JPH06191925A - Method for forming formed ceramic article - Google Patents
Method for forming formed ceramic articleInfo
- Publication number
- JPH06191925A JPH06191925A JP4344499A JP34449992A JPH06191925A JP H06191925 A JPH06191925 A JP H06191925A JP 4344499 A JP4344499 A JP 4344499A JP 34449992 A JP34449992 A JP 34449992A JP H06191925 A JPH06191925 A JP H06191925A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- adhesive
- solvent
- ceramic
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Producing Shaped Articles From Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はセラミックス成形体の成
形方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for molding a ceramic compact.
【０００２】[0002]
【従来の技術】セラミックス成形体の成形方法として、
泥奬鋳込成形法、射出成形法（インジェクション成形
法）が一般的に知られている。しかし、泥奬鋳込成形法
は石膏型を用いる方法であるため、着肉時間が長く、型
に目詰まりを生じやすい等の欠点がある。また、射出成
形法は樹脂を大量に用いるため、脱脂工程に長い日数を
要する。このため、近年、これらの欠点を改善し、成形
時間と脱脂時間とを短縮化する方法として、セラミック
粉末に有機性分散剤を加えてスラリとした後、このスラ
リを所定形状の型内に注入し、有機性分散剤の融点以下
に冷却することによりスラリを固化させて脱型する成形
方法が提案されている（特開昭６１−１５８４０３号公
報）。2. Description of the Related Art As a method for molding a ceramic molded body,
Mud casting method and injection molding method (injection molding method) are generally known. However, since the mud casting method is a method using a gypsum mold, it has drawbacks such as long inking time and easy clogging of the mold. Further, since the injection molding method uses a large amount of resin, it takes a long time for the degreasing step. Therefore, in recent years, as a method of improving these drawbacks and shortening the molding time and the degreasing time, after adding an organic dispersant to ceramic powder to form a slurry, the slurry is injected into a mold of a predetermined shape. However, a molding method has been proposed in which the slurry is solidified by cooling to below the melting point of the organic dispersant and the mold is removed (JP-A-61-158403).
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記提案の方
法で得られたセラミックス成形体は有機性分散剤の融点
以下で固化し、有機性分散剤の融点以上で液化するとい
う可逆性を有している。このため、セラミックス成形体
中の溶媒を除去すべく加熱した場合、この加熱温度が例
え有機性分散剤の融点以下であっても有機性分散剤が軟
化可能であることから、セラミックス成形体に変形を生
じやすい。However, the ceramic molded body obtained by the above-mentioned method has the reversibility of solidifying below the melting point of the organic dispersant and liquefying above the melting point of the organic dispersant. ing. Therefore, when heated to remove the solvent in the ceramic compact, the organic dispersant can be softened even if the heating temperature is below the melting point of the organic dispersant, and the ceramic compact is transformed. Prone to
【０００４】本発明は、上記従来の実情に鑑みてなされ
たものであって、成形時間と脱脂時間とを短縮可能とし
つつ、セラミックス成形体に変形を生じにくい成形方法
を提供することを目的とする。The present invention has been made in view of the above conventional circumstances, and an object of the present invention is to provide a molding method capable of shortening the molding time and the degreasing time while preventing the ceramic molded body from being easily deformed. To do.
【０００５】[0005]
【課題を解決するための手段】本発明のセラミックス成
形体の成形方法は、セラミック粉末に熱硬化性有機接着
剤と溶媒とを加えてスラリとした後、該スラリを所定形
状の金型内に注入し、該熱硬化性接着剤が硬化する温度
以上に加熱することを特徴とするものである。熱硬化性
有機接着剤の配合量はセラミックス成形体の固化に必要
な最小限にすることが好ましい。脱脂時間を可及的に短
くかつ容易にするためである。[Means for Solving the Problems] A method for molding a ceramic molded body of the present invention is a method in which a thermosetting organic adhesive and a solvent are added to ceramic powder to form a slurry, and the slurry is placed in a mold of a predetermined shape. It is characterized in that it is injected and heated to a temperature at which the thermosetting adhesive is cured or higher. The blending amount of the thermosetting organic adhesive is preferably the minimum necessary for solidifying the ceramic molded body. This is to make the degreasing time as short and easy as possible.
【０００６】また、溶媒の配合量は必要最小限にするこ
とが好ましい。乾燥時間を可及的に短くするためであ
る。Further, it is preferable that the amount of the solvent to be blended is set to the minimum necessary. This is to shorten the drying time as much as possible.
【０００７】[0007]
【作用】本発明のセラミックス成形体の成形方法では、
熱硬化性有機接着剤をバインダとしてセラミック粉末が
スラリにされる。熱硬化性有機接着剤は一旦硬化すれば
軟化することはなく、非可逆性であるため、セラミック
ス成形体中の溶媒を除去すべく加熱したとしても、上記
提案の方法のようにセラミックス成形体に変形を生じな
い。[Function] In the method for molding a ceramic molded body of the present invention,
The ceramic powder is slurried with the thermosetting organic adhesive as a binder. The thermosetting organic adhesive does not soften once hardened and is irreversible. Therefore, even if it is heated to remove the solvent in the ceramic molded body, it does not change to the ceramic molded body as proposed above. No deformation occurs.
【０００８】また、この方法では、スラリを金型に注入
し、泥奬鋳込成形法のように石膏型を用いないため、着
肉時間及び目詰まりを考慮する必要がなく、成形時間の
短縮化が可能である。さらに、この成形方法では、従来
の射出成形法と比較してバインダ（熱硬化性有機接着
剤）量を数分の１に低減できるため、脱脂時間の短縮化
も可能である。Further, in this method, the slurry is poured into a mold and a plaster mold is not used unlike the mud casting method, so that it is not necessary to consider the inking time and clogging, and the molding time can be shortened. Is possible. Furthermore, in this molding method, the amount of binder (thermosetting organic adhesive) can be reduced to a fraction of that of the conventional injection molding method, and therefore the degreasing time can be shortened.
【０００９】[0009]
【実施例】以下、本発明のセラミックス成形体の成形方
法を脱脂・乾燥工程、焼結工程を含めて具体化した実施
例１、２を説明する。 （実施例１）Ｓｉ3 Ｎ4 粉末１００重量部に対して、Ｙ
2 Ｏ3 粉末６重量部と、Ａｌ2 Ｏ3粉末４重量部とを添
加し、さらに溶媒としてミネラルスピリット１６重量部
と、熱硬化性有機接着剤としてエポキシ系接着剤（サン
スター技研（株）製、商品名：ペンギンセメント１０７
３、推奨熱硬化条件１２０℃×２０分）４重量部とを加
える。このとき、脱脂時間を可及的に短くかつ容易にす
るため、熱硬化性有機接着剤の配合量をセラミックス成
形体の固化に必要な最小限にしている。また、乾燥時間
も可及的に短くするため、溶媒の配合量も必要最小限に
している。EXAMPLES Examples 1 and 2 which embody the method for forming a ceramics compact of the present invention including a degreasing / drying step and a sintering step will be described below. (Example 1) Y was added to 100 parts by weight of Si 3 N 4 powder.
And 2 O 3 powder 6 parts by weight, Al 2 O 3 powder 4 was added and the parts by weight, further mineral spirit 16 parts by weight as a solvent, an epoxy adhesive as the thermosetting organic adhesive (Sunstar Giken Co. Product name: Penguin cement 107
3, recommended heat curing conditions 120 ° C. × 20 minutes) 4 parts by weight are added. At this time, in order to make the degreasing time as short and easy as possible, the blending amount of the thermosetting organic adhesive is set to the minimum necessary for solidifying the ceramic molded body. In addition, in order to shorten the drying time as much as possible, the compounding amount of the solvent is also minimized.
【００１０】これらを室温（２０〜３０℃）にて２４時
間攪拌し、スラリを作製する。このスラリの粘度はＢ型
粘度計では３０ｒｐｍにおいて５ポイズである。こうし
て調製したスラリを１００℃に予め加熱した金型のキャ
ビティに注入し、その後１２０℃で２０分間維持する。
このとき、溶媒が沸騰してセラミックス成形体に欠陥が
生じないように金型温度を上げすぎないようにする。These are stirred at room temperature (20 to 30 ° C.) for 24 hours to prepare a slurry. The viscosity of this slurry is 5 poise at 30 rpm in a B type viscometer. The slurry thus prepared is poured into the cavity of the mold preheated to 100 ° C., and then maintained at 120 ° C. for 20 minutes.
At this time, the mold temperature is not raised excessively so that the solvent does not boil and the ceramic molded body is not defective.
【００１１】この後、セラミックス成形体を脱型し、１
４０℃で１時間乾燥させることにより溶媒を除去する。
続いて、次第に温度を上昇させて４５０℃にて熱硬化性
有機接着剤を除去して脱脂体を得る。こうして得られた
脱脂体を窒素ガス雰囲気中において１７５０℃の温度で
２時間焼成し、窒化珪素焼結体を得る。 （実施例２）Ａｌ2 Ｏ3 粉末１００重量部に対して、溶
媒として水２０重量部と、熱硬化性有機接着剤としてア
クリル系接着剤（サンスター技研（株）製、商品名：ペ
ンギンセメント１２７０、推奨熱硬化条件８０℃×５
分）４重量部とを加える。After that, the ceramic molded body was released from the mold, and 1
The solvent is removed by drying at 40 ° C. for 1 hour.
Then, the temperature is gradually raised to remove the thermosetting organic adhesive at 450 ° C. to obtain a degreased body. The degreased body thus obtained is fired in a nitrogen gas atmosphere at a temperature of 1750 ° C. for 2 hours to obtain a silicon nitride sintered body. Example 2 100 parts by weight of Al 2 O 3 powder, 20 parts by weight of water as a solvent, and an acrylic adhesive as a thermosetting organic adhesive (trade name: Penguin Cement, manufactured by Sunstar Giken Co., Ltd.) 1270, recommended thermosetting conditions 80 ℃ × 5
Min) 4 parts by weight.
【００１２】これらを室温（２０〜３０℃）にて２４時
間攪拌し、スラリを作製する。このスラリの粘度はＢ型
粘度計では３０ｒｐｍにおいて５ポイズである。こうし
て調製したスラリを６０℃に予め加熱した金型のキャビ
ティに注入し、その後８０℃で５分間維持する。この
後、セラミックス成形体を脱型し、９０℃で１時間乾燥
させ、次第に温度を上昇させて４５０℃にて脱脂する。These are stirred at room temperature (20 to 30 ° C.) for 24 hours to prepare a slurry. The viscosity of this slurry is 5 poise at 30 rpm in a B type viscometer. The slurry thus prepared is poured into the cavity of the mold preheated to 60 ° C., and then maintained at 80 ° C. for 5 minutes. After this, the ceramic molded body is demolded, dried at 90 ° C. for 1 hour, gradually raised in temperature and degreased at 450 ° C.
【００１３】こうして得られた脱脂体を大気雰囲気中に
おいて１６００℃の温度で２時間焼成し、酸化アルミニ
ウム焼結体を得る。 （比較例）上記提案の方法によりセラミックス成形体を
得る。すなわち、Ｓｉ3 Ｎ4 粉末１００重量部に対し
て、Ｙ2 Ｏ3 粉末６重量部と、Ａｌ2 Ｏ3 粉末４重量部
とを添加し、さらに溶媒としてミネラルスピリット１６
重量部と、有機性分散剤としてポリオキシエチレンアル
キルエーテル系フォスフェート（第１工業製薬（株）
製、商品名：プライサーフ２１９Ｂ、融点３５℃）３重
量部とを加える。The degreased body thus obtained is fired in the atmosphere at a temperature of 1600 ° C. for 2 hours to obtain an aluminum oxide sintered body. Comparative Example A ceramic molded body is obtained by the method proposed above. That is, to 100 parts by weight of Si 3 N 4 powder, 6 parts by weight of Y 2 O 3 powder and 4 parts by weight of Al 2 O 3 powder were added, and mineral spirit 16 was added as a solvent.
Parts by weight and polyoxyethylene alkyl ether phosphate as an organic dispersant (Daiichi Kogyo Seiyaku Co., Ltd.)
And trade name: PRYSURF 219B, melting point 35 ° C.) 3 parts by weight.
【００１４】これらを３６℃にて１２時間攪拌し、スラ
リを作製する。このスラリの粘度はＢ型粘度計では３０
ｒｐｍにおいて５ポイズである。こうして調製したスラ
リを３５〜４０℃に予め加熱した金型のキャビティに注
入し、その後１５℃で１０〜２０分間維持する。この
後、セラミックス成形体を脱型し、２５℃で５時間真空
乾燥して溶媒を除去する。次に４０℃の乾燥機に入れ、
次第に温度を上昇させて４５０℃にて有機性分散剤を除
去して脱脂体を得る。These are stirred at 36 ° C. for 12 hours to prepare a slurry. The viscosity of this slurry is 30 with a B type viscometer.
5 poise at rpm. The slurry thus prepared is poured into the cavity of the mold preheated to 35 to 40 ° C, and then maintained at 15 ° C for 10 to 20 minutes. Then, the ceramic molded body is demolded and vacuum dried at 25 ° C. for 5 hours to remove the solvent. Then put in a dryer at 40 ° C,
The temperature is gradually raised and the organic dispersant is removed at 450 ° C. to obtain a defatted body.
【００１５】こうして得られた脱脂体を窒素ガス雰囲気
中において１７５０℃の温度で２時間焼成し、窒化珪素
焼結体を得る。 （評価）上記実施例１によるセラミックス成形体の特性
と、比較例によるセラミックス成形体の特性とを表１に
示す。特性としては、４５０℃で乾燥した後及び焼成後
における密度（ｋｇ／ｍ3 ）と、線収縮率（％）と、Ｊ
ＩＳ規定による４点曲げ強度（ＭＰａ）とを示す。The degreased body thus obtained is fired in a nitrogen gas atmosphere at a temperature of 1750 ° C. for 2 hours to obtain a silicon nitride sintered body. (Evaluation) Table 1 shows the characteristics of the ceramic molded body according to Example 1 and the characteristics of the ceramic molded body according to the comparative example. The characteristics include the density (kg / m 3 ) after drying at 450 ° C. and after firing, linear shrinkage (%), and J
4 point bending strength (MPa) by IS regulation is shown.
【００１６】[0016]
【表１】 表１より、実施例１のセラミックス成形体は、４５０℃
乾燥後において、比較例のものより低い線収縮率を示
し、変形しにくいことがわかる。これは、実施例１で
は、バインダとしての熱硬化性有機接着剤が一旦硬化す
れば軟化することはないため、セラミックス成形体中の
溶媒を除去すべく加熱したとしても、比較例のようにセ
ラミックス成形体に変形を生じないからである。そし
て、実施例１のセラミックス成形体は、比較例のものと
同様の高い密度及び４点曲げ強度を有することがわか
る。[Table 1] From Table 1, the ceramic molded body of Example 1 has a temperature of 450 ° C.
After drying, it shows a lower linear shrinkage than that of the comparative example, and it is understood that it is difficult to deform. This is because in Example 1, the thermosetting organic adhesive as the binder does not soften once it is hardened, so even if it is heated to remove the solvent in the ceramic molded body, the same as in the comparative example. This is because the molded body is not deformed. Then, it can be seen that the ceramic molded body of Example 1 has the same high density and four-point bending strength as those of the comparative example.
【００１７】また、実施例１のセラミックス成形体は、
エポキシ系接着剤からなる熱硬化性有機接着剤をバイン
ダとしてセラミック粉末を固化しているため、比較例の
ものと比較して、硬質であり、取扱が容易である。この
点は実施例２も同様である。さらに、実施例１のセラミ
ックス成形体は、硬化反応が非可逆であるため、一旦硬
化されれば、セラミックス成形体の段階での長期保管が
可能である。この点は実施例２も同様である。これに対
し、比較例のセラミックス成形体は、可逆性の有機性分
散剤を含んだままでは時間の経過とともに塑性変形しや
すく、管理が困難である。The ceramic compact of Example 1 is
Since the ceramic powder is solidified using the thermosetting organic adhesive made of an epoxy adhesive as a binder, it is harder and easier to handle than the comparative example. This point is the same as in the second embodiment. Further, since the hardening reaction of the ceramic molded body of Example 1 is irreversible, once cured, it can be stored for a long time at the stage of the ceramic molded body. This point is the same as in the second embodiment. On the other hand, the ceramic molded body of the comparative example is easily plastically deformed with the passage of time when it contains the reversible organic dispersant, and is difficult to manage.
【００１８】また、実施例１、２では、スラリを金型に
注入し、鋳込成形法のように石膏型を用いないため、従
来の鋳込成形法と比較して、成形時間の短縮化を実現し
ている。さらに、実施例１、２では、従来の射出成形法
と比較してバインダ（熱硬化性有機接着剤）量を数分の
１に低減しているため、脱脂時間の短縮化も実現してい
る。Further, in Examples 1 and 2, the slurry is poured into the mold and the plaster mold is not used unlike the cast molding method, so that the molding time is shortened as compared with the conventional cast molding method. Has been realized. Furthermore, in Examples 1 and 2, the amount of binder (thermosetting organic adhesive) is reduced to a fraction of that of the conventional injection molding method, so that the degreasing time is also shortened. .
【００１９】[0019]
【発明の効果】以上詳述したように、本発明のセラミッ
クス成形体の成形方法では、特許請求の範囲記載の構成
を採用しているため、成形時間と脱脂時間とを短縮可能
としつつ、セラミックス成形体に変形を生じにくいとい
う優れた効果を発揮することができる。As described above in detail, in the method for molding a ceramic molded body of the present invention, since the structure described in the claims is adopted, the molding time and the degreasing time can be shortened and the ceramics can be shortened. It is possible to exert an excellent effect that the molded body is hardly deformed.
【００２０】また、この成形方法において、エポキシ系
接着剤やアクリル系接着剤等のように、硬化状態で硬質
の熱硬化性有機接着剤をバインダとしてセラミック粉末
を固化すれば、セラミックス成形体を容易に取り扱うこ
とができる。さらに、この成形方法では、熱硬化性有機
接着剤の硬化反応が非可逆であるため、セラミックス成
形体の段階での長期保管が可能である。Further, in this molding method, if the ceramic powder is solidified by using a hard thermosetting organic adhesive in a cured state as a binder, such as an epoxy adhesive or an acrylic adhesive, a ceramic molded body can be easily formed. Can be handled. Furthermore, in this molding method, since the curing reaction of the thermosetting organic adhesive is irreversible, the ceramic molded body can be stored for a long period of time.
Claims (1)
媒とを加えてスラリとした後、該スラリを所定形状の金
型内に注入し、該熱硬化性接着剤が硬化する温度以上に
加熱することを特徴とするセラミックス成形体の成形方
法。1. A thermosetting organic adhesive and a solvent are added to a ceramic powder to form a slurry, and the slurry is poured into a mold having a predetermined shape, and the temperature is set to a temperature at which the thermosetting adhesive is cured or higher. A method for molding a ceramics molded body, which comprises heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4344499A JPH06191925A (en) | 1992-12-24 | 1992-12-24 | Method for forming formed ceramic article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4344499A JPH06191925A (en) | 1992-12-24 | 1992-12-24 | Method for forming formed ceramic article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06191925A true JPH06191925A (en) | 1994-07-12 |
Family
ID=18369744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4344499A Pending JPH06191925A (en) | 1992-12-24 | 1992-12-24 | Method for forming formed ceramic article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06191925A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009016698A1 (en) * | 2007-07-27 | 2009-02-05 | Ngk Insulators, Ltd. | Ceramic powder molding, ceramic burning product, and process for producing ceramic powder molding |
| US20100092657A1 (en) * | 2007-07-27 | 2010-04-15 | Ngk Insulators, Ltd. | Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part |
-
1992
- 1992-12-24 JP JP4344499A patent/JPH06191925A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009016698A1 (en) * | 2007-07-27 | 2009-02-05 | Ngk Insulators, Ltd. | Ceramic powder molding, ceramic burning product, and process for producing ceramic powder molding |
| US20100092657A1 (en) * | 2007-07-27 | 2010-04-15 | Ngk Insulators, Ltd. | Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part |
| US7973238B2 (en) | 2007-07-27 | 2011-07-05 | Ngk Insulators, Ltd. | Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part |
| US8034402B2 (en) | 2007-07-27 | 2011-10-11 | Ngk Insulators, Ltd. | Method for producing ceramic compact and ceramic part |
| US8409484B2 (en) | 2007-07-27 | 2013-04-02 | Ngk Insulators, Ltd. | Method for producing a ceramic compact |
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