JPH06128096A - Method for producing compound semiconductor polycrystal - Google Patents
Method for producing compound semiconductor polycrystalInfo
- Publication number
- JPH06128096A JPH06128096A JP4306592A JP30659292A JPH06128096A JP H06128096 A JPH06128096 A JP H06128096A JP 4306592 A JP4306592 A JP 4306592A JP 30659292 A JP30659292 A JP 30659292A JP H06128096 A JPH06128096 A JP H06128096A
- Authority
- JP
- Japan
- Prior art keywords
- polycrystal
- crucible
- carbon
- compound semiconductor
- carbon concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
(57)【要約】
【目的】 GaAs、Inp等の化合物半導体単結晶育
成の原料となる多結晶を製造する際に、カーボンの混入
を防止すると共に、カーボン濃度を所望の濃度に制御で
きるようにしたこと。
【構成】 不活性ガスを充填した気密容器内で、サセプ
タ8により支持されたルツボ5内に化合物半導体材料を
充填し、周囲のヒーター3により材料を溶融し、ルツボ
下端より冷却して結晶成長を行う化合物半導体多結晶の
製造方法において、該ルツボに蓋10を施して、多結晶
のカーボン濃度を制御することを特徴とする化合物半導
体多結晶の製造方法。
(57) [Abstract] [Purpose] To prevent carbon from being mixed and to control the carbon concentration to a desired concentration when manufacturing a polycrystal as a raw material for growing a compound semiconductor single crystal such as GaAs or Inp. What I did. [Constitution] A compound semiconductor material is filled in a crucible 5 supported by a susceptor 8 in an airtight container filled with an inert gas, and the material is melted by a heater 3 around the crucible and cooled from the lower end of the crucible to grow crystals. A method for producing a compound semiconductor polycrystal, which comprises performing a lid 10 on the crucible to control the carbon concentration of the polycrystal in the method for producing a compound semiconductor polycrystal.
Description
【0001】[0001]
【産業上の利用分野】本発明はGaAs、Inp等の化
合物半導体単結晶育成の原料となる半導体多結晶の、カ
ーボン濃度を制御できる化合物半導体多結晶の製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a compound semiconductor polycrystal such as GaAs, Inp or the like, which is a raw material for growing a compound semiconductor single crystal, in which the carbon concentration can be controlled.
【0002】[0002]
【従来の技術】化合物半導体の単結晶は、液体封止引上
げ法(LEC法)、垂直温度勾配法(VGF法)、液体
封止垂直ブリッジマン法(LE−VB法)等により育成
される。いずれの方法においても原料として、化合物半
導体の多結晶を用いて育成を行うものである。この化合
物半導体多結晶の製造は、図4に示す方法により製造さ
れる。図において1は耐圧容器、2はカーボン製のホッ
トゾーン、3はカーボン製のヒーター、4はルツボホル
ダー、5はルツボであり、耐圧容器1内にAr、N2 等
の不活性ガスを充填し、ルツボ5にGa及びAs等の化
合物半導体の材料を充填し、容器の外周のヒーター3に
より材料を溶融し、ルツボ下端より徐々に冷却して多結
晶の成長を行うものである。2. Description of the Related Art A single crystal of a compound semiconductor is grown by a liquid sealing pulling method (LEC method), a vertical temperature gradient method (VGF method), a liquid sealing vertical Bridgman method (LE-VB method) and the like. In either method, a compound semiconductor polycrystal is used as a raw material for growth. The compound semiconductor polycrystal is manufactured by the method shown in FIG. In the figure, 1 is a pressure vessel, 2 is a carbon hot zone, 3 is a carbon heater, 4 is a crucible holder, 5 is a crucible, and the pressure vessel 1 is filled with an inert gas such as Ar or N 2. The crucible 5 is filled with a compound semiconductor material such as Ga and As, the material is melted by the heater 3 on the outer periphery of the container, and the polycrystal is grown by gradually cooling from the lower end of the crucible.
【0003】Ga、As等の材料の表面は、結晶成長の
過程において、融液からのV族元素の解離、蒸散を防止
するためにB2 03 等の液体封止剤6で覆われている。
しかし材料の溶融から結晶成長の過程において、カーボ
ン製のホットゾーンやカーボン製のヒーターより発生す
る遊離カーボンが、固体またはCo2 として、ルツボ上
方からB2 O3 を透過して成長結晶7に混入する。成長
結晶中に混入するカーボンの濃度は、結晶成長の条件に
より異なり、カーボン濃度の一定な多結晶が得られなか
った。[0003] Ga, surface materials such as As, in the course of crystal growth, the dissociation of the V group elements from the melt, is covered with a liquid sealant 6 2 0 3, etc. B in order to prevent transpiration There is.
However, in the process of melting the material to growing the crystal, free carbon generated from the hot zone made of carbon or the heater made of carbon is mixed as solid or Co 2 into the grown crystal 7 through B 2 O 3 from above the crucible. To do. The concentration of carbon mixed in the grown crystal varied depending on the crystal growth conditions, and a polycrystal having a constant carbon concentration could not be obtained.
【0004】上記の多結晶を原料として、LEC法、V
GF法、LE−VB法等により、単結晶の育成を行った
場合、単結晶中のカーボン濃度は原料のカーボン濃度に
依存するため、その濃度を制御することは困難であっ
た。単結晶中のカーボンは、単結晶の比抵抗、超高速集
積回路、光電子集積回路等の基板の特性に影響を及ぼす
もので、原料の多結晶中のカーボンの混入を無くするこ
と、およびカーボン濃度を自在に制御することが望まれ
ていた。Using the above polycrystal as a raw material, LEC method, V
When a single crystal was grown by the GF method, LE-VB method or the like, it was difficult to control the carbon concentration in the single crystal because it depends on the carbon concentration of the raw material. The carbon in the single crystal affects the characteristics of the substrate such as the specific resistance of the single crystal, the ultra-high speed integrated circuit, the optoelectronic integrated circuit, etc., and eliminates the mixing of carbon in the polycrystal of the raw material and the carbon concentration. It was desired to freely control the.
【0005】[0005]
【発明が解決しようとする課題】本発明は上記の問題に
ついて検討の結果なされたもので、化合物半導体多結晶
へのカーボンの混入を無くすること、および多結晶中の
カーボンの濃度を自在に制御できる製造方法を開発した
ものである。DISCLOSURE OF THE INVENTION The present invention has been made as a result of studying the above-mentioned problems, and it is possible to eliminate the incorporation of carbon into a compound semiconductor polycrystal and to freely control the carbon concentration in the polycrystal. This is the development of a possible manufacturing method.
【0006】[0006]
【課題を解決するための手段】本発明は不活性ガスを充
填した気密容器内で、サセプタにより支持されたルツボ
内に化合物半導体材料を充填し、周囲のヒーターにより
材料を溶融し、ルツボ下端より冷却して結晶成長を行う
化合物半導体多結晶の製造方法において、該ルツボに蓋
を施して多結晶のカーボン濃度を制御することを特徴と
する化合物半導体多結晶の製造方法を請求項1とし、前
記ルツボの下部に予め適量のカーボンを添加し、多結晶
のカーボン濃度を制御することを特徴とする請求項1記
載の化合物半導体多結晶の製造方法を請求項2とし、前
記ルツボの蓋に適当量の穴を設け、多結晶のカーボン濃
度を制御することを特徴とする請求項1記載の化合物半
導体多結晶の製造方法を請求項3とするものである。According to the present invention, a compound semiconductor material is filled in a crucible supported by a susceptor in an airtight container filled with an inert gas, and the material is melted by a heater around the crucible. A method for producing a compound semiconductor polycrystal, which comprises cooling and performing crystal growth, wherein the crucible is capped to control the carbon concentration of the polycrystal. A method for producing a compound semiconductor polycrystal according to claim 1, wherein an appropriate amount of carbon is added in advance to the lower part of the crucible to control the carbon concentration of the polycrystal, and an appropriate amount is added to the lid of the crucible. The method for producing a compound semiconductor polycrystal according to claim 1 is characterized in that the hole of 1 is provided to control the carbon concentration of the polycrystal.
【0007】[0007]
【作用】すなわち本発明は、ルツボにPBN製等の蓋を
かぶせることによってカーボン製ヒーター等の外部から
のカーボンの混入を防止して、高純度の多結晶を得る
他、意図的にルツボ内に所定量のカーボンを添加して置
き、カーボンをドープすることによって所望のカーボン
濃度の多結晶が得られるようにしたものである。上記の
蓋はルツボ上部にかぶせてもよく、またルツボホルダー
にかぶせてもよい。またカーボンをドープする手段とし
て、上記の他に、蓋の上部に所定のサイズと数の穴を設
け、この穴から外部のカーボンを結晶中に取り込むこと
により、所望のカーボン濃度の多結晶を得ることができ
る。なお本発明は、GaAs、Inpの他カーボンが問
題とされる多結晶の製造に適用できる。In other words, according to the present invention, by covering the crucible with a lid made of PBN or the like, it is possible to prevent the mixture of carbon from the outside, such as a heater made of carbon, to obtain a high-purity polycrystal. A predetermined amount of carbon is added and placed, and the carbon is doped so that a polycrystal having a desired carbon concentration can be obtained. The lid may be placed on the upper portion of the crucible, or may be placed on the crucible holder. In addition to the above, as a means for doping carbon, a hole of a predetermined size and number is provided in the upper part of the lid, and external carbon is taken into the crystal through this hole to obtain a polycrystal having a desired carbon concentration. be able to. The present invention can be applied to the production of polycrystals in which carbon is a problem in addition to GaAs and Inp.
【0008】[0008]
【実施例】以下に本発明の一実施例について説明する。 実施例1 図1に示す装置を用いてGaAs多結晶の成長を行っ
た。耐圧容器1内にArを充填し、PBN製の4吋径の
ルツボ5内にGaを1800g、Asを1940gおよ
びカーボン濃度が既知のGaAsと、その上にB2O3
の液体封止剤6を約160g収納した。ルツボホルダー
4上にPBN製の蓋10をかぶせ、ヒーター3の加熱に
より、Ga、Asを溶融する。その時の耐圧容器内の圧
力は70atmとした。その後、ヒーターのパワーを減
少させるか、またはルツボサセプタ8を下方に移動させ
ることにより、ルツボ下部より上部に向って固化させ結
晶成長を行った。EXAMPLES An example of the present invention will be described below. Example 1 A GaAs polycrystal was grown using the apparatus shown in FIG. The pressure vessel 1 was filled with Ar, and 1800 g of Ga, 1940 g of As, 1940 g of As, and GaAs with a known carbon concentration, and B 2 O 3 were formed on the crucible 5 made of PBN having a diameter of 4 inches.
About 160 g of the liquid sealant 6 was stored. A lid 10 made of PBN is put on the crucible holder 4, and Ga and As are melted by heating the heater 3. The pressure in the pressure vessel at that time was 70 atm. After that, the power of the heater was reduced or the crucible susceptor 8 was moved downward to solidify the crucible from the lower part toward the upper part to perform crystal growth.
【0009】上記のようにして種々のカーボン濃度のG
aAs多結晶を作製し、カーボンドープ量とカーボン濃
度の関係を調べた。この結果を図2に示す。図2より明
らかなように、カーボンドープ量と得られる多結晶中の
カーボン濃度は比例していることが判る。これにより多
結晶中のカーボン濃度を所望の濃度にすることができ
る。なお、カーボンをドープしないものは、外部からの
カーボンの混入がないためカーボン濃度は零を示した。
したがって蓋をすることにより、外部からのカーボンの
混入を防止できることが判る。As described above, G having various carbon concentrations is used.
An aAs polycrystal was prepared and the relationship between the carbon doping amount and the carbon concentration was investigated. The result is shown in FIG. As is clear from FIG. 2, the carbon doping amount and the carbon concentration in the obtained polycrystal are in proportion to each other. Thereby, the carbon concentration in the polycrystal can be set to a desired concentration. In addition, the carbon concentration was zero in the case where carbon was not doped because there was no mixing of carbon from the outside.
Therefore, it can be seen that the cover can prevent the mixture of carbon from the outside.
【0010】次にルツボの中にカーボンを添加するかわ
りに、ルツボ上の蓋に直径5mmの穴を1〜10個あけた
蓋を用いて、カーボンを外部から混入させてドーピング
した結果、カーボン濃度は、略穴の数に比例することが
分かった。したがって蓋に穴を適当量あけることによ
り、外部からカーボンを混入させ多結晶中のカーボン濃
度を制御することが可能である。Next, instead of adding carbon into the crucible, the lid on the crucible was opened with 1 to 10 holes having a diameter of 5 mm, and the carbon was mixed from the outside to be doped. Was found to be approximately proportional to the number of holes. Therefore, it is possible to control the concentration of carbon in the polycrystal by mixing carbon from the outside by forming an appropriate amount of holes in the lid.
【0011】実施例2 実施例1の方法により作製したカーボン濃度が既知の多
結晶を用い、GaAs単結晶を引上げ、単結晶の固化率
(原料融液に対する結晶固化の比率)とカーボン濃度と
の関係を調べた。この結果を図3に示す。図3から明ら
かなように、従来のCo2 を用いてカーボンをドープす
る方法は、固化率が高くなるにつれてカーボン濃度が高
くなり、不安定である。これに対して本発明方法により
得られたカーボン含有の多結晶を用いた場合は、固化率
とカーボン濃度が比例しており、カーボン濃度を制御し
易いことが分かる。Example 2 Using a polycrystal having a known carbon concentration produced by the method of Example 1, a GaAs single crystal was pulled up and the solidification rate of the single crystal (ratio of crystal solidification to the raw material melt) and the carbon concentration were compared. I investigated the relationship. The result is shown in FIG. As is clear from FIG. 3, the conventional method of doping carbon with Co 2 is unstable because the carbon concentration increases as the solidification rate increases. On the other hand, when the carbon-containing polycrystal obtained by the method of the present invention is used, the solidification rate is proportional to the carbon concentration, and it is understood that the carbon concentration can be easily controlled.
【0012】[0012]
【発明の効果】以上に説明したように本発明によれば、
多結晶の育成時にルツボ外部からのカーボンの混入を防
ぐと共に、カーボン濃度を所望の濃度に制御した多結晶
が得られるもので工業上顕著な効果を奏する。As described above, according to the present invention,
It is possible to prevent the mixture of carbon from the outside of the crucible during the growth of the polycrystal and obtain a polycrystal in which the carbon concentration is controlled to a desired concentration, which is a remarkable industrial effect.
【図1】本発明の一実施例に係る化合物半導体多結晶の
製造方法を説明する概略図FIG. 1 is a schematic diagram illustrating a method for producing a compound semiconductor polycrystal according to an embodiment of the present invention.
【図2】本発明の一実施例に係るカーボン濃度とカーボ
ンドープ量の関係を示す線図FIG. 2 is a diagram showing the relationship between carbon concentration and carbon doping amount according to an embodiment of the present invention.
【図3】本発明の一実施例に係るカーボン濃度と固化率
の関係を示す線図FIG. 3 is a diagram showing the relationship between carbon concentration and solidification rate according to an example of the present invention.
【図4】従来の化合物半導体多結晶の製造方法を説明す
る概略図FIG. 4 is a schematic diagram illustrating a conventional method for producing a compound semiconductor polycrystal.
1 耐圧容器 2 ホットゾーン 3 ヒーター 4 ルツボホルダー 5 ルツボ 6 液体封止剤 7 成長結晶 8 ルツボサセプタ 9 熱電対 10 蓋 1 Pressure-resistant container 2 Hot zone 3 Heater 4 Crucible holder 5 Crucible 6 Liquid sealant 7 Growing crystal 8 Crucible susceptor 9 Thermocouple 10 Lid
Claims (3)
セプタにより支持されたルツボ内に化合物半導体材料を
充填し、周囲のヒーターにより材料を溶融し、ルツボ下
端より冷却して結晶成長を行う化合物半導体多結晶の製
造方法において、該ルツボに蓋を施して、多結晶のカー
ボン濃度を制御することを特徴とする化合物半導体多結
晶の製造方法。1. A crystal growth is carried out by filling a compound semiconductor material in a crucible supported by a susceptor in an airtight container filled with an inert gas, melting the material by a heater in the surrounding, and cooling from the lower end of the crucible. A method for producing a compound semiconductor polycrystal, wherein the crucible is covered to control the carbon concentration of the polycrystal.
を添加し、多結晶のカーボン濃度を制御することを特徴
とする請求項1記載の化合物半導体多結晶の製造方法。2. The method for producing a compound semiconductor polycrystal according to claim 1, wherein an appropriate amount of carbon is added in advance to the lower portion of the crucible to control the carbon concentration of the polycrystal.
結晶のカーボン濃度を制御することを特徴とする請求項
1記載の化合物半導体多結晶の製造方法。3. The method for producing a compound semiconductor polycrystal according to claim 1, wherein the crucible lid is provided with an appropriate amount of holes to control the carbon concentration of the polycrystal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4306592A JPH06128096A (en) | 1992-10-20 | 1992-10-20 | Method for producing compound semiconductor polycrystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4306592A JPH06128096A (en) | 1992-10-20 | 1992-10-20 | Method for producing compound semiconductor polycrystal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06128096A true JPH06128096A (en) | 1994-05-10 |
Family
ID=17958925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4306592A Pending JPH06128096A (en) | 1992-10-20 | 1992-10-20 | Method for producing compound semiconductor polycrystal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06128096A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6045767A (en) * | 1997-11-21 | 2000-04-04 | American Xtal Technology | Charge for vertical boat growth process and use thereof |
| USRE39778E1 (en) | 1996-04-26 | 2007-08-21 | Sumitomo Electric Industries, Ltd. | Method of preparing group III-V compound semiconductor crystal |
| USRE40662E1 (en) | 1998-03-25 | 2009-03-17 | Sumitomo Electric Industries, Ltd. | Method of preparing a compound semiconductor crystal |
| JP2009149519A (en) * | 2009-04-03 | 2009-07-09 | Sumitomo Electric Ind Ltd | Method for producing group III-V compound semiconductor crystal |
| US8850715B2 (en) * | 2006-09-07 | 2014-10-07 | Eisenmann Ag | Process and installation for drying articles |
| KR20190013223A (en) * | 2017-08-01 | 2019-02-11 | 한국과학기술연구원 | DEVICE FOR SINGLE CRYSTAL GROWTH OF GaAs |
-
1992
- 1992-10-20 JP JP4306592A patent/JPH06128096A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE39778E1 (en) | 1996-04-26 | 2007-08-21 | Sumitomo Electric Industries, Ltd. | Method of preparing group III-V compound semiconductor crystal |
| USRE41551E1 (en) | 1996-04-26 | 2010-08-24 | Sumitomo Electric Industries, Ltd. | Method of preparing group III-V compound semiconductor crystal |
| US6045767A (en) * | 1997-11-21 | 2000-04-04 | American Xtal Technology | Charge for vertical boat growth process and use thereof |
| USRE40662E1 (en) | 1998-03-25 | 2009-03-17 | Sumitomo Electric Industries, Ltd. | Method of preparing a compound semiconductor crystal |
| US8850715B2 (en) * | 2006-09-07 | 2014-10-07 | Eisenmann Ag | Process and installation for drying articles |
| JP2009149519A (en) * | 2009-04-03 | 2009-07-09 | Sumitomo Electric Ind Ltd | Method for producing group III-V compound semiconductor crystal |
| KR20190013223A (en) * | 2017-08-01 | 2019-02-11 | 한국과학기술연구원 | DEVICE FOR SINGLE CRYSTAL GROWTH OF GaAs |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4040895A (en) | Control of oxygen in silicon crystals | |
| US5454346A (en) | Process for growing multielement compound single crystal | |
| US3173765A (en) | Method of making crystalline silicon semiconductor material | |
| EP0244987A1 (en) | A process for growing a multi-component crystal | |
| JPH10279398A (en) | Gallium arsenide single crystal and its production | |
| WO2006106644A1 (en) | Si-DOPED GaAs SINGLE CRYSTAL INGOT AND PROCESS FOR PRODUCING THE SAME, AND Si-DOPED GaAs SINGLE CRYSTAL WAFER PRODUCED FROM SAID Si-DOPED GaAs SINGLE CRYSTAL INGOT | |
| JPH06128096A (en) | Method for producing compound semiconductor polycrystal | |
| JPH10167898A (en) | Method for producing semi-insulating GaAs single crystal | |
| JPH06219900A (en) | Production of si-doped n-type gallium arsenide single crystal | |
| JP3707110B2 (en) | Method for growing compound semiconductor single crystal | |
| JP2010059052A (en) | METHOD AND APPARATUS FOR PRODUCING SEMI-INSULATING GaAs SINGLE CRYSTAL | |
| JPH11147785A (en) | Single crystal manufacturing method | |
| JP4586154B2 (en) | Gallium arsenide single crystal manufacturing equipment | |
| JP2529934B2 (en) | Single crystal manufacturing method | |
| JPS63195188A (en) | Compound semiconductor single crystal manufacturing method and manufacturing device | |
| JP2000109400A (en) | Si-doped GaAs single crystal and method and apparatus for producing the same | |
| JP4399631B2 (en) | Method for manufacturing compound semiconductor single crystal and apparatus for manufacturing the same | |
| JP4691909B2 (en) | Manufacturing method of semiconductor crystal | |
| JPS6058196B2 (en) | Compound semiconductor single crystal pulling method and device | |
| JP2539841B2 (en) | Crystal manufacturing method | |
| JPS6395194A (en) | Compound single crystal manufacturing method | |
| JPS6389497A (en) | Production of silicon-added gallium arsenic single crystal | |
| JP3654314B2 (en) | Manufacturing method of AlGaAs single crystal by flux method and manufacturing apparatus used therefor | |
| JPH11189499A (en) | Method for manufacturing compound semiconductor single crystal | |
| JP5050184B2 (en) | Si-doped GaAs single crystal |