JPH06188538A - Formation of this film circuit - Google Patents

Abstract

(57) [Summary] [Object] To provide a method for forming a thin film circuit by treating a thin film circuit forming method using a strong acid as an etching solution with a developing solution in the conventional thin film circuit forming method. . [Structure] A resin component having a property of photopolymerization such as a cyclic olefin oligomer, a resin component having a property of photopolymerization, a compound of a metal such as a noble metal and / or a photopolymerization metalloorganic consisting of an organic solvent is applied, After drying, it is exposed with a photomask and then treated with a developer,
A thin film circuit is formed by firing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film circuit forming method for forming a metal thin film circuit on a glass or ceramic substrate used as an electronic industrial material.

[0002]

2. Description of the Related Art Conventionally, a paste or the like has been used as a method for forming a metal thin film circuit. For example, a paste or the like is used to directly form a metal thin film circuit on a glass or ceramic substrate. The method of drying and baking is difficult to apply to a fine circuit, and there are methods such as transfer, but the uniformity and reproducibility of the thickness of the metal thin film are insufficient. In addition, paste is applied to the entire surface, dried and baked to form a metal thin film, a desired circuit part is covered with a resist using a photoresist or the like, and a part other than the circuit is etched using an etching solution such as an acid. There is also a method to form a metal thin film circuit, but when the metal thin film is platinum or a resistor, the acid used for etching can not be etched unless it is a strong acid, so the resist is attacked or the glass or ceramic substrate is corroded. However, it is difficult to form a fine circuit.

[0003]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional drawbacks and provides a method for forming a fine metal thin film circuit by etching without using a strong acid. That is the purpose.

[0004]

The thin film circuit forming method of the present invention is a method for forming a metal thin film circuit on a glass or ceramic substrate, in which a resin component having a photopolymerization property and a resin having a photopolymerization property are used. A thin film-forming material composed of a mixed solution of a component and a metal compound and / or a complex salt and an organic solvent, which has a property of photopolymerization, is applied, dried, photomasked, exposed, and then treated with a developing solution, and then baked. This is a thin film circuit forming method.

The photopolymerizable resin component used in the present invention is selected from epoxy-based acrylate oligomers and urethane-based acrylate oligomers, and the metal is Au, Pt, Ag, Pd, Rh, Ir, Ru, C.
A material selected from u, Ni, etc. can be used, and this resin component and a compound and / or complex salt of this resin component and a metal which are added to an organic solvent to form a uniform solution have a property of photopolymerization. It can be used as a thin film forming material.

The coating method of the thin film forming material may be selected from various printing methods, spin coaters, dipping, brush coating, stamping, rolling and the like. Next, the method for drying is as follows:
It may be carried out at 00 to 125 ° C. for 10 minutes.

Next, a photomask on which a desired circuit is drawn is used as a coating surface and exposed to light.
Negative type can be used under the conditions used in commonly used photolithographic etching method, and it is also used as a developing solution for ordinary photoresists, and dissolves non-photopolymerized or photopolymerized parts. .

Thereafter, the firing temperature is 500 to 850 in the atmosphere.
A desired metal thin film circuit can be formed by carrying out at 1 ° C. for 1 to 10 minutes. Hereinafter, the present invention will be described in more detail with reference to Examples, but the Examples are not intended to limit the present invention.

[0009]

[Example 1] Glass glaze substrate (75 mm x 150 m
(m x thickness 0.85mm) negative type photo-polymerized gold metalloorganic (urethane acrylate oligomer) is applied on the entire surface by screen printing method, dried at 120 ° C for 10 minutes, and then a positive photomask is used as a light source for an ultraviolet lamp. Was exposed for 10 seconds for polymerization. Then, NMD-3 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is used as a developing solution, and then baked at 800 ° C. for 10 minutes in the atmosphere to form a gold circuit having a line width of 25 μm and a thickness of 0.5 μm. It was

[0010]

[Example 2] Glass glaze substrate (75 mm x 150 m
m × thickness 0.85 mm) photopolymerized platinum metalloorganic (epoxy acrylate oligomer) is applied to the entire surface by spin coater method, dried at 120 ° C. for 10 minutes, and then exposed to an ultraviolet lamp as a light source using a positive photomask. It was exposed and polymerized for 10 seconds. Then NM as a developer
Treated with D-3 (manufactured by Tokyo Ohka Co., Ltd.), then 800 ° C
Line width 25 microns, thickness 0.3 after firing for 10 minutes
A micron platinum circuit could be formed.

[0011]

As is apparent from the above description, the method of the present invention uses a thin film-forming material having a property of photopolymerization, coats it on a glass or ceramic substrate, and after drying, a desired circuit is drawn. Positive or negative photomask,
It is possible to form a fine metal thin film circuit by exposing, developing and baking. Compared with the method in which a strong acid is used as an etching solution after forming a thin film in the conventional method, it is treated with a developing solution. Since it is possible to form a fine circuit easily, it can be said that it is extremely effective without damaging the glass or ceramic substrate.

Claims (1)

[Claims] 1. A method of forming a metal thin film circuit on a glass or ceramic substrate, wherein a resin component having a photopolymerization property, a compound and / or a complex salt of a resin component and a metal having a photopolymerization property, and an organic solvent are used. A method for forming a thin film circuit, which comprises coating a thin film forming material having a property of photopolymerization consisting of a mixed solution of 1), drying, exposing with a photomask, exposing with a developing solution, and then baking.