible board, a conductor circuit is formed on the rigid board or the conductor circuit on the rigid board and the conductor circuit on the flexible board are connected by through-holes. In order to perform through-hole plating, the flexible board was exposed to the outside directly, so the flexible board was corroded by the plating solution etc. and corroded, or the plating stains remained after cleaning after plating. I made it. In order to improve this, it has been attempted to cover the flexible substrate with a liquid resin or the like before plating or the like, but there is no suitable liquid resin that can withstand the plating liquid, and this liquid resin is also peeled off. It was not adopted because the cleaning at that time was insufficient.
【０００４】[0004]
【発明が解決しようとする課題】本発明は以上の経緯に
基づいてなされたものであり、本発明の解決しようとす
る課題は、リジッド基板の窓空部に露出するフレキシブ
ル基板がメッキ液等で腐蝕したり、汚れが残らないよう
にすることにある。そして本発明の目的は、フレキシブ
ル基板の部分が腐蝕したり汚れたりせず、しかも部分的
に折り曲げ等ができる可撓性を有するリジッドフレキ基
板を製造する方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made based on the above-described background. The problem to be solved by the present invention is that a flexible substrate exposed in a window space of a rigid substrate is formed by a plating solution or the like. It is to prevent corrosion and stains. It is an object of the present invention to provide a method for manufacturing a rigid flexible substrate which is flexible and does not corrode or stain the flexible substrate portion and can be partially bent.
【０００５】[0005]
【課題を解決するための手段】以上の課題を解決するた
めに本発明の採った手段は、「ポリイミド等のフレキシ
ブル基板１０にガラスエポキシ等のリジッド基板２０を
積層し屈曲部等の窓空部３０をリジッド基板２０に有す
るリジッドフレキ基板５０の製造方法において、少なく
とも次の工程を含んで窓空部３０を形成することを特徴
とするリジッドフレキ基板５０の製造方法。 （１）片面に銅箔１１を有し、残る片面には窓空部３０
となるべき溝３１を形成すべき部分に少なくとも導体回
路２１を有さないガラスエポキシ等のリジッド基板２０
を準備する工程。 （２）リジッド基板２０にレーザー光を照射して、銅箔
１１は貫通させずにリジッド基板２０の絶縁層のみに溝
３１を形成する工程。 （３）導体回路２１を形成したフレキシブル基板１０
に、溝３１を内側にしてリジッド基板２０を積層し、適
宜穴明、メッキ、マスク、エッチング等を施して、少な
くとも窓空部３０となるべき溝３１部には導体を有さな
いように、リジッド基板２０上に導体回路２１を形成す
る工程。 （４）溝３１に沿ってリジッド基板２０を剥離し窓空部
３０を形成させ、窓空部３０にフレキシブル基板１０を
露出させたリジッドフレキ基板５０を形成する工程。」
である。Means for Solving the Problems In order to solve the above-mentioned problems, the means adopted by the present invention is that "a flexible substrate 10 made of polyimide or the like is laminated with a rigid substrate 20 made of glass epoxy or the like, and a window space such as a bent portion is formed. A method for manufacturing a rigid-flexible substrate 50 having the rigid substrate 20 including 30. The method for manufacturing a rigid-flexible substrate 50, characterized in that the window void portion 30 is formed by including at least the following steps: (1) Copper foil on one side 11 and the window vacant part 30 on the other side
A rigid substrate 20 made of glass epoxy or the like which does not have at least the conductor circuit 21 in the portion where the groove 31 to be formed is formed.
The step of preparing. (2) A step of irradiating the rigid substrate 20 with laser light to form the groove 31 only in the insulating layer of the rigid substrate 20 without penetrating the copper foil 11. (3) Flexible substrate 10 on which the conductor circuit 21 is formed
Then, the rigid substrate 20 is laminated with the groove 31 inside, and appropriate perforation, plating, masking, etching, etc. are carried out so as not to have a conductor in at least the groove 31 that should become the window vacant portion 30. A step of forming the conductor circuit 21 on the rigid substrate 20. (4) A step of peeling the rigid substrate 20 along the groove 31 to form the window void portion 30 and forming the rigid flexible substrate 50 with the flexible substrate 10 exposed in the window void portion 30. "
Is.
【０００６】[0006]
【作用】本発明によれば、リジッド基板２０の片面の窓
空部３０となるべき溝３１を形成すべき部分に導体回路
２１を有さない部分を形成し、そこに炭酸ガスレーザー
等のレーザー光を照射させた。ここで反対側には銅箔１
１があり、レーザー光は銅箔１１で反射されるため、銅
箔１１は貫通させずにリジッド基板２０の絶縁層のみに
窓空部３０となるべき溝３１を形成することができる。
そして、この溝３１を有するリジッド基板２０を、導体
回路２１を形成したフレキシブル基板１０に、溝３１を
内側にして積層し、それから適宜穴明、メッキ、マス
ク、エッチング等を施すようにしたのである。従って、
それらの工程中は窓空部３０となるべき部分はリジッド
基板２０で塞がれたままとなっているため、フレキシブ
ル基板１０が腐蝕したり汚れが残ったりすることはな
い。また、ここでは窓空部３０となるべき溝３１部には
導体を有さないようにリジッド基板２０上に導体回路２
１を形成したので、溝３１部は上下両面とも導体回路２
１がなくなっており、従って、この溝３１に沿ってリジ
ッド基板２０が容易に剥離でき、窓空部３０にフレキシ
ブル基板１０を露出させることができるのである。According to the present invention, a portion which does not have the conductor circuit 21 is formed in a portion of the rigid substrate 20 where the groove 31 to be the window vacant portion 30 should be formed, and a laser such as a carbon dioxide laser is formed therein. It was irradiated with light. Copper foil 1 on the other side
1 is present and the laser light is reflected by the copper foil 11, it is possible to form the groove 31 to be the window void portion 30 only in the insulating layer of the rigid substrate 20 without penetrating the copper foil 11.
Then, the rigid substrate 20 having the groove 31 is laminated on the flexible substrate 10 on which the conductor circuit 21 is formed, with the groove 31 being inside, and then appropriate punching, plating, masking, etching and the like are performed. .. Therefore,
During these steps, the portion that should become the window vacant portion 30 remains covered with the rigid substrate 20, so that the flexible substrate 10 does not corrode or remain dirty. Further, here, the conductor circuit 2 is provided on the rigid substrate 20 so that the conductor does not exist in the groove 31 that should become the window vacant portion 30.
1 is formed, the groove 31 is formed on both the upper and lower surfaces of the conductor circuit 2.
Therefore, the rigid substrate 20 can be easily peeled off along the groove 31, and the flexible substrate 10 can be exposed in the window vacant portion 30.
【０００７】[0007]
【実施例】次に、本発明の実施例を詳細に説明する。図
１は本発明の１実施例によって製造したリジッドフレキ
基板（５０）の１例の断面図である。図１では、フレキ
シブル基板（１０）の両面およびリジッド基板（２０）
の両外側及び両内側に導体回路（２１）が形成してあ
り、スルーホールにより各導体回路（２１）間が適宜接
続してある。リジッド基板（２０）を積層した部分では
可撓性を有さないが、窓空部（３０）にフレキシブル基
板（１０）が露出してフレキシブル基板（１０）のみと
なっており、その部分は可撓性を有し、図２のように折
り曲げて使用した場合には、上のリジッド基板（２０）
と下のリジッド基板（２０）をコネクタなしでフレキシ
ブル基板（１０）によって接続させることができる。た
だし、図１では合計６層の導体回路（２１）層を有した
例を示しているが６層には限定されず、複数枚のフレキ
シブル基板（１０）と複数枚のリジッド基板（２０）の
組合せを行ってもよい。少なくとも１枚のフレキシブル
基板（１０）と１枚のリジッド基板（２０）があればそ
れらの枚数および導体回路（２１）の層数には限定され
ない。図３はその平面図に表れたフレキシブル基板（１
０）とリジッド基板（２０）および窓空部（３０）とを
示す概念平面図である。EXAMPLES Next, examples of the present invention will be described in detail. FIG. 1 is a sectional view of an example of a rigid flexible substrate (50) manufactured according to an embodiment of the present invention. In FIG. 1, both sides of the flexible substrate (10) and the rigid substrate (20) are shown.
Conductor circuits (21) are formed on both outer sides and both inner sides, and the respective conductor circuits (21) are appropriately connected by through holes. The portion where the rigid substrates (20) are laminated is not flexible, but the flexible substrate (10) is exposed to the window vacant portion (30) and only the flexible substrate (10) is formed. It has flexibility, and when it is bent and used as shown in FIG.
The lower rigid board (20) can be connected by the flexible board (10) without a connector. However, although FIG. 1 shows an example having a total of 6 layers of conductor circuit (21) layers, it is not limited to 6 layers, and a plurality of flexible boards (10) and a plurality of rigid boards (20) are included. Combinations may be made. If there is at least one flexible board (10) and one rigid board (20), the number of them and the number of layers of the conductor circuit (21) are not limited. FIG. 3 shows the flexible substrate (1
0), the rigid substrate (20) and the window vacant part (30) are conceptual plan views.
【０００８】次に図４に基づいて、本発明の１実施例の
製造工程（Ａ）〜（Ｆ）を順に説明する。図４で（Ａ）
にはガラスエポキシリジッド基板（２０）が示してあ
る。ここでは片面に銅箔（１１）を有し、残る片面の窓
空部３０となるべき溝（３１）の部分を除いて導体回路
（２１）を有するように、たとえば両面銅箔張ガラスエ
ポキシ基板の片面をパターニング、エッチングして形成
してある。これを準備する工程が工程（１）である。こ
の絶縁層であるガラスエポキシは、一般に使用される他
のガラストリアジン、ガラスポリイミド、紙フェノール
等の硬質プリント配線板材料に置き換えることができ
る。また、銅箔（１１）の厚みは９〜７０μｍが使用で
きる。９μｍ未満では後のレーザー照射で貫通し易くな
るし、７０μｍより厚いとパターン形成が難しくなる。
また、基材厚みは限定されないが、ここでは一般的な１
８μｍ銅箔付き０．４ｍｍ厚みのガラスエポキシ基板を
使用した。次に図４（Ｂ）のように（Ａ）で銅箔（１
１）を除いた溝（３１）となるべき部分にレーザー光を
照射して、絶縁層のみに窓空部（３０）となるべき溝
（３１）を形成した。これが工程（２）である。レーザ
ー光は本実施例では炭酸ガスレーザーを使用し、１００
Ｗの出力で加工スピード８ｍｍ／分で加工した。レーザ
ー光は他にエキシマレーザーが有効である。また、レー
ザー光は銅箔（１１）で反射するため、銅箔（１１）は
貫通させずに絶縁層のみに溝（３１）を形成できた。そ
の後、適宜溝（３１）の周りに付着した基材粉や炭化物
を研磨によって除去した。研磨方法はジェットスクラブ
法が好適である。Next, manufacturing steps (A) to (F) of one embodiment of the present invention will be described in order with reference to FIG. In Figure 4 (A)
Shown is a glass epoxy rigid substrate (20). Here, a copper foil (11) is provided on one side, and a conductor circuit (21) is provided except for the portion of the groove (31) which should be the window vacant portion 30 on the remaining one side. Is formed by patterning and etching one surface of the. The step of preparing this is the step (1). The insulating layer, glass epoxy, can be replaced with other commonly used hard printed wiring board materials such as glass triazine, glass polyimide, and paper phenol. The thickness of the copper foil (11) may be 9 to 70 μm. If it is less than 9 μm, it will be easy to penetrate by laser irradiation afterwards, and if it is thicker than 70 μm, pattern formation will be difficult.
Further, the thickness of the base material is not limited, but here, a general thickness of 1
A 0.4 mm thick glass epoxy substrate with 8 μm copper foil was used. Next, as shown in FIG. 4B, the copper foil (1
The groove (31) except for 1) was irradiated with a laser beam to form the groove (31) to be the window vacant portion (30) only in the insulating layer. This is step (2). As the laser light, a carbon dioxide gas laser is used in this embodiment, and 100
Processing was performed at a processing speed of 8 mm / min with an output of W. Excimer laser is also effective as the laser light. Further, since the laser light is reflected by the copper foil (11), the groove (31) could be formed only in the insulating layer without penetrating the copper foil (11). After that, the base material powder and the carbide adhered around the groove (31) were removed by polishing as appropriate. A jet scrubbing method is suitable as the polishing method.
【０００９】次に図４（Ｃ）のように、接着シート（４
０）に窓空部（３０）と同じ大きさの貫通孔（４１）を
空けたものを用意した。この接着シート（４０）はガラ
スエポキシプリプレブ、ガラスポリイミドプリプレグ等
のガラス織布に熱硬化樹脂を含侵したプリプレグあるい
は織布を含まない接着剤が使用できる。プリプレグを使
用する場合は、市販の多層プリント配線板用のものを市
販のままのＢステージからさらに加熱して硬化を進めて
使用する。ガラスエポキシプリプレグの場合では１００
℃で３０分の加熱を加えた。接着剤の場合は市販のエポ
キシノンフロー接着剤（ニッカン工業ＳＡＦ−Ｖ４０
等）がよい。ここで重要なことは、その後の積層時に樹
脂が流れ出し周辺を汚さないように接着シート（４０）
をノンフロー化して用いることである。先にＢステージ
からさらに加熱したのはそのためである。そして（Ｂ）
で準備したリジッド基板（２０）を、図４（Ｄ）〜
（Ｅ）のように、接着シート（４０）を介してフレキシ
ブル基板（１０）に積層した。そして、図４（Ｆ）のよ
うに適宜穴明、メッキ、マスク、エッチング等を施し
て、少なくとも窓空部（３０）となるべき溝（３１）部
のリジッド基板（２０）の両面には導体（２１）を有さ
ないようにして、リジッド基板（２０）上に導体回路
（２１）を形成した。これが（３）の工程である。その
後、工程（４）で、窓空部（３０）となるべき溝（３
１）に沿ってリジッド基板（２０）を剥離し、窓空部
（３０）にフレキシブル基板（１０）を露出させたリジ
ッドフレキ基板（５０）を得たのである。Next, as shown in FIG. 4C, the adhesive sheet (4
A through hole (41) having the same size as the window vacant part (30) was prepared in (0). As the adhesive sheet (40), a glass woven cloth such as glass epoxy prepreg or glass polyimide prepreg, which is a prepreg obtained by impregnating a thermosetting resin with a thermosetting resin, or an adhesive which does not contain a woven cloth can be used. When a prepreg is used, a commercially available one for a multilayer printed wiring board is further heated from the B stage as it is on the market to proceed with curing to be used. 100 for glass epoxy prepreg
Heat was added for 30 minutes at ° C. In the case of an adhesive, a commercially available epoxy non-flow adhesive (Nikan Kogyo SAF-V40
Etc.) is good. What is important here is that the adhesive sheet (40) prevents the resin from flowing out and contaminating the surrounding area during subsequent lamination.
Is to be used after making it non-flow. That is why the B stage was further heated. And (B)
The rigid substrate (20) prepared in step (4) of FIG.
As in (E), it was laminated on the flexible substrate (10) via the adhesive sheet (40). Then, as shown in FIG. 4 (F), appropriate conductors are formed on both surfaces of the rigid substrate (20) at least in the groove (31) that should become the window cavity (30) by performing drilling, plating, masking, etching, etc. A conductor circuit (21) was formed on the rigid substrate (20) so as not to have (21). This is the step (3). Then, in step (4), the groove (3
The rigid substrate (20) was peeled off along 1) to obtain the rigid flexible substrate (50) in which the flexible substrate (10) was exposed in the window vacant portion (30).
【００１０】[0010]
【発明の効果】以上詳述した通り、本発明によれば、リ
ジッド基板の窓空部に露出するフレキシブル基板がメッ
キ液等で腐蝕したり、汚れが残ることはなく、フレキシ
ブル基板の部分が腐蝕したり汚れたりせず、しかも部分
的に折り曲げ等ができる可撓性を有するリジッドフレキ
基板が製造できるのである。As described above in detail, according to the present invention, the flexible substrate exposed in the window portion of the rigid substrate is not corroded by the plating liquid or the like, and no stain remains, and the flexible substrate portion is corroded. Thus, it is possible to manufacture a rigid flexible substrate that is flexible and can be partially bent without being soiled or soiled.
【図１】本発明の１実施例によって製造したリジッドフ
レキ基板（５０）の１例の断面図である。FIG. 1 is a cross-sectional view of an example of a rigid flexible substrate (50) manufactured according to an embodiment of the present invention.
【図２】本発明の１実施例によって製造したリジッドフ
レキ基板（５０）を折り曲げて使用した場合を示す断面
図である。FIG. 2 is a cross-sectional view showing a case where a rigid flexible substrate (50) manufactured according to an embodiment of the present invention is folded and used.
【図３】本発明の１実施例によって製造したリジッドフ
レキ基板（５０）のフレキシブル基板（１０）とリジッ
ド基板（２０）および窓空部（３０）の部分を示す概念
平面図である。FIG. 3 is a conceptual plan view showing a flexible substrate (10), a rigid substrate (20) and a window vacant portion (30) of a rigid flexible substrate (50) manufactured according to an embodiment of the present invention.
【図４】本発明の１実施例の製造方法を工程順に説明し
た断面図である。FIG. 4 is a cross-sectional view illustrating the manufacturing method according to the first embodiment of the present invention in the order of steps.
【図５】従来のリジッドフレキ基板（５０）の断面図で
ある。FIG. 5 is a cross-sectional view of a conventional rigid flexible substrate (50).
１０ フレキシブル基板 １１ 銅箔 ２０ リジッド基板 ２１ 導体回路 ３０ 窓空部 ４０ 接着シート ５０ リジッドフレキ基板 10 Flexible Board 11 Copper Foil 20 Rigid Board 21 Conductor Circuit 30 Window Void Area 40 Adhesive Sheet 50 Rigid Flexible Board
Claims (1)
０）に、ガラスエポキシ等のリジッド基板（２０）を積
層し、屈曲部等の窓空部（３０）をリジッド基板（２
０）に有するリジッドフレキ基板（５０）の製造方法に
おいて、少なくとも次の工程を含んで窓空部（３０）を
形成することを特徴とするリジッドフレキ基板（５０）
の製造方法。（１）片面に銅箔（１１）を有し、残る片
面には窓空部（３０）となるべき溝（３１）を形成すべ
き部分に少なくとも導体回路（２１）を有さないガラス
エポキシ等のリジッド基板（２０）を準備する工程。
（２）リジッド基板（２０）にレーザー光を照射して、
銅箔（１１）は貫通させずにリジッド基板（２０）の絶
縁層のみに溝（３１）を形成する工程。（３）導体回路
（２１）を形成したフレキシブル基板（１０）に、溝
（３１）を内側にしてリジッド基板（２０）を積層し、
適宜穴明、メッキ、マスク、エッチング等を施して、少
なくとも窓空部（３０）となるべき溝（３１）部には導
体を有さないように、リジッド基板（２０）上に導体回
路（２１）を形成する工程。（４）溝（３１）に沿って
リジッド基板（２０）を剥離し窓空部（３０）を形成さ
せ、窓空部（３０）にフレキシブル基板（１０）を露出
させたリジッドフレキ基板（５０）を形成する工程。1. A flexible substrate (1) made of polyimide or the like.
0) is laminated with a rigid substrate (20) made of glass epoxy or the like, and a window space (30) such as a bent portion is provided with a rigid substrate (2).
0) In the method for manufacturing a rigid flexible substrate (50), the window portion (30) is formed by including at least the following steps.
Manufacturing method. (1) Glass epoxy or the like which has a copper foil (11) on one side and does not have at least a conductor circuit (21) in a portion where a groove (31) to be a window vacant portion (30) should be formed on the remaining one side A step of preparing the rigid substrate (20).
(2) Irradiate the rigid substrate (20) with laser light,
A step of forming the groove (31) only in the insulating layer of the rigid substrate (20) without penetrating the copper foil (11). (3) The rigid board (20) is laminated on the flexible board (10) on which the conductor circuit (21) is formed, with the groove (31) inside.
A conductor circuit (21) is provided on the rigid substrate (20) so as not to have a conductor at least in the groove (31) portion which should be the window vacant portion (30) by appropriately performing drilling, plating, masking, etching and the like. ) Forming process. (4) Rigid flexible substrate (50) in which the rigid substrate (20) is peeled off along the groove (31) to form the window empty part (30) and the flexible substrate (10) is exposed in the window empty part (30). Forming step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27665491A JPH0590756A (en) | 1991-09-28 | 1991-09-28 | Production of rigid/flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27665491A JPH0590756A (en) | 1991-09-28 | 1991-09-28 | Production of rigid/flexible board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0590756A true JPH0590756A (en) | 1993-04-09 |
Family
ID=17572469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27665491A Pending JPH0590756A (en) | 1991-09-28 | 1991-09-28 | Production of rigid/flexible board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0590756A (en) |
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| US7378596B2 (en) | 2003-04-18 | 2008-05-27 | Ibiden Co., Ltd. | Rigid-flex wiring board |
| US7423219B2 (en) | 2004-06-11 | 2008-09-09 | Ibiden Co., Ltd. | Flex-rigid wiring board |
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| EP2268112A1 (en) * | 2006-10-24 | 2010-12-29 | Ibiden Co., Ltd. | Method of manufacturing a flex-rigid wiring board |
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| US8093502B2 (en) | 2004-06-10 | 2012-01-10 | Ibiden Co., Ltd. | Flex-rigid wiring board and manufacturing method thereof |
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-
1991
- 1991-09-28 JP JP27665491A patent/JPH0590756A/en active Pending
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|---|---|---|---|---|
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| US7655869B2 (en) | 2003-04-18 | 2010-02-02 | Ibiden Co., Ltd. | Flex-rigid wiring board |
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| US7758225B2 (en) | 2005-07-15 | 2010-07-20 | Samsung Electronics Co., Ltd. | Key pad lighting apparatus for a portable terminal |
| US8071883B2 (en) | 2006-10-23 | 2011-12-06 | Ibiden Co., Ltd. | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
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