JPH06125033A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To provide a thin semiconductor device which has excellent resistance against the reflow of solder. CONSTITUTION:Slopes are formed on inner edges of a frame tub 2 supporting a semiconductor element 1 that has corresponding slant sides on which it is bonded to the tub 2 with a bonding agent 6. Since side faces of the element 1 are supported on the slopes of the tub 2, the element 1 can be easily mounted on the tub 2 in a highly stable state. Therefore, the problem encountered when the element is mounted by the conventional technique can be solved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a resin-encapsulated semiconductor device, and more particularly to a semiconductor device which is thin and has excellent solder reflow resistance.

[0002]

2. Description of the Related Art As one of the most effective methods for thinning a semiconductor device and improving solder reflow resistance, as shown in a side sectional view of a semiconductor device in FIG. Utilizing the fact that the adhesiveness of the resin 5 is considerably better than that of the tab 2 and the sealing resin 5, the tab 2 is formed into a frame-like tab, the semiconductor element 1 is fitted therein, and the resin is adhered to the lower surface of the element to form an adhesive interface. There is a method for strengthening the above-mentioned structure, which is known, for example, from Japanese Patent Laid-Open Nos. 58-52852 and 2-119255.

[0003]

Of the above-mentioned conventional techniques,
In the technique described in Japanese Patent Laid-Open No. 58-53852, since the semiconductor element side surface and the frame tab inner side surface are held on the vertical planes of each other, when they are held via an adhesive, the element is heated in a heated atmosphere until the adhesive is cured. If the support method is not proper, the element may be bent and fixed to the frame tab due to the dropout of the element from the frame tab or the looseness caused by the fitting size difference between the two. Also, if a protrusion is provided on the inner side surface of the frame tab to make support unnecessary, it is possible to hold the element on the inner side surface of the frame tab, but it is difficult to fit the element with the conventional suction support, which is a practical problem. Becomes

Further, in the technique disclosed in Japanese Patent Laid-Open No. 2-119255, the side of the frame tab and the side of the element are fixed by shrink fitting by utilizing the difference in linear expansion between the frame tab and the element. In order to fix, it is necessary to mount the element in the frame tab in a heating atmosphere, and it is necessary to support the element until it cools to room temperature. Furthermore, the shrink fit will apply an excessive load to the device.

An object of the present invention is to provide a package structure which can solve the problems when mounting a semiconductor element in these conventional techniques and which is thin and excellent in reflow resistance.

[0006]

The above object is achieved by holding the side surface of the semiconductor element side face and the inner side face of the frame tab in a slanting manner with respect to the thickness direction when the side face is fitted.

The semiconductor device of the present invention comprises a semiconductor element, a tab for supporting the semiconductor element, a lead frame, and a wire for electrically connecting the lead frame and the semiconductor element. In a semiconductor device in which a part and wires are packaged in a resin sealing body, the side surface of the semiconductor element is formed at an oblique portion of the inner side surface of the frame-shaped tab.

[0008]

In the semiconductor device of the present invention, since the side surface of the semiconductor element is supported by the oblique portion of the inner side surface of the frame-shaped tab, the mounting between the element and the tab becomes easier and the mounting stability is improved as compared with the conventional case. .

[0009]

1 is a partial perspective view of a semiconductor element and a frame tab according to a first embodiment of the present invention and a partial sectional view thereof.

In FIG. 1, the semiconductor element 1 is formed by cutting the opposite side surfaces into taper shapes, and the inner side surfaces of the frame tabs 2 which are entirely tapered in the thickness direction are fitted and adhered to each other at their taper surfaces. Fix through agent 6. Adhesive 6
Is applied to the inner side surface of the frame tab 2 so that it does not leak out of the fitting surface, and the semiconductor element 1 is press-fitted to the inner side surface of the frame tab 2 by suction support.

FIG. 4 is a cross-sectional view showing a method of tapering the side surface of the semiconductor element. A suction table 10 capable of suction-supporting the wafer 8 is used with the lower surface of the silicon wafer 8 (the side having no integrated circuit) as the cutting upper surface. To fix. At that time, the wafer 8 is fixed via a protective body 9 that protects the upper surface (on the integrated circuit side). Then, the side surface of the semiconductor element is tapered by cutting the wafer 8 with a blade having a tapered tip. further,
To process the entire side surface of the frame tab 2 into a tapered shape, etching or punching is performed. In the case of etching, it can be achieved by changing the sizes of the mask regions on the upper surface and the lower surface of the tab. In the case of punching, a punching die 11 as shown in FIG. 5 is used for punching, followed by pressing into a taper shape so that the side surface of the frame tab is tapered.

FIG. 2 is a sectional view of the semiconductor device shown in FIG. In FIG. 2, the semiconductor element 1 fixed to the frame tab 2 in the configuration of FIG. 1 and the lead 3 are electrically connected by the metal wire 5. Then, it is sealed with a sealing resin 5 by transfer molding to protect the semiconductor element and the like from the external environment. Further, in order to prevent the rigidity from being reduced by forming the tab into a frame shape, the tab can be thickened within a range not exceeding the thickness of the element.

FIG. 6 is a cross-sectional view of the fitting portion of the semiconductor element and the frame tab according to the first embodiment, in which only the portion where the side surface of the semiconductor element 1 is fitted to the inner side surface of the frame tab 2 in the first embodiment is tapered. Then, the taper surfaces are fixed to each other via a fitting adhesive 6. The side surface shape of the semiconductor element 1 in this case is the same as that of FIG. 4, and is achieved by first chamfering with a blade having a tapered tip to a required thickness, and then cutting the same position by a conventional method. it can.

FIG. 7 is also a side cross-sectional view of the fitting portion of the semiconductor element and the frame tab according to the first embodiment. The inner side surface of the frame tab 2 is punched out in a taper shape from the middle in the thickness direction to form a side surface of the semiconductor element 1. Also, only the portion to be fitted to the inner side surface of the frame tab 2 is tapered, and the taper surfaces are fixed to each other via the fitting adhesive 6.

FIGS. 8 and 9 are sectional views of the semiconductor element and the frame tab fitting portion of the second embodiment of the present invention. Figure 8
In, the frame tab 2 whose inner side surface is entirely tapered with respect to the thickness direction and the semiconductor element 1 whose side surface is vertically cut by the conventional method are fixed to each other with an adhesive 6 between them. At this time, the minimum value of the inner diameter of the frame tab 2 whose inner side surface is a tapered portion is set to be smaller than the outer diameter dimension of the semiconductor element 1. In FIG. 9, the inner side surface of the frame tab 2 is punched out in the middle in the thickness direction in a taper shape, the lower surface of the semiconductor element 1 is held by the taper surface, and the vertical side surfaces thereof are fixed with an adhesive 6. Therefore, also in this case, the minimum value of the inner diameter of the frame tab 1 is set to be smaller than the outer diameter dimension of the semiconductor element 1. The taper angles of the inner side surface of the frame tab and the side surface of the semiconductor element in the embodiments are 70 to 80 degrees in each embodiment.

[0016]

According to the present invention, in the resin-sealed semiconductor device, the side surface of the semiconductor element is held by the oblique surface of the inner side surface of the frame-shaped tab, so that the element tabs can be easily mounted and the mounting stability can be improved. The property is improved, and the problem when mounting the element in the prior art is solved.

[Brief description of drawings]

FIG. 1 is a partial perspective view of a semiconductor device and a frame tab according to a first embodiment of the present invention.

2 is a cross-sectional view of a semiconductor device using FIG.

FIG. 3 is a sectional view of a semiconductor device according to a conventional technique.

FIG. 4 is a cross-sectional view showing a method for tapering the side surface of a semiconductor element.

FIG. 5 is a cross-sectional view of a punching die for processing the tab side surface into a tapered shape.

FIG. 6 is a cross-sectional view of the semiconductor device and the frame tab according to the first embodiment of the present invention.

FIG. 7 is a cross-sectional view of the semiconductor device and the frame tab according to the first embodiment of the present invention.

FIG. 8 is a sectional view of a semiconductor device and a frame tab according to a second embodiment of the present invention.

FIG. 9 is a sectional view of a semiconductor device and a frame tab according to a second embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor element, 2 ... Frame tab, 3 ... Lead, 4 ... Metal wire, 5 ... Sealing resin, 6 ... Adhesive agent, 7 ... Suspension lead, 8 ...
Silicon wafer, 9 ... Wafer protector, 10 ... Suction table, 1
1 ... Punching die.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryuji Kono 502 Jinmachi-cho, Tsuchiura-shi, Ibaraki Pref.

Claims (1)

[Claims] 1. A semiconductor element, a tab for supporting the semiconductor element, a lead frame, a member for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame and the semiconductor element, The tab and the connection member supporting the semiconductor element are sealed with resin,
In a resin-sealed semiconductor device that forms a package,
The tab supporting the semiconductor element is formed in a frame shape, and at least one direction of the frame tab inner side surface has a portion oblique to the thickness direction, and the side surface of the semiconductor element is opposed to at least one direction. A resin-encapsulated semiconductor device, characterized in that it has diagonal portions with respect to the thickness direction, and the diagonal portions are fitted together.