JPH0596468A - Ultra-precision mirror surface processing method - Google Patents
Ultra-precision mirror surface processing methodInfo
- Publication number
- JPH0596468A JPH0596468A JP3074029A JP7402991A JPH0596468A JP H0596468 A JPH0596468 A JP H0596468A JP 3074029 A JP3074029 A JP 3074029A JP 7402991 A JP7402991 A JP 7402991A JP H0596468 A JPH0596468 A JP H0596468A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- processed
- processing
- ultra
- ultrafine powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
(57)【要約】
【目的】 被加工物の加工面に超微粉体を流動接触させ
て、歪み、クラック及び熱変質等を全く生じさせずに鏡
面加工を進行させる超精密鏡面加工方法である。
【構成】 超微粉体を分散させた懸濁液中に配した被加
工物の近傍に、該加工面と平行となして長尺円柱状の加
工体を配し、該加工体を加工面に一定荷重にて押圧しな
がら回転させるとともに、加工体の軸方向を基準として
0〜90度の範囲内で所定角度傾斜した方向へ被加工物
を相対的に平行移動させて超微粉体と加工面界面での相
互作用により面加工を進行させるのである。
(57) [Summary] [Purpose] An ultra-precision mirror surface processing method in which ultra-fine powder is brought into fluid contact with the surface to be processed of a workpiece, and mirror surface processing proceeds without causing distortion, cracks or thermal alteration. is there. [Structure] A long cylindrical workpiece is disposed in the vicinity of a workpiece placed in a suspension in which ultrafine powder is dispersed, in parallel with the workpiece, and the workpiece is processed. While rotating while pressing with a constant load, the workpiece is relatively translated in a direction inclined by a predetermined angle within a range of 0 to 90 degrees with respect to the axial direction of the workpiece to form an ultrafine powder. The surface processing is advanced by the interaction at the processing surface interface.
Description
【0001】[0001]
【産業上の利用分野】本発明は、シリコンウエハ及び薄
膜用基板等の被加工物の加工面に超微粉体を流動接触さ
せて歪み、クラック及び熱変質等を全く生じさせずに鏡
面加工を進行させる超精密鏡面加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a mirror-finishing process in which ultrafine powder is brought into fluid contact with a processed surface of a workpiece such as a silicon wafer and a thin film substrate without causing distortion, cracking or thermal alteration. The present invention relates to a super-precision mirror-surface processing method for advancing the process.
【0002】[0002]
【従来の技術】従来、超微粉体を分散した懸濁液を被加
工物の加工面に沿って流動させて、該超微粉体を加工面
上に略無荷重の状態で接触させ、その際の超微粉体と加
工面界面での相互作用(一種の化学結合)により、加工
面原子を原子単位に近いオーダで除去して加工する、い
わゆるEEM(Elastic Emission Machining) による超
精密鏡面加工は既に知られている。2. Description of the Related Art Conventionally, a suspension in which ultrafine powder is dispersed is caused to flow along a machined surface of a workpiece to bring the ultrafine powder into contact with the machined surface under substantially no load, Ultra-precision mirror surface by so-called EEM (Elastic Emission Machining), which removes processed surface atoms in the order close to atomic units by the interaction (a kind of chemical bond) at the interface between the ultrafine powder and the processed surface. Processing is already known.
【0003】従来のEEMを使った加工では、図6に示
すように加工用球体aを被加工物bの加工面cに圧接し
ながら回転駆動手段dにより回転させて加工面近傍に懸
濁液流を発生させ、そして球体aを加工面全面に走査し
て、加工面上の微小領域に形成されるスポット加工痕を
連続させて、全面を精密に加工するのである。In the conventional processing using EEM, as shown in FIG. 6, while the processing sphere a is pressed against the processing surface c of the object b to be processed, it is rotated by the rotation driving means d to suspend the suspension in the vicinity of the processing surface. A flow is generated, and the spherical surface a is scanned over the entire surface to be machined, and spot machining marks formed in a minute region on the surface to be machined are made continuous to precisely machine the entire surface.
【0004】しかし、前記加工用球体を用いた場合に
は、加工面の各点での走査速度を変化させることにより
加工量を変化させて凹凸のある形状加工が可能である反
面、それによるスポット加工痕は非常に小さいため、面
積の広い被加工物の場合は加工時間が多くかかるととも
に、走査方向と直交する方向の隣接するスポット加工痕
の平滑性にやや劣るといった問題があった。However, when the above-mentioned processing sphere is used, the amount of processing can be changed by changing the scanning speed at each point on the processing surface to form an uneven shape. Since the processing marks are very small, there is a problem that it takes a long processing time for a workpiece having a large area and the smoothness of adjacent spot processing marks in the direction orthogonal to the scanning direction is slightly inferior.
【0005】そこで、前記球体を円状回転体に代えれ
ば、広い面積も短時間で加工できることは容易に考慮さ
れ得る。しかし、この回転体を製造する過程において、
その表面円周方向には加工に悪影響を及ぼす無数の条痕
が不可避的に形成されている。即ち、前記条痕は、該回
転体を成形する金型製造時に金型内面を切削した際に形
成される微小な凹凸が転写されて現れ、又は回転体の表
面仕上げの際に、回転体を回転させながら表面研磨又は
切削する工程において形成されるのである。それにより
回転体の回転軸とその走査方向を直交させた場合には、
この条痕の存在により加工面の鏡面精度が低下するので
ある。Therefore, it can be easily considered that a large area can be processed in a short time by replacing the spherical body with a circular rotary body. However, in the process of manufacturing this rotating body,
Innumerable striations that inevitably affect machining are inevitably formed in the circumferential direction of the surface. That is, the streaks appear by transferring minute irregularities formed when the inner surface of the mold is cut at the time of manufacturing the mold for molding the rotating body, or when the surface of the rotating body is finished, It is formed in the process of polishing or cutting the surface while rotating. As a result, when the rotation axis of the rotating body and its scanning direction are made orthogonal,
The presence of these scratches reduces the mirror surface precision of the machined surface.
【0006】[0006]
【発明が解決しようとする課題】本発明が前述の状況に
鑑み、解決しようとするところは、被加工物の平面状加
工面を鏡面加工するに際し、単位時間当たりの加工面積
を大幅に増加することができ、しかも0.1 μm以下の高
精度で鏡面加工することができる超精密鏡面加工方法を
提供する点にある。SUMMARY OF THE INVENTION In view of the above-mentioned situation, the present invention is to solve the problem that when the flat machining surface of a workpiece is mirror-finished, the machining area per unit time is significantly increased. It is an object of the present invention to provide an ultra-precision mirror surface processing method capable of performing mirror surface processing with high accuracy of 0.1 μm or less.
【0007】[0007]
【課題を解決するための手段】本発明は、前述の課題解
決の為に、超微粉体を一様に分散した懸濁液中に配した
平面状の加工面を有する被加工物の近傍に、該加工面と
平行となして長尺円柱状の加工体を配するとともに、該
加工体を前記加工面に一定荷重にて押圧しながら回転さ
せて、該加工面の微小領域に面に沿った方向の懸濁液流
を発生させ、更に前記加工体の軸方向を基準として0〜
90度の範囲内の所定角度傾斜した方向へ前記被加工物を
相対的に平行移動させて超微粉体と加工面界面での相互
作用により面加工を進行してなる超精密鏡面加工方法を
構成した。In order to solve the above-mentioned problems, the present invention provides a vicinity of a work having a flat work surface in which a super fine powder is uniformly dispersed in a suspension. In addition, a long columnar processed body is arranged parallel to the machined surface, and the machined body is rotated while being pressed against the machined surface with a constant load so that the machined surface is formed in a minute region of the machined surface. A suspension flow is generated in a direction along the axis of the workpiece, and further, 0 to
An ultra-precision mirror surface processing method in which the workpiece is relatively translated in a direction inclined by a predetermined angle within a range of 90 degrees, and surface processing is progressed by interaction between the ultrafine powder and the processing surface interface. Configured.
【0008】また、超微粉体を一様に分散した懸濁液中
に配した平面状の加工面を有する被加工物の近傍に、該
加工面と平行となして長尺円柱状の加工体を配するとと
もに、該加工体を前記加工面に一定荷重にて押圧しなが
ら回転させて、該加工面の微小領域に面に沿った方向の
懸濁液流を発生させ、更に前記加工体を相対的に軸方向
へ往復移動させ且つ被加工物を該回転体の軸方向と略直
交する方向へ相対的に平行移動させて超微粉体と加工面
界面での相互作用により面加工を進行してなる超精密鏡
面加工方法を構成した。Further, in the vicinity of a work having a flat work surface in which a super fine powder is uniformly dispersed, a long cylindrical work is formed in parallel with the work surface. A body is placed, and the processed body is rotated while being pressed against the processed surface with a constant load to generate a suspension flow in a direction along the surface in a minute region of the processed surface. Is relatively reciprocally moved in the axial direction, and the workpiece is relatively moved in a direction substantially orthogonal to the axial direction of the rotating body to perform surface processing by interaction between the ultrafine powder and the processing surface interface. An advanced ultra-precision mirror finishing method was constructed.
【0009】そして、前記加工体として、軸の周囲にポ
リウレタン製の円柱状回転体を配した加工体を用いた。As the processed body, a processed body in which a cylindrical rotating body made of polyurethane is arranged around the shaft is used.
【0010】更に、前記超微粉体として、粒径10-9〜10
-6mの粉体を用いた。Further, the ultrafine powder has a particle size of 10 -9 to 10
-6 m of powder was used.
【0011】[0011]
【作用】以上の如き内容からなる本発明の超精密鏡面加
工方法は、長尺円柱状の加工体を被加工物の平面状加工
面に一定荷重にて押圧しながら回転させることにより、
該加工体と加工面間に超微粉体を一様に分散した懸濁液
を巻き込んで、超微粉体を該加工面に沿った方向に次々
と通過させ、該超微粉体と加工面界面での一種の化学結
合による相互作用により、該加工面の構成原子を原子単
位に近いオーダで除去して変質層を全く伴わずに面加工
するのであるが、更に加工体の軸方向を基準として0〜
90度の範囲内の所定角度傾斜した方向へ前記被加工物を
相対的に平行移動させて、加工体の製造時に加工精度の
限界によりその円周に沿って無数に形成される凹凸条に
よる影響を除いて超精密な鏡面加工を行うのである。The ultra-precision mirror-surface machining method of the present invention having the above-mentioned contents is achieved by rotating a long cylindrical workpiece while pressing it against a flat machining surface of a workpiece with a constant load.
A suspension in which ultra-fine powder is uniformly dispersed is wound between the processed body and the processed surface, and the ultra-fine powder is successively passed in the direction along the processed surface to form the ultra-fine powder and the processed surface. Due to the interaction of a kind of chemical bond at the surface interface, the constituent atoms of the processed surface are removed on the order of atomic units and surface processing is performed without any altered layer. 0 as a standard
Influence of innumerable ridges and valleys formed along the circumference of the workpiece by parallel translation of the workpiece in a direction inclined by a predetermined angle within a range of 90 degrees due to the limit of processing accuracy during manufacturing of the workpiece Except for that, ultra-precision mirror surface processing is performed.
【0012】また、加工体を相対的に軸方向へ往復移動
させ且つ被加工物を該加工体の軸方向と略直交する方向
へ相対的に平行移動させることにより、前述の加工体円
周に有する凹凸条による影響を同様に除いて鏡面加工す
るのである。Further, the workpiece is reciprocally moved in the axial direction relatively and the workpiece is moved in parallel in a direction substantially orthogonal to the axial direction of the workpiece, so that the circumference of the workpiece is moved. The mirror surface processing is performed by similarly removing the influence of the uneven lines.
【0013】そして、加工体の周囲にポリウレタンを用
いた場合、加工面を傷つけることなく該加工体と加工面
の微小間隙間に超微粉体を有効的に巻き込み、加工面に
沿った方向に超微粉体を次々に供給するのである。When polyurethane is used around the processed body, the ultrafine powder is effectively caught in the minute gap between the processed body and the processed surface without damaging the processed surface. The ultrafine powder is supplied one after another.
【0014】更に、超微粉体として粒径10-9〜10-6mの
粉体を用いて、精度0.1μm以内の鏡面加工が行えるの
である。Furthermore, by using a powder having a particle size of 10 -9 to 10 -6 m as the ultrafine powder, it is possible to perform mirror finishing with an accuracy of 0.1 μm or less.
【0015】[0015]
【実施例】次に添付図面に示した実施例に基づき更に本
発明の詳細を説明する。The present invention will be further described in detail with reference to the embodiments shown in the accompanying drawings.
【0016】図1は、本発明の加工方法の原理を示した
もので、図中1は加工体、2は被加工物、3は超微粉体
をそれぞれ示している。FIG. 1 shows the principle of the processing method of the present invention. In the figure, 1 is a workpiece, 2 is a workpiece, and 3 is an ultrafine powder.
【0017】ポリウレタン等の可撓性合成樹脂で円柱状
に成形された加工体1と、平面状の加工面4を有する被
加工物2を超微粉体3,…を一様に分散した懸濁液5中
に配し、前記被加工物2を平行移動可能となすととも
に、前記加工体1を回転可能且つ前記加工面4に一定荷
重Wにて押圧可能となし、該加工体1の回転により該加
工体1と加工面4間に懸濁液5を巻き込み、該加工面4
に沿った方向に流れる局所的な懸濁液流が発生し、それ
に伴い懸濁液5中の超微粉体3は前記被加工物2に接触
しながら次々に該加工面4と加工体1間を通過し、該加
工面4と超微粉体3との界面での化学的な相互作用(一
種の化学結合)により該加工面4の微小な凹凸を原子レ
ベルに近い大きさで除去して鏡面加工を進行させるので
ある。尚、図1において加工体1の被加工物2と面する
側は、荷重Wと流体動圧によりやや変形させて示してあ
り、また該加工体1の回転により生じる懸濁液5の流れ
の流線に沿って超微粉体3,…が移動する様子を示して
いる。A cylindrical body 1 made of a flexible synthetic resin such as polyurethane and a workpiece 2 having a flat surface 4 are suspended in which ultrafine powders 3, ... Are uniformly dispersed. The workpiece 2 is placed in the suspension 5 so that the workpiece 2 can be moved in parallel, the workpiece 1 can be rotated, and the workpiece 4 can be pressed with a constant load W. The suspension 5 is wound between the processed body 1 and the processed surface 4 by
A local suspension flow that flows in the direction along is generated, and accordingly, the ultrafine powder 3 in the suspension 5 is in contact with the workpiece 2 and the processed surface 4 and the processed body 1 one after another. The fine irregularities on the processed surface 4 are removed by a chemical interaction (a kind of chemical bond) at the interface between the processed surface 4 and the ultrafine powder 3 at a size close to the atomic level. The mirror surface processing is advanced. In FIG. 1, the side of the workpiece 1 facing the workpiece 2 is shown as slightly deformed by the load W and the fluid dynamic pressure, and the flow of the suspension 5 generated by the rotation of the workpiece 1 is shown. It is shown that the ultrafine powders 3, ... Are moving along the streamline.
【0018】ここで、ポリウレタン製の加工体1と被加
工物2の加工面4の間隙は、該加工体1にかかる荷重W
と懸濁液5の流体動圧との釣り合いによって自動的に安
定に保たれ、流れの状態と超微粉体3の分散状態が安定
であれば、単位時間当たりの作用粉末数も安定となり、
単位時間当たりの加工量も安定となる。それゆえ、任意
の位置での加工量は、前記加工体1と被加工物2の相対
的な平行移動における移動速度又は停止時間によって正
確に制御でき、高精度の鏡面加工が行えるのである。Here, the gap between the processing body 1 made of polyurethane and the processing surface 4 of the workpiece 2 is the load W applied to the processing body 1.
And the fluid dynamic pressure of the suspension 5 are automatically kept stable, and if the flow state and the dispersion state of the ultrafine powder 3 are stable, the number of working powders per unit time is also stable,
The processing amount per unit time is also stable. Therefore, the processing amount at an arbitrary position can be accurately controlled by the moving speed or the stop time in the relative parallel movement of the workpiece 1 and the workpiece 2, and high-precision mirror surface processing can be performed.
【0019】また、本発明の加工方法において、前記被
加工物2と使用する超微粉体3との組合わせでその加工
速度が1000倍を遥かに越える範囲で大きく変化するた
め、被加工物2の加工に最適な物性を有する超微粉体3
を選択することが望まれる。例えば、被加工物2として
シリコンウエハ(Si)を選択した場合、その加工に最
も適した超微粉体3は、天然産の原石を粉砕したZrO
2 の粉体であり、また人工的にZr(OH)4 を 850℃
で焼成し、35%のSiO2 を加えた後 900℃で焼成し
て、全体として結晶性の不完全なジルコン結晶として合
成した粉末を用いることも若干加工速度は落ちるが可能
である。そして、超微粉体3の粒径も、被加工物2の加
工面4の状態及び加工精度に応じて選択し、通常は粒径
10-9〜10-6mの粉体を用いるが、粒径が10-9m以下のも
のは粉体製造に限界があり殆ど不可能で、また10-6m以
上のものは加工精度が悪くなり、それゆえ本発明の加工
方法の原理及び目的から前記粒径範囲の超微粉体3を用
いるのである。Further, in the processing method of the present invention, the combination of the work piece 2 and the ultrafine powder 3 to be used causes a large change in the working speed in the range far exceeding 1000 times. Ultrafine powder 3 with optimum physical properties for processing 2
Is desired to be selected. For example, when a silicon wafer (Si) is selected as the workpiece 2, the ultrafine powder 3 that is most suitable for the processing is ZrO obtained by crushing naturally occurring rough stones.
2 powder, and artificially added Zr (OH) 4 at 850 ℃
It is also possible to slightly lower the processing speed by using a powder synthesized by firing at 900 ° C., adding 35% of SiO 2 and then firing at 900 ° C., and synthesizing as a zircon crystal having incomplete crystallinity as a whole. The particle size of the ultrafine powder 3 is also selected according to the state of the processed surface 4 of the workpiece 2 and the processing accuracy, and usually the particle size is
Powders with a size of 10 -9 to 10 -6 m are used, but if the particle size is 10 -9 m or less, it is almost impossible due to the limitation of powder production, and if the particle size is 10 -6 m or more, the processing accuracy is high. Therefore, from the principle and purpose of the processing method of the present invention, the ultrafine powder 3 having the above particle size range is used.
【0020】次に、更に本発明を具体的に述べれば、前
記加工体1は、図2に示す如く軸6の周囲にポリウレタ
ン製の回転体7を配した構造のものであり、該回転体7
の表面円周方向には加工に悪影響を及ぼす無数の条痕8
が不可避的に形成されている。即ち、前記条痕8は、該
回転体7を成形する金型製造時に金型内面を切削した際
に形成される微小な凹凸が転写されて現れたものであ
る。又は、前記条痕8は、該回転体7の表面仕上げの際
に、該回転体7を回転させながら表面研磨又は切削する
工程において形成される。この条痕8の存在により、加
工体1を回転させ、該加工体1の軸6と直交する方向に
被加工物2を相対的に平行移動させて、加工面4の全面
を加工した場合に、該加工面4に無数の直線状の条痕9
が転写され、高精度の平滑性を有する鏡面が得られない
ことになる。Next, to describe the present invention in more detail, the processed body 1 has a structure in which a polyurethane rotating body 7 is arranged around a shaft 6 as shown in FIG. 7
Innumerable striations 8 that adversely affect the processing in the circumferential direction of the surface of
Is inevitably formed. That is, the streaks 8 are formed by transferring the minute irregularities formed when the inner surface of the mold is cut during the manufacture of the mold for molding the rotating body 7. Alternatively, the streaks 8 are formed in the step of surface polishing or cutting while rotating the rotating body 7 when finishing the surface of the rotating body 7. When the workpiece 1 is rotated due to the existence of the streaks 8 and the workpiece 2 is relatively translated in the direction orthogonal to the axis 6 of the workpiece 1, and the entire surface 4 is machined. , Innumerable linear scratches 9 on the processed surface 4
Is transferred, and a mirror surface having high precision smoothness cannot be obtained.
【0021】しかして、本発明の超精密鏡面加工方法を
実施する加工装置は、図3に示す如く前記加工体1の軸
6を軸受10, 10にて支持するとともに、該軸6の一端に
固定した従動プーリ11とモータ12の駆動プーリ13とに巻
架したベルト14にて回転可能となし、そして前記被加工
物2を取付けるテーブル15を、前記加工体1に近接配す
るとともに、該加工体1の軸方向を基準として0〜90度
の範囲内の所定角度、好ましくは約45度傾斜した方向へ
相対的に平行移動可能となし、更に前記加工体1又はテ
ーブル15を互いに接近する方向に一定荷重で押圧する図
示しない押圧手段を有し、前記加工体1とテーブル15を
超微粉体3,…を一様に分散した懸濁液5中に配して構
成した。尚、本実施例では前記加工体1を定位置回転可
能となし、テーブル15を平行移動させているが、該テー
ブル15は固定し、加工体1を回転させながら平行移動す
るように構成することも勿論可能である。また、前記モ
ータ12の回転力を前記加工体1の軸6に伝達する手段は
他のチェーン又はギア等を用いてもよい。そして、前記
加工体1を回転させながら被加工物2の加工面4に一定
荷重で押圧し、更に前記テーブル15を傾斜方向へ平行移
動させ、もって加工体1表面の条痕8の影響を全く受け
ずに高精度で鏡面加工を行うのである。Therefore, as shown in FIG. 3, the processing apparatus for carrying out the ultra-precision mirror surface processing method of the present invention supports the shaft 6 of the processed body 1 by the bearings 10, 10 and at one end of the shaft 6. A belt 14 wound around a fixed driven pulley 11 and a drive pulley 13 of a motor 12 makes it rotatable, and a table 15 for mounting the workpiece 2 is placed close to the workpiece 1 and the machining is performed. A direction in which the body 1 or the table 15 is brought closer to each other is relatively movable in parallel to a predetermined angle within a range of 0 to 90 degrees with respect to the axial direction of the body 1, preferably about 45 degrees. In addition, it has a pressing means (not shown) for pressing with a constant load, and the processed body 1 and the table 15 are arranged in a suspension 5 in which ultrafine powders 3, ... Are uniformly dispersed. In this embodiment, the workpiece 1 is not rotatable at a fixed position and the table 15 is moved in parallel. However, the table 15 is fixed, and the workpiece 1 may be rotated and translated in parallel. Of course, it is possible. Further, as the means for transmitting the rotational force of the motor 12 to the shaft 6 of the processed body 1, another chain or gear may be used. Then, while rotating the machined body 1, the machined surface 4 of the work piece 2 is pressed with a constant load, and further the table 15 is translated in the tilt direction, so that the influence of the scratches 8 on the surface of the machined body 1 is completely eliminated. The mirror surface is processed with high precision without receiving it.
【0022】また、図4に示した実施例は、前記加工体
1を被加工物2を取付けたテーブル15に対して相対的に
軸方向へ往復移動させ且つ該テーブル15を加工体1の軸
方向と略直交する方向へ相対的に平行移動させて、該加
工体1表面の条痕8の影響を受けないようになした加工
方法である。更に、具体的に前記加工体1の軸6を軸受
10,…にて回転可能且つスライド可能に支持し、該軸6
の一端に該軸6を往復移動させる移動手段16を連係する
とともに、該軸6の一部に形成したスプライン軸17に従
動プーリ11をスライド可能に装着して前記同様にモータ
12により回転駆動し、更に前記テーブル15は軸6に対し
て略直交する方向に適宜手段にて平行移動するようにな
し、結果として前記加工体1の軸方向移動と前記テーブ
ル15の略直交方向移動が合わさって軸方向に対して傾斜
方向に相対的に移動して加工するのである。In the embodiment shown in FIG. 4, the workpiece 1 is reciprocally moved in the axial direction relative to the table 15 on which the workpiece 2 is mounted, and the table 15 is moved along the axis of the workpiece 1. This is a processing method in which the workpiece 8 is relatively parallel moved in a direction substantially orthogonal to the direction so as not to be affected by the scratches 8 on the surface of the processed body 1. Further, specifically, the shaft 6 of the processed body 1 is a bearing.
The shaft 6 is rotatably and slidably supported by 10 ,.
A moving means 16 for reciprocating the shaft 6 is linked to one end of the shaft 6, and a driven pulley 11 is slidably mounted on a spline shaft 17 formed on a part of the shaft 6 to drive the motor in the same manner as described above.
It is rotationally driven by 12, and the table 15 is adapted to be moved in parallel in a direction substantially orthogonal to the shaft 6 by an appropriate means. As a result, the axial movement of the workpiece 1 and the substantially orthogonal direction of the table 15 are performed. The movements are combined to move relative to the axial direction in the inclination direction for processing.
【0023】また、図5に示した実施例は、被加工物2
をテーブル15に装着して該被加工物2を回転体7に一定
荷重にて押圧する荷重機構18と、回転体7に対して被加
工物2を相対的に移動させる走査機構19の一例を示して
いる。Further, the embodiment shown in FIG.
An example of a loading mechanism 18 that attaches the workpiece 2 to the table 15 and presses the workpiece 2 against the rotating body 7 with a constant load, and a scanning mechanism 19 that relatively moves the workpiece 2 with respect to the rotating body 7. Shows.
【0024】前記荷重機構18は、テーブル15に貫通形成
した開口20内にスライドベアリング等の案内具21を内装
するとともに、該案内具21にて真空チャック22を下方へ
出没自在に取付け、該真空チャック22の自重及び真空チ
ャック22の上方から重鎮若しくはバネにて又はそれらを
組合せて一定荷重Fをかけたものである。該真空チャッ
ク22は内部に空間部23を設け、下面の取付面24に多数の
吸込孔25,…を設け、前記空間部23に接続したフレキシ
ブルホース26で吸気して取付面24に被加工物2を吸着固
定するのである。こうして、一定荷重Fがかけられた真
空チャック22に固定された被加工物2はテーブル15の下
方に近接配置した回転体7に一定荷重にて押圧されるの
である。The load mechanism 18 is provided with a guide tool 21 such as a slide bearing inside an opening 20 formed through the table 15, and a vacuum chuck 22 is attached by the guide tool 21 so as to be retractable downwards. A constant load F is applied from above the weight of the chuck 22 and the vacuum chuck 22 with a heavy weight, a spring, or a combination thereof. The vacuum chuck 22 is provided with a space portion 23 inside, a large number of suction holes 25, ... Are provided in a mounting surface 24 on the lower surface, and a flexible hose 26 connected to the space portion 23 sucks air to suck the workpiece on the mounting surface 24. 2 is adsorbed and fixed. In this way, the work piece 2 fixed to the vacuum chuck 22 to which a constant load F is applied is pressed by the constant load to the rotating body 7 arranged in the vicinity below the table 15.
【0025】前記走査機構19は、テーブル15又はそれに
面接する固定部27の何れか一方に一又は複数のアリ溝2
8,28を形成し、他方に該アリ溝28にスライド係合する
アリ29を突設したものである。そして、テーブル15を固
定部27に対して適宜な手段にて移動させるのである。The scanning mechanism 19 includes one or a plurality of dovetail grooves 2 on either the table 15 or the fixed portion 27 that is in contact with the table 15.
8 and 28 are formed, and a dovetail 29, which is slidably engaged with the dovetail groove 28, is projectingly provided on the other side. Then, the table 15 is moved with respect to the fixed portion 27 by an appropriate means.
【0026】更に、長時間の加工において、回転体7の
表面が擦り減ったり、微小なダメージを受けたりする場
合があるが、その加工後に回転体7の表面を修復する必
要がある。また、加工前に回転体7の表面を所定の精度
に調整したい場合がある。そのため、本実施例では回転
体7の近傍にその軸6と平行な案内軸30を配し、その案
内軸30に沿って移動可能且つ回転体7に直交する方向に
移動可能なチャック31を有し、そのチャック31に高精度
な切削が可能なバイト32を装着してなる超精密切削装置
も設けている。Further, the surface of the rotating body 7 may be worn or slightly damaged during long-time processing, but it is necessary to restore the surface of the rotating body 7 after the processing. Further, there are cases where it is desired to adjust the surface of the rotating body 7 to a predetermined accuracy before processing. Therefore, in this embodiment, a guide shaft 30 parallel to the shaft 6 is arranged near the rotary body 7, and a chuck 31 movable along the guide shaft 30 and movable in a direction orthogonal to the rotary body 7 is provided. However, an ultra-precision cutting device in which the chuck 31 is equipped with a cutting tool 32 capable of highly accurate cutting is also provided.
【0027】このようにして、本発明の加工方法によれ
ば、材料の物性を極限まで利用する機能材料等の最終表
面を加工することができ、例えば高性能な表面を必要と
するレーザージャイロ用ミラー等の鏡面加工を加工変質
層を全く伴わずしかも0.1 nmオーダの精度で行うこと
が可能である。As described above, according to the processing method of the present invention, it is possible to process the final surface of a functional material or the like which makes full use of the physical properties of the material, for example, for a laser gyro that requires a high-performance surface. It is possible to perform mirror finishing such as mirrors with no processing-altered layer and with an accuracy of the order of 0.1 nm.
【0028】[0028]
【発明の効果】以上にしてなる本発明の超精密鏡面加工
方法によれば、超微粉体を一様に分散した懸濁液中に被
加工物を配するとともに、該被加工物の加工面に長尺円
柱状の加工体を一定荷重にて押圧しながら回転させ、更
に該加工体と被加工物を相対的に平行移動させることに
より、懸濁液中の超微粉体を加工面に作用させて、加工
面と超微粉体の界面間の一種の化学結合による相互作用
により加工面を原子単位に近いオーダで除去して、該加
工面に転位やクラック及び熱変質層を全く発生させるこ
となく最小単位である原子オーダでの超精密な鏡面加工
を行うことができ、しかも加工体の軸方向を基準として
0〜90度の範囲内の所定角度傾斜した方向へ被加工物を
相対的に平行移動させたので、該加工体の製造仮定にお
いて該加工体の表面円周方向に不可避的に形成された条
痕の影響を全く受けることなく加工することができ、従
って広い面積の加工面も短時間で加工することができ
る。According to the ultraprecision mirror surface processing method of the present invention as described above, a work piece is placed in a suspension in which ultrafine powder is uniformly dispersed, and the work piece is processed. The long cylindrical work piece is pressed against the surface while rotating it while pressing it with a constant load, and the work piece and the work piece are relatively moved in parallel, whereby the ultrafine powder in the suspension is processed. The processed surface is removed on the order of atomic units by a kind of chemical bond interaction between the processed surface and the interface of the ultrafine powder, and dislocations, cracks and thermal alteration layers are completely removed from the processed surface. It is possible to perform ultra-precision mirror surface machining on the atomic order, which is the smallest unit, without generating it, and further, to machine the workpiece in a direction inclined by a predetermined angle within the range of 0 to 90 degrees with the axial direction of the workpiece as a reference. Since the parallel translation is performed, the surface of the workpiece is assumed in the manufacturing assumption of the workpiece. It can be processed without being circumferentially the effect of inevitably formed streaks at all, therefore it can be processed in a short time processing surface of large area.
【0029】また、加工体を相対的に軸方向へ往復移動
させ且つ被加工物を該加工体の軸方向と略直交する方向
へ相対的に平行移動させた場合も、前記同様の効果を有
するとともに、加工体の往復移動速度及び被加工物の平
行移動速度を変えることにより、加工体の軸方向に対す
る被加工物の移動方向を実質的に変更することができ、
微妙な加工条件の設定を容易に行うことができる。The same effect as described above can be obtained when the workpiece is reciprocally moved in the axial direction and the workpiece is relatively moved in the direction substantially orthogonal to the axial direction of the workpiece. At the same time, by changing the reciprocating speed of the workpiece and the parallel moving speed of the workpiece, the moving direction of the workpiece with respect to the axial direction of the workpiece can be substantially changed.
It is possible to easily set delicate processing conditions.
【0030】更に、軸の周囲にポリウレタン製の円柱状
回転体を配した加工体を用いることにより、加工面を傷
つけることなく、しかも該加工体と被加工物間に懸濁液
を効率よく供給し、もって超微粉体による加工効率の向
上を図ることができる。Furthermore, by using a machined body in which a cylindrical rotating body made of polyurethane is arranged around the shaft, the suspension is efficiently supplied between the machined body and the workpiece without damaging the machined surface. Therefore, the processing efficiency of the ultrafine powder can be improved.
【0031】また、粒径が10-9〜10-6mの超微粉体を用
いれば、シリコンウエハ等に要求される0.1 μm以上の
高精度な鏡面加工が行える。If ultrafine powder having a particle size of 10 −9 to 10 −6 m is used, highly precise mirror finishing of 0.1 μm or more required for silicon wafers can be performed.
【図1】本発明の超精密鏡面加工方法の加工原理を示し
た簡略断面図である。FIG. 1 is a simplified cross-sectional view showing a processing principle of an ultraprecision mirror surface processing method of the present invention.
【図2】加工体の表面円周方向に有する条痕により被加
工物の加工面に条痕が生じる状態を示した簡略斜視図で
ある。FIG. 2 is a simplified perspective view showing a state in which a scratch is generated on a processing surface of a workpiece by a scratch having a circumferential direction of a surface of a workpiece.
【図3】本発明の超精密鏡面加工方法の代表的実施例を
示す簡略平面図である。FIG. 3 is a simplified plan view showing a typical embodiment of the ultra-precision mirror surface processing method of the present invention.
【図4】同じく他の実施例を示す簡略平面図である。FIG. 4 is a simplified plan view showing another embodiment of the present invention.
【図5】荷重及び走査機構の一例を示す簡略断面図であ
る。FIG. 5 is a simplified cross-sectional view showing an example of a load and scanning mechanism.
【図6】従来例を示す簡略斜視図である。FIG. 6 is a simplified perspective view showing a conventional example.
1 加工体 2 被加工物 3 超微粉体 4 加工面 5 懸濁液 6 軸 7 回転体 8 条痕 9 条痕 10 軸受 11 従動プーリ 12 モータ 13 駆動プーリ 14 ベルト 15 テーブル 16 移動手段 17 スプライン軸 18 荷重機構 19 走査機構 20 開口 21 案内具 22 真空チャック 23 空間部 24 取付面 25 吸込孔 26 フレキシブル
ホース 27 固定部 28 アリ溝 29 アリ 30 案内軸 31 チャック 32 バイト1 Workpiece 2 Workpiece 3 Ultrafine powder 4 Machining surface 5 Suspension 6 Shaft 7 Rotating body 8 Streak 9 Streak 10 Bearing 11 Driven pulley 12 Motor 13 Drive pulley 14 Belt 15 Table 16 Moving means 17 Spline shaft 18 Load mechanism 19 Scanning mechanism 20 Opening 21 Guide tool 22 Vacuum chuck 23 Space 24 Mounting surface 25 Suction hole 26 Flexible hose 27 Fixed part 28 Dovetail groove 29 Dovetail 30 Guide shaft 31 Chuck 32 bytes
Claims (4)
した平面状の加工面を有する被加工物の近傍に、該加工
面と平行となして長尺円柱状の加工体を配するととも
に、該加工体を前記加工面に一定荷重にて押圧しながら
回転させて、該加工面の微小領域に面に沿った方向の懸
濁液流を発生させ、更に前記加工体の軸方向を基準とし
て0〜90度の範囲内の所定角度傾斜した方向へ前記被加
工物を相対的に平行移動させて超微粉体と加工面界面で
の相互作用により面加工を進行してなることを特徴とす
る超精密鏡面加工方法。1. A long cylindrical processing in the vicinity of an object to be processed having a planar processing surface, which is arranged in a suspension in which ultrafine powder is uniformly dispersed, in parallel with the processing surface. A body is placed, and the processed body is rotated while being pressed against the processed surface with a constant load to generate a suspension flow in a direction along the surface in a minute region of the processed surface. The workpiece is relatively moved in parallel in a direction inclined by a predetermined angle within a range of 0 to 90 degrees with reference to the axial direction, and the surface processing is advanced by the interaction between the ultrafine powder and the processing surface interface. An ultra-precision mirror surface processing method characterized by the following.
した平面状の加工面を有する被加工物の近傍に、該加工
面と平行となして長尺円柱状の加工体を配するととも
に、該加工体を前記加工面に一定荷重にて押圧しながら
回転させて、該加工面の微小領域に面に沿った方向の懸
濁液流を発生させ、更に前記加工体を相対的に軸方向へ
往復移動させ且つ被加工物を該加工体の軸方向と略直交
する方向へ相対的に平行移動させて超微粉体と加工面界
面での相互作用により面加工を進行してなることを特徴
とする超精密鏡面加工方法。2. A long columnar processing which is parallel to the processed surface and is provided in the vicinity of a workpiece having a planar processed surface which is disposed in a suspension in which ultrafine powder is uniformly dispersed. A body is placed, and the processed body is rotated while being pressed against the processed surface with a constant load to generate a suspension flow in a direction along the surface in a minute region of the processed surface. Is relatively reciprocally moved in the axial direction and the workpiece is relatively moved in a direction substantially orthogonal to the axial direction of the workpiece to perform surface processing by interaction between the ultrafine powder and the processing surface interface. An ultra-precision mirror surface processing method characterized by being advanced.
タン製の円柱状回転体を配した加工体を用いてなる請求
項1又は2記載の超精密鏡面加工方法。3. The ultra-precision mirror-surface processing method according to claim 1, wherein the processed body is a processed body having a cylindrical rotating body made of polyurethane arranged around a shaft.
の粉体を用いてなる請求項1又は2記載の超精密鏡面加
工方法。4. The ultrafine powder has a particle size of 10 −9 to 10 −6 m.
The ultra-precision mirror surface processing method according to claim 1 or 2, wherein the powder of (1) is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3074029A JPH0596468A (en) | 1991-03-12 | 1991-03-12 | Ultra-precision mirror surface processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3074029A JPH0596468A (en) | 1991-03-12 | 1991-03-12 | Ultra-precision mirror surface processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0596468A true JPH0596468A (en) | 1993-04-20 |
Family
ID=13535306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3074029A Pending JPH0596468A (en) | 1991-03-12 | 1991-03-12 | Ultra-precision mirror surface processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0596468A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0950975A (en) * | 1995-08-07 | 1997-02-18 | Samsung Electron Co Ltd | Wafer polishing equipment |
| WO1999053528A3 (en) * | 1998-04-10 | 2002-01-10 | Silicon Genesis Corp | Surface treatment process and system |
| US6705922B1 (en) * | 1999-12-06 | 2004-03-16 | Renesas Technology Corp. | Method and apparatus for polishing a semiconductor substrate wafer |
| US7150253B2 (en) | 2003-12-22 | 2006-12-19 | Nissan Motor Co., Ltd. | Engine start control system and engine start control method |
-
1991
- 1991-03-12 JP JP3074029A patent/JPH0596468A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0950975A (en) * | 1995-08-07 | 1997-02-18 | Samsung Electron Co Ltd | Wafer polishing equipment |
| WO1999053528A3 (en) * | 1998-04-10 | 2002-01-10 | Silicon Genesis Corp | Surface treatment process and system |
| US6705922B1 (en) * | 1999-12-06 | 2004-03-16 | Renesas Technology Corp. | Method and apparatus for polishing a semiconductor substrate wafer |
| US7150253B2 (en) | 2003-12-22 | 2006-12-19 | Nissan Motor Co., Ltd. | Engine start control system and engine start control method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4441823B2 (en) | Truing method and chamfering device for chamfering grindstone | |
| CN115070549A (en) | Method and apparatus for manufacturing semiconductor device | |
| JP5033066B2 (en) | Polishing apparatus and polishing method for workpiece outer periphery | |
| CN115194581A (en) | Grinding method | |
| JP3426132B2 (en) | Machining non-axisymmetric aspheric surface | |
| JP2000167753A (en) | Method and device for polishing and manufacture of grinding wheel | |
| JPH0596468A (en) | Ultra-precision mirror surface processing method | |
| JPS63267155A (en) | Polishing device | |
| KR102267749B1 (en) | Grindstone for machining circumference of plate and apparatus for chamfering plate | |
| JP2007044817A (en) | Apparatus for chamfering wafer, grinding wheel therefor and truing grinding wheel | |
| JP2007030119A (en) | Wafer chamfering device and wafer chamfering method | |
| JP7158702B2 (en) | chamfering grinder | |
| JPH05177524A (en) | Apparatus and method for rounding edge of semiconductor circular blank | |
| JPH11114800A (en) | Method for specular-polishing cylindrical body | |
| JP4650678B2 (en) | Truing method of chamfering grindstone | |
| JP2007061978A (en) | Truing method for wafer chamfering grinding wheel and wafer chamfering device | |
| JP2007044853A (en) | Method and apparatus for chamfering wafer | |
| JPH0531669A (en) | Grinding machine | |
| JP3261897B2 (en) | Honing head forming method and forming apparatus | |
| JP3407691B2 (en) | Grinding method of cylindrical shape of hard brittle material with belt drive rotation applying method | |
| JPH074747B2 (en) | Method and apparatus for grinding outer peripheral surface of hard and brittle material | |
| JPH07276196A (en) | Centerless grinding method for pipe shape member and device therefor | |
| JPH0753884Y2 (en) | Precision internal grinding machine for cylindrical parts | |
| JP2001150311A (en) | Circumferential processing method and processing apparatus for thin disk | |
| JP2004136416A (en) | Polishing device for edge of work |