JPH06186169A - Substrate inspection method and device - Google Patents

Abstract

(57) [Abstract] [Purpose] The inspection data of a specific board is diverted to inspect the board to be inspected, thereby significantly reducing the labor and time required for teaching. [Structure] A board 24B in a mounted state in which an arbitrary part group Z is thinned out of a plurality of parts mounted on a specific board.
In the case of inspecting the mounting quality of each mounting component 30 with the inspection target as the inspection target, the inspection of each mounting component 30 of the board 24B as the inspection target is performed by using one of the inspection data files 26 necessary for inspecting the specific board. Use the inspection data of the department. When carrying out such an inspection,
With reference to the identification data file 27b, the inspection data for each mounting component 30 of the board 24B is identified from other inspection data and read from the inspection data file 26.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted on a printed circuit board (hereinafter simply referred to as "substrate"), for example, whether or not the electronic component is present or not before soldering, and soldering after soldering. Related to the board inspection method and its equipment used to inspect the quality, respectively,
In particular, the present invention is intended to teach a board inspection device the inspection data necessary to inspect the quality of each mounted state (hereinafter referred to as "mounting quality") of a plurality of components mounted on a board. Regarding the method.

[0002]

2. Description of the Related Art Conventionally, a visual inspection has been performed to inspect the mounting quality of mounted components on a substrate to be inspected (collectively, the one before soldering and the one after soldering). It is being appreciated. However, in this type of visual inspection, the occurrence of inspection errors is unavoidable, the inspection results vary depending on the inspector, and the inspection processing capacity is limited.

Therefore, in recent years, a board inspection apparatus has been put into practical use which automatically inspects the mounting quality of a board on which a large number of components are mounted by using an image processing technique. When this board inspection device is used, it is necessary to teach the board inspection device for each type of board at what position on the board to be inspected, what kind of component is mounted, and how the board is mounted before the inspection. is there. This teaching work is generally called "teaching".

Information relating to the inspection of the mounting quality of parts includes
In addition to the position, type, and orientation of the components mounted on the board to be inspected, information about the land on the board to which each component is soldered (shape, length, width, etc.), window set as the inspection area Information about the shape (shape, size, etc.),
It includes information about characteristic parameters (such as hue and lightness) that indicates the soldering state on the land, and criteria for determining whether the characteristic parameters are good or bad (hereinafter, these are collectively referred to as "inspection data"). .

[0005]

The inspection data is
There is a problem that the operator manually inputs each type of substrate to be inspected into the substrate inspection device, which requires a great deal of labor and time, and the inspection by the substrate inspection device cannot be performed during the teaching work.

[0006] In the group of boards to be inspected, there is a board in a mounted state in which arbitrary parts among the mounted parts of a specific board are thinned out. Requires a teaching operation in the same procedure, which is complicated, and since the board inspection apparatus holds inspection data for each type of board, the amount of memory becomes enormous.

The present invention has been made by paying attention to the above problems, and the labor and time required for teaching can be reduced by diverting inspection data for a specific substrate to inspect the substrate to be inspected. It is an object of the present invention to provide a substrate inspection method and an apparatus thereof that can be significantly reduced and require a small memory capacity.

[0008]

According to a first aspect of the present invention, a mounted printed circuit board in which any one of a plurality of parts mounted on a specific printed circuit board is thinned out is inspected. Is a board inspection method for inspecting the mounting quality of the printed circuit board, the inspection of each mounted component of the printed circuit board to be inspected is performed by an inspection data for each component necessary for inspecting the specific printed circuit board. The feature is that the part is diverted.

According to a second aspect of the present invention, the mounting quality of each mounted component is inspected with the printed circuit board in a mounted state in which any one of a plurality of components mounted on a specific printed circuit board is thinned out as an inspection target. A board inspection device for inspecting the specific board, the inspection data for each part necessary for inspecting the specific board, and the inspection data corresponding to each mounted part of the printed board to be inspected for other inspection. Storage means for storing identification data for distinguishing from the inspection data, and each of the printed circuit boards to be inspected by diverting a part of the inspection data while referring to the identification data stored in the storage means. And an inspection execution means for executing inspection on the mounted component.

[0010]

According to the board inspection method of the present invention, when a printed board in a mounted state in which any one of a plurality of parts mounted on a specific printed board is thinned out is an object to be inspected. Since the inspection of each mounted component of the printed circuit board is carried out by diverting part of the inspection data for each component necessary for inspecting the specific printed circuit board, the labor required for teaching the inspection data And the time can be significantly reduced.

The board inspecting device according to the second aspect need only hold one type of inspection data for a specific board and identification data for each printed board to be inspected. Compared to holding data, the memory capacity is small.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the overall construction of a board inspection apparatus in which the present invention is implemented. This board inspection device is a reference board 1S.
Each component 2 on the reference board 1S obtained by imaging
Characteristic parameters of the inspection region of S and each component 2T on the inspected substrate 1T obtained by imaging the inspected substrate 1T
2T of each part by comparing with the characteristic parameters of the inspection area of
It is for inspecting the mounting quality of, and includes an X-axis table unit 3, a Y-axis table unit 4, a light projecting unit 5, an imaging unit 6, a control processing unit 7, and the like as its configuration.

The X-axis table section 3 and the Y-axis table section 4 each include a motor (not shown) that operates based on a control signal from the control processing section 7, and the X-axis table section is driven by these motors. The unit 3 moves the image pickup unit 6 in the X direction, and the Y axis table unit 4 moves the conveyor 8 supporting the substrates 1S and 1T in the Y direction.

The light projecting unit 5 has three annular light sources 9, 10, 11 which have different diameters and which simultaneously emit red light, green light and blue light based on a control signal from the control processing unit 7. The light sources 9, 10 and 11 are arranged so as to be centered right above the observation position and in directions corresponding to different elevation angles when viewed from the observation position.

In this embodiment, a white light source is used as each of the light sources 9, 10 and 11 with a colored transparent plate of red, green and blue, respectively, but instead of this, red light,
It is also possible to use three annular color fluorescent lamps or neon tubes that respectively generate green light and blue light.

Each of the light sources 9, 10 and 11 is constituted by a light source which emits light of a red light spectrum, a green light spectrum and a blue light spectrum having an emission energy distribution with respect to wavelength so as to become white by mixing colors. , 1
The light quantity of each hue light can be adjusted by the imaging controller 18 described later so that the red light, the green light, and the blue light emitted from 0 and 11 are mixed to become white light.

Next, as the image pickup section 6, a color television camera is used, and the image pickup section 6 is positioned right above the observation position so as to face downward. As a result, the reflected light on the surface of the substrate 1S, 1T to be observed is imaged by the imaging unit 6, converted into color signals R, G, B of the three primary colors and supplied to the control processing unit 7.

The control processing unit 7 includes an A / D conversion unit 12, a memory 13, a teaching table 14, an image processing unit 15,
Judgment unit 16, XY table controller 17, imaging controller 18, control unit 19, display unit 20, printer 2
1, a keyboard 22, a floppy disk device 23, and the like. In the teaching mode, the color signals R, G, and B for the reference substrate 1S are processed, and the hue is set for the inspection area of each component in a good mounting state. , Characteristic parameters such as brightness are detected to create a judgment data file.

In the inspection mode, the control processing unit 7 processes the color signals R, G and B for the substrate 1S to be inspected for red, green and blue for the inspection area of each component 2T on the substrate 1T to be inspected. Each hue pattern is detected, characteristic parameters are generated, and an inspection data file is created. Then, this inspection data file is compared with the determination data file, and the mounting quality such as the quality of soldering is automatically determined for each component 2T on the inspection substrate 1T from this comparison result.

FIG. 2 shows the cross-sectional shape of the solder 25 when soldering is good, when parts are missing, and when there is insufficient solder, and the image pickup pattern and red pattern by the image pickup unit 6 in each case. The relationship between the green pattern and the blue pattern is shown in a list, and a clear difference appears between any of the hue patterns. Therefore, it is possible to determine the presence or absence of a component and the quality of soldering.

Returning to FIG. 1, the A / D converter 12 converts the color signals R, G, B from the image pickup unit 6 into digital signals and outputs them to the controller 19. The memory 13 includes a RAM and the like and is used as a work area of the control unit 19.
The image processing unit 15 performs image processing on the image data supplied via the control unit 19 to create the inspection data file and the determination data file, and these are processed by the control unit 19 and the determination unit 1.
Supply to 6.

The teaching table 14 stores the judgment data file when it is supplied from the control unit 19 at the time of teaching, and when the control unit 19 outputs a transfer request at the time of inspection, the judgment data file is stored according to this request. It is read and supplied to the control unit 19, the determination unit 16, and the like.

This board inspecting apparatus is a board 24 in a mounted state in which an arbitrary part group Z is thinned out of a plurality of parts 30 mounted on a specific board 24A as shown in FIG. 3 (1).
B (shown in FIG. 3 (2)) as an inspection target
In the case of inspecting the mounting quality of 0, the inspection of each mounting component 30 of the substrate 24B to be inspected is carried out by diverting the inspection data for each component necessary for inspecting the specific substrate 24A. FIG. 4 and FIG. 5 show a concrete method thereof.

FIG. 4 shows a specific board 24A on which a plurality of components 30 are mounted, and FIG. 5 shows a specific board 2 shown in FIG.
4A shows the mounted state of the board 24B in which the component group Z at the lower right corner of the mounted component 30 of 4A is thinned out, and one inspection data file 26 and a plurality of (in this example, as the determination data file) Two) identification data files 27a and 27b are stored in the teaching table 14.

The inspection data file 26 is composed of inspection data for each mounting component 30 necessary for inspecting the specific board 24A, while the identification data files 27a and 27b are inspection objects. Each board 24
The inspection data corresponding to each mounting component 30 of A and 24B is composed of identification data for distinguishing it from other inspection data.

The identification data is, for example, a flag,
Identification data file 2 for substrate 24A shown in FIG.
7a requires inspection data for all the mounted components 30 in the inspection data file 26 for inspection, so the flag "1" is set for the inspection data for all mounted components 30. .

On the other hand, in the identification data file 27b for the board 24B shown in FIG. 5, only the inspection data for each mounted component 30 except the component group Z in the inspection data file 26 is necessary for the inspection. , The flag “1” is set for the inspection data for each mounted component 30 excluding the component group Z, and the flag “0” is set for the inspection data for the thinned component group Z. ing.

Therefore, at the time of inspection, the inspection is performed by referring to the identification data files 27a and 27b according to the type of the substrate to be inspected and reading out the inspection data set with the flag "1" from the inspection data file 26. Will be executed.

The identification data files 27a, 27b
Is independent of the inspection data file 26 and is stored in the teaching table 14 in association with each component for each type of board. However, the invention is not limited to this, and data indicating the type of board is included in the inspection data file 26. It is also possible to store it together with it.

Returning to FIG. 1, the judgment unit 16 compares the judgment data file supplied from the control unit 19 at the time of the inspection with the inspection data file transferred from the image processing unit 15, and compares the inspection substrate. The quality of the soldering state is determined for each 1T component 2T, and the determination result is determined by the control unit 19
Output to.

The image pickup controller 18 is provided with an interface for connecting the control unit 19 to the light projecting unit 5 and the image pickup unit 6, and adjusts the light amount of each of the light sources 9 to 11 of the light projecting unit 5 based on the output of the control unit 19. Control is performed or the mutual balance of the light output of each hue of the image pickup unit 6 is maintained.

The XY table controller 17 is the controller 1
9 is provided with an interface for connecting the X-axis table unit 3 and the Y-axis table unit 4, and controls the X-axis table unit 3 and the Y-axis table unit 4 based on the output of the control unit 19.

The display unit 20 receives image data, inspection results, key input data, etc. from the control unit 19,
This is displayed on the display screen, and when the inspection result and the like are supplied from the control unit 19, the printer 21 prints out this in a predetermined format.

The keyboard 22 is used for operation information and the reference board 1.
Various keys necessary for inputting S and data relating to the inspected substrate 1T are provided, and the key input data is supplied to the control unit 19. The control unit 19 includes a microprocessor and the like, and controls the operation of the substrate inspection apparatus in teaching and inspection according to the procedure shown in FIGS. 6 to 8.

FIG. 6 shows a teaching procedure for creating the inspection data file 26 for a specific board 24A in steps 1 (indicated by "ST1" in the figure) to ST7. First, in step 1 of the figure, the operator uses the keyboard 2
2 is operated to register the name of the board to be taught, and the board size is keyed in. Then, in step 2, the reference board 1 for the board 24A having good mounting quality is provided.
S is set on the Y-axis table unit 4 and the start key is pressed.

Next, in step 3, the origin of the reference board 1S and the upper right and lower left corners are imaged by the imaging section 6 and the board size is input by the position of each point, and the control section 19 determines X based on the input data. The reference table 1S is positioned at the initial position by controlling the axis table section 3 and the Y-axis table section 4.

When the reference board 1S is positioned at the initial position, in the next step 4, the image pickup section 6 picks up an image of the area on the reference board 1S and teaches information on the respective mounting positions of the component 30.

In the next step 5, the image pickup section 6
An image of the mounting position of the first component 30 having good mounting quality is taken, and the inspection data is created by teaching the image and information regarding the determination standard for this component 30.

When the same procedure is repeatedly executed for all the components 30 on the reference board 1S, the determination in step 6 becomes "YES" and the process shifts to step 7 for the inspection taught in steps 4 and 5. Data specific board 24
An inspection data file 26 necessary for inspecting A is created and stored in the teaching table 14.

FIG. 7 shows a teaching procedure for creating the identification data files 27a and 27b for the board 24A or 24B to be inspected. First, after inputting the board name of the board 24A in step 1, when the reference board 1S of the board 24A having good mounting quality is carried in and set on the Y-axis table 4 in step 2, this board 2A
The inspection data file 26 for 4A is referred to, and the image of the entire board in which the component positions are indicated is displayed graphically on the display unit 20 (step 3).

In the next step 4, when the operator operates the keyboard 22 or a light pen or mouse (not shown) to designate a thinned part among the parts shown on the screen, the part is inspected. A flag "0" is set as identification data for the work data. When the same operation is executed for all the thinned parts, the determination in step 5 becomes "YES", the identification data file 27a or 27b is generated in step 6 and stored in the teaching table 14 (step 6). ). Then, in the next step 7, the board name of the corresponding board 24A or 24B is input, and in the next step 8, the reference board 1S is carried out and the teaching is completed.

FIG. 8 shows an automatic inspection procedure. In steps 1 and 2 of the same figure, a board name to be inspected is selected and a board inspection start operation is performed. In the next step 3, the supply of the inspected substrate 1T to the substrate inspection device is checked,
When the determination is "YES", the conveyor 8 is operated, the substrate 1T to be inspected is carried into the Y-axis table portion 4, and automatic inspection is started (steps 4 and 5).

In step 5, the control section 19 refers to the identification data file 27a or 27b to read out the inspection data for the first part 2T from the inspection data file 26, and then to the X-axis table section 3 and the Y-axis table. The unit 4 is controlled to position the field of view of the image pickup unit 6 on the first component 2T to perform image pickup, and each land region in the inspection region is automatically extracted and the characteristic parameter of each land region is calculated. Then, an inspection data file is created. Then, the control unit 19 compares the inspected data file with the inspection data file 26 to determine the mounting quality such as the quality of soldering for the first component 2T.

Such an inspection is repeatedly executed for all the components 2T on the inspected substrate 1T. As a result, if there is a defective soldering, the defective component and the details of the defect are displayed on the display unit 20 or the printer. After being printed on 21, the inspected substrate 1T is carried out from the observation position (steps 7 and 8). Thus, when the same inspection procedure is executed for all the inspected substrates 1T, the determination in step 9 is “YE
"S" and the inspection is completed.

[0045]

As described above, the present invention is an object to be inspected when a printed circuit board in a mounted state in which any one of a plurality of parts mounted on a specific printed circuit board is thinned out is inspected. It is necessary to teach the inspection data because the inspection of each mounted component of a certain printed circuit board is performed by diverting part of the inspection data for each component necessary for inspecting the specific printed circuit board. The labor and time can be significantly reduced.

According to a second aspect of the present invention, in order to carry out the above-mentioned board inspection method, inspection data for each part necessary for inspecting a specific board and each mounted part of the printed board to be inspected. The identification data for distinguishing the inspection data corresponding to the other inspection data from other inspection data is stored, and a part of the inspection data is diverted while referring to the identification data and a printed circuit board to be inspected. Since the inspection is performed for each mounted component of the above, it is only necessary to hold one type of inspection data for a specific board and identification data for a printed board that is an inspection target. Compared with holding a plurality of inspection data, the memory capacity is small.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of a board inspection device.

FIG. 2 is an explanatory diagram showing the relationship between the quality of the soldered state and the pattern.

FIG. 3 is an explanatory diagram showing a configuration of a board in a mounted state in which specific boards and parts are thinned out.

FIG. 4 is an explanatory diagram showing a configuration of a determination data file for a specific board.

FIG. 5 is an explanatory diagram illustrating a configuration of a mounted board in which components are thinned out.

FIG. 6 is a flowchart showing a teaching procedure for generating an inspection data file.

FIG. 7 is a flowchart showing a teaching procedure for generating an identification data file.

FIG. 8 is a flowchart showing a procedure of automatic inspection.

[Explanation of symbols]

 7 Control Processing Section 14 Teaching Table 19 Control Section 24A, 24B Substrate 30 Parts

Claims (2)

[Claims] 1. A board inspection method for inspecting the mounting quality of each mounted component, with a printed circuit board in a mounted state in which an arbitrary component is thinned out of a plurality of components mounted on a specific printed circuit board as an inspection target. It is characterized in that the inspection of each mounted component of the printed circuit board to be inspected is carried out by diverting part of the inspection data for each component necessary for inspecting the specific printed circuit board. Substrate inspection method. 2. A board inspecting apparatus for inspecting the mounting quality of each mounted component with a printed circuit board in a mounted state in which an arbitrary component is thinned out of a plurality of components mounted on a specific printed circuit board as an inspection target. Which distinguishes the inspection data for each component required to inspect the specific board and the inspection data corresponding to each mounted component of the printed circuit board to be inspected from other inspection data And a storage unit for storing identification data for storing, and an inspection for each mounted component of the printed circuit board to be inspected by diverting a part of the inspection data while referring to the identification data stored in the storage unit. A board inspecting device, comprising: