JPH06149912A - CAD / CAM data conversion device and conversion method - Google Patents

Abstract

(57) [Summary] [Purpose] An excellent CAD / CAM system that creates unified data from various design data and enables accurate and speedy supply of NC data in the manufacture of electronic packages.
Provide a data conversion system. [Arrangement] CAD data generating means 10 for generating CAD data 11 for the layout design of an electronic package, mounting data generating means 20 for generating mounting data 21 for electronic components to be mounted on a printed circuit board, and individual data for the electronic components. A CA that creates the CAM data 42 by unifying the CAD data and the mounting data, and the NC data 47 that creates the CAM data 42 by unifying the CAD data and the mounting data.
The M data generating means 40 and the component mounting means 50 for automatically mounting the electronic component on the printed circuit board according to the NC data are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CAD / CAM data conversion device and a conversion method (hereinafter collectively referred to as "CAD / CAM data conversion system") in the manufacture of electronic packages used in electric equipment. .

[0002]

2. Description of the Related Art In recent years, electronic package production forms have become more and more prone to high-mix low-volume production as user needs diversify. Although an automatic mounting machine is used for the production of electronic packages, the data of the mounting position coordinates, the mounting angle, and the part name are the minimum necessary for mounting electronic parts.

In a conventional data conversion system, mounting data such as mounting position coordinates and mounting angles are obtained by a digitizer (component mounting coordinate measuring device) for inserting a needle into an insertion hole for mounting an electronic component on a printed circuit board or CAD data. It was wanted. On the other hand, the component data about the product name of the component to be mounted is obtained from the component list.

The NC data used in the automatic mounting machine is created by manually connecting the separated mounting data and component data according to the assembly drawing of the electronic package. Further, the created NC data is re-edited for each automatic mounting machine according to the mounting conditions of the automatic mounting machine.

[0005]

However, in the above-mentioned conventional data conversion system, N of several hundred parts is used.
Since the C data is created by hand, it takes a lot of time and labor, and it is difficult to deal with a wide variety of products, and there are problems such as the occurrence of defective products due to differences in the names of mounted parts and mounting positions. It was

The present invention solves the above-mentioned conventional problems, and automatically uses various items of data distributed in each design department used in the layout design of an electronic package by using common items. In accordance with the mounting conditions of the automatic device machine registered in advance, it is divided into an automatic process and a manual assembly process. For the data of the automatic process, the NC data for each automatic mounting machine is used, and for the manual assembly process, Excellent CAD / CAM that enables accurate and speedy supply of NC data in the manufacture of electronic packages by automatically creating and outputting NC data for hand-set indicators.
It is to provide a data conversion system.

[0007]

In order to achieve the above object, the present invention provides a CAD of a layout design of an electronic package.
CAD data generating means for generating data, mounting data generating means for generating mounting data of electronic components mounted on a printed circuit board, component data generating means for generating component data by registering individual data of the electronic components, CA
CAM data generating means for unifying D data and mounting data to generate CAM data and generating NC data based on the CAM data and the component data;
Component mounting means for automatically mounting the electronic component on the printed circuit board according to C data.

[0008]

According to the present invention, by the system configuration described above, component mounting means for unifying CAD data and mounting data to generate CAM data and automatically mounting the electronic component on the printed circuit board by the CAM data and the component data. By generating unique NC data for each, it is possible to make a variety of high quality electronic packages and shorten the delivery time.

[0009]

Embodiments of the present invention will be described below with reference to FIGS. 1 to 29.

FIG. 1 shows the configuration of a first embodiment of a CAD / CAM data converter according to the present invention. In FIG. 1, 1
0 is the CA used in the layout design of the electronic package
A CAD system as CAD data generating means for creating D data, that is, graphic data, 11 is CAD data output from the CAD system 10 and stored in an external storage means such as a floppy disk. Reference numeral 20 is an LSI system as a mounting data generating means for generating mounting data which is mounting information of electronic parts, and 21 is LSI data output from the LSI system 20 and stored in an external storage means, that is, mounting data. Further, 30 is a host computer (hereinafter simply referred to as "host") as a component data generating means for generating component master data which is component data by registering individual information of electronic components, 31 is an external storage means output from the host 30. It is the component master data stored in.

Reference numeral 40 is a C which is obtained by converting the CAD data 11, the LSI data 21 and the component master data 31 into a unified C.
CAM that creates and outputs NC data that is AM data
A CAM data management system that is a system as a data generation unit and is configured by a device such as a workstation. In the CAM data management system 40, the PKG assembly information (hereinafter, referred to as "PKG assembly information" in which the production technique information 41 in which the mounting conditions of the electronic components mountable by the automatic mounting machine are registered, the CAD data 11 and the LSI data 21 are linked and integrated.
"CAM data") 42, the classification of the automatic mounting machine used for component mounting (hereinafter referred to as "shape classification") and the possibility of mounting by the automatic mounting machine (hereinafter referred to as "automatic insertion classification") are registered. Component information 43, optimal mounting order processing unit 44, interference check processing unit 45, NC data output unit 4
6. It has NC data 47 stored in an external storage means such as a floppy disk.

Reference numeral 50 denotes an automatic mounting machine group as a component mounting means for mounting electronic components on a printed circuit board. This automatic mounter group 50 includes a DIP IC (dual-in-package IC) inserter 51 and an axial inserter 5.
2, radial inserter 53, AR inserter 54, C
The HIP inserters 55a and 55b, the FIC (flat package IC) inserter 56, and the hand set indicator 57 are provided.

FIG. 2 is a flow chart showing a processing process executed by the CAD / CAM data converter shown in FIG. Based on this flowchart and FIGS. 3 to 28, CAD / CA by the apparatus of the present embodiment
The M data conversion method will be described.

In FIG. 2, the CAD data 11 and the LSI data 21 are input to the CAM data management system 40 (step S1). The format of the CAD data 11 is shown in FIG. The CAD data 11 is configured to include the PKG name of the electronic package, the printed circuit board name, the X and Y coordinates of the component to be mounted, the circuit symbol, etc. shown in FIG. The format of the LSI data 21 is shown in FIG.
And shown in FIG. Fig. 5 shows L on the component side of the printed circuit board
This is SI data, and FIG. 6 is LSI data on the solder side. The LSI data 21 includes the number of workers of the components mounted in the electronic package shown in FIG. 7, the component drawing number, the component product name,
It has a structure that includes circuit symbols.

Next, it is confirmed whether or not the new component is registered in the component information 43 (step S2). If it is not registered, the host 30 transmits the component master data 3 shown in FIG.
Input 1 (step S3). The component master data 31 includes the component product name, component drawing number, specification standard, etc. shown in FIG. For example, in the case of DIP / IC, according to the definition of FIG.
It is registered in the format of the part information setting shown in FIG. 11 (step S4), and the shape of the part is input according to the shape division of FIG. 12 (step S5). As shown in FIG. 11, in the case of an IC with a component name “TTT5173N”, the shape classification is [D0100] and the classification [D] type [01] shape [00].

Next, it is confirmed whether or not the production skill information 41 has been registered (step S6). If not registered,
Mounting conditions such as the dimensions of each part of the electronic component mountable by the automatic mounting machine are input to the production technique information 41 (step S7).
For example, in the case of DIP / IC, the automatic mounting machine is the DIP inserter 51, and from the definition of the biotechnology information of the DIP inserter 51 shown in FIG. 13, the size of the target electronic component that can be mounted on the printed circuit board is 0.3 inch in lead pitch ( If P2 is 7.62 mm), the lateral dimension W is 7.62 to 2
The conditions are 6.68 mm, the maximum vertical dimension L is 7.37 mm, and the number of pins N is 6 to 20 pins.

When mounting electronic parts, the size of the mounting head (1 in FIG. 13, W ₀ = 26.68 mm, L ₀₎
= 12.7 mm) space is required. Printed circuit board size (horizontal X ₀ = 150-440 mm, vertical Y ₀ = 100
(-440 mm) and the mountable range (hatched part in the figure) is limited. The formats of inserter data and mountable component data that incorporate the above mounting conditions are shown in FIGS. In addition, production skill information 41
Once registered, it is not necessary to enter it unless the automatic mounting machine is changed.

Further, the component information 43 and the production technique information 41 are automatically matched with each other to determine whether or not mounting is possible by an automatic mounting machine (hereinafter, automatic mounting classification), and register the component information (step S8). For example, in the case of the "TTT5173N" IC shown in FIG. 11, the lead pitch is 7.62 mm and the lateral dimension W is 1.
Since it is 9.50 mm, the vertical dimension L is 6.40 mm, and the number of pins N is 16, it is determined that automatic mounting is possible, and [1] indicating that mounting is possible in the automatic mounting section (mounting) of the component information format in FIG. be registered.

The CAD data 11 input first
The definition of the coordinates of the printed circuit board 6 is as shown in FIG.
The first reference hole (x1, y1), not the substrate origin 61 of 0
A is the origin (0, 0), and for example, IC6 in this figure
In the case of 2, the coordinate P of pin 1 (x: 114.3, y: 1
3.97), and this coordinate P indicates the component position of the CAD data 11. This is because the CAD data 11 is based on the layout design on the printed circuit board, and the component position in that case is the pin 1 of the IC as a reference for the layout design. In this figure, 63 and 64 are first and second alignment marks for alignment.

However, as shown in FIG. 16, the inputted CAD data 11 has four types of patterns depending on the positions of the first reference hole A and the second reference hole B on the printed circuit board. The arrow in FIG. 16 indicates the front of the CAD data 11. FIG. 17 shows a list of pattern conversion values.
According to the list of pattern conversion values, the above coordinate definition, that is, pattern 1 is converted. However, the coordinate of pin 1 is CAD
The reference coordinates of the component position in the data 11 are the reference coordinates of the mounting position input to the IC inserter 51, that is, C.
It is not the reference coordinate of the component position in the AM coordinate. CAM
The reference coordinates of the component position in coordinates are usually based on the shape of the component because the mounting head grips the component.
In the case of an IC, the coordinates in the line direction (direction of the row in which the pins are arranged) have a predetermined displacement position a from the pin on the side opposite to pin 1.
It becomes 2. The direction perpendicular to this is the center of the two pin rows (that is, dual in line). Therefore, the component coordinates of the CAD data 11 must be converted into the mounting position coordinates of the IC inserter.

This coordinate conversion will be described below with reference to FIG. Assuming that the number of pins used is 16 and the mounting pitch is 7.62 mm, the offsets a1 and b1 in the X and Y directions are calculated by the following equation. In this case, the above-mentioned “predetermined displacement position a
2 "is 7.62 mm.

A1 = ((16 ÷ 2) −1) × 2.54-7.62 = 10.16 b1 = 7.62 ÷ 2 = 3.81 FIGS. 18A and 18B show this state. It is shown.

Therefore, the component position in the converted CAM coordinates is CAM coordinates X X = 114.3-10.16 = 104.14 CAM coordinates Y Y = 13.97-3.81 = 10.16, and CAM Coordinate X is 104.14 mm, Y is 10.1
It will be 6 mm. The CAM component position Q after conversion in FIG.
Indicates.

The part position P in the CAD data 11 is
It differs depending on the shape of the part and also on the pattern number shown in FIG. 16, that is, the mounting angle. Figure 1
9 shows the definition of the 1st pin coordinate and mounting angle of other electronic components.

After the conversion to CAM coordinates, the data is linked and unified based on the LSI data 21 and the circuit symbol,
It is registered according to the CAM data format shown in FIG. 20 (step S9).

Next, the mounting machine is sorted by the CAM data and the component information (step S10). For example, C in FIG.
Data "TTT5173N" of the part name of AM data
Is an IC mounting process (IC inserter) from the shape information of the component information, and the mounting process sequence of the automatic mounting machine described later is the mounting process [3].

Then, the optimum mounting order of the electronic components to be mounted on the electronic package is determined (step S11). In other words, in order to reduce the mounting head interference and the mounting time, the mounting angle is divided into "-90 degrees", "0 degrees", and "90 degrees" according to pre-registered production technique information as shown in FIG.
22 is output in the order of "degree" and "180 degree".
As described above, the mounting order of 102, 101, 103, 106, ... Is registered in the mounting order of the CAM data.

When the optimum mounting order is determined, it is checked whether there is any interference (step S12). For example, in the case of automatically mounting an IC with the IC inserter, FIG.
As shown in (a), if the previously mounted IC 81 exists in the same IC inserter process, that is, in the IC mounting process, the mounting head 8 that mounts the next IC 82 to be mounted is mounted.
3 interferes. Further, also in the radial inserter shown in FIG. 23 (b), the radial component 8 previously mounted is mounted.
4 exists, if the interference check is not performed and the next radial component 85 is mounted as it is, the two radial components interfere with each other.

On the other hand, between the different processes, as shown in FIG. 24, there is a priority in the mounting order depending on the type of components to be mounted. That is, the mounting of chip parts is the first step [1], and the second is FIC (flat package I).
The step [2] of mounting C) and finally the step [8] of manual assembly by the manual assembly indicator. Therefore, as shown in FIG. 23C, if there is a QFP 86 previously mounted by the FIC mounter in the step [2] having a higher mounting order, the IC 87 mounted by the IC inserter is mounted in the next step [3]. The head 83 will interfere with the QFP 86.

The interference check range of such an electronic component is performed on the component surface from the step [1] to the step [5] in FIG. 24, and on the solder surface, the step [6] and the step [7]. ]]

A method of checking the interference of the electronic parts described above will be described with reference to FIG.

As shown in FIG. 25A, IC91 (mounting angle "0 degree") is mounted first, and then IC92.
(Mounting angle "-90 degrees"), when the IC93 and the IC94 are mounted in this order, the CAM coordinates X, Y, the lead pitch, and the vertical and horizontal dimensions of the IC92 are first called from the CAM data, and the IC92 is moved to the CAM coordinate position. And the figure of the mounting head 95 holding this is drawn. At this time, FIG. 25 (b)
As shown in FIG. 25, there is no problem if the mounting head 95 does not interfere with the IC 91. However, as shown in FIG. 25C, a part of the IC 91 and a part of the mounting head 95 are shown in a hatched area 9
When they overlap with each other at 6, the IC 92 becomes an interference component. Similarly, IC93 and IC94 are also interference parts. In this case, the number of interfering parts mounted first and the number of interfering parts mounted later are calculated, and the smaller number is used as the interfering part for the hand setting indicator data of the hand setting process.
The mounting step [3] of the CAM data is changed to the step [8] with 1 as an interference component.

Then, as shown in FIG. 26, the NC data 47 shown in FIG. 1 is output for each automatic mounting machine with respect to the input data consisting of the CAD data, the component master data and the POL data (step S13). In this case,
The CAM data is divided according to the mounting process, and the NC data 47 is output to a floppy disk or the like with an individual file name. For example, since the mounting process [3] is the IC inserter, the file name is edited by editing the assembly drawing number in FIG.
607A. 27, and outputs in the format of FIG. 27. The definition of the format of FIG. 27 is according to FIG.

As described above, CAD which is data at the time of design
Data, LSI data, and component master data are used to automatically and accurately generate and output NC data suitable for a mounting machine, so the time required for NC data creation can be reduced and a high-quality electronic package can be obtained. It is possible to make a variety of products and shorten the delivery time.

In this embodiment, the IC inserter for mounting an IC as an automatic mounter for electronic parts has been described, but the invention is not limited to this, and an axial inserter for mounting an axial part such as a resistor, a capacitor, a transistor, etc. Radial inserter for mounting the radial parts of, or the imposition parts QFP, SOP,
It is also applied to FIC mounters that mount chips and chip mounters.

FIG. 29 is a diagram showing the configuration of the second embodiment of the CAD / CAM data conversion system of the present invention. In FIG. 29, elements that are substantially the same as the first configuration shown in FIG. 1 (the detailed internal configuration is different from the configuration in FIG. 1) are designated by the same reference numerals, and description thereof will be omitted.

In FIG. 29, the CAD system 10 which is a CAD data generating means collectively manages and stores all the created CAD data in a CAD database (hereinafter referred to as "CAD database").
It is stored in the ADDB) 101. This CAD system is equipped with a plurality of CAD terminal devices.
It is connected to the ADDB 101. Further, the POL system 20 which is the mounting data generation means is
LSI that collectively manages and stores all data (mounting data)
It is stored in a database (hereinafter, POLDB) 201. This POL system includes a plurality of POL terminal devices, each of which is connected to a POLDB 201.

Similarly, the host 30, which is the component data generating means, stores all component master data, which is individual information of the component, in a component master database (hereinafter, component master DB) 301 for collectively managing and storing.

The CAM data management system 40, which is a CAM data generating means, receives and combines CAD data, LSI data and component master data to create NC data which is CAM data. NC database for management and storage (hereinafter, NCD
It is stored in B).

The CAD system 10, the POL system 20, the host 30, and the CAM data management system 40 are connected by a high-speed LAN 100 using an optical fiber. In addition, the CAM data management system 40
And the automatic mounting machine group 50 are also connected by the high-speed LAN 200.

Further, 60 is another system connected via the optical LAN 200. In this embodiment, as the other system, an in-circuit tester 61 is connected to perform an inspection such as a continuity test or a constant value test of an electronic package on which electronic components are mounted.

In the operation of the configuration of FIG. 29, LA
N100 and 200 enable high-speed mutual communication, and CAD data in the CADDB 12 can be transmitted from the CAD system 10 to the CAM data management system 40 or can be called from the CAM data management system 40. Similarly, the LSI data of the POLDB 22 can be transmitted from the POL system 20 to the CAM data management system 40 or can be called from the CAM 4, and the component master data of the component master DB 32 can be managed by the host 30 in the CAM data management. It can be sent to the system 40 or can be called from the CAM data management system 40.

The NC data of NCDB48 is CA
It is possible to transmit from the M data management system 40 to the control device (51c etc.) of each automatic mounting device (51 etc.) of the automatic mounting machine group 50, or to call from each control device.

[0044]

As is apparent from the above embodiments, a CAD system for outputting CAD data such as mounting position coordinates, mounting angles, circuit symbols, etc. of electronic components on a printed circuit board, LSI for component names, circuit symbols, etc. A POL system that is a device that outputs data, a host computer that outputs component master data such as component names and specifications of electronic components, and CAD data, LSI data, and component master data are linked to generate unified CAM data. A CAM data management system that automatically creates and outputs NC data for each automatic mounting machine, including component information such as the classification of the automatic mounting machine and whether or not automatic mounting is possible, and production technology information that is the mounting conditions for the automatic mounting machine. By having and, CAD data, LSI data, and component master data, which are design-time data, can be Since NC data suitable for a mounting machine can be automatically and accurately created and output without manual creation, it is possible to make a variety of high-quality electronic packages and shorten the delivery time. .

Further, by connecting the above-mentioned systems by a high-speed LAN using an optical fiber, a large amount of CAD data, LSI data, and component master data are transmitted at high speed over a high-speed LAN over a long distance to generate CAM data. Then
Further, since this CAM data is transmitted to the automatic mounting machine group and the inspection device via the high-speed LAN, a series of rapid manufacturing processes for the electronic package can be performed even if the design department, the management department, the manufacturing factory, the inspection department, etc. are located in remote places. The effect that can be built is obtained.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of a CAD / CAM data conversion device according to the present invention.

FIG. 2 is a flowchart showing a CAD / CAM data conversion method according to the present invention.

FIG. 3 is a diagram showing a format of CAD data.

FIG. 4 is a diagram showing the definition of CAD data.

FIG. 5 is a diagram showing a format of LSI data on a component side.

FIG. 6 is a diagram showing a format of LSI data on a solder side.

FIG. 7 is a diagram showing the definition of LSI data.

FIG. 8 is a diagram showing a format of component master data.

FIG. 9 is a diagram showing a definition of component master data.

FIG. 10 is a diagram showing the definition of each dimension of an IC that is an electronic component.

FIG. 11 is a diagram showing a data format of component information.

FIG. 12 is a diagram showing the definition of part shape classification.

FIG. 13 is a diagram showing the definition of an IC inserter.

FIG. 14 is a diagram showing a data format of an IC inserter.

FIG. 15 is a diagram showing a definition of coordinates of an electronic package.

FIG. 16 is a diagram showing a definition of a pattern number of CAD data.

FIG. 17 is a diagram showing a list of pattern conversion values for CAM data.

FIG. 18 is a diagram showing an outline of converting CAD data into CAM data.

FIG. 19 is a diagram showing a definition of a mounting angle for each electronic component.

FIG. 20 is a diagram showing a format of CAM data.

FIG. 21 is a diagram showing the priority of mounting angles in the optimum mounting order.

FIG. 22 is a diagram showing priorities of mounting positions in the optimum mounting order.

FIG. 23 is a diagram showing a six-way check between a mounting head and mounted components.

FIG. 24 is a diagram showing a mounting process sequence of the automatic mounting machine.

FIG. 25A is a diagram showing a mounted state of an electronic package. FIG. 6B is a diagram showing a state where the mounting head and the components do not interfere with each other. (C) is a figure which shows the state which the mounting head and the component interfered.

FIG. 26 is a diagram showing a file name list of NC data for each mounting machine.

FIG. 27 is a diagram showing a format of NC data in an IC inserter.

FIG. 28 is a diagram showing the definition of NC data.

FIG. 29 is a configuration diagram of another embodiment of the CAD / CAM data converter according to the present invention.

[Explanation of symbols]

10 CAD system (CAD data generating means) 20 POL system (mounting data generating means) 30 Host computer (component data generating means) 40 CAM data management system (CAM data generating means) 50 Automatic mounting machine group (component mounting means) 11 CAD Data 21 LSI data (mounting data) 31 Component master data (component data) 42 CAM data 47 NC data

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Gunji Sasaki 94 Kuniyama, Koriyama, Fukushima Prefectural Telecom Technology Co., Ltd. In Tate Telecom Technology (72) Inventor Shinji Hoshi 94, Funaba, Koriyama City, Fukushima Prefecture

Claims (4)

[Claims] 1. An apparatus for producing an electronic package by mounting electronic components on a printed circuit board, comprising: CAD data generating means for generating CAD data of a layout design of the electronic package; and electronic components mounted on the printed circuit board. Mounting data generating means for generating mounting data, component data generating means for generating component data by registering individual data of the electronic component, and the CAM data by unifying the CAD data and the mounting data. And NC based on the part data
A CAM data generating means for generating data, and a component mounting means for automatically mounting the electronic component on the printed circuit board according to the NC data, C
AD / CAM data converter. 2. An optical fiber is used between the CAD data generating means, the mounting data generating means and the component data generating means, and the CAM data generating means, and between the CAM data generating means and the component mounting means. The CAD according to claim 1, wherein the CAD is connected by a high-speed LAN.
/ CAM data converter. 3. A production method for producing an electronic package by mounting electronic components on a printed circuit board, wherein CAD data of a layout design of the electronic package and mounting data of electronic components mounted on the printed circuit board are unified. CAD / CA, wherein CAM data is generated, and NC data unique to a component mounting means for automatically mounting the electronic component on the printed circuit board is generated based on the CAM data and the component data of the electronic component.
M data conversion method. 4. The CAD data, the mounting data, the component data, and the CAM data are high-speed LAN using an optical fiber.
C according to claim 3, characterized in that it is transmitted via
AD / CAM data conversion method.