JPH0596366A - Soldering apparatus - Google Patents
Soldering apparatusInfo
- Publication number
- JPH0596366A JPH0596366A JP3256282A JP25628291A JPH0596366A JP H0596366 A JPH0596366 A JP H0596366A JP 3256282 A JP3256282 A JP 3256282A JP 25628291 A JP25628291 A JP 25628291A JP H0596366 A JPH0596366 A JP H0596366A
- Authority
- JP
- Japan
- Prior art keywords
- mirror
- light
- soldering
- light source
- focus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 51
- 238000003384 imaging method Methods 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims description 23
- 230000004907 flux Effects 0.000 abstract description 37
- 239000013307 optical fiber Substances 0.000 description 9
- 229910052724 xenon Inorganic materials 0.000 description 6
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Lenses (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は光エネルギーを利用した
半田付け装置に関し、特に光源からの光束を半田付け箇
所へ導光する部分の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus utilizing light energy, and more particularly to improvement of a portion for guiding a light beam from a light source to a soldering point.
【0002】[0002]
【従来の技術】従来の光を利用した半田付け装置として
は、図2に示すような構成のものが知られている。2. Description of the Related Art As a conventional soldering device utilizing light, a structure shown in FIG. 2 is known.
【0003】図中、31はキセノン光源で、楕円鏡32
の第1焦点近傍に配設されている。34はキセノン光源
31からの光を半田付け箇所37に導光するための光フ
ァイバで、その入射端面33が楕円鏡32によるキセノ
ン光源31の結像位置に配設されている。光ファイバ3
4の出射端面35側には半田付け箇所37に光を集光さ
せる結像レンズ36が配設されている。In the figure, 31 is a xenon light source, and an elliptical mirror 32.
Is disposed near the first focal point. Reference numeral 34 is an optical fiber for guiding the light from the xenon light source 31 to the soldering portion 37, and its incident end face 33 is arranged at the image forming position of the xenon light source 31 by the elliptical mirror 32. Optical fiber 3
An image forming lens 36 for condensing light at a soldering portion 37 is arranged on the side of the emission end face 35 of 4.
【0004】そして、キセノン光源31は楕円鏡32に
よって光ファイバ34の入射端面33に結像され、さら
に結像レンズ36によって半田付け箇所37に結像され
る。Then, the xenon light source 31 is imaged on the incident end face 33 of the optical fiber 34 by the elliptic mirror 32, and is further imaged on the soldering spot 37 by the imaging lens 36.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、上述し
た従来の光源装置では光ファイバ34を使用するため、
次のような問題点がある。However, since the above-mentioned conventional light source device uses the optical fiber 34,
There are the following problems.
【0006】(1) 楕円鏡32の周縁部で反射した光
は、光ファイバ34の入射端面33に対して入射角が大
きくなり、光ファイバ34の許容入射角を越えた光線は
光エネルギーを有効に伝達できない。(1) The light reflected by the peripheral portion of the elliptic mirror 32 has a large incident angle with respect to the incident end face 33 of the optical fiber 34, and a light ray exceeding the allowable incident angle of the optical fiber 34 has effective light energy. Cannot be communicated to.
【0007】(2) 光ファイバ34は多数の細いガラ
スファイバをバンドルした構造であるため、入射端面3
3にはバンドルしたガラスファイバの間に隙間があり、
そこに入射した光線は有効に使われず、光エネルギーの
ロスとなる。(2) Since the optical fiber 34 has a structure in which many thin glass fibers are bundled, the incident end face 3
3 has a gap between the bundled glass fibers,
The light rays incident on it are not used effectively, resulting in a loss of light energy.
【0008】(3) 光線が光ファイバを通過する際に
ガラスの透過率に起因する減衰が生じ、光エネルギーの
ロスとなる。(3) When a light beam passes through an optical fiber, attenuation occurs due to the transmittance of glass, resulting in a loss of light energy.
【0009】本発明は以上の問題点に鑑みなされたもの
で、光源からの光束を光エネルギーのロスを抑えて効率
的に半田付け箇所に集光できる半田付け装置を提供する
ことを目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide a soldering device capable of efficiently focusing a light flux from a light source on a soldering portion while suppressing loss of light energy. ..
【0010】[0010]
【課題を解決するための手段】上述の課題を解決するた
めに本発明は、光軸上に第1焦点近傍の光源から発する
光束を第2焦点に集光させる楕円鏡と、前記第1焦点を
球芯とし前記楕円鏡の出射側を覆うように配設され、前
記第2焦点への収束光を導光する開口を備えた半球状補
助球面鏡とを有し、前記第2焦点を結像レンズと2枚の
平面鏡により半田付け箇所と共役とし、前記結像レンズ
と2枚の平面鏡を光軸に対し回転可能としたことを特徴
とする。In order to solve the above-mentioned problems, the present invention provides an elliptical mirror for converging a light beam emitted from a light source near the first focal point on the optical axis to a second focal point, and the first focal point. And a hemispherical auxiliary spherical mirror having an opening for guiding the convergent light to the second focus, and the second focus is imaged. It is characterized in that the lens and the two plane mirrors are conjugated with the soldering point, and the imaging lens and the two plane mirrors are rotatable with respect to the optical axis.
【0011】[0011]
【作用】上述の構成によれば、光源からの光束は、楕円
鏡で反射されて第2焦点に集光し、半球状補助球面鏡で
反射した光束は楕円鏡へ進み、この楕円鏡で反射して第
2焦点に集光する。この光源からの光束は反射鏡で半田
付け箇所に向けられ、結像レンズで集光されて半田付け
箇所に高密度の光エネルギーを与える。According to the above-mentioned structure, the light beam from the light source is reflected by the elliptical mirror and focused on the second focal point, and the light beam reflected by the hemispherical auxiliary spherical mirror advances to the elliptic mirror and is reflected by this elliptic mirror. To focus on the second focal point. The light flux from this light source is directed to the soldering spot by the reflecting mirror and is condensed by the imaging lens to give high density light energy to the soldering spot.
【0012】[0012]
【実施例】以下に本発明の実施例を添付図面に基づいて
説明する。Embodiments of the present invention will be described below with reference to the accompanying drawings.
【0013】図1は本実施例の半田付け装置の要部であ
る光源装置を示す概略構成図、図3は半田付け装置の全
体構成図である。FIG. 1 is a schematic configuration diagram showing a light source device which is a main part of the soldering device of this embodiment, and FIG. 3 is an overall configuration diagram of the soldering device.
【0014】図1中、1はキセノンランプから構成され
る光源である。この光源1は放電灯で、両電極が光軸A
上に置かれ、光軸Aに対して30゜〜150゜程度の角
度に円環状の配光特性を持つ。即ち、光源1より光軸A
の後方に±30゜、前方に±30゜の立体角には光束を
発しないため、後述の楕円鏡2の中心部(光軸Aとの交
点)に開口を設け、この開口を介して支持部材(図示せ
ず)を挿入し、光源1をサポートしている。In FIG. 1, reference numeral 1 is a light source composed of a xenon lamp. This light source 1 is a discharge lamp, and both electrodes have an optical axis A.
It has an annular light distribution characteristic at an angle of about 30 ° to 150 ° with respect to the optical axis A. That is, the optical axis A from the light source 1
Since no light beam is emitted at a solid angle of ± 30 ° behind and ± 30 ° forward, an opening is provided in the central portion (intersection with the optical axis A) of the elliptic mirror 2 described later, and is supported through this opening. A light source 1 is supported by inserting a member (not shown).
【0015】2は第1焦点近傍に配設された前記光源1
からの光束を反射する楕円鏡で、光源1より後側(図中
の上側)に向かう光束を反射して第2焦点に集光させ
る。Reference numeral 2 denotes the light source 1 arranged near the first focal point.
An elliptic mirror that reflects the light beam from the light source 1 reflects the light beam toward the rear side (the upper side in the drawing) of the light source 1 and focuses it on the second focal point.
【0016】3は半球状補助球面鏡で、球面の一部を用
い、その内面を鏡面としたものである。この半球状補助
球面鏡3は、楕円鏡2の第1焦点を球芯としてその出射
側開口部(楕円鏡2の前側)を覆うように配設され、第
1焦点から前側に向う全光束を反射して光源1側に戻
し、後側に向う光束として楕円鏡2で反射させ、第2焦
点に集光させる。さらに、半球状補助球面鏡3の光軸A
との交点の部分には、開口部3Aが形成されている。こ
の開口部3Aは、前記±30゜の立体角内にあって光源
1からの光束は直接には伝搬せず、楕円鏡2で反射した
光束を導光して第2焦点に集光させる。Reference numeral 3 denotes a hemispherical auxiliary spherical mirror, in which a part of the spherical surface is used and the inner surface thereof is a mirror surface. The hemispherical auxiliary spherical mirror 3 is arranged so as to cover the exit side opening (front side of the ellipsoidal mirror 2) with the first focus of the ellipsoidal mirror 2 as a spherical core, and reflects the entire light flux directed from the first focal point to the front side. Then, the light is returned to the light source 1 side, reflected by the elliptical mirror 2 as a light flux directed to the rear side, and condensed at the second focus. Further, the optical axis A of the hemispherical auxiliary spherical mirror 3
An opening 3A is formed at the intersection of and. The opening 3A is within the solid angle of ± 30 ° and the light flux from the light source 1 does not propagate directly, but the light flux reflected by the elliptical mirror 2 is guided and focused at the second focal point.
【0017】前記楕円鏡2と半球状補助球面鏡3とは、
光源1を境にしてその後側へ出た光束を楕円鏡2が受け
て反射し、前側へ出た光束を半球状補助球面鏡3で反射
するようにそれぞれほぼ半球状に形成することが望まし
い。半球状補助球面鏡3は楕円鏡2より大きな曲率半径
を有することにより、これらの間には環状の隙間(環状
開口部)3Bを有し、前記開口部3Aと環状開口部3B
の一方を冷却空気の取入れ口、他方を冷却空気の排出口
として光源1の冷却を行っている。The elliptical mirror 2 and the hemispherical auxiliary spherical mirror 3 are
It is preferable that the ellipsoidal mirror 2 receives and reflects the light flux emitted to the rear side of the light source 1 and the semi-spherical auxiliary spherical mirror 3 reflects the light flux emitted to the front side. Since the hemispherical auxiliary spherical mirror 3 has a larger radius of curvature than the elliptic mirror 2, it has an annular gap (annular opening) 3B between them and the opening 3A and the annular opening 3B.
The light source 1 is cooled by using one of them as an inlet for cooling air and the other as an outlet for cooling air.
【0018】4は第1平面鏡で、楕円鏡2の第2焦点近
くに位置して光軸A上に設けられ、楕円鏡2からの光束
を光軸Aから横へ反射して取り出す。5は第1平面鏡4
によって反射された光束が集光し結像する位置(実質上
の第2焦点位置)に設けられた開口部で、最小径に集光
した光束のうち、周囲ににじむ光束を除去する。6は第
2平面鏡で、第1平面鏡4によって取り出した光束をさ
らに反射させて半田付け箇所8に向かう光束にする。7
は結像レンズで、第2平面鏡6で反射させた光束を半田
付け箇所8に集光させる。この結像レンズ7で第2焦点
と半田付け箇所8とが共役となっている。Reference numeral 4 denotes a first plane mirror, which is located near the second focal point of the elliptic mirror 2 and is provided on the optical axis A. The light flux from the elliptic mirror 2 is reflected laterally from the optical axis A and is extracted. 5 is the first plane mirror 4
The aperture provided at the position (substantially the second focal point position) where the light flux reflected by is condensed and formed an image, of the light flux condensed to the minimum diameter, is eliminated. Reference numeral 6 denotes a second plane mirror, which further reflects the light beam extracted by the first plane mirror 4 to form a light beam toward the soldering point 8. 7
Is an image forming lens, which focuses the light flux reflected by the second plane mirror 6 on the soldering point 8. In this imaging lens 7, the second focus and the soldering point 8 are conjugated.
【0019】前記第1平面鏡4、第2平面鏡6及び結像
レンズ7は互いの位置関係を固定した一体構造となって
おり、さらに光軸Aに対して回転可能な状態で取り付け
られている。さらに、第2平面鏡6で反射した光束が結
像する半田付け箇所8は光軸A上に設定され、第1,第
2平面鏡4,6及び結像レンズ7の回転によってはその
位置がずれないようになっている。また、第1,第2平
面鏡4,6によって光束が光軸Aと重複しないように傾
斜させることにより半田付けを行う素子に光束が直接当
たるのを防いでいる。The first plane mirror 4, the second plane mirror 6 and the imaging lens 7 have an integral structure in which their positional relationship is fixed, and are further mounted so as to be rotatable with respect to the optical axis A. Further, the soldering point 8 where the light flux reflected by the second plane mirror 6 forms an image is set on the optical axis A, and its position is not displaced by the rotation of the first and second plane mirrors 4, 6 and the image forming lens 7. It is like this. Further, the first and second plane mirrors 4 and 6 are tilted so that the light flux does not overlap the optical axis A, thereby preventing the light flux from directly impinging on the element to be soldered.
【0020】なお、光軸A上の第1平面鏡4の下側(半
田付け箇所8側)には、半田付け箇所8を観察するため
の観察系(図示せず)を設けることも可能である。An observation system (not shown) for observing the soldering points 8 can be provided below the first plane mirror 4 on the optical axis A (on the side of the soldering points 8). ..
【0021】次に、以上の構成の光源部分を備えた半田
付け装置を図3に基づいて説明する。Next, a soldering device equipped with the light source portion having the above structure will be described with reference to FIG.
【0022】図中の11はベース板で、このベース板1
1の上面に後述の各装置が装着されている。12はプリ
ント基板13等を載置して半田付け作業を行う移動台
で、第1ガイド装置14に取り付けられている。第1ガ
イド装置14は、ベース板11に固定された一対の支持
板15と、この支持板15に両側を支持され、移動台1
2を摺動自在に支持する一対のガイドロッド16と、支
持板15に回転自在に、かつガイドロッド16と平行に
取り付けられた駆動ロッド17と、この駆動ロッド17
を回転駆動する駆動モータ18とから構成されている。
駆動ロッド17にはねじ山が設けられ、このねじ山が移
動台12に係合されている。そして、駆動モータ18の
駆動によって駆動ロッド17を回転させることで、その
ねじ山によって移動台12がガイドロッド16にガイド
されて移動するようになっている。Reference numeral 11 in the drawing denotes a base plate, which is the base plate 1.
Each device described below is mounted on the upper surface of 1. Reference numeral 12 denotes a movable table on which the printed circuit board 13 and the like is placed and which is used for soldering work, and is attached to the first guide device 14. The first guide device 14 has a pair of support plates 15 fixed to the base plate 11 and both sides supported by the support plates 15.
A pair of guide rods 16 that slidably support 2, a drive rod 17 that is rotatably attached to the support plate 15 and is parallel to the guide rod 16, and the drive rod 17
And a drive motor 18 for rotating the motor.
The drive rod 17 is provided with threads, which are engaged with the carriage 12. Then, by rotating the drive rod 17 by driving the drive motor 18, the moving base 12 is moved by being guided by the guide rod 16 by the thread thereof.
【0023】20は光源装置で、その内部は前述した図
1のように構成されている。さらに、この光源装置20
は第2ガイド装置21に取り付けられている。この第2
ガイド装置21は、前記第1ガイド装置14に対して直
交する方向に配設され、第1ガイド装置14と同様に、
一対の支持板22と一対のガイドロッド23と駆動ロッ
ド24と駆動モータ25とから構成され、駆動モータ2
5による駆動ロッド24の駆動によって、光源装置20
が移動台12の移動方向と直交する方向に移動して適宜
位置に半田付けを行うようになっている。なお、駆動モ
ータ18,25は図示しない制御装置に接続され、さら
に光源装置20も接続され、自動的に半田付け箇所8を
光軸A上に移動させて半田付け作業を行うようになって
いる。Reference numeral 20 denotes a light source device, the inside of which is constructed as shown in FIG. Furthermore, this light source device 20
Is attached to the second guide device 21. This second
The guide device 21 is arranged in a direction orthogonal to the first guide device 14, and like the first guide device 14,
The drive motor 2 includes a pair of support plates 22, a pair of guide rods 23, a drive rod 24, and a drive motor 25.
The light source device 20 is driven by driving the drive rod 24 by
Moves in a direction orthogonal to the moving direction of the moving table 12 to perform soldering at an appropriate position. The drive motors 18 and 25 are connected to a control device (not shown), and the light source device 20 is also connected to automatically move the soldering location 8 onto the optical axis A for soldering work. ..
【0024】以上のように構成された半田付け装置は次
のように作用する。The soldering device configured as described above operates as follows.
【0025】光源1より発する光束は前側及び後側に進
行する。後側に進む光束は楕円鏡2で反射されて第1平
面鏡4に入射(第2焦点に集光)する。前側に進む光束
は半球状補助球面鏡3で反射されて同一光路を逆行し、
光源1を再び通過して楕円鏡2に入射し、この楕円鏡2
で反射されて第2焦点に集光する。これにより、光源1
から発するすべての光束が第1平面鏡4に入射する。The luminous flux emitted from the light source 1 advances to the front side and the rear side. The light flux traveling to the rear side is reflected by the elliptic mirror 2 and enters the first plane mirror 4 (condenses at the second focus). The light flux traveling to the front side is reflected by the hemispherical auxiliary spherical mirror 3 and travels backward in the same optical path,
After passing through the light source 1 again, the light enters the elliptic mirror 2, and the elliptic mirror 2
It is reflected by and is focused on the second focal point. Thereby, the light source 1
All the light fluxes emitted from the first plane mirror 4 enter.
【0026】この光束は第1平面鏡4で反射した後、第
2焦点で結像するが、光源1であるキセノンランプはア
ーク長が短いため、第2焦点附近の極めて小さい領域に
集光し、さらに、第2焦点に設けられた開口部5で周囲
ににじんだ光束が除去されて光エネルギー密度の高い光
束となる。そして、この光束は第2平面鏡6で反射され
て半田付け箇所8に向かう光束となり、結像レンズ7で
集光されて半田付け箇所8に、高エネルギー密度の第2
焦点像が結像する。This light flux is reflected by the first plane mirror 4 and then forms an image at the second focal point. Since the xenon lamp, which is the light source 1, has a short arc length, it is condensed in an extremely small area near the second focal point. Further, the luminous flux bleeding around is removed by the opening 5 provided at the second focal point to become a luminous flux having a high optical energy density. Then, this light flux is reflected by the second plane mirror 6 to become a light flux heading for the soldering point 8, and is condensed by the imaging lens 7 to the soldering point 8 and the second high energy density second flux.
A focus image is formed.
【0027】一方、半田付け装置全体におては、移動台
12にプリント基板13が載置される。観察系で半田付
け箇所8を観察しながら駆動モータ18が制御されて移
動台12が移動され、さらに駆動モータ25が制御され
て光源装置20が移動台12の移動方向と直交する方向
に移動される。これにより、プリント基板13の半田付
け箇所8が光軸Aとの交点に移動され、半田付け箇所8
の小さな領域に光束が集光され、半田付け箇所8に直接
接することなく効率的に半田付けを行う。On the other hand, in the entire soldering apparatus, the printed board 13 is placed on the moving table 12. While observing the soldering points 8 in the observation system, the drive motor 18 is controlled to move the moving table 12, and the drive motor 25 is further controlled to move the light source device 20 in a direction orthogonal to the moving direction of the moving table 12. It As a result, the soldering point 8 on the printed circuit board 13 is moved to the intersection with the optical axis A, and the soldering point 8
The light flux is condensed in a small area of the area, and the soldering is efficiently performed without directly contacting the soldering location 8.
【0028】この結果、光源1からの光束を半田付け箇
所8に正確に、かつ効率的に集光させ、光エネルギー密
度の高い半田付け用の光束を得ることができる。As a result, the light flux from the light source 1 can be accurately and efficiently focused on the soldering point 8 to obtain a soldering light flux having a high light energy density.
【0029】なお、前記実施例では、光源1からの光束
を半田付け箇所8に導光する第1平面鏡4、第2平面鏡
6及び結像レンズ7を1組だけ設け、光軸Aに対して回
転可能に配設したが、第2平面鏡6及び結像レンズ7の
組を光軸Aの周囲に複数個固定して設けると共に第1平
面鏡4のみを光軸Aに対して回転可能に設け、この第1
平面鏡4を回転させることで、光束の半田付け箇所8へ
の照射方向に合せて複数の第2平面鏡6及び結像レンズ
7の組の中から適宜選択するようにしてもよい。さら
に、複数の第2平面鏡6及び結像レンズ7は、その導光
方向及び焦点距離を半田付け箇所の位置等に合せて適宜
設定しておくようにしてもよい。In the above embodiment, only one set of the first plane mirror 4, the second plane mirror 6 and the image forming lens 7 for guiding the light beam from the light source 1 to the soldering point 8 is provided, and with respect to the optical axis A. Although it is rotatably disposed, a plurality of sets of the second plane mirror 6 and the imaging lens 7 are fixedly provided around the optical axis A, and only the first plane mirror 4 is rotatably provided with respect to the optical axis A. This first
By rotating the plane mirror 4, it may be appropriately selected from a set of the plurality of second plane mirrors 6 and the imaging lens 7 in accordance with the irradiation direction of the light flux to the soldering portion 8. Furthermore, the plurality of second plane mirrors 6 and the imaging lenses 7 may be appropriately set in their light guide direction and focal length in accordance with the position of the soldering location and the like.
【0030】[0030]
【発明の効果】以上、詳細に説明したように、本発明に
よれば、次のような効果を奏する。As described above in detail, the present invention has the following effects.
【0031】光源からのすべての光束を楕円鏡と半球状
補助球面鏡により集光し、伝搬途中でロスを生じる光フ
ァイバを使用せずに平面鏡で半田付け箇所に結像させる
ようにしたので、高い効率で集光することができ、高い
光エネルギー密度の光束を得ることができるようにな
る。Since all the light fluxes from the light source are condensed by the elliptic mirror and the hemispherical auxiliary spherical mirror, and the image is formed on the soldering portion by the plane mirror without using the optical fiber which causes a loss during the propagation, it is high. The light can be condensed with high efficiency, and a light flux with a high light energy density can be obtained.
【0032】これにより、微小面積の加熱に対して極め
て効果的な半田付け用の光束を得ることができる。This makes it possible to obtain a soldering light flux that is extremely effective for heating a very small area.
【図1】本発明の半田付け装置の光源装置部分を示す概
略構成図である。FIG. 1 is a schematic configuration diagram showing a light source device portion of a soldering device of the present invention.
【図2】従来の半田付け装置を示す概略構成図である。FIG. 2 is a schematic configuration diagram showing a conventional soldering device.
【図3】本発明の半田付け装置の全体構成を示す斜視図
である。FIG. 3 is a perspective view showing an overall configuration of a soldering device of the present invention.
1 光源 2 楕円鏡 3 半球状補助球面鏡 4 第1平面鏡 6 第2平面鏡 7 結像レンズ 8 半田付け箇所 A 光軸 1 Light Source 2 Elliptical Mirror 3 Hemispherical Auxiliary Spherical Mirror 4 First Plane Mirror 6 Second Plane Mirror 7 Imaging Lens 8 Soldering Point A Optical Axis
Claims (1)
光束を第2焦点に集光させる楕円鏡と、前記第1焦点を
球芯とし前記楕円鏡の出射側を覆うように配設され、前
記第2焦点への収束光を導光する開口を備えた半球状補
助球面鏡とを有し、前記第2焦点を結像レンズと2枚の
平面鏡により半田付け箇所と共役とし、前記結像レンズ
と2枚の平面鏡を光軸に対し回転可能としたことを特徴
とする半田付け装置。1. An elliptical mirror for converging a light beam emitted from a light source near the first focus on a second focal point on an optical axis, and a first core having a spherical core to cover an emission side of the elliptic mirror. And a semi-spherical auxiliary spherical mirror having an opening for guiding converged light to the second focus, and the second focus is conjugated with a soldering point by an imaging lens and two plane mirrors. A soldering device characterized in that an image lens and two plane mirrors are rotatable about an optical axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3256282A JPH0596366A (en) | 1991-10-03 | 1991-10-03 | Soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3256282A JPH0596366A (en) | 1991-10-03 | 1991-10-03 | Soldering apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0596366A true JPH0596366A (en) | 1993-04-20 |
Family
ID=17290486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3256282A Pending JPH0596366A (en) | 1991-10-03 | 1991-10-03 | Soldering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0596366A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250187093A1 (en) * | 2023-12-08 | 2025-06-12 | Hanon Systems | Brazed components and improved method of manufacturing them |
-
1991
- 1991-10-03 JP JP3256282A patent/JPH0596366A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250187093A1 (en) * | 2023-12-08 | 2025-06-12 | Hanon Systems | Brazed components and improved method of manufacturing them |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI287236B (en) | Soft X-ray light source apparatus, EUV exposure apparatus, and illumination method | |
| JP2008288215A (en) | Optical system for fresnel lens light, especially for spotlight or floodlight | |
| CN216576062U (en) | Laser welding head integrated with vibrating mirror group | |
| JP4348037B2 (en) | Condensing system using parabolic reflectors or corresponding ellipsoid / hyperboloid pairs of reflectors | |
| JPH11326212A (en) | Wide-visual-field fluorescent image forming device | |
| JP2002519715A (en) | Hole scanning laser scanner | |
| CN112251748A (en) | Laser cladding head for inner wall of pipeline | |
| JPH0572628A (en) | Light source device | |
| JP2662065B2 (en) | Optical system for laser marking | |
| JP2002529776A (en) | Laser irradiation equipment for cathode ray tubes. | |
| JPH0596366A (en) | Soldering apparatus | |
| JP5184775B2 (en) | Optical processing equipment | |
| CN101189472A (en) | Double-paraboloid and double-ellipsoid reflecting system with optimized magnification | |
| JP2002286914A (en) | Image forming device | |
| JP3868116B2 (en) | Laser processing head | |
| JPS63114186A (en) | Lighting apparatus | |
| JP2001255491A (en) | Laser converging optical system | |
| JP3406946B2 (en) | Illumination optical system, optical apparatus using the same, and device manufacturing method using the optical apparatus | |
| TWI845996B (en) | Focusing device having an image plane extending parallel to or coinciding with a target surface | |
| CN224190392U (en) | An illumination device and a wafer exposure system for wafer exposure. | |
| JP2842676B2 (en) | Light beam irradiation device | |
| JP2821691B2 (en) | Light source device for projector | |
| JPS58184117A (en) | Scanner of plural beams | |
| CN221735129U (en) | Laser drilling optical system and drilling equipment | |
| JP2871227B2 (en) | Flash illumination device with variable irradiation angle |