JPH0596396A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH0596396A JPH0596396A JP3282006A JP28200691A JPH0596396A JP H0596396 A JPH0596396 A JP H0596396A JP 3282006 A JP3282006 A JP 3282006A JP 28200691 A JP28200691 A JP 28200691A JP H0596396 A JPH0596396 A JP H0596396A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- tin
- particles
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3485—Application of solder paste, slurry or powder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【構成】 錫粒子の表面に鉛または錫−鉛合金を被覆し
た粒径100 μm 以下の複合粒子からなる半田基材粉末
と、所要の粘着性、粘度等を得るための粘着剤、粘度調
整剤等とを混合したクリーム半田。
【効果】 0.3 mm程度の微小ピッチで配列されたパッド
にブリッジを生じさせることなく半田層を形成すること
ができ、したがってリードピッチの小さな電子部品の実
装を実現することができる。またこのクリーム半田は、
個々のパッドに個別に印刷する必要がなく、パッド配列
部にベタ塗りするだけで、個々のパッドに選択的に半田
層を形成できるので、精密な印刷技術を必要としない。(57) [Summary] [Structure] A solder base powder consisting of composite particles with a particle size of 100 μm or less in which the surface of tin particles is coated with lead or a tin-lead alloy, and to obtain the required adhesion, viscosity, etc. Cream solder mixed with adhesive, viscosity modifier, etc. [Effect] The solder layer can be formed on the pads arranged at a fine pitch of about 0.3 mm without causing a bridge, and therefore, the mounting of electronic components having a small lead pitch can be realized. Also, this cream solder
Since it is not necessary to individually print on each pad, and a solder layer can be selectively formed on each pad by simply applying a solid coating to the pad array portion, a precise printing technique is not required.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品を回路基板に
実装するのに使用されるクリーム半田に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder used for mounting electronic parts on a circuit board.
【０００２】[0002]
【従来の技術】従来、電子部品を回路基板に実装する場
合には、回路基板のパッドにクリーム半田をスクリーン
印刷法等により印刷し、その上に電子部品のリードを載
置し、これをリフロー炉に通して加熱し、クリーム半田
を溶融させてリードとパッドを半田付けするという方法
がとられている。クリーム半田は、半田粉と、粘着剤、
粘度調整剤および必要に応じ活性剤などを混合して、ク
リーム状（ペースト状）にしたものである。2. Description of the Related Art Conventionally, when an electronic component is mounted on a circuit board, cream solder is printed on a pad of the circuit board by a screen printing method or the like, and leads of the electronic component are placed on the pad and reflowed. A method is used in which the leads and pads are soldered by heating them in a furnace to melt the cream solder. Cream solder is solder powder, adhesive,
It is a cream-like (paste-like) mixture by mixing a viscosity modifier and an activator as required.
【０００３】[0003]
【発明が解決しようとする課題】最近、電子機器、電子
部品の小型化にともない、回路基板のパッドの配列ピッ
チが微細化されてきており、従来のクリーム半田では
0.5mm程度の配列ピッチまでは対応可能であるが、それ
より小さいピッチになると、パッド間に半田のブリッジ
が発生してしまい良好な半田付けを行うことができな
い。Recently, with the miniaturization of electronic devices and electronic parts, the pitch of the pads on the circuit board has become finer.
Although it is possible to deal with the arrangement pitch of up to about 0.5 mm, if the pitch is smaller than that, a solder bridge is generated between the pads and good soldering cannot be performed.
【０００４】また従来のクリーム半田は隣合うパッドに
跨がらないように一つ一つのパッドに正確に塗布する必
要があるため、正確な印刷技術が必要であり、パッド間
隔が小さくなると印刷そのものが困難になる。Further, since the conventional cream solder needs to be accurately applied to each pad so that it does not straddle the adjacent pads, an accurate printing technique is required, and if the pad interval becomes small, the printing itself will occur. It will be difficult.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記のような
従来技術の問題点に鑑み、より配列ピッチの小さなパッ
ドに、かなりラフな印刷技術で対応できるクリーム半田
を提供するものである。SUMMARY OF THE INVENTION In view of the problems of the prior art as described above, the present invention provides a cream solder capable of dealing with a pad having a smaller array pitch by a considerably rough printing technique.
【０００６】本発明のクリーム半田は、錫粒子の表面に
鉛または錫−鉛合金を被覆した粒径100 μm 以下の複合
粒子からなる半田基材粉末を使用することに特徴があ
り、この半田基材粉末と、クリーム半田として所要の粘
着性、粘度等を得るための粘着剤、粘度調整剤等とを混
合することにより構成されるものである。必要に応じ活
性剤などを含ませることもできる。The cream solder of the present invention is characterized by using a solder base powder composed of composite particles having a particle size of 100 μm or less in which the surface of tin particles is coated with lead or a tin-lead alloy. It is constituted by mixing the material powder with an adhesive, a viscosity adjusting agent or the like for obtaining the required adhesiveness, viscosity and the like as cream solder. If necessary, an activator or the like can be included.
【０００７】粘着剤は従来と同様のもので、ロジンまた
はそれに代わる有機酸などが使用される。粘度調整剤も
従来と同様のもので、カルビトール系溶剤やミネラルス
ピリッツなどが使用される。これにカスターワックスな
どのチキソ剤を加えることもある。活性剤も従来と同様
のもので、アミンやハロゲンなどが使用される。The adhesive is the same as the conventional one, and rosin or an organic acid in place of it is used. The viscosity modifier is also the same as the conventional one, and a carbitol-based solvent or mineral spirits is used. A thixotropic agent such as castor wax may be added to this. The activator is the same as the conventional one, and an amine or halogen is used.
【０００８】また本発明のクリーム半田は、半田基材粉
末、粘着剤、粘度調整剤などのほかに、複合粒子が加熱
され半田粒子となって溶融するときに半田粒子同士の結
合を妨げる結合抑制剤を混合することが好ましい。結合
抑制剤としてはセルロースやガラス粉末などが使用でき
る。In addition to the solder base powder, the adhesive, the viscosity modifier, etc., the cream solder of the present invention suppresses the binding of the solder particles to each other when the composite particles are heated to become the solder particles and melt. It is preferable to mix the agents. Cellulose, glass powder or the like can be used as the binding inhibitor.
【０００９】[0009]
【作用】本発明のクリーム半田は、例えば 0.3mmピッチ
のパッド配列部にベタ塗りした後、加熱すると、ブリッ
ジを生じさせることなく各パッド上に半田を析出させる
ことが可能である。In the cream solder of the present invention, for example, when the pad array portion having a pitch of 0.3 mm is solidly coated and then heated, the solder can be deposited on each pad without causing a bridge.
【００１０】その理由は次のように考えられる。すなわ
ち従来のクリーム半田でパッド間に半田ブリッジが発生
するのは、クリーム半田が加熱され、半田溶融温度にな
るとすべての半田粒子がほとんど同時に溶融し、互いに
ぶつかり合って大きな半田粒子に成長し、パッド間に跨
がるようになるためである。これに対し本発明のクリー
ム半田は、半田粉末（錫−鉛合金粉末）ではなく、錫粒
子の表面を鉛または錫−鉛合金で覆った複合粒子からな
る半田基材粉末を使用しているので、これが加熱されて
溶融するときは、内部の錫と外部の鉛または錫鉛合金と
が互いに拡散し合って半田合金を形成し、溶融すること
になる。このとき個々の複合粒子が半田合金化し、溶融
するまでの時間は一定ではないから、全体としては半田
の溶融が徐々に進行することになり、溶融した半田粒子
が互いにぶつかり合う機会が少なくなる。そのために大
きな半田粒子に成長することがなくなり、ブリッジが発
生し難くなるものと考えられる。The reason is considered as follows. That is, in the conventional cream solder, a solder bridge occurs between pads because when the cream solder is heated and all the solder particles melt at the solder melting temperature almost at the same time, they collide with each other and grow into large solder particles. This is because they will straddle the gap. On the other hand, the cream solder of the present invention uses not the solder powder (tin-lead alloy powder) but the solder base powder made of composite particles in which the surface of tin particles is covered with lead or a tin-lead alloy. When this is heated and melted, internal tin and external lead or tin-lead alloy are diffused with each other to form a solder alloy, which is melted. At this time, since the time until individual composite particles are solder alloyed and melted is not constant, the melting of the solder gradually progresses as a whole, and the chances of the molten solder particles colliding with each other are reduced. Therefore, it is considered that large solder particles do not grow and bridging becomes difficult.
【００１１】上記のようにして個々のパッドに個別に半
田を析出させることができれば、その半田によって電子
部品のリードを半田付けすることが可能である。If solder can be individually deposited on each pad as described above, the leads of the electronic component can be soldered by the solder.
【００１２】なお、溶融した半田粒子が互いに結合して
成長するのをさらに抑制するためには、半田粒子同士の
結合を妨げる結合抑制剤を混合しておくことが望まし
い。結合抑制剤は溶融半田粒子の自由な移動を妨げるも
のであればよく、例えばセルロース、ガラス粉末などが
使用可能である。セルロースを使用する場合、その含有
量は６〜20重量％程度にすることが好ましい。In order to further prevent the molten solder particles from binding to each other and growing, it is desirable to mix a binding inhibitor that prevents the binding of the solder particles to each other. Any binding inhibitor may be used as long as it prevents free movement of the molten solder particles, and for example, cellulose, glass powder or the like can be used. When cellulose is used, its content is preferably about 6 to 20% by weight.
【００１３】本発明のクリーム半田に使用される半田基
材粉末は、加熱されると、複合粒子の内部の錫と外部の
鉛または錫鉛合金とが互いに拡散し合って半田合金化し
ながら溶融して、半田合金となるものである。複合粒子
の錫と鉛または錫鉛合金との比率は、得ようとする半田
合金組成に応じて適宜選定すればよい。上記複合粒子か
らなる半田基材粉末を製造する方法としては、錫粉末
と、ナフテン酸鉛などの有機鉛とを混合して、100 〜18
0 ℃の温度で５分ないし５時間加熱し、錫と鉛の置換反
応を起こさせて、錫粒子の表面に鉛または錫−鉛合金を
析出させる方法が比較的容易である。When the solder base powder used in the cream solder of the present invention is heated, tin inside the composite particles and external lead or tin-lead alloy are diffused into each other and melted while forming a solder alloy. And becomes a solder alloy. The ratio of tin to lead or tin-lead alloy in the composite particles may be appropriately selected according to the solder alloy composition to be obtained. As a method for producing a solder base powder composed of the above composite particles, tin powder and organic lead such as lead naphthenate are mixed to obtain 100 to 18
It is relatively easy to heat at a temperature of 0 ° C. for 5 minutes to 5 hours to cause a substitution reaction of tin and lead to precipitate lead or a tin-lead alloy on the surface of tin particles.
【００１４】[0014]
【実施例】以下、本発明の実施例を詳細に説明する。表
１のような組成の、本発明の実施例に係るクリーム半田
と、従来のクリーム半田を調製した。EXAMPLES Examples of the present invention will be described in detail below. The cream solder according to the example of the present invention and the conventional cream solder having the compositions shown in Table 1 were prepared.
【００１５】従来例の半田粉末は平均粒径約10μm の共
晶半田粉末である。また実施例１、２の半田基材粉末
は、錫粒子の表面に鉛が平均0.5μm 程度の厚さに被覆
された平均粒径約10μm の複合粒子からなる粉末であ
る。この半田基材粉末は、ナフテン酸鉛 (鉛含有率24
％) 100 重量部に対し、錫粉約54重量部、ロジン30〜50
重量部を混合したものを、約150 ℃で20〜40分加熱し
て、錫と鉛の置換反応により錫粒子の表面に鉛を析出さ
せたものである。また粘着剤にはロジンを、粘度調整剤
(溶剤) にはブチルカルビトールを、チキソ剤にはカス
ターワックスを、活性剤にはハロゲンを使用した。The conventional solder powder is a eutectic solder powder having an average particle size of about 10 μm. The solder base powders of Examples 1 and 2 are powders composed of composite particles having an average particle size of about 10 μm in which lead is coated on the surface of tin particles to an average thickness of about 0.5 μm. This solder base powder is lead naphthenate (lead content 24%
%) 100 parts by weight of tin powder, about 54 parts by weight, rosin 30-50
A mixture of parts by weight is heated at about 150 ° C. for 20 to 40 minutes to deposit lead on the surface of tin particles by a substitution reaction of tin and lead. Also, rosin is used as an adhesive and a viscosity modifier.
Butyl carbitol was used as the (solvent), castor wax was used as the thixotropic agent, and halogen was used as the activator.
【００１６】これらのクリーム半田を回路基板のパッド
配列部に塗布し、加熱して、半田層を形成した。試験に
用いた回路基板は、パッドピッチが0.3 mm (パッド幅＝
0.2mm、パッド間隔＝0.1mm)のガラスエポキシ基板であ
る。そのパッド配列部に表１の各組成のクリーム半田を
300μm の厚さにベタ塗りした後、加熱してリフローさ
せ、洗浄した。These cream solders were applied to the pad array portion of the circuit board and heated to form a solder layer. The circuit board used in the test had a pad pitch of 0.3 mm (pad width =
It is a glass epoxy board with 0.2mm and pad spacing = 0.1mm. Cream solder of each composition shown in Table 1 is applied to the pad arrangement part.
After solid coating to a thickness of 300 μm, it was heated to reflow and washed.
【００１７】その後パッド上の半田の状態を調べ、ブリ
ッジ発生率を求めた。その結果を表１に示す。ブリッジ
発生率とは半田を塗布した全パッド数に対するブリッジ
発生件数の割合である。After that, the state of the solder on the pad was examined to obtain the bridge generation rate. The results are shown in Table 1. The bridge occurrence rate is the ratio of the number of bridge occurrences to the total number of pads coated with solder.
【００１８】[0018]
【表１】 [Table 1]
【００１９】表１から明らかなように本発明のクリーム
半田を使用すると、ブリッジの発生を格段に少なくする
ことができる。なお同時に、錫粒子の表面に鉛が平均６
μm 程度の厚さに被覆された平均粒径約50μm の複合粒
子からなる半田基材粉末を用いた場合についても実験を
行ったところ、ほぼ同一の結果が得られた。As is clear from Table 1, when the cream solder of the present invention is used, the occurrence of bridges can be significantly reduced. At the same time, the average amount of lead on the surface of the tin particles is 6
When the solder base powder composed of composite particles having an average particle size of about 50 μm and coated to a thickness of about μm was used, an experiment was conducted and almost the same result was obtained.
【００２０】[0020]
【発明の効果】以上説明したように本発明に係るクリー
ム半田を使用すると、0.3 mm程度の微小ピッチで配列さ
れたパッドにブリッジを生じさせることなく半田層を形
成することができ、したがってリードピッチの小さな電
子部品の実装を実現することができる。またこのクリー
ム半田は、個々のパッドに個別に印刷する必要がなく、
パッド配列部にベタ塗りするだけで、個々のパッドに選
択的に半田層を形成できるので、精密な印刷技術を必要
とせず、回路基板への印刷がきわめて簡単である。As described above, when the cream solder according to the present invention is used, it is possible to form a solder layer on the pads arranged with a fine pitch of about 0.3 mm without causing a bridge, and therefore the lead pitch. It is possible to realize mounting of small electronic components. Also, this cream solder does not need to be printed individually on each pad,
Since the solder layer can be selectively formed on each pad only by solidly coating the pad array portion, precise printing technology is not required and printing on the circuit board is extremely easy.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 河野 政直 兵庫県加古川市新神野４丁目10番２号 (72)発明者 入江 久夫 兵庫県高砂市米田町神爪423番地 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masanobu Kono, 4-10-2 Shinjinno, Kakogawa-shi, Hyogo Prefecture (72) Hisao Irie 423 Kamizume, Yoneda-cho, Takasago-shi, Hyogo Prefecture
Claims (2)
した粒径100 μm 以下の複合粒子からなる半田基材粉末
と、所要の粘着性、粘度等を得るための粘着剤、粘度調
整剤等とが混合されていることを特徴とするクリーム半
田。1. A solder base powder consisting of composite particles having a particle size of 100 μm or less in which the surface of tin particles is coated with lead or a tin-lead alloy, an adhesive for obtaining the required adhesiveness, viscosity, etc., and a viscosity. A cream solder characterized by being mixed with an adjusting agent and the like.
合粒子が加熱され半田粒子となって溶融するときに半田
粒子同士の結合を妨げる結合抑制剤が混合されているこ
とを特徴とするもの。2. The cream solder according to claim 1, wherein a bonding inhibitor that prevents bonding between the solder particles is mixed when the composite particles are heated to become the solder particles and melt. thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3282006A JPH0596396A (en) | 1991-10-03 | 1991-10-03 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3282006A JPH0596396A (en) | 1991-10-03 | 1991-10-03 | Cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0596396A true JPH0596396A (en) | 1993-04-20 |
Family
ID=17646917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3282006A Pending JPH0596396A (en) | 1991-10-03 | 1991-10-03 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0596396A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012718A1 (en) * | 1995-10-06 | 1997-04-10 | Brown University Research Foundation | Soldering methods and compositions |
| WO2005091354A1 (en) * | 2004-03-22 | 2005-09-29 | Tamura Corporation | Solder composition and method of bump formation therewith |
| US7025906B2 (en) * | 2001-03-06 | 2006-04-11 | Fujitsu Limited | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method |
| WO2007078717A3 (en) * | 2005-12-30 | 2008-01-10 | Intel Corp | Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same |
| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
-
1991
- 1991-10-03 JP JP3282006A patent/JPH0596396A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012718A1 (en) * | 1995-10-06 | 1997-04-10 | Brown University Research Foundation | Soldering methods and compositions |
| US6340113B1 (en) | 1995-10-06 | 2002-01-22 | Donald H. Avery | Soldering methods and compositions |
| US7025906B2 (en) * | 2001-03-06 | 2006-04-11 | Fujitsu Limited | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method |
| US7351361B2 (en) * | 2001-03-06 | 2008-04-01 | Fujitsu Limited | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method |
| WO2005091354A1 (en) * | 2004-03-22 | 2005-09-29 | Tamura Corporation | Solder composition and method of bump formation therewith |
| JPWO2005091354A1 (en) * | 2004-03-22 | 2008-02-07 | 株式会社タムラ製作所 | Solder composition and bump forming method using the same |
| JP4892340B2 (en) * | 2004-03-22 | 2012-03-07 | 株式会社タムラ製作所 | Solder composition and bump forming method using the same |
| WO2007078717A3 (en) * | 2005-12-30 | 2008-01-10 | Intel Corp | Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same |
| US7745013B2 (en) | 2005-12-30 | 2010-06-29 | Intel Corporation | Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same |
| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
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