JPH06164082A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH06164082A JPH06164082A JP4313318A JP31331892A JPH06164082A JP H06164082 A JPH06164082 A JP H06164082A JP 4313318 A JP4313318 A JP 4313318A JP 31331892 A JP31331892 A JP 31331892A JP H06164082 A JPH06164082 A JP H06164082A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- resin
- weight
- epoxy resin
- represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 ボンディングを行う際の加熱温度範囲を広げ
てボンディングの信頼性の向上をはかる。
【構成】 多官能エポキシ樹脂にフエノール樹脂を配合
することにより、可とう性と架橋密度を高め、耐熱性を
向上させた樹脂組成物を使用した高耐熱性基板２１に、
ベアチップ２を乗せ、このベアチップ２の電極と前記基
板２１の導体層５のパッド部とを金ワイヤ６のボンディ
ングにより接続した構造のプリント配線板。
(57) [Summary] [Purpose] The heating temperature range for bonding is expanded to improve the reliability of bonding. [Structure] A highly heat resistant substrate 21 using a resin composition in which flexibility and cross-linking density are increased by blending a polyfunctional epoxy resin with a phenol resin to improve heat resistance,
A printed wiring board having a structure in which the bare chip 2 is placed and the electrodes of the bare chip 2 and the pad portions of the conductor layer 5 of the substrate 21 are connected by gold wire 6 bonding.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体のベアチップ
を実装したプリント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board on which a semiconductor bare chip is mounted.
【０００２】[0002]
【従来の技術】図３は、例えば特開昭６１−２８０９５
３号にて提案された従来のベアチップ実装型のプリント
配線板を示す断面図である。図において、１はガラスエ
ポキシ樹脂を基材とする基板、２はベアチップ、３はチ
ップランド、４はダイペースト、５は導体層、６は金ワ
イヤである。2. Description of the Related Art FIG. 3 shows, for example, JP-A-61-28095.
It is sectional drawing which shows the conventional bare chip mounting type printed wiring board proposed by No. 3. In the figure, 1 is a substrate based on glass epoxy resin, 2 is a bare chip, 3 is a chip land, 4 is a die paste, 5 is a conductor layer, and 6 is a gold wire.
【０００３】上記ベアチップ２は、基板１に設けられた
チップランド３にダイペースト４を介してアウントされ
ている。ベアチップ２の電極と基板１に形成された導体
層５のパッド部は、金ワイヤ６の熱圧着または超音波熱
圧着によるボンディングによって接続されている。The bare chip 2 is laid on a chip land 3 provided on the substrate 1 through a die paste 4. The electrode of the bare chip 2 and the pad portion of the conductor layer 5 formed on the substrate 1 are connected by bonding the gold wire 6 by thermocompression bonding or ultrasonic thermocompression bonding.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来のプリン
ト配線板にあっては、上述のように、熱圧着または超音
波熱圧着によって金ワイヤ６のボンディングを行うの
で、基板１を加熱しなければならなかった。このため、
基板１のガラス転移温度以上に加熱した場合には、基板
１が軟化し、圧力が吸収され、ボンディングの信頼性が
低下するという問題があった。特に、基板１の板厚が薄
い（１．０mm以下）場合には、ボンディングの温度範囲
をガラス転移温度の上限から１４０℃付近までの狭い範
囲でコントロールしなければならず、実装条件の管理が
困難であった。However, in the conventional printed wiring board, since the gold wire 6 is bonded by thermocompression bonding or ultrasonic thermocompression bonding as described above, the substrate 1 must be heated. did not become. For this reason,
When the substrate 1 is heated to the glass transition temperature or higher, there is a problem that the substrate 1 is softened, the pressure is absorbed, and the bonding reliability is lowered. In particular, when the board 1 is thin (1.0 mm or less), the bonding temperature range must be controlled within a narrow range from the glass transition temperature upper limit to around 140 ° C. It was difficult.
【０００５】この発明は、上記のような問題点を解消す
るためになされたもので、ボンディングを行う際の加熱
温度範囲を広げることができ、したがって、ボンディン
グの信頼性の向上を図ることができるプリント配線板を
得ることを目的とする。The present invention has been made in order to solve the above-mentioned problems, and the heating temperature range for bonding can be widened, and therefore the reliability of bonding can be improved. The purpose is to obtain a printed wiring board.
【０００６】また、この発明は、樹脂モールド工程が容
易であり、組立品の薄形化も可能なプリント配線板を得
ることを目的とする。Another object of the present invention is to obtain a printed wiring board which can be easily resin-molded and whose assembly can be made thinner.
【０００７】[0007]
【課題を解決するための手段】この発明に係るプリント
配線は、次の（１）〜（４）に記載の樹脂組成物
（Ｃ），（Ｄ），（Ｅ）または（Ｆ）を使用した基板に
ベアチップを乗せ、ワイヤボンディングを行って構成し
たものである。The printed wiring according to the present invention uses the resin composition (C), (D), (E) or (F) described in (1) to (4) below. This is configured by placing a bare chip on a substrate and performing wire bonding.
【０００８】（１）(1)
【０００９】[0009]
【化９】 で表わされる多官能エポキシ樹脂（α1 ）に、[Chemical 9] In the polyfunctional epoxy resin (α 1 ) represented by
【００１０】[0010]
【化１０】 で表わされるビスフエノールＡ型エポキシ樹脂（α2 ）
を、重量比１００：０〜３０：７０で配合したエポキシ
樹脂組成物（α）に、[Chemical 10] Bisphenol A type epoxy resin (α 2 ) represented by
To the epoxy resin composition (α) blended in a weight ratio of 100: 0 to 30:70,
【００１１】[0011]
【化１１】 で表わされるブロム化ビスフエノールＡ（β）を、上記
エポキシ樹脂組成物（α）のエポキシ基末端１当量に対
し上記ブロム化ビスフエノールＡ（β）の水酸基が０．
０５〜０．５当量となる割合で配合した組成物をエポキ
シ基と水酸基の反応率が８０％以上になるまで反応させ
て得られる多官能エポキシ樹脂（Ａ）と、ビスフエノー
ルＡとホルムアルデヒドとの重縮合物である分子量１，
０００〜１０，０００のフエノール樹脂（Ｂ）とを、上
記多官能エポキシ樹脂（Ａ）のエポキシ基末端１当量に
対し上記フエノール樹脂（Ｂ）の水酸基が０．７〜１．
２当量となる割合で配合した組成物（Ｉ）１００重量部
に、この組成物（Ｉ）に相溶する分子量５，０００〜１
００，０００の直鎖状高分子（II）を１〜６０重量部配
合した樹脂組成物（Ｃ）。[Chemical 11] The brominated bisphenol A (β) represented by the formula (1) has a hydroxyl group of the brominated bisphenol A (β) of 0.1 equivalent to 1 equivalent of the epoxy group terminal of the epoxy resin composition (α).
A polyfunctional epoxy resin (A) obtained by reacting a composition blended in a proportion of 05 to 0.5 equivalents until the reaction rate of epoxy groups and hydroxyl groups becomes 80% or more, bisphenol A and formaldehyde. Molecular weight 1, which is a polycondensate
000 to 10,000 of the phenol resin (B), and the hydroxyl group of the phenol resin (B) is 0.7 to 1. per 1 equivalent of the epoxy group terminal of the polyfunctional epoxy resin (A).
100 parts by weight of the composition (I) blended in a ratio of 2 equivalents have a molecular weight of 5,000 to 1 compatible with the composition (I).
A resin composition (C) containing 1 to 60 parts by weight of a linear polymer (II) of 0,000.
【００１２】（２）(2)
【００１３】[0013]
【化１２】 で表わされる多官能エポキシ樹脂（α）に、[Chemical 12] In the polyfunctional epoxy resin (α) represented by
【００１４】[0014]
【化１３】 で表わされるブロム化ビスフエノールＡ（β1 ）および[Chemical 13] Brominated bisphenol A (β 1 ) represented by
【００１５】[0015]
【化１４】 で表わされるビスフエノールＡ（β2 ）の内の少なくと
も一種を配合した組成物（β）を、上記多官能エポキシ
樹脂（α）のエポキシ基末端１当量に対し上記組成物
（β）の水酸基が０．０５〜０．５当量となる割合で配
合した組成物を、エポキシ基と水酸基の反応率が８０％
以上になるまで反応させて得られる多官能エポキシ樹脂
（Ａ）と、ビスフエノールＡとホルムアルデヒドとの重
縮合物である分子量１，０００〜１０，０００のフエノ
ール樹脂（Ｂ）とを、上記多官能エポキシ樹脂（Ａ）の
エポキシ基末端１当量に対し上記フエノール樹脂（Ｂ）
の水酸基が０．７〜１．２当量となる割合で配合した組
成物（Ｉ）に、この組成物（Ｉ）に相溶する分子量５，
０００〜１００，０００の直鎖状高分子（II）を１〜６
０重量部配合した樹脂組成物（Ｄ）。[Chemical 14] The composition (β) containing at least one of the bisphenol A (β 2 ) represented by the formula (1) has a hydroxyl group of the composition (β) with respect to 1 equivalent of the epoxy group terminal of the polyfunctional epoxy resin (α). The composition containing 0.05 to 0.5 equivalents was used, and the reaction rate of the epoxy group and the hydroxyl group was 80%.
The above-mentioned polyfunctional epoxy resin (A) obtained by reacting until the above and the phenol resin (B) having a molecular weight of 1,000 to 10,000, which is a polycondensation product of bisphenol A and formaldehyde, are added. The above-mentioned phenol resin (B) per 1 equivalent of the epoxy group terminal of the epoxy resin (A)
Of the hydroxyl group of 0.7 to 1.2 equivalents in the composition (I), the molecular weight 5, which is compatible with the composition (I).
000-100,000 linear polymer (II) 1-6
A resin composition (D) blended with 0 part by weight.
【００１６】（３）(3)
【００１７】[0017]
【化１５】 で示される多官能エポキシ樹脂（α）に、フエノール樹
脂（β）を、上記多官能エポキシ樹脂（α）のエポキシ
基末端１当量に対し上記フエノール樹脂（β）の水酸基
が０．７〜１．２当量となる割合で配合した組成物
（Ｉ）１００重量部に、分子量５，０００〜１００，０
００の直鎖状高分子（Ａ）を１〜１００重量部配合した
樹脂組成物（Ｅ）。[Chemical 15] The phenol resin (β) is added to the polyfunctional epoxy resin (α) represented by the formula (1), and the hydroxyl group of the phenol resin (β) is 0.7 to 1. A molecular weight of 5,000 to 100,0 was added to 100 parts by weight of the composition (I) mixed in a ratio of 2 equivalents.
A resin composition (E) containing 1 to 100 parts by weight of the linear polymer (A) of No. 00.
【００１８】（４）(4)
【００１９】[0019]
【化１６】 で示される多官能エポキシ樹脂（α）に、フエノール樹
脂（β）を、上記多官能エポキシ樹脂（α）のエポキシ
基末端１当量に対し上記フエノール樹脂（β）の水酸基
が０．７〜１．２当量となる割合で配合した組成物
（Ｉ）１００重量部に、ビスマレイミドリリアジン化合
物，又はビスマレイミド化合物とビスマレイミド化合物
にモル比率０．３〜１．０の芳香族ジアミン化合物をあ
らかじめ予備反応させた組成物であるイミド組成物
（Ｂ）を１０〜２００重量部配合した組成物（II）に、
分子量５，０００〜１００，０００の直鎖状高分子
（Ａ）を１〜１００重量部配合した樹脂組成物（Ｆ）。[Chemical 16] The phenol resin (β) is added to the polyfunctional epoxy resin (α) represented by the formula (1), and the hydroxyl group of the phenol resin (β) is 0.7 to 1. 100 parts by weight of the composition (I) compounded in a ratio of 2 equivalents was preliminarily preliminarily prepared with a bismaleimidolyriazine compound or a bismaleimide compound and a bismaleimide compound with an aromatic diamine compound having a molar ratio of 0.3 to 1.0. To the composition (II) containing 10 to 200 parts by weight of the reacted imide composition (B),
A resin composition (F) containing 1 to 100 parts by weight of a linear polymer (A) having a molecular weight of 5,000 to 100,000.
【００２０】また、この発明に係るプリント配線板は、
エポキシ系高耐熱性基板に設けた凹部にベアチップを乗
せ、ワイヤボンディングを行って構成したものである。The printed wiring board according to the present invention is
A bare chip is placed in a recess provided on an epoxy-based high heat resistant substrate and wire bonding is performed.
【００２１】[0021]
【作用】この発明によるプリント配線板にあっては、多
官能エポキシ樹脂にフエノール樹脂を配合することによ
り可とう性と架橋密度を高め、耐熱性を向上させた樹脂
組成物を基材とした基板を用いているので、ボンディン
グを行う際の加熱温度範囲を広げることができる。In the printed wiring board according to the present invention, a substrate having a resin composition as a base material in which flexibility and crosslink density are increased by blending a polyfunctional epoxy resin with a phenol resin to improve heat resistance Therefore, the heating temperature range for bonding can be expanded.
【００２２】また、この発明によるプリント配線板にあ
っては、その基板にベアチップをマウトする凹部を設け
たので、ボンディング後のベアチップの樹脂モールドが
容易になり、ベアチップ実装後の高さも高くすることが
できる。Further, in the printed wiring board according to the present invention, since the concave portion for mounting the bare chip is provided in the substrate, the resin molding of the bare chip after bonding is facilitated and the height after mounting the bare chip is increased. You can
【００２３】[0023]
【実施例】（実施例１）以下、この発明の実施例を図１
によって説明する。図１は実施例のプリント配線板を断
面で示した図である。Embodiment 1 Embodiment 1 of the present invention will be described below with reference to FIG.
Explained by. FIG. 1 is a cross-sectional view of the printed wiring board of the example.
【００２４】図において、２〜６は図３に示す従来例に
おける構成要素と同一の要素を示す。２１は板厚１．０
mmの高耐熱性基板である。In the figure, 2 to 6 represent the same elements as those in the conventional example shown in FIG. 21 is 1.0
High heat resistance substrate of mm.
【００２５】上記高耐熱性基板２１は、その基材として
次の樹脂組成物１〜３をそれぞれ使用することによって
製造した。各樹脂組成物１〜３は、次の要領で調整し
た。The high heat resistant substrate 21 was manufactured by using the following resin compositions 1 to 3 as its base materials, respectively. Each of the resin compositions 1 to 3 was prepared in the following manner.
【００２６】（１）樹脂組成物１(1) Resin composition 1
【００２７】[0027]
【化１７】 で示される多官能エポキシ樹脂７０ｇ（商品名：ＴＡＣ
ＴＩＸ−７４２，ダウケミカル製）にモノブロムビスフ
エノールＡ３ｇとビスフエノールＡ４ｇおよびトリエチ
ルアミン０．０１ｇを配合して、１００℃で３時間加熱
し、組成物のエポキシ基と水酸基の反応率が８５％とな
る多官能エポキシ樹脂（Ａ）を得た。[Chemical 17] 70g of polyfunctional epoxy resin (trade name: TAC
TIX-742, manufactured by Dow Chemical Co., Ltd.) was mixed with 3 g of monobromobisphenol A, 4 g of bisphenol A and 0.01 g of triethylamine and heated at 100 ° C. for 3 hours, and the reaction rate of the epoxy group and the hydroxyl group of the composition was 85%. The following polyfunctional epoxy resin (A) was obtained.
【００２８】これに、ビスフエノールＡノボラックタイ
プのフエノール樹脂（Ｂ）２３ｇ（商品名ＫＰ−７５６
Ｐ荒川化学工業製）を配合した組成物（Ｉ）１００ｇ
に、分子量３０，０００のフエノキシ樹脂１５ｇ（商品
名ＰＫＨＨユニオンカーバイド）および２−エチル−４
−メチルイミダゾール０．１ｇを配合し、エチレングリ
コールモノメチルエーテル８０ｇに溶解させ、５９％濃
度の樹脂組成物１を得た。In addition, 23 g of bisphenol A novolac type phenol resin (B) (trade name KP-756)
P (made by Arakawa Chemical Industry Co., Ltd.), composition (I) 100 g
In addition, 15 g of phenoxy resin having a molecular weight of 30,000 (trade name PKHH Union Carbide) and 2-ethyl-4
-Methylimidazole 0.1g was mix | blended and it was made to melt | dissolve in ethylene glycol monomethyl ether 80g, and the resin composition 1 of 59% concentration was obtained.
【００２９】（２）樹脂組成物２(2) Resin composition 2
【００３０】[0030]
【化１８】 で示される多官能エポキシ樹脂１００ｇ（商品名ＴＡＣ
ＴＩＸ−７４２ダウケミカル製）にビスフエノールＡ型
エポキシ樹脂１０ｇ（商品名エピコート１００１油化シ
エル製）とテトラブロムビスフエノールＡ２５ｇおよび
トリエチルアミン０．０１ｇを配合して、１３０℃で１
時間加熱し、組成物のエポキシ基と水酸基の反応率が８
５％となる多官能エポキシ樹脂（Ａ）を得た。[Chemical 18] 100g of polyfunctional epoxy resin (trade name TAC
TIX-742 Dow Chemical Co., Ltd.) was blended with 10 g of bisphenol A type epoxy resin (trade name Epicoat 1001 made by Yuka Shell Co., Ltd.), 25 g of tetrabromobisphenol A and 0.01 g of triethylamine.
After heating for a period of time, the reaction rate between the epoxy group and the hydroxyl group of the composition is 8
A 5% polyfunctional epoxy resin (A) was obtained.
【００３１】これに、ビスフエノールＡノボラックタイ
プのフエノール樹脂２５ｇ（商品名ＫＰ−７５６荒川化
学工業製）を配合した組成物（Ｉ）１００ｇに、分子量
３０，０００のフエノキシ樹脂（II）１５ｇ（商品名Ｐ
ＫＨＨユニオンカーバイド）および２−エチル−４−メ
チルイミダゾール０．１ｇを配合し、エチレングリコー
ルモノメチルエーテル８０ｇに溶解させ、５９％濃度の
樹脂組成物２を得た。To 100 g of the composition (I) in which 25 g of bisphenol A novolac type phenol resin (trade name KP-756 manufactured by Arakawa Chemical Industry Co., Ltd.) was added, 15 g of a phenoxy resin (II) having a molecular weight of 30,000 (commercial product) First name P
KHH Union Carbide) and 2-ethyl-4-methylimidazole (0.1 g) were mixed and dissolved in 80 g of ethylene glycol monomethyl ether to obtain a resin composition 2 having a concentration of 59%.
【００３２】（３）樹脂組成物３(3) Resin composition 3
【００３３】[0033]
【化１９】 で示される多官能エポキシ樹脂（商品名ＴＡＣＴＩＸ−
７４２ダウケミカル製）６５ｇとフエノール樹脂（商品
名ＰＳＦ−４２６１群栄化学製）３５ｇ（フエノール性
水酸基／エポキシ基の当量比：０．７）を配合した組成
物（Ｉ）１００ｇに、ポリパラバン酸１５ｇ（商品名Ｘ
Ｔ−４東燃石油製）および２−エチル−４−メチルイミ
ダゾール０．１ｇを配合し、エチレングリコールモノメ
チルエーテル５０ｇとシクロヘキサノン３０ｇに溶解さ
せ、５９％濃度の樹脂組成物３を得た。[Chemical 19] Polyfunctional epoxy resin (trade name TACTIX-
742 Dow Chemical) 65 g and phenol resin (trade name PSF-4261 Gunei Chemical Co., Ltd.) 35 g (phenolic hydroxyl group / epoxy group equivalent ratio: 0.7) 100 g composition (I), polyparabanic acid 15 g (Product name X
(T-4 Tonen Sekiyu KK) and 0.1 g of 2-ethyl-4-methylimidazole were mixed and dissolved in 50 g of ethylene glycol monomethyl ether and 30 g of cyclohexanone to obtain a resin composition 3 having a concentration of 59%.
【００３４】次に、ワイヤボンディングによるベアチッ
プ２の実装は、従来と同様に行った。すなわち、上記各
樹脂組成物１〜３からなる各高耐熱性基板２１に設けた
チップランド３にダイペースト４を介してベアチップ２
をマウントし、ベアチップ２の電極と高耐熱性基板２１
に形成された導体層５のパッド部とを金ワイヤ６のボン
ディングにより接続した。Next, the bare chip 2 was mounted by wire bonding in the same manner as in the prior art. That is, the bare lands 2 are formed on the chip lands 3 provided on the high heat resistant substrates 21 made of the resin compositions 1 to 3 via the die paste 4.
Mounted, the electrode of the bare chip 2 and the high heat resistant substrate 21
The pad portion of the conductor layer 5 formed in the above was connected by the bonding of the gold wire 6.
【００３５】上記ボンディング時における加熱は、１８
６℃まで可能であった。このような高い加熱温度でボン
ディングを行っても、高耐熱性基板２１の軟化は認めら
れなかった。The heating at the time of bonding is 18
It was possible up to 6 ° C. Even if bonding was performed at such a high heating temperature, softening of the high heat resistant substrate 21 was not observed.
【００３６】このことから、実施例のプリント配線板に
よれば、熱圧着または超音波熱圧着における熱エネルギ
ーの設定条件を広くでき、より品質の高いボンディング
が可能となることが判った。From the above, it has been found that the printed wiring board of the embodiment can widen the setting conditions of the thermal energy in thermocompression bonding or ultrasonic thermocompression bonding, and can achieve higher quality bonding.
【００３７】（実施例２）図２は他の実施例を示す。こ
の実施例によるプリント配線板は、実施例１の高耐熱性
基板２１に設けた凹部２２にベアチップ２をマウント
し、上記実施例と同様にワイヤボンディングした構造の
ものである。(Embodiment 2) FIG. 2 shows another embodiment. The printed wiring board according to this example has a structure in which the bare chip 2 is mounted in the recess 22 provided in the high heat resistant substrate 21 of Example 1 and wire bonding is performed in the same manner as in the above example.
【００３８】この実施例によれば、上記実施例と同様の
効果を得ることができるとともに、凹部２２を設けたの
で、ボンディング後のベアチップ２の樹脂モールドが容
易になり、またベアチップ実装後の高さも低くなる。According to this embodiment, the same effect as that of the above embodiment can be obtained, and since the recess 22 is provided, the resin molding of the bare chip 2 after bonding is facilitated, and the height after mounting the bare chip is high. Will also be lower.
【００３９】[0039]
【発明の効果】以上のように、請求項１〜５のプリント
配線板によれば、多官能エポキシ樹脂とフエノール樹脂
を反応させることにより耐熱性を向上させた高耐熱性基
板にワイヤボンディングを行うことができるので、ボン
ディングを行う際の加熱温度範囲を広げることができ、
したがって、ボンディングの信頼性が向上する。As described above, according to the printed wiring board of the present invention, the polyfunctional epoxy resin and the phenol resin are reacted with each other to perform the wire bonding on the high heat resistant substrate having the improved heat resistance. Therefore, it is possible to widen the heating temperature range when performing bonding,
Therefore, the reliability of bonding is improved.
【００４０】また、請求項５のプリント配線板によれ
ば、樹脂モールド工程が容易となり、組立品の薄型化も
可能となる。According to the printed wiring board of the fifth aspect, the resin molding process is facilitated and the thickness of the assembled product can be reduced.
【図１】実施例のプリント配線板の断面図FIG. 1 is a sectional view of a printed wiring board according to an embodiment.
【図２】他の実施例のプリント配線板の断面図FIG. 2 is a sectional view of a printed wiring board according to another embodiment.
【図３】従来のプリント配線板の断面図FIG. 3 is a sectional view of a conventional printed wiring board.
２ ベアチップ ３ チップランド ４ ダイペースト ５ 導体層 ６ 金ワイヤ ２１ 高耐熱性基板 ２２ 凹部 2 Bare chip 3 Chip land 4 Die paste 5 Conductor layer 6 Gold wire 21 High heat resistant substrate 22 Recess
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/14 Ｈ０５Ｋ 1/02 Ｐ 7047−4Ｅ Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display location H01L 23/14 H05K 1/02 P 7047-4E
Claims (5)
にベアチップを乗せ、ワイヤボンディングを行ってなる
プリント配線板。 【化１】 で表わされる多官能エポキシ樹脂（α1 ）に、 【化２】 で表わされるビスフエノールＡ型エポキシ樹脂（α2 ）
を、重量比１００：０〜３０：７０で配合したエポキシ
樹脂組成物（α）に、 【化３】 で表わされるブロム化ビスフエノールＡ（β）を、上記
エポキシ樹脂組成物（α）のエポキシ基末端１当量に対
し上記ブロム化ビスフエノールＡ（β）の水酸基が０．
０５〜０．５当量となる割合で配合した組成物をエポキ
シ基と水酸基の反応率が８０％以上になるまで反応させ
て得られる多官能エポキシ樹脂（Ａ）と、ビスフエノー
ルＡとホルムアルデヒドとの重縮合物である分子量１，
０００〜１０，０００のフエノール樹脂（Ｂ）とを、上
記多官能エポキシ樹脂（Ａ）のエポキシ基末端１当量に
対し上記フエノール樹脂（Ｂ）の水酸基が０．７〜１．
２当量となる割合で配合した組成物（Ｉ）１００重量部
に、この組成物（Ｉ）に相溶する分子量５，０００〜１
００，０００の直鎖状高分子（II）を１〜６０重量部配
合した樹脂組成物（Ｃ）。1. A printed wiring board obtained by placing a bare chip on a substrate using the following resin composition (C) and performing wire bonding. [Chemical 1] A polyfunctional epoxy resin (α 1 ) represented by Bisphenol A type epoxy resin (α 2 ) represented by
To an epoxy resin composition (α) compounded in a weight ratio of 100: 0 to 30:70, and The brominated bisphenol A (β) represented by the formula (1) has a hydroxyl group of the brominated bisphenol A (β) of 0.1 equivalent to 1 equivalent of the epoxy group terminal of the epoxy resin composition (α).
A polyfunctional epoxy resin (A) obtained by reacting a composition blended in a proportion of 05 to 0.5 equivalents until the reaction rate of epoxy groups and hydroxyl groups becomes 80% or more, bisphenol A and formaldehyde. Molecular weight 1, which is a polycondensate
000 to 10,000 of the phenol resin (B), and the hydroxyl group of the phenol resin (B) is 0.7 to 1. per 1 equivalent of the epoxy group terminal of the polyfunctional epoxy resin (A).
100 parts by weight of the composition (I) blended in a ratio of 2 equivalents have a molecular weight of 5,000 to 1 compatible with the composition (I).
A resin composition (C) containing 1 to 60 parts by weight of a linear polymer (II) of 0,000.
にベアチップを乗せ、ワイヤボンディングを行ってなる
プリント配線板。 【化４】 で表わされる多官能エポキシ樹脂（α）に、 【化５】 で表わされるブロム化ビスフエノールＡ（β1 ）および 【化６】 で表わされるビスフエノールＡ（β2 ）の内の少なくと
も一種を配合した組成物（β）を、上記多官能エポキシ
樹脂（α）のエポキシ基末端１当量に対し上記組成物
（β）の水酸基が０．０５〜０．５当量となる割合で配
合した組成物を、エポキシ基と水酸基の反応率が８０％
以上になるまで反応させて得られる多官能エポキシ樹脂
（Ａ）と、ビスフエノールＡとホルムアルデヒドとの重
縮合物である分子量１，０００〜１０，０００のフエノ
ール樹脂（Ｂ）とを、上記多官能エポキシ樹脂（Ａ）の
エポキシ基末端１当量に対し上記フエノール樹脂（Ｂ）
の水酸基が０．７〜１．２当量となる割合で配合した組
成物（Ｉ）に、この組成物（Ｉ）に相溶する分子量５，
０００〜１００，０００の直鎖状高分子（II）を１〜６
０重量部配合した樹脂組成物（Ｄ）。2. A printed wiring board obtained by placing a bare chip on a substrate using the following resin composition (D) and performing wire bonding. [Chemical 4] A polyfunctional epoxy resin (α) represented by Brominated bisphenol A (β 1 ) represented by The composition (β) containing at least one of the bisphenol A (β 2 ) represented by the formula (1) has a hydroxyl group of the composition (β) with respect to 1 equivalent of the epoxy group terminal of the polyfunctional epoxy resin (α). The composition containing 0.05 to 0.5 equivalents was used, and the reaction rate of the epoxy group and the hydroxyl group was 80%.
The above-mentioned polyfunctional epoxy resin (A) obtained by reacting until the above and the phenol resin (B) having a molecular weight of 1,000 to 10,000, which is a polycondensation product of bisphenol A and formaldehyde, are added. The above-mentioned phenol resin (B) per 1 equivalent of the epoxy group terminal of the epoxy resin (A)
Of the hydroxyl group of 0.7 to 1.2 equivalents in the composition (I), the molecular weight 5, which is compatible with the composition (I).
000-100,000 linear polymer (II) 1-6
A resin composition (D) blended with 0 part by weight.
にベアチップを乗せ、ワイヤボンディングを行ってなる
プリント配線板。 【化７】 で示される多官能エポキシ樹脂（α）に、フエノール樹
脂（β）を、上記多官能エポキシ樹脂（α）のエポキシ
基末端１当量に対し上記フエノール樹脂（β）の水酸基
が０．７〜１．２当量となる割合で配合した組成物
（Ｉ）１００重量部に、分子量５，０００〜１００，０
００の直鎖状高分子（Ａ）を１〜１００重量部配合した
樹脂組成物（Ｅ）。3. A printed wiring board obtained by placing a bare chip on a substrate using the following resin composition (E) and performing wire bonding. [Chemical 7] The phenol resin (β) is added to the polyfunctional epoxy resin (α) represented by the formula (1), and the hydroxyl group of the phenol resin (β) is 0.7 to 1. A molecular weight of 5,000 to 100,0 was added to 100 parts by weight of the composition (I) mixed in a ratio of 2 equivalents.
A resin composition (E) containing 1 to 100 parts by weight of the linear polymer (A) of No. 00.
にベアチップを乗せ、ワイヤボンディングを行ってなる
プリント配線板。 【化８】 で示される多官能エポキシ樹脂（α）に、フエノール樹
脂（β）を、上記多官能エポキシ樹脂（α）のエポキシ
基末端１当量に対し上記フエノール樹脂（β）の水酸基
が０．７〜１．２当量となる割合で配合した組成物
（Ｉ）１００重量部に、ビスマレイミドリリアジン化合
物，又はビスマレイミド化合物とビスマレイミド化合物
にモル比率０．３〜１．０の芳香族ジアミン化合物をあ
らかじめ予備反応させた組成物であるイミド組成物
（Ｂ）を１０〜２００重量部配合した組成物（II）に、
分子量５，０００〜１００，０００の直鎖状高分子
（Ａ）を１〜１００重量部配合した樹脂組成物（Ｆ）。4. A printed wiring board obtained by placing a bare chip on a substrate using the following resin composition (F) and performing wire bonding. [Chemical 8] The phenol resin (β) is added to the polyfunctional epoxy resin (α) represented by the formula (1), and the hydroxyl group of the phenol resin (β) is 0.7 to 1. 100 parts by weight of the composition (I) compounded in a ratio of 2 equivalents was preliminarily preliminarily prepared with a bismaleimidolyriazine compound or a bismaleimide compound and a bismaleimide compound with an aromatic diamine compound having a molar ratio of 0.3 to 1.0. To the composition (II) containing 10 to 200 parts by weight of the reacted imide composition (B),
A resin composition (F) containing 1 to 100 parts by weight of a linear polymer (A) having a molecular weight of 5,000 to 100,000.
ベアチップを乗せ、ワイヤボンディングを行ってなるプ
リント配線板。5. A printed wiring board obtained by placing a bare chip in a recess provided in an epoxy-based high heat resistant substrate and performing wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4313318A JPH06164082A (en) | 1992-11-24 | 1992-11-24 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4313318A JPH06164082A (en) | 1992-11-24 | 1992-11-24 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06164082A true JPH06164082A (en) | 1994-06-10 |
Family
ID=18039790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4313318A Pending JPH06164082A (en) | 1992-11-24 | 1992-11-24 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06164082A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006132372A1 (en) | 2005-06-10 | 2006-12-14 | Mitsubishi Chemical Corporation | Nonaqueous electrolyte solution, nonaqueous electrolyte secondary battery and carbonate compound |
-
1992
- 1992-11-24 JP JP4313318A patent/JPH06164082A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006132372A1 (en) | 2005-06-10 | 2006-12-14 | Mitsubishi Chemical Corporation | Nonaqueous electrolyte solution, nonaqueous electrolyte secondary battery and carbonate compound |
| EP2339684A2 (en) | 2005-06-10 | 2011-06-29 | Mitsubishi Chemical Corporation | Nonaqueous electrolytic solution, nonaqueous electrolyte secondary cell, and carbonate compounds |
| EP2485314A1 (en) | 2005-06-10 | 2012-08-08 | Mitsubishi Chemical Corporation | Nonaqueous electrolytic solution and nonaqueous electrolyte secondary cell |
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