JPH06127583A - Semiconductor device carrier - Google Patents
Semiconductor device carrierInfo
- Publication number
- JPH06127583A JPH06127583A JP28319392A JP28319392A JPH06127583A JP H06127583 A JPH06127583 A JP H06127583A JP 28319392 A JP28319392 A JP 28319392A JP 28319392 A JP28319392 A JP 28319392A JP H06127583 A JPH06127583 A JP H06127583A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- adhesive
- electromagnetic wave
- base
- transporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packages (AREA)
Abstract
(57)【要約】
【目的】 搬送過程で半導体装置が突発的且つ過大な衝
撃を受けてもそのリード線を傷めることなく、また搬送
器具から半導体装置が飛び出したりすることなく半導体
装置を搬送することができ、更に、実装時には、半導体
装置を搬送器具から簡単に且つ迅速に取り出すことがで
きる半導体装置の搬送器具を提供する。
【構成】 本半導体装置の搬送器具は、半導体装置３を
個別に収納する収納ポケット２を複数有するキャリアテ
ープ１と、収納ポケット２に収納された半導体装置３を
被覆するカバーテープ４とを備え、キャリアテープ１を
光を透過しない非透過性材料によって形成し且つ収納ポ
ケット２に透孔７を設けると共に、透孔７からの光を受
ける部位に光劣化性接着剤８を設け、この光劣化性接着
剤８により半導体装置３を収納ポケット２に固定したも
のである。
(57) [Abstract] [Purpose] A semiconductor device is transported without damaging its lead wires even when the semiconductor device is suddenly and excessively shocked during the transportation process, and without the semiconductor device jumping out of a transportation tool. (EN) Provided is a semiconductor device transporting tool capable of easily and quickly taking out a semiconductor device from a transporting tool at the time of mounting. A semiconductor device transport tool includes a carrier tape 1 having a plurality of storage pockets 2 for individually storing the semiconductor devices 3, and a cover tape 4 for covering the semiconductor devices 3 stored in the storage pockets 2. The carrier tape 1 is made of a non-transmissive material that does not transmit light, the through-hole 7 is provided in the storage pocket 2, and the photo-degradable adhesive 8 is provided at a portion for receiving light from the through-hole 7. The semiconductor device 3 is fixed to the storage pocket 2 with the adhesive 8.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置を搬送する
際に用いられる半導体装置の搬送器具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device carrying tool used for carrying a semiconductor device.
【０００２】[0002]
【従来の技術】従来のこの種の搬送器具としては、例え
ば、図８に示すエンボスタイプのテープアンドリール梱
包形式のものが知られている。そこで、従来のテープア
ンドリール梱包形式の半導体装置の搬送器具について図
８を参照しながら説明する。同図において、１は縦列に
形成された収納ポケット２それぞれに複数の半導体装置
３を個別に収納するキャリアテープ、４はこのキャリア
テープ１の各収納ポケット２に収納された半導体装置３
を被覆するカバーテープ、５はこのカバーテープ４を上
記キャリアテープ１にその両側縁部で接着する接着剤、
６は各接着剤５の外側で上記キャリアテープ１及び上記
カバーテープ４に所定間隔を持って形成された送り穴で
ある。2. Description of the Related Art As a conventional transporting instrument of this type, for example, an embossing type tape-and-reel packing type shown in FIG. 8 is known. Therefore, a conventional tape-and-reel packaging type semiconductor device transport tool will be described with reference to FIG. In FIG. 1, 1 is a carrier tape for individually storing a plurality of semiconductor devices 3 in each of the storage pockets 2 formed in a column, and 4 is a semiconductor device 3 stored in each storage pocket 2 of the carrier tape 1.
A cover tape 5 for covering the cover tape 4 with an adhesive agent for adhering the cover tape 4 to the carrier tape 1 at both side edges thereof,
Reference numeral 6 is a feed hole formed on the outside of each adhesive 5 in the carrier tape 1 and the cover tape 4 at a predetermined interval.
【０００３】従って、従来の半導体装置の搬送器具で半
導体装置３を搬送する際には、キャリアテープ１の各収
納ポケット２に半導体装置３を個別に収納し、更に、こ
のキャリアテープ１にカバーテープ４を接着剤５で接着
し、このカバーテープ４で半導体装置３を被覆すること
によって上記両テープ１、４で半導体装置３を個別に梱
包した状態で後工程の実装機等まで搬送するようにして
いる。そして、キャリアテープ１の各収納ポケット２内
に収納された半導体装置３は、通常固定されることなく
フリーな状態で各収納ポケット２内に収納されている。Therefore, when the semiconductor device 3 is transported by the conventional semiconductor device transport tool, the semiconductor device 3 is individually stored in each storage pocket 2 of the carrier tape 1, and the carrier tape 1 is covered with the cover tape. 4 is adhered with an adhesive 5 and the semiconductor device 3 is covered with the cover tape 4 so that the semiconductor devices 3 are individually packaged with the both tapes 1 and 4 and transported to a mounting machine or the like in a subsequent process. ing. The semiconductor device 3 stored in each storage pocket 2 of the carrier tape 1 is normally stored in each storage pocket 2 in a free state without being fixed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
半導体装置の搬送器具の場合には、上述のように半導体
装置３はキャリアテープ１の収納ポケット２内における
収納状態が不安定であるため、その搬送過程で半導体装
置３に突発的に衝撃が加わったりすると、この衝撃力に
よって半導体装置３が収納ポケット２内で上下左右に急
激に動き収納ポケット２内で衝突して半導体装置３のリ
ード線を損傷したり、また接着剤５の劣化などによって
半導体装置３がその収納ポケット２から飛び出すなどの
不具合を生じるという課題があった。However, in the case of the conventional semiconductor device carrier, as described above, the semiconductor device 3 is unstable in the storage state of the carrier tape 1 in the storage pocket 2. If a shock is suddenly applied to the semiconductor device 3 during the transportation process, the shock force causes the semiconductor device 3 to move abruptly up, down, left, and right in the storage pocket 2 and collide in the storage pocket 2 so that the lead wire of the semiconductor device 3 is damaged. There is a problem in that the semiconductor device 3 may be damaged, or the semiconductor device 3 may pop out of the storage pocket 2 due to deterioration of the adhesive 5.
【０００５】また、上述の不具合を解決するためにキャ
リアテープ１の各収納ポケット２内で半導体装置３を接
着剤で強固に固定して半導体装置３を安定化する方法も
あるが、この場合には接着剤の接着強度の選定が難し
く、例えば接着強度を強くすると実装時に収納ポケット
２から半導体装置３を取り出し難くなり、また、接着強
度が弱いと搬送途上で接着具合が悪くなって半導体装置
３の収納状態が上述のように不安定になってしまうなど
という課題があった。There is also a method of stabilizing the semiconductor device 3 by firmly fixing the semiconductor device 3 with an adhesive in each storage pocket 2 of the carrier tape 1 in order to solve the above-mentioned problems. It is difficult to select the adhesive strength of the adhesive. For example, if the adhesive strength is high, it becomes difficult to take out the semiconductor device 3 from the storage pocket 2 at the time of mounting. However, there is a problem that the storage state becomes unstable as described above.
【０００６】本発明は、上記課題を解決するためになさ
れたもので、搬送過程で半導体装置が突発的且つ過大な
衝撃を受けても初期の収納状態を維持して半導体装置の
リード線を傷めることがなく、また搬送器具から半導体
装置が飛び出したりすることなく半導体装置を搬送する
ことができ、更に、実装時には半導体装置を搬送器具か
ら容易に取り出すことができる半導体装置の搬送器具を
提供することを目的としている。The present invention has been made to solve the above problems, and maintains the initial storage state even if the semiconductor device is suddenly and excessively shocked during the transportation process and damages the lead wire of the semiconductor device. To provide a semiconductor device transporting tool capable of transporting a semiconductor device without causing the semiconductor device to pop out of the transporting tool and easily removing the semiconductor device from the transporting tool at the time of mounting. It is an object.
【０００７】[0007]
【課題を解決するための手段】本発明の請求項１に記載
の半導体装置の搬送器具は、基台を電磁波が透過しない
非透過性材料によって形成し且つ収納部に透孔を設ける
と共に、上記透孔からの電磁波を受ける部位に電磁波劣
化性接着剤を設け、この電磁波劣化性接着剤により上記
半導体装置を上記収納ポケットに固定したものである。According to a first aspect of the present invention, there is provided a semiconductor device transporting instrument, wherein the base is made of a non-transparent material that does not allow electromagnetic waves to pass therethrough, and a through hole is provided in the storage portion. An electromagnetic wave-deteriorating adhesive is provided in a portion that receives an electromagnetic wave from the through hole, and the semiconductor device is fixed to the storage pocket by the electromagnetic wave-deteriorating adhesive.
【０００８】また、本発明の請求項２に記載の半導体装
置の搬送器具は、基台を電磁波透過性材料によって形成
すると共に、半導体装置を電磁波劣化性接着剤によって
収納部に固定したものである。According to a second aspect of the present invention, there is provided a semiconductor device transporting tool in which a base is formed of an electromagnetic wave permeable material and the semiconductor device is fixed to a storage portion by an electromagnetic wave deterioration adhesive. .
【０００９】また、本発明の請求項３に記載の半導体装
置の搬送器具は、被覆体を電磁波劣化性接着剤によって
基台に接着したものである。According to a third aspect of the present invention, there is provided a semiconductor device transporting instrument in which a cover is adhered to a base with an electromagnetic wave deterioration adhesive.
【００１０】[0010]
【作用】本発明の請求項１に記載の発明によれば、収納
部の透孔からの電磁波を受ける部位に電磁波劣化性接着
剤を設け、この電磁波劣化性接着剤により半導体装置を
上記収納部に固定してあるため、半導体装置の搬送過程
では半導体装置を安定した状態で搬送することができ、
半導体装置の実装時には透孔から電磁波を照射すると、
この電磁波が電磁波劣化性接着剤に照射されてこれを劣
化させ、半導体装置をその収納部から容易に取り出すこ
とができる。According to the first aspect of the present invention, an electromagnetic wave-deteriorating adhesive is provided at a portion of the housing portion that receives an electromagnetic wave from the through hole, and the semiconductor device is provided with the electromagnetic wave-degrading adhesive. Since it is fixed to the semiconductor device, the semiconductor device can be stably transported during the transportation process of the semiconductor device.
When electromagnetic waves are emitted from the through holes when mounting the semiconductor device,
This electromagnetic wave irradiates the electromagnetic wave-deteriorating adhesive agent to deteriorate it, and the semiconductor device can be easily taken out from the housing portion.
【００１１】また、本発明の請求項２に記載の発明によ
れば、基台を電磁波透過性材料で形成し、半導体装置を
電磁波劣化性接着剤によって収納部に固定してあるた
め、半導体装置の搬送過程では半導体装置を安定した状
態で搬送することができ、半導体装置の実装時には電磁
波透過性の基台へ電磁波を照射すると、この電磁波が基
台を透過して電磁波劣化性接着剤を劣化させ、半導体装
置をその収納部から容易に取り出すことができる。Further, according to the second aspect of the present invention, the base is made of the electromagnetic wave permeable material, and the semiconductor device is fixed to the housing portion by the electromagnetic wave deterioration adhesive. The semiconductor device can be transported in a stable state during the transportation process, and when the semiconductor device is mounted, if an electromagnetic wave radiating base is irradiated with electromagnetic waves, the electromagnetic waves pass through the base and deteriorate the electromagnetic wave deterioration adhesive. Therefore, the semiconductor device can be easily taken out from the storage portion.
【００１２】また、本発明の請求項３に記載の発明によ
れば、被覆体を電磁波劣化性接着剤によって基台に接着
したため、半導体装置の実装時に電磁波劣化性接着剤に
電磁波を照射すれば、被覆体を基台から簡単に取り外す
ことができる。According to the third aspect of the present invention, since the covering body is adhered to the base by the electromagnetic wave degrading adhesive, it is possible to irradiate the electromagnetic wave degrading adhesive with electromagnetic waves when the semiconductor device is mounted. , The cover can be easily removed from the base.
【００１３】[0013]
【実施例】以下、図１〜図７に示す実施例に基づいて従
来と同一または相当部分には同一符号を付して本発明を
説明する。尚、各図中、図１は本発明の半導体装置の搬
送器具の一実施例を示す図で、同図（ａ）はその平面
図、同図（ｂ）はその長手方向の断面図、図２は本発明
の半導体装置の搬送器具の他の実施例を示す図で、同図
（ａ）はその平面図、同図（ｂ）はその長手方向の断面
図、図３は本発明の半導体装置の搬送器具の更に他の実
施例を示す図で、同図（ａ）はその平面図、同図（ｂ）
はその長手方向の断面図、図４は本発明の半導体装置の
搬送器具の更に他の実施例を示す図で、同図（ａ）はそ
の平面図、同図（ｂ）はその長手方向の断面図、図５は
本発明の半導体装置の搬送器具の更に他の実施例を示す
図で、同図（ａ）はその平面図、同図（ｂ）はその長手
方向の断面図、図６は本発明の半導体装置の搬送器具の
更に他の実施例を示す図で、同図（ａ）はその平面図、
同図（ｂ）はその長手方向の断面図、図７は本発明の半
導体装置の搬送器具の更に他の実施例を示す平面図であ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. In each of the drawings, FIG. 1 is a diagram showing an embodiment of a carrier for semiconductor devices according to the present invention. FIG. 1A is a plan view thereof, and FIG. 1B is a longitudinal sectional view thereof. 2A and 2B are views showing another embodiment of the semiconductor device transporting tool of the present invention. FIG. 2A is a plan view thereof, FIG. 2B is a longitudinal sectional view thereof, and FIG. It is a figure which shows another Example of the conveyance tool of an apparatus, the figure (a) is the top view, the figure (b).
FIG. 4 is a longitudinal sectional view thereof, FIG. 4 is a view showing still another embodiment of the semiconductor device transporting tool of the present invention, FIG. 4 (a) is its plan view, and FIG. 4 (b) is its longitudinal direction. 5 is a cross-sectional view, FIG. 5 is a view showing still another embodiment of the semiconductor device transporting tool of the present invention. FIG. 6 (a) is its plan view, FIG. 5 (b) is its longitudinal cross-sectional view, and FIG. Is a diagram showing still another embodiment of the semiconductor device transport tool of the present invention, and FIG.
FIG. 7B is a longitudinal sectional view thereof, and FIG. 7 is a plan view showing still another embodiment of the semiconductor device transporting tool of the present invention.
【００１４】実施例１．本実施例の半導体装置の搬送器
具は、図１に示すように、半導体装置３を個別に収納す
る収納部としての収納ポケット２を複数有する、基台と
してのキャリアテープ１と、このキャリアテープ１の収
納ポケット２に収納された半導体装置３を被覆する被覆
体としてのカバーテープ４とを備えて構成されている。
そして、上記カバーテープ４は、その両側縁部が接着剤
５、５によって上記キャリアテープ１に接着され、上記
キャリアテープ１の各収納ポケット２に収納された半導
体装置３を被覆している。また、上記キャリアテープ１
及び上記カバーテープ４の両側縁部にはそれぞれの接着
部の外側に縦列に所定間隔毎に送り穴６が形成され、各
送り穴６を介して搬送器具を移送するように構成されて
いる。Example 1. As shown in FIG. 1, a carrier device for a semiconductor device according to the present embodiment has a carrier tape 1 as a base having a plurality of storage pockets 2 as storage parts for individually storing the semiconductor devices 3, and the carrier tape 1. And a cover tape 4 as a cover for covering the semiconductor device 3 housed in the housing pocket 2.
Both side edges of the cover tape 4 are adhered to the carrier tape 1 with adhesives 5 and 5, and cover the semiconductor device 3 housed in each housing pocket 2 of the carrier tape 1. In addition, the carrier tape 1
Further, feed holes 6 are formed at predetermined intervals in columns outside the respective adhesive portions on both side edges of the cover tape 4, and are configured to transfer the transporting device through the feed holes 6.
【００１５】また、上記キャリアテープ１は、電磁波で
ある光を透過しない非透過性材料によって形成されてい
る。また、上記キャリアテープ１の各収納ポケット２の
中央には、透孔７がそれぞれ形成されていると共に、上
記透孔７からの入射する光を受ける部位、つまり各収納
ポケット２を内面から上記透孔７を覆う部位に光劣化性
接着剤８が設けられている。そして、この電磁波劣化性
接着剤である光劣化性接着剤８は、紫外線を照射するこ
とによりその接着強度が著しく劣化する接着剤で、この
光劣化性接着剤８としては、例えば市販品の、いわゆる
ＵＶテープ（バンドー化学（株）製、日東化学工業
（株）製等）を用いることができる。The carrier tape 1 is made of a non-transmissive material that does not transmit light which is electromagnetic waves. A through hole 7 is formed at the center of each storage pocket 2 of the carrier tape 1, and a portion for receiving the light incident from the through hole 7, that is, each storage pocket 2 is transparent from the inner surface. A photo-deteriorating adhesive 8 is provided on the portion covering the hole 7. The photo-degradable adhesive 8, which is the electromagnetic wave-degradable adhesive, is an adhesive whose adhesive strength is significantly deteriorated by irradiation with ultraviolet rays. As the photo-degradable adhesive 8, for example, a commercially available product is used. So-called UV tape (manufactured by Bando Chemical Co., Ltd., Nitto Chemical Co., Ltd., etc.) can be used.
【００１６】そして、上記半導体装置３は、上記光劣化
性接着剤８によって上記収納ポケット２の底面に固定さ
れている。従って、上記半導体装置３の搬送過程では上
記半導体装置３は上記光劣化性接着剤８によって固定さ
れ、上記半導体装置３の実装時には光を上記透孔７から
透過して上記光劣化性接着剤８に光を照射し、この光劣
化性接着剤８を劣化させてその接着強度を弱くするよう
に構成されている。The semiconductor device 3 is fixed to the bottom surface of the storage pocket 2 by the photo-degradable adhesive 8. Therefore, in the process of transporting the semiconductor device 3, the semiconductor device 3 is fixed by the photo-degradable adhesive 8, and when the semiconductor device 3 is mounted, light is transmitted through the through hole 7 and the photo-degradable adhesive 8 is provided. The photo-deteriorating adhesive 8 is irradiated with light to deteriorate the adhesive strength and weaken the adhesive strength.
【００１７】従って、上記半導体装置の搬送器具を用い
て半導体装置３を搬送する際には、半導体装置３はキャ
リアテープ１の収納ポケット２内で光劣化性接着剤８に
よって固定されているため、半導体装置３が突発的且つ
過大な衝撃を受けてもそのリード線を傷めたり、また収
納ポケット２から半導体装置３が飛び出したりすること
なく半導体装置を搬送することができる。また、上記半
導体装置３の搬送後の実装時には、半導体装置３に光を
収納ポケット２から照射し、この光によって光劣化性接
着剤８を反応させて劣化させれば、半導体装置３をその
収納ポケット２から容易に取り出すことができる。Therefore, when the semiconductor device 3 is transported using the above-described semiconductor device transport tool, the semiconductor device 3 is fixed in the storage pocket 2 of the carrier tape 1 by the photo-degradable adhesive 8. Even if the semiconductor device 3 is suddenly and excessively shocked, the semiconductor device 3 can be transported without damaging the lead wire thereof or protruding the semiconductor device 3 from the storage pocket 2. When the semiconductor device 3 is mounted after being transported, the semiconductor device 3 is accommodated by irradiating the semiconductor device 3 with light from the storage pocket 2 and causing the photo-degradable adhesive 8 to react and deteriorate. It can be easily taken out from the pocket 2.
【００１８】実施例２．本実施例の半導体装置の搬送器
具は、図２に示すように、キャリアテープ１及びカバー
テープ４を光透過性材料によって形成すると共に、キャ
リアテープ１の収納ポケット２に透孔を設けずにその底
面両側に光劣化性接着剤８、８を塗布した以外は実施例
１と同様に構成されている。Example 2. As shown in FIG. 2, the semiconductor device carrying tool of the present embodiment has the carrier tape 1 and the cover tape 4 formed of a light-transmissive material, and the storage pocket 2 of the carrier tape 1 is not provided with a through hole. The structure is the same as in Example 1 except that the photo-deteriorating adhesives 8, 8 are applied to both sides of the bottom surface.
【００１９】従って本実施例によれば、光を照射する位
置が実施例１の場合のように透孔７に拘束されず、光を
キャリアテープ１の下方からでもカバーテープ４の上方
からでも照射することができ、かかる光の照射によって
光劣化性接着剤８、８を劣化させることができ、実施例
１と同様の作用効果を期することができる。Therefore, according to this embodiment, the light irradiation position is not restricted by the through hole 7 as in the case of the first embodiment, and the light is irradiated from below the carrier tape 1 or above the cover tape 4. The photodegradable adhesives 8, 8 can be deteriorated by the irradiation of such light, and the same effect as that of the first embodiment can be expected.
【００２０】実施例３．本実施例の半導体装置の搬送器
具は、図３に示すように、光劣化性接着剤８をキャリア
テープ１の収納ポケット２底面中央に塗布した以外は実
施例２と同様に構成されている。従って、本実施例にお
いても実施例２と同様の作用効果を期することができ
る。Example 3. As shown in FIG. 3, the semiconductor device transport tool of this embodiment has the same structure as that of the second embodiment except that the photo-deteriorating adhesive 8 is applied to the center of the bottom surface of the storage pocket 2 of the carrier tape 1. Therefore, also in the present embodiment, it is possible to obtain the same effects as those of the second embodiment.
【００２１】実施例４．本実施例の半導体装置の搬送器
具は、図４に示すように、光劣化性接着剤８をキャリア
テープ１の収納ポケット２底面に点状に４箇所塗布した
以外は実施例２及び３と同様に構成されている。従っ
て、本実施例においても実施例２、３と同様の作用効果
を期することができる。Example 4. As shown in FIG. 4, the semiconductor device transport tool of this example is the same as that of Examples 2 and 3 except that the photo-deteriorating adhesive 8 is applied to the bottom of the storage pocket 2 of the carrier tape 1 at four spots. Is configured. Therefore, also in this embodiment, it is possible to obtain the same effects as those of the second and third embodiments.
【００２２】実施例５．本実施例の半導体装置の搬送器
具は、図５に示すように、キャリアテープ１とカバーテ
ープ４を光に反応する光劣化性接着剤５Ａ、５Ａによっ
て接着した以外は実施例２と同様に構成されている。従
って、本実施例によれば、半導体装置３の実装時に光を
照射すれば、キャリアテープ１とカバーテープ４を接着
する光劣化性接着剤５Ａ、５Ａ及び半導体装置３を収納
ポケット２に固定する光劣化性接着剤８、８が共に劣化
してキャリアテープ１からカバーテープ４を迅速に取り
外すことができ、上記各実施例の場合よりも簡単に半導
体装置３を実装でき、更に上記各実施例と同様の作用効
果を期することができる。Embodiment 5. As shown in FIG. 5, the semiconductor device carrying tool of the present embodiment has the same configuration as that of the second embodiment except that the carrier tape 1 and the cover tape 4 are bonded by the photodegradable adhesives 5A and 5A that react with light. Has been done. Therefore, according to this embodiment, if the semiconductor device 3 is mounted with light, the photo-deteriorating adhesives 5A and 5A for bonding the carrier tape 1 and the cover tape 4 and the semiconductor device 3 are fixed to the storage pocket 2 by irradiating light. Since the photo-degradable adhesives 8 and 8 are both deteriorated, the cover tape 4 can be quickly removed from the carrier tape 1, and the semiconductor device 3 can be mounted more easily than in the case of each of the above-mentioned embodiments. The same action and effect as can be expected.
【００２３】実施例６．本実施例の半導体装置の搬送器
具は、図６に示すように、トレータイプの搬送器具であ
り、光透過性材料によって形成されたトレー９には半導
体装置３を収納する収納ポケット２が縦列に２列配置さ
れ、各収納ポケット２の長手方向の両側に光劣化性接着
剤８、８が塗布されて、各収納ポケット２内に半導体装
置３を固定した状態で搬送できるように構成されてい
る。本実施例の半導体装置の搬送器具は、カバーがな
く、光を照射して光劣化性接着剤８、８を劣化させるこ
とにより各収納ポケット２から半導体装置３を直接取り
出せるように構成されている。本実施例においても上記
各実施例に準じた作用効果を期することができる。Example 6. As shown in FIG. 6, the semiconductor device transport tool of the present embodiment is a tray type transport tool, and storage trays 2 for storing the semiconductor devices 3 are arranged in a row in a tray 9 formed of a light transmissive material. It is arranged in two rows, and the photo-deteriorating adhesives 8 are applied to both sides of each storage pocket 2 in the longitudinal direction so that the semiconductor device 3 can be transported in a fixed state in each storage pocket 2. . The semiconductor device carrying tool of this embodiment does not have a cover and is configured so that the semiconductor device 3 can be directly taken out from each storage pocket 2 by irradiating light to deteriorate the photo-degradable adhesives 8, 8. . Also in this embodiment, it is possible to achieve the same effects as the above embodiments.
【００２４】実施例７．本実施例の半導体装置の搬送器
具は、図７に示すように、光劣化性接着剤８が塗布され
た粘着テープまたは紙テープ１０の光劣化性接着剤８の
塗布面に半導体装置３を直接接着して固定するように構
成されている。本実施例では光による光劣化性接着剤８
の劣化作用が多少劣るが、従来に比べれば、搬送過程で
の半導体装置３の固定及び実装時の半導体装置３の取り
外しに優れた効果を期することができる。Example 7. As shown in FIG. 7, the semiconductor device transport tool according to the present embodiment directly adheres the semiconductor device 3 to the adhesive tape or paper tape 10 coated with the photo-deteriorating adhesive 8 on the surface on which the photo-degrading adhesive 8 is applied. Then, it is configured to be fixed. In this embodiment, the light-degradable adhesive 8
Although the deterioration effect of 1. is slightly inferior, it is possible to expect an excellent effect in fixing the semiconductor device 3 in the carrying process and detaching the semiconductor device 3 at the time of mounting as compared with the conventional case.
【００２５】尚、上記実施例では電磁波として光を用い
た場合について説明したが、電磁波として電波を用い、
電波の照射により劣化する接着剤であってもよいし、熱
により劣化する接着剤であってもよい。In the above embodiment, the case where light is used as the electromagnetic wave has been described, but radio waves are used as the electromagnetic wave.
It may be an adhesive that deteriorates by irradiation of radio waves or an adhesive that deteriorates by heat.
【００２６】[0026]
【発明の効果】以上説明したように本発明の請求項１に
記載の発明によれば、半導体装置を基台の収納部にその
透孔からの電磁波を受ける部位に設けられた電磁波劣化
性接着剤により固定してあるため、搬送過程で半導体装
置が突発的且つ過大な衝撃を受けても初期の収納状態を
維持して半導体装置のリード線を傷めることがなく、ま
た搬送器具から半導体装置が飛び出したりすることなく
半導体装置を搬送することができ、更に、実装時には半
導体装置を搬送器具から容易に取り出すことができる半
導体装置の搬送器具を提供することができる。As described above, according to the first aspect of the present invention, the semiconductor device is provided with an electromagnetic wave-deteriorating adhesive which is provided in a portion for receiving an electromagnetic wave from the through hole in the housing of the base. Since the semiconductor device is fixed by the agent, even if the semiconductor device is suddenly and excessively shocked during the transportation process, the initial storage state is maintained and the lead wire of the semiconductor device is not damaged. It is possible to provide a semiconductor device transporting tool that can transport a semiconductor device without popping out and can easily take out the semiconductor device from the transporting tool during mounting.
【００２７】また、本発明の請求項２に記載の発明によ
れば、基台を電磁波透過性材料で形成し、半導体装置を
電磁波劣化性接着剤によって収納部に固定してあるた
め、請求項１に記載の発明と同様の半導体装置の搬送器
具を提供することができる。According to the second aspect of the present invention, the base is formed of the electromagnetic wave permeable material, and the semiconductor device is fixed to the storage portion by the electromagnetic wave deterioration adhesive. It is possible to provide the same semiconductor device transporting tool as that of the invention described in 1.
【００２８】また、本発明の請求項３に記載の発明によ
れば、被覆体を電磁波劣化性接着剤によって基台に接着
したため、実装時に被覆体を基台から上記各発明よりも
容易に取り出すことができる半導体装置の搬送器具を提
供することができる。According to the third aspect of the present invention, the cover is adhered to the base with the electromagnetic wave degrading adhesive, so that the cover can be taken out of the base more easily than the above inventions during mounting. It is possible to provide a semiconductor device transporting tool.
【図１】本発明の半導体装置の搬送器具の一実施例を示
す図で、同図（ａ）はその平面図、同図（ｂ）はその長
手方向の断面図である。1A and 1B are views showing an embodiment of a semiconductor device transport tool of the present invention, FIG. 1A being a plan view thereof, and FIG. 1B being a longitudinal sectional view thereof.
【図２】本発明の半導体装置の搬送器具の他の実施例を
示す図で、同図（ａ）はその平面図、同図（ｂ）はその
長手方向の断面図である。2A and 2B are views showing another embodiment of the semiconductor device transporting tool of the present invention, FIG. 2A being a plan view thereof, and FIG. 2B being a longitudinal sectional view thereof.
【図３】本発明の半導体装置の搬送器具の更に他の実施
例を示す図で、同図（ａ）はその平面図、同図（ｂ）は
その長手方向の断面図である。3A and 3B are views showing still another embodiment of the semiconductor device transporting tool of the present invention, wherein FIG. 3A is a plan view thereof, and FIG. 3B is a longitudinal sectional view thereof.
【図４】本発明の半導体装置の搬送器具の更に他の実施
例を示す図で、同図（ａ）はその平面図、同図（ｂ）は
その長手方向の断面図である。4A and 4B are views showing still another embodiment of the semiconductor device transporting tool of the present invention, wherein FIG. 4A is a plan view thereof and FIG. 4B is a longitudinal sectional view thereof.
【図５】本発明の半導体装置の搬送器具の更に他の実施
例を示す図で、同図（ａ）はその平面図、同図（ｂ）は
その長手方向の断面図である。5A and 5B are views showing still another embodiment of the semiconductor device transporting tool of the present invention, in which FIG. 5A is a plan view thereof and FIG. 5B is a longitudinal sectional view thereof.
【図６】本発明の半導体装置の搬送器具の更に他の実施
例を示す図で、同図（ａ）はその平面図、同図（ｂ）は
その長手方向の断面図である。6A and 6B are views showing still another embodiment of the semiconductor device transporting tool of the present invention, wherein FIG. 6A is a plan view thereof and FIG. 6B is a longitudinal sectional view thereof.
【図７】本発明の半導体装置の搬送器具の更に他の実施
例を示す平面図である。FIG. 7 is a plan view showing still another embodiment of the carrier for semiconductor device according to the present invention.
【図８】従来の半導体装置の搬送器具の一例を示す図
で、同図（ａ）はその平面図、同図（ｂ）はその長手方
向の断面図である。8A and 8B are views showing an example of a conventional semiconductor device transport tool, in which FIG. 8A is a plan view thereof, and FIG. 8B is a longitudinal sectional view thereof.
１ キャリアテープ（基台） ２ 収納ポケット（収納部） ３ 半導体装置 ４ カバーテープ（被覆体） ５Ａ 光劣化性接着剤（電磁波劣化性接着剤） ７ 透孔 ８ 光劣化性接着剤（電磁波劣化性接着剤） ９ トレー（基台） 1 Carrier Tape (Base) 2 Storage Pocket (Storage) 3 Semiconductor Device 4 Cover Tape (Coating) 5A Photodegradable Adhesive (Electromagnetic Wave Degradable Adhesive) 7 Through Hole 8 Photodegradable Adhesive (Electromagnetic Wave Degradable) Adhesive) 9 trays (base)
Claims (3)
送する基台を有する半導体装置の搬送器具において、上
記基台を電磁波が透過しない非透過性材料によって形成
し且つ上記収納部に透孔を設けると共に、上記透孔から
の電磁波を受ける部位に電磁波劣化性接着剤を設け、こ
の電磁波劣化性接着剤により上記半導体装置を上記収納
ポケットに固定したことを特徴とする半導体装置の搬送
器具。1. A transporting device for a semiconductor device having a base for individually storing and transporting a semiconductor device in a storage unit, wherein the base is formed of an impermeable material that does not allow electromagnetic waves to pass through and is transparent to the storage unit. An apparatus for conveying a semiconductor device, characterized in that a hole is provided and an electromagnetic wave-deteriorating adhesive is provided at a portion for receiving an electromagnetic wave from the through hole, and the semiconductor device is fixed to the storage pocket by the electromagnetic-wave-deteriorating adhesive. .
送する基台を有する半導体装置の搬送器具において、上
記基台を電磁波透過性材料によって形成すると共に、上
記半導体装置を電磁波劣化性接着剤によって上記収納部
に固定したことを特徴とする半導体装置の搬送器具。2. A semiconductor device transporting tool having a base for individually storing and transporting a semiconductor device in a storage portion, wherein the base is formed of an electromagnetic wave permeable material, and the semiconductor device is bonded by an electromagnetic wave deterioration. A semiconductor device carrying device, characterized in that it is fixed to the above-mentioned storage portion by means of an agent.
する基台と、この基台の収納部に収納された半導体装置
を被覆する被覆体とを備えた半導体装置の搬送器具にお
いて、上記被覆体を電磁波劣化性接着剤によって上記基
台に接着したことを特徴とする半導体装置の搬送器具。3. A carrier for semiconductor device, comprising: a base having an accommodating portion for accommodating the semiconductor device individually; and a covering body for covering the semiconductor device accommodated in the accommodating portion of the base, wherein the covering is provided. A carrier device for a semiconductor device, characterized in that a body is bonded to the base with an electromagnetic wave deterioration adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28319392A JPH06127583A (en) | 1992-10-21 | 1992-10-21 | Semiconductor device carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28319392A JPH06127583A (en) | 1992-10-21 | 1992-10-21 | Semiconductor device carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06127583A true JPH06127583A (en) | 1994-05-10 |
Family
ID=17662345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28319392A Pending JPH06127583A (en) | 1992-10-21 | 1992-10-21 | Semiconductor device carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06127583A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008273620A (en) * | 2007-03-30 | 2008-11-13 | Shin Etsu Polymer Co Ltd | Accommodation body, manufacturing method of carrier tape, and its manufacturing device |
| JP2011181733A (en) * | 2010-03-02 | 2011-09-15 | Disco Corp | Method of manufacturing semiconductor device |
| JP2015527952A (en) * | 2012-07-20 | 2015-09-24 | スリーエム イノベイティブ プロパティズ カンパニー | Component carrier tape with UV radiation curable adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6242555B2 (en) * | 1978-09-14 | 1987-09-09 | Hitachi Ltd | |
| JPH04114876A (en) * | 1990-08-29 | 1992-04-15 | Murata Mfg Co Ltd | Electronic component assembly and manufacture of electronic apparatus using same |
-
1992
- 1992-10-21 JP JP28319392A patent/JPH06127583A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6242555B2 (en) * | 1978-09-14 | 1987-09-09 | Hitachi Ltd | |
| JPH04114876A (en) * | 1990-08-29 | 1992-04-15 | Murata Mfg Co Ltd | Electronic component assembly and manufacture of electronic apparatus using same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008273620A (en) * | 2007-03-30 | 2008-11-13 | Shin Etsu Polymer Co Ltd | Accommodation body, manufacturing method of carrier tape, and its manufacturing device |
| JP2011181733A (en) * | 2010-03-02 | 2011-09-15 | Disco Corp | Method of manufacturing semiconductor device |
| JP2015527952A (en) * | 2012-07-20 | 2015-09-24 | スリーエム イノベイティブ プロパティズ カンパニー | Component carrier tape with UV radiation curable adhesive |
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