JPH0613263Y2 - MOCVD equipment - Google Patents
MOCVD equipmentInfo
- Publication number
- JPH0613263Y2 JPH0613263Y2 JP13687188U JP13687188U JPH0613263Y2 JP H0613263 Y2 JPH0613263 Y2 JP H0613263Y2 JP 13687188 U JP13687188 U JP 13687188U JP 13687188 U JP13687188 U JP 13687188U JP H0613263 Y2 JPH0613263 Y2 JP H0613263Y2
- Authority
- JP
- Japan
- Prior art keywords
- tube
- reaction tube
- cooling pipe
- reaction
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 title claims 2
- 238000001816 cooling Methods 0.000 claims description 37
- 230000012010 growth Effects 0.000 description 21
- 239000013078 crystal Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 19
- 239000000376 reactant Substances 0.000 description 14
- 230000007547 defect Effects 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Description
【考案の詳細な説明】 (イ)産業上の利用分野 本考案は、良質な半導体結晶が成長可能なMOCVD装
置に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a MOCVD apparatus capable of growing good-quality semiconductor crystals.
(ロ)従来の技術 MOCVD(有機金属化学気相成長)法は、膜厚制御性
に優れ、良質な結晶を成長可能な成長方法として現在多
く研究されている。(B) Conventional Technology The MOCVD (Metal Organic Chemical Vapor Deposition) method has been extensively researched at present as a growth method that has excellent film thickness controllability and can grow high quality crystals.
第3図は、例えばJournal of C−ysta
l Growth,68(1984),P.483〜4
89に示されている如き、従来のMOCVD装置の断面
図である。同図において(1)は反応管、(2)は反応管(1)
に連通し、当該反応管(1)に原料ガスを導入するガス導
入管、(4)は反応管(1)に連通する排気管で、他端は図示
していない排気ポンプに接続され、反応管(1)内を減
圧、排気する。(5)はグラファイト等からなるサセプタ
で、反応管(1)内に配される。(6)はサセプタ(5)上に載
置された基板で、この上に所望の結晶が形成される。
(7)はサセプタ(5)及び基板(6)が位置する反応管(1)の周
囲に設けられたRF(高周波)コイルで、サセプタ(5)
を介して基板(6)を加熱する。(8)は反応管(1)の周囲に
設けられた冷却管で、図中矢印に示す様に水を流すこと
によって反応管(1)を冷却し、空中で反応した原料ガス
の不所望な反応物(11)をトラップ除去する。したがっ
て、斯る従来装置における結晶成長は基板(6)に達した
原料ガスのみが当該基板(6)上で分解し、堆積すること
によって行われる。即ち、以上の構成によって、斯る従
来装置は空中で反応した不所望な反応物が基板(6)に付
着しないので欠陥の少ない良質の結晶を形成可能であ
る。FIG. 3 shows, for example, Journal of C-ysta.
L Growth, 68 (1984), P.I. 483-4
FIG. 89 is a cross-sectional view of a conventional MOCVD apparatus as shown at 89. In the figure, (1) is a reaction tube, (2) is a reaction tube (1)
To the reaction tube (1) for introducing the raw material gas, (4) is an exhaust tube communicating with the reaction tube (1), the other end is connected to an exhaust pump (not shown), The inside of the pipe (1) is decompressed and exhausted. (5) is a susceptor made of graphite or the like, which is arranged in the reaction tube (1). (6) is a substrate placed on the susceptor (5) on which a desired crystal is formed.
Reference numeral (7) is an RF (high frequency) coil provided around the reaction tube (1) where the susceptor (5) and the substrate (6) are located, and the susceptor (5)
The substrate (6) is heated via. (8) is a cooling tube provided around the reaction tube (1), which cools the reaction tube (1) by flowing water as shown by the arrow in the figure, and the undesired reaction of the raw material gas reacted in the air The reactant (11) is trapped off. Therefore, the crystal growth in such a conventional apparatus is performed by decomposing and depositing only the source gas reaching the substrate (6) on the substrate (6). That is, according to the above-mentioned structure, since the undesired reaction product reacted in the air does not adhere to the substrate (6), the conventional apparatus can form high quality crystals with few defects.
(ハ)考案が解決しようとする課題 しかし乍ら、斯る従来装置では成長毎に冷却管(1)に反
応物(11)が付着していくため、遂には基板(6)上部の反
応管(1)に積み重なった反応物(11)が落下、飛散してし
まい、これが成長中の基板(6)上に付着することによっ
て成長結晶に欠陥が生じることになる。また、積み重な
った反応物(11)によって反応管(1)内の原料ガスの流れ
に乱れが生じ、成長むらが生じる。(C) Problems to be solved by the invention However, in such a conventional apparatus, the reaction product (11) adheres to the cooling pipe (1) at every growth, so that the reaction pipe above the substrate (6) is finally formed. The reactant (11) piled up on (1) falls and scatters, and this adheres on the growing substrate (6), thereby causing defects in the grown crystal. In addition, the stacked reactants (11) disturb the flow of the raw material gas in the reaction tube (1), resulting in uneven growth.
従って、従来では30〜40回の成長毎に反応管(1)を
取りはずし、王水による洗浄を行わなければならなかっ
た。ところが、反応管(1)の洗浄を行うと、反応管(1)内
にH2O等の不純物が残留するため、成長時の反応雰囲気
が変化してしまい、良好な結晶が得られない。そこで洗
浄後は2〜3回の予備成長を行う必要があり、このため
結晶成長工程のランニングコストが高くなると共に製造
歩留りが低下する等の問題が生じる。Therefore, conventionally, the reaction tube (1) had to be removed and washed with aqua regia every 30 to 40 times of growth. However, when the reaction tube (1) is washed, impurities such as H 2 O remain in the reaction tube (1), so that the reaction atmosphere at the time of growth changes, and good crystals cannot be obtained. Therefore, after cleaning, it is necessary to perform preliminary growth 2-3 times, which causes problems such as an increase in running cost of the crystal growth step and a decrease in manufacturing yield.
(ニ)課題を解決するための手段 本考案は、反応管と、該反応管に連通するガス導入管及
びガス排気管と、前記反応管の内壁に沿って配された冷
却管と、を備えたMOCVD装置であって、上記課題を
解決するため、前記冷却管は前記反応管の長手方向に沿
ってスライド可能であり、及び/又は前記冷却管にはこ
れを振動させる振動手段が接続されていることを特徴と
する。(D) Means for Solving the Problems The present invention comprises a reaction tube, a gas introduction tube and a gas exhaust tube communicating with the reaction tube, and a cooling tube arranged along the inner wall of the reaction tube. In order to solve the above problem, the cooling pipe is slidable along the longitudinal direction of the reaction pipe, and / or a vibration means for vibrating the cooling pipe is connected to the cooling pipe. It is characterized by being
(ホ)作用 本考案装置は、反応管の中に冷却管を配し、これをスラ
イド可能とすることによって、基板周囲の冷却管に反応
物の付着量が多くなる毎に、当該冷却管をスライドさ
せ、基板周囲の冷却管を反応物の付着していないきれい
な面とすることができる。また、本考案装置は、冷却管
に振動手段を接続し、成長後、冷却管を振動させること
によって、基板上部の冷却管に付着し、落下、飛散し易
い状態となった反応物を取り除くことができる。(E) Action The device of the present invention arranges a cooling tube in the reaction tube and makes it slidable, so that the cooling tube is attached to the cooling tube around the substrate every time the amount of reactant attached increases. By sliding, the cooling tube around the substrate can be made to have a clean surface free from reactants. Further, in the device of the present invention, a vibrating means is connected to the cooling pipe, and after growth, the cooling pipe is vibrated to remove the reactant attached to the cooling pipe on the upper part of the substrate and easily dropped or scattered. You can
(ヘ)実施例 第1図は本考案装置の一実施例を示し、第3図の従来装
置と同じものには同番号を付してある。即ち、(1)は反
応管、(2)は反応管(1)に連通したガス導入管である。ま
た、(3)はステンレス製のフランジで、Oリングを介し
て反応管(1)と密着してある。これは第3図では省略し
ているが、周知の構成である。(4)は排気管で、フラン
ジ(3)を通って反応管(1)と連通される。(5)はサセプ
タ、(6)は基板、(7)はRFコイルで、従来装置と同様に
配置される。(8)は冷却管で、本考案装置においては、
反応管(1)の中に配される。斯る冷却管(8)は、反応管
(1)の内壁に沿う円筒形をなし、第1図の状態において
サセプタ(5)よりもフランジ(3)側で2本の管に集束さ
れ、フランジ(3)を通って外部に取り出されている。ま
た冷却管(8)は反応管(1)内で長手方向(図中左右方向)
にスライド可能となっている。尚、冷却管(8)の2本の
管は通常反応管(1)と同様にOリングを介してフランジ
(3)と密着されている。(9)は任意の周波数を有する電圧
を発生する周知のマルチバイブレータ、(10)はマルチハ
ブレータ(9)に接続された圧電振動子である。圧電振動
子(10)は夫々2本の冷却管(8)に固着され、マルチバイ
ブレータ(9)から電圧を印加されるとその周波数に従い
冷却管(8)を振動させる。斯る振動手段はマルチバイブ
レータ(9)と圧電振動子(10)に限ることなく、モータを
用いた振動手段等、他の振動手段を用いてもよい。(F) Embodiment FIG. 1 shows an embodiment of the device of the present invention, and the same parts as those of the conventional device of FIG. That is, (1) is a reaction tube, and (2) is a gas introduction tube communicating with the reaction tube (1). Further, (3) is a flange made of stainless steel, which is in close contact with the reaction tube (1) through an O-ring. Although omitted in FIG. 3, this is a well-known configuration. An exhaust pipe (4) communicates with the reaction pipe (1) through the flange (3). (5) is a susceptor, (6) is a substrate, and (7) is an RF coil, which are arranged in the same manner as the conventional device. (8) is a cooling pipe.
It is placed in the reaction tube (1). Such a cooling pipe (8) is a reaction pipe.
It has a cylindrical shape along the inner wall of (1), and in the state of FIG. 1, it is focused on two pipes on the flange (3) side of the susceptor (5) and taken out to the outside through the flange (3). There is. The cooling pipe (8) is in the longitudinal direction (left-right direction in the figure) in the reaction tube (1).
It is possible to slide to. In addition, the two tubes of the cooling pipe (8) are flanged via the O-ring like the normal reaction pipe (1).
It is in close contact with (3). (9) is a well-known multivibrator that generates a voltage having an arbitrary frequency, and (10) is a piezoelectric vibrator connected to the multihubrator (9). The piezoelectric vibrators (10) are respectively fixed to the two cooling pipes (8), and when a voltage is applied from the multivibrator (9), the cooling pipes (8) vibrate according to the frequency. The vibrating means is not limited to the multivibrator (9) and the piezoelectric vibrator (10), and other vibrating means such as a vibrating means using a motor may be used.
而して本実施例装置では、結晶成長時においては従来装
置と同様に冷却管(8)に水を流すことによって、原料ガ
スが空中で反応して生成した不所望な反応物(11)を冷却
管(8)にトラップし、反応物(11)が基板(6)に付着するこ
とを防ぐ。また成長終了後においては、H2ガスを流し、
サセプタ(5)を加熱しながらマルチバイブレータ(9)を用
いて冷却管(8)を振動させ、基板(6)上部の冷却管(8)に
付着した落下、飛散し易い状態の反応物(11)を除去す
る。この時、2つのマルチバイブレータ(9)の振動数
を、例えば5KHzと1KHzというように変えておけば、冷
却管(8)に定常波が発生せず効率よく反応物(11)を除去
できる。これにより、成長中に基板(6)上に飛来してく
る反応物(11)は大幅に減ることになる。ただし、斯るマ
ルチバイブレータ(9)と圧電振動子(10)の振動によって
すべての反応物(11)が除去されるわけではなく、成長回
数が増えるに従って振動によって除去されない反応物(1
1)が徐々に積み重なっていく。この場合、本実施例装置
においては、冷却管(8)を原料ガスの下流方向(図中右
方向)にスライドさせることによって、反応物(11)の付
着していない冷却管(8)の面を基板(6)周囲に配せばよ
い。これによって長期間にわたって反応管(1)を洗浄す
ることなく、結晶欠陥の少ない結晶成長を行うことがで
きる。Thus, in the device of the present embodiment, during crystal growth, by flowing water through the cooling pipe (8) as in the conventional device, the undesired reaction product (11) produced by the reaction of the source gas in the air was generated. The reaction product (11) is trapped in the cooling pipe (8) to prevent the reactant (11) from adhering to the substrate (6). After the growth, H 2 gas was flowed,
While heating the susceptor (5), the cooling pipe (8) is vibrated by using the multivibrator (9), and the reaction product (11) attached to the cooling pipe (8) above the substrate (6) is easily dropped or scattered. ) Is removed. At this time, if the frequencies of the two multivibrators (9) are changed to, for example, 5 KHz and 1 KHz, a standing wave is not generated in the cooling pipe (8) and the reactant (11) can be efficiently removed. As a result, the reactant (11) flying onto the substrate (6) during the growth is greatly reduced. However, not all the reactants (11) are removed by the vibration of the multivibrator (9) and the piezoelectric vibrator (10), and the reactants (1) that are not removed by the vibration as the number of growth increases (1
1) gradually accumulates. In this case, in the device of the present embodiment, the cooling pipe (8) is slid in the downstream direction of the raw material gas (rightward in the figure), so that the surface of the cooling pipe (8) on which the reactant (11) is not attached May be arranged around the substrate (6). As a result, crystal growth with few crystal defects can be performed without cleaning the reaction tube (1) for a long period of time.
第2図は本実施例装置及び従来装置を用いてInGaP
結晶を作製する時の結晶成長回数に対する結晶欠陥密度
の変化を測定したものである。同図において実線は本実
施例装置で、上述の如く、マルチバイブレータ(9)の使
用及び冷却管(8)のスライドを行った場合(A)を示し、図
中矢印で示す回数の所で冷却管(8)のスライドを行っ
た。また一点鎖線は本実施例装置でマルチバイブレータ
(9)のみを使用した場合(B)を示し、破線は従来装置を用
いた場合(C)を示す。図から明らかな如く、本実施例装
置を用いれば従来装置に比して成長回数に対する結晶欠
陥密度を大幅に低くすることができる。また、図には示
していないが、本実施例装置において冷却管(8)のスラ
イドのみを行った場合についても従来装置に比して成長
回数に対する結晶欠陥密度を低くすることができる。FIG. 2 shows InGaP using the device of this example and the conventional device.
This is a measurement of the change in the crystal defect density with respect to the number of crystal growths during the production of crystals. In the figure, the solid line shows the apparatus of this embodiment, as described above, when the multivibrator (9) is used and the cooling pipe (8) is slid (A), and cooled at the number of times indicated by the arrow in the figure. Slide of tube (8) was performed. Also, the alternate long and short dash line indicates the multivibrator in this embodiment.
The case where only (9) is used is shown (B), and the broken line shows the case where the conventional device is used (C). As is clear from the figure, by using the device of this embodiment, the crystal defect density with respect to the number of times of growth can be significantly reduced as compared with the conventional device. Although not shown in the figure, the crystal defect density with respect to the number of times of growth can be reduced as compared with the conventional device also in the case where only the cooling pipe (8) is slid in the device of this embodiment.
(ト)考案の効果 本考案装置によれば、反応管内に配された冷却管をスラ
イド可能とし、及び/又は前記冷却管に振動手段を接続
することによって、基板上部の冷却管に付着し、結晶成
長中に基板上に落下、飛散する反応物を極力抑えること
ができるので、長期間にわたって結晶欠陥の少ない結晶
成長を行うことができる。従って製造歩留りを改善でき
ると共に、ランニングコストを大幅に低減することがで
きる。(G) Effect of the Invention According to the device of the present invention, the cooling pipe arranged in the reaction tube is made slidable, and / or the vibration pipe is connected to the cooling pipe so that the cooling pipe is attached to the cooling pipe above the substrate. Since it is possible to suppress as much as possible the reactant that drops and scatters on the substrate during crystal growth, crystal growth with few crystal defects can be performed for a long period of time. Therefore, the manufacturing yield can be improved and the running cost can be significantly reduced.
第1図は本考案装置の一実施例を示す断面図、第2図は
本考案装置と従来装置において成長回数に対する結晶欠
陥密度の変化を示す特性図、第3図は従来装置を示す断
面図である。 (1)……反応管、(2)……ガス導入管、(3)……フラン
ジ、(4)……排気管、(5)……サセプタ、(6)……基板、
(7)……RFコイル、(8)……冷却管、(9)……マルチバ
イブレータ、(10)……圧電振動子、(11)……反応物。FIG. 1 is a sectional view showing an embodiment of the device of the present invention, FIG. 2 is a characteristic diagram showing a change in crystal defect density with respect to the number of times of growth in the device of the present invention and a conventional device, and FIG. 3 is a sectional view showing the conventional device. Is. (1) …… Reaction tube, (2) …… Gas introduction tube, (3) …… Flange, (4) …… Exhaust tube, (5) …… Susceptor, (6) …… Substrate,
(7) ... RF coil, (8) ... cooling tube, (9) ... multivibrator, (10) ... piezoelectric vibrator, (11) ... reactant.
Claims (1)
及びガス排気管と、前記反応管の内壁に沿って配された
冷却管と、を備え、前記冷却管は前記反応管の長手方向
に沿ってスライド可能であり、及び/又は前記冷却管に
はこれを振動させる振動手段が接続されていることを特
徴とするMOCVD装置。1. A reaction tube, a gas introduction tube and a gas exhaust tube communicating with the reaction tube, and a cooling tube arranged along an inner wall of the reaction tube, wherein the cooling tube is of the reaction tube. An MOCVD apparatus, which is slidable in the longitudinal direction, and / or a vibration means for vibrating the cooling pipe is connected to the cooling pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13687188U JPH0613263Y2 (en) | 1988-10-20 | 1988-10-20 | MOCVD equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13687188U JPH0613263Y2 (en) | 1988-10-20 | 1988-10-20 | MOCVD equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0257965U JPH0257965U (en) | 1990-04-26 |
| JPH0613263Y2 true JPH0613263Y2 (en) | 1994-04-06 |
Family
ID=31397785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13687188U Expired - Lifetime JPH0613263Y2 (en) | 1988-10-20 | 1988-10-20 | MOCVD equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0613263Y2 (en) |
-
1988
- 1988-10-20 JP JP13687188U patent/JPH0613263Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0257965U (en) | 1990-04-26 |
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