JPH059773U - Laser light shaping mechanism - Google Patents
Laser light shaping mechanismInfo
- Publication number
- JPH059773U JPH059773U JP061740U JP6174091U JPH059773U JP H059773 U JPH059773 U JP H059773U JP 061740 U JP061740 U JP 061740U JP 6174091 U JP6174091 U JP 6174091U JP H059773 U JPH059773 U JP H059773U
- Authority
- JP
- Japan
- Prior art keywords
- light
- laser beam
- condenser lens
- laser
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007493 shaping process Methods 0.000 title claims abstract description 10
- 230000007246 mechanism Effects 0.000 title claims description 7
- 238000005553 drilling Methods 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 10
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 230000002411 adverse Effects 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 230000008859 change Effects 0.000 description 4
- 230000001687 destabilization Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
Abstract
(57)【要約】
【目的】 レーザ光による微細穴明加工装置におけるレ
ーザ光の整形手段に関するもので、発振器からの伝送レ
ーザ光に穴明加工に悪影響を及ぼす不安定化状態が生じ
た時に、伝送レーザ光の余剰光を取り除いて真円に近い
状態で集光レンズにレーザ光を送り高精度の加工を可能
とすることを目的としている。
【構成】 発振器から発振されベンドミラー3をもつ光
路を伝送されるレーザ光1が集光レンズ2に至る手前に
複数枚の開口板(アパーチャ)5を配設する。発振器の
熱的平衡状態のくずれや、設定出力条件等のレーザ自体
の特性としてのビームモードの経時変化及び不安定時に
生じた変形した伝送レーザ光が加工中に生じたとき、そ
の余剰光4を集光レンズ2の手前に配した開口板5によ
り取り除く。開口板5により、けり出し光6が生ずる場
合を考慮して次段にも同寸法形状の開口板5を配置し、
けり出し光6を排除する。複数枚の開口板を配置するこ
とにより真円に近い状態の良質なレーザ光を集光レンズ
2に伝送することにより、高精度な安定した微細穴加工
を行なう。
(57) [Abstract] [Purpose] The present invention relates to a laser beam shaping means in a micro-drilling device using a laser beam, and when a destabilized state occurs in the laser beam transmitted from an oscillator, which adversely affects the drilling process, The purpose is to remove surplus light of the transmitted laser light and send the laser light to a condenser lens in a state close to a perfect circle to enable highly accurate processing. [Structure] A plurality of aperture plates (apertures) 5 are arranged in front of a laser beam 1 oscillated from an oscillator and transmitted through an optical path having a bend mirror 3 to reach a condenser lens 2. When the thermal equilibrium state of the oscillator collapses, the beam mode changes over time as a characteristic of the laser itself such as the set output condition, and the deformed transmission laser light generated at the time of instability occurs during processing, the surplus light 4 is removed. It is removed by the aperture plate 5 arranged in front of the condenser lens 2. Considering the case where the projected light 6 is generated by the aperture plate 5, the aperture plate 5 having the same size and shape is arranged in the next stage,
Escape light 6 is excluded. By disposing a plurality of aperture plates and transmitting high-quality laser light in a state close to a perfect circle to the condenser lens 2, highly precise and stable fine hole machining is performed.
Description
【0001】[0001]
本考案はレーザ光による微細穴明加工装置におけるレーザ光の整形手段に関す る。 The present invention relates to a laser beam shaping means in a fine hole drilling apparatus using a laser beam.
【0002】[0002]
従来のレーザによる微細穴明加工は、図3(a)に示すように、発振され伝送 過程にあるレーザ光1をコリメートするなどして伝送し、ベンドミラー3等をも った光路中を通って集光レンズ2まで導き、長焦点等の集光レンズ2を用いてこ れを集光して穴明加工を行う方法が一般的に用いられている。なお図3(b)は 図3(a)のA−A′断面矢視図である。 As shown in FIG. 3 (a), the conventional micro-drilling process transmits the laser beam 1 which is oscillated and is in the process of being transmitted, by collimating and transmitting the laser beam 1 through the optical path having the bend mirror 3 and the like. A method is generally used in which the condenser lens 2 is guided to reach the condenser lens 2, and the condenser lens 2 having a long focal point or the like is used to condense it to perform the drilling process. Note that FIG. 3B is a cross-sectional view taken along the line AA ′ of FIG.
【0003】[0003]
ところで上述のような従来のレーザ光1による微細穴明加工装置により加工を 行うと、真円度の高いビームスポットを設定して加工を行ったにもかかわらず、 ビームスポット径と同径の穴明加工やビームスポット径の寸法に近い穴径加工な どに楕円形状等の変形を生じる場合がある。 By the way, when processing is performed with the conventional fine hole drilling device using the laser light 1 as described above, even though the beam spot with high circularity is set and the processing is performed, a hole having the same diameter as the beam spot diameter is used. Deformation such as elliptical shape may occur during light processing or hole diameter processing close to the beam spot diameter.
【0004】 これは、発振器の熱的平衡状態のくずれや、ピーク出力の高いパルスレーザを 用いる場合などのパルス幅等の影響によるビームモードの経時変化によるものと 考えられ、インライン化の高精度のレーザによる微細穴明加工に難を来たしてい る。It is considered that this is due to the deterioration of the thermal equilibrium state of the oscillator and the change over time of the beam mode due to the influence of the pulse width etc. when using a pulsed laser with a high peak output. There are difficulties in laser drilling.
【0005】 本考案は上記従来技術の問題点を解決し、高精度の加工を可能とした新たなレ ーザ光の整形機構を提供することを目的としている。An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a new laser light shaping mechanism that enables highly accurate processing.
【0006】[0006]
上記目的を達成するため本考案のレーザ光の整形機構は、レーザ光による微細 穴明加工装置において、発振器から発振され光路を伝送されてくるレーザ光を集 光する集光レンズの手前に、伝送過程にあるビームの整形を行なう複数枚の開口 板(アパーチャ)を配設し加工寸法誤差の減少を可能とすることを特徴としてい る。 In order to achieve the above-mentioned object, the laser beam shaping mechanism of the present invention is provided in a laser beam micro-drilling device, in front of a condenser lens for collecting the laser beam oscillated from an oscillator and transmitted through an optical path. It is characterized by arranging a plurality of aperture plates (apertures) that shape the beam in the process so that machining dimensional error can be reduced.
【0007】[0007]
本考案のレーザ光の整形機構によれば、発振器から発振されベンドミラー等に より設けられた光路を伝送されてきた経時変化のともなった不安定モードを含む レーザ光を、集光レンズの手前に設けたあらかじめ健全状態時に設定した伝送過 程のレーザ光の径と同寸法の開口部をもつ開口板(アパーチャ)により、穴加工 に悪影響を与える楕円や変形部を有する伝送レーザ光の余剰光を取り除き真円に 近い状態をもって集光レンズに至らせて集光の後に微細穴明加工に寄与させ高精 度の加工及び加工の安定化を図るものである。 According to the laser beam shaping mechanism of the present invention, the laser beam including the unstable mode accompanied by the temporal change that is oscillated from the oscillator and transmitted through the optical path provided by the bend mirror or the like is provided in front of the condenser lens. The extra light of the transmitted laser light that has an ellipse or a deformed portion that adversely affects hole processing is provided by the aperture plate (aperture) that has the same size as the diameter of the laser light of the transmission distance set in advance in a sound state. By removing the light and bringing it to a condenser lens in a state close to a perfect circle, it contributes to fine drilling processing after light collection to achieve high-precision processing and stabilization of processing.
【0008】[0008]
以下図面により本考案の1実施例について説明すると、図1(a)は本考案の 概略説明図、(b)は(a)のA−A′矢視図、(c)は(a)のB−B′矢視 図を示し、また図2の(a)〜(d)は開口板の具体例の構成を示す正面及び側 面図である。 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 (a) is a schematic explanatory view of the present invention, (b) is a view taken along the line AA 'of (a), and (c) is of (a). 2B is a front view and a side view showing the configuration of a specific example of the aperture plate.
【0009】 図1において、図示しない発振器から発振されて来たレーザ光1を伝送の過程 においてコリメートし平行化した伝送レーザ光1において、発振器の熱的平衡状 態のくずれや、設定出力条件等のレーザ自体の特性としてのビームモードの経時 変化及び不安定時に生じる変形した伝送レーザ光1が加工中に生じた場合、図1 (b)に示すような余剰光4を、集光レンズ2の前方に配した開口板(アパーチ ャ)5により取り除く。なおこの開口板(アパーチャ)5により図1(a)に示 すけり出し光6が生じた場合を考慮して次段に同寸法形状の開口板(アパーチャ )5を配し、このけり出し光6を排除する。In FIG. 1, in the transmitted laser light 1 obtained by collimating and collimating the laser light 1 oscillated from an oscillator (not shown) in the process of transmission, the thermal equilibrium state of the oscillator is disturbed, set output conditions, etc. When the deformed transmission laser light 1 generated during the time change and instability of the beam mode as a characteristic of the laser itself is generated during processing, the surplus light 4 as shown in FIG. It is removed by the aperture plate (aperture) 5 arranged in the front. In consideration of the case where the projected light 6 shown in FIG. 1A is generated by this aperture plate (aperture) 5, an aperture plate (aperture) 5 of the same size and shape is arranged in the next stage. Eliminate 6.
【0010】 これら2連の開口板(アパーチャ)5によりほとんどの余剰光4を取り除くこ とが可能ではあるが、伝送過程においてレーザ光1の平行化に乱れが生じた場合 なども配慮し、複数枚の開口板(アパーチャ)5を配することにより、真円に近 い状態の良質なレーザ光を集光レンズ2に伝送する。伝送されて来たレーザ光を 集光し加工を行うことにより、高精度な安定した微細穴加工を行うことができる 。It is possible to remove most of the surplus light 4 by these two series of aperture plates (apertures) 5. However, in consideration of the case where the parallelization of the laser light 1 occurs during the transmission process, it is possible to avoid By disposing a single aperture plate (aperture) 5, high-quality laser light in a state close to a perfect circle is transmitted to the condenser lens 2. By converging the transmitted laser light and processing it, it is possible to perform highly accurate and stable fine hole processing.
【0011】 またこれに用いる開口板(アパーチャ)5は、図2(a),(b),(c), (d)に示すように、使用する出力条件や要求される加工精度等により、寸法形 状を選定できる。Further, the aperture plate (aperture) 5 used for this, as shown in FIGS. 2 (a), (b), (c), and (d), depends on the output conditions to be used, the required processing accuracy, and the like. The size and shape can be selected.
【0012】 このように本考案のレーザ光整形機構においては、集光レンズ2により集光さ れたビームスポットの状態において、穴明加工に悪影響を与えるビームモードの 経時変化等による不安定化が生じた場合においてあらかじめ健全状態時に設定し た伝送過程のレーザ光1の径と同寸法の開口部をもつ開口板(アパーチャ)5を 集光過程に入る手前、すなわち集光レンズ2前方に配し、モードの不安定化によ り生じた設定以上の寸法、形状を有する伝送レーザ光1の余剰部4をこれにより 取り除かせる。そしてこの開口板(アパーチャ)5は、例えば、伝送レーザ光1 がコリメートされている場合、1枚では開口部のエッヂ形状等により、開口部通 過時にけられて平行化を失う場合があるので、複数枚の組合せとし、順次余剰光 4を排除し平行化、真円化をはかり集光過程に至らせることにより、微細穴明加 工の精度向上及び安定化に寄与させることが出来る。As described above, in the laser beam shaping mechanism of the present invention, in the state of the beam spot condensed by the condenser lens 2, the destabilization due to the temporal change of the beam mode which adversely affects the drilling process is caused. If it occurs, place an aperture plate (aperture) 5 with an opening of the same size as the diameter of the laser beam 1 in the transmission process, which was set in advance in a sound state, before the focusing process, that is, in front of the focusing lens 2. The excess portion 4 of the transmitted laser light 1 having a size and shape larger than the setting caused by the destabilization of the mode is thereby removed. When the transmitted laser beam 1 is collimated, the aperture plate 5 may be eclipsed at the time of passing through the opening and lose its parallelism due to the edge shape of the opening. By combining a plurality of sheets and sequentially eliminating the excess light 4 and collimating and rounding it to reach the light condensing process, it is possible to contribute to the improvement and stabilization of the precision of the fine hole drilling process.
【0013】[0013]
以上述べたように本考案のレーザ光の整形機構によれば、発振器よりの伝送過 程において異常変化した伝送レーザ光の余剰分を集光レンズの手前に配置した開 口板(アパーチャ)により取り除くことにより整形し、安定、かつ、加工寸法誤 差の少ない微細穴明加工を行なうことができる。 As described above, according to the laser beam shaping mechanism of the present invention, the excess portion of the transmitted laser beam that has abnormally changed in the transmission process from the oscillator is removed by the aperture plate (aperture) arranged in front of the condenser lens. By doing so, it is possible to shape and perform stable and fine drilling with less dimensional error.
【図1】本考案の1実施例装置を示し、(a)は概略構
成図、(b)は(a)のA−A′断面矢視図、(c)は
同B−B′断面矢視図である。FIG. 1 shows an apparatus according to one embodiment of the present invention, in which (a) is a schematic configuration diagram, (b) is a sectional view taken along the line AA ′ of (a), and (c) is the sectional view taken along the line BB ′. It is a perspective view.
【図2】(a)〜(d)はいずれも本考案における開口
板の具体例を示す正面図及び側面図である。2 (a) to 2 (d) are a front view and a side view showing a specific example of an aperture plate in the present invention.
【図3】従来装置を示し、(a)は概略構成図、(b)
は(a)におけるA−A′断面矢視図である。FIG. 3 shows a conventional device, (a) is a schematic configuration diagram, (b).
FIG. 7A is a sectional view taken along the line AA ′ in FIG.
1 レーザ光 2 集光レンズ 3 ベンドミラー 4 余剰光 5 開口板(アパーチャ) 6 けり出し光 1 Laser Light 2 Condensing Lens 3 Bend Mirror 4 Excessive Light 5 Aperture Plate 6 Aperture Light
Claims (1)
て、発振器から発振され光路を伝送されてくるレーザ光
を集光する集光レンズの手前に、伝送過程にあるビーム
の整形を行なう複数枚の開口板(アパーチャ)を配設し
たことを特徴とするレーザ光の整形機構。[Claims for utility model registration] 1. In a micro-drilling apparatus using a laser beam, the laser beam is being transmitted before a condenser lens for condensing the laser beam oscillated from the oscillator and transmitted through the optical path. A laser beam shaping mechanism comprising a plurality of aperture plates (apertures) for shaping a beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP061740U JPH059773U (en) | 1991-07-11 | 1991-07-11 | Laser light shaping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP061740U JPH059773U (en) | 1991-07-11 | 1991-07-11 | Laser light shaping mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH059773U true JPH059773U (en) | 1993-02-09 |
Family
ID=13179891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP061740U Withdrawn JPH059773U (en) | 1991-07-11 | 1991-07-11 | Laser light shaping mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH059773U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193374A (en) * | 1993-12-27 | 1995-07-28 | Taiyo Yuden Co Ltd | Method of processing ceramic green sheet |
| JP2002316291A (en) * | 2001-04-18 | 2002-10-29 | Amada Co Ltd | Laser beam machine |
| JP2024539128A (en) * | 2021-12-20 | 2024-10-28 | 上海名古屋精密工具股▲分▼有限公司 | Method and device for correcting path deviation when laser pointing changes, and machine tool |
-
1991
- 1991-07-11 JP JP061740U patent/JPH059773U/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193374A (en) * | 1993-12-27 | 1995-07-28 | Taiyo Yuden Co Ltd | Method of processing ceramic green sheet |
| JP2002316291A (en) * | 2001-04-18 | 2002-10-29 | Amada Co Ltd | Laser beam machine |
| JP2024539128A (en) * | 2021-12-20 | 2024-10-28 | 上海名古屋精密工具股▲分▼有限公司 | Method and device for correcting path deviation when laser pointing changes, and machine tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19951102 |