JPH06196577A - Package for electronic element - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a small package for housing an electronic element, in which the electronic element housed inside is completely hermetically sealed and the electronic element can be securely and firmly connected to an external electric circuit. It is in. A wiring metallization layer 4 having a cutout portion 1b on a side surface and led out from an upper surface to the lower surface through the cutout portion 1b.
A package for storing an electronic element comprising an insulating base body 1 having the above, and an insulating frame body 2 joined to the outer peripheral portion of the upper surface of the insulating base body 1, having a cutout portion 2b on the side surface, and having a metallizing layer 6 for sealing on the upper surface. In addition, the cutout cross-sectional area of the cutout portion 2b provided on the side surface of the insulating frame body 2 is made smaller than the cutout cross-sectional area of the cutout portion 1b provided on the side surface of the insulating base body 1, and the cutout portion 2b provided on the side surface of the insulating frame body 2. Then, a connection metallization layer 7 for electrically connecting the sealing metallization layer 6 and the wiring metallization layer 4 was applied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic element housing package for housing small electronic elements such as SAW filters and light emitting elements.

[0002]

2. Description of the Related Art Conventionally, an electronic element housing package for housing a small electronic element such as a SAW filter or a light emitting element is made of an electrically insulating material such as alumina ceramics as shown in FIGS. Insulating substrate 11 having a mounting portion 11a for mounting an electronic element on a portion and a wiring metallization layer 13 made of a high melting point metal powder such as tungsten or molybdenum, which is led out from the periphery of the mounting portion 11a to the lower surface, and also alumina ceramics or the like. And an insulating frame 12 having an encapsulating metallization layer 14 bonded to the outer peripheral portion of the upper surface of the insulating base 11 and having a metal lid bonded to the upper surface. The electronic element 15 is bonded and fixed to the mounting portion 11a of the electronic component 11 with an adhesive such as solder, resin, or glass, and each electrode of the electronic element 15 is fixed. (Including the ground electrode) is electrically connected to the wiring metallization layer 13 via the bonding wire 16, and then the sealing metallization layer 14 attached to the upper surface of the insulating frame 12 is covered with the metal lid 17 Are joined via a sealing material such as solder, and the electronic element 15 is hermetically sealed inside the container composed of the insulating base 11, the insulating frame 12 and the lid 17 to form an electronic component as a final product.

The wiring metallization layer 13 adhered to the insulating base 11 has a portion led out to the lower surface of the insulating base 11 on the wiring conductor of the external electric circuit board via a conductive adhesive such as solder. They are joined together, so that the electronic element 15 housed inside is electrically connected to an external electric circuit.

Further, in the package for housing the electronic element, a plurality of substantially semicircular cutouts 11b having a radius of about 0.2 mm are formed on the side surface of the insulating base 11, and the cutouts 11b are formed.
The metallization layer 13 for wiring is led out from the upper surface to the lower surface of the insulating base 11 via.

Further, in the electronic element housing package, unnecessary electrostatic coupling is provided between the sealing metallization layer 14 attached to the upper surface of the insulating frame 12 and the wiring metallization layer 13 attached to the insulating substrate 11. In order to prevent the operation of the electronic element from becoming unstable due to the formation of the metal, the metallizing layer 14 for sealing which is attached to the insulating frame 12 and the metallizing layer 13 for wiring which is attached to the insulating base 11. Part (generally, the wiring metallization layer 13 connected to the ground electrode of the electronic element) is electrically connected through the connection metallization layer 18 provided in the notch 12a on the side surface of the insulating frame 12. Has been done.

[0006]

However, in recent years,
Along with the miniaturization of electronic components, electronic device housing packages that house electronic devices have also become smaller, and the width of the insulating frame has become extremely narrow at the position where the notch is formed. Therefore, when the metal lid is bonded to the sealing metallization layer on the upper surface of the insulating frame via the sealing material to house the electronic element in the electronic element housing package, the space between the insulating frame and the metallic lid is reduced. The amount of the sealing material intervening in the package is small, and as a result, the reliability of the hermetic sealing of the package is low.

[0007]

[Object] The present invention has been devised in view of the above-mentioned drawbacks, and an object thereof is to complete the hermetic sealing of an electronic element housed therein and to securely and firmly connect the electronic element to an external electric circuit. An object of the present invention is to provide a small package for accommodating electronic elements.

[0008]

According to the present invention, there is provided an insulating base having a notch on a side surface and a wiring metallization layer extending from an upper surface to a lower surface through the notch, and an outer peripheral surface of an upper surface of the insulating base. What is claimed is: 1. A package for storing an electronic element, comprising an insulating frame body which is joined and has a notch portion on a side surface and an encapsulating metallization layer on an upper surface, wherein the notch cross-sectional area of the notch portion provided on the side surface of the insulating frame body is A connection metallization layer for electrically connecting the metallization layer for sealing and the metallization layer for wiring is attached to the cutout portion formed on the side surface of the insulating frame while making the cutout cross-sectional area of the cutout portion formed on the side surface of the insulating substrate smaller. It is characterized by having done.

[0009]

Since the notch cross-sectional area of the notch provided on the side surface of the insulating frame is made smaller than the notch cross-sectional area of the notch provided on the side of the insulating base, the width of the notch of the insulating frame can be increased. Therefore, when the insulating frame and the metallic lid are joined together via the sealing material, the amount of the sealing material interposed between the insulating frame and the metallic lid increases and the package air The reliability of tight sealing is significantly improved.

Further, since the notch cross-sectional area of the notch formed on the side surface of the insulating base is large, the metallization layer for wiring led out to the lower surface of the insulating base is electrically conductive such as solder to the wiring conductor of the external electric circuit board. Between the wiring metallization layer located in the notch on the side surface of the insulating substrate and the wiring conductor of the external electric circuit board when the electronic element accommodated inside is electrically connected to the external electric circuit by bonding via an adhesive. A pool (meniscus) of conductive adhesive is formed on the surface, which strengthens the bond between the metallization layer for wiring and the wiring conductor of the external electric circuit board, and securely and firmly electrically connects the electronic element to the external electric circuit. It becomes possible.

[0011]

The present invention will now be described in detail with reference to the accompanying drawings. 1 and 2 show an embodiment of a package for housing an electronic element according to the present invention, in which 1 is an insulating base and 2 is an insulating frame. The insulating substrate 1 and the insulating frame 2 form a semiconductor element housing package in which the electronic element 3 is housed.

The insulating substrate 1 is a substantially rectangular flat plate,
A mounting portion 1a on which an electronic element is mounted is provided in the central portion of the upper surface, and the electronic element 3 is mounted on the mounting portion 1a by solder, glass,
It is adhered and fixed via an adhesive such as resin.

The insulating substrate 1 is made of an electrically insulating material such as an alumina sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, and a glass-ceramic sintered body. When it is composed of an alumina-based sintered body, it is made into a slurry by adding and mixing an appropriate binder and solvent to raw material powder such as alumina, silica, calcia, magnesia, etc. and it is a sheet of the conventionally known doctor blade method or calender roll method. A ceramic green sheet (ceramic green sheet) is obtained by adopting a forming technique, and then the ceramic green sheet is formed into a predetermined shape by a punching method and is fired at a high temperature of about 1600 ° C.

A wiring metallization layer 4 extending from the periphery of the electronic element mounting portion 1a on the upper surface to the lower surface via the side surface is adhered to the insulating substrate 1, and the electronic element mounting portion of the wiring metallization layer 4 is formed. Electrodes of the electronic element 3 are electrically connected to the periphery of 1a via the bonding wires 5, and wiring conductors of an external electric circuit board (not shown) are electrically conductive such as solder in a portion led out to the lower surface of the insulating substrate 1. It is electrically connected via an adhesive.

The wiring metallization layer 4 is made of a metal powder of tungsten, molybdenum, manganese, copper, silver or the like. For example, a metal paste obtained by adding and mixing an appropriate binder and a solvent to the metal powder of tungsten, molybdenum or the like. An electronic element mounting portion 1 of the insulating substrate 1 is formed by printing and applying a predetermined pattern to a ceramic green sheet to be the insulating substrate 1 in advance by a conventionally known screen printing method.
It is adhered from the periphery of a to the lower surface via the side surface.

Further, a cutout 1 is formed on the side surface of the insulating base 1.
b, the notch 1b acts as a side passage of the wiring metallization layer 4 and connects the wiring metallization layer 4 to the wiring conductor of the external electric circuit board through a conductive adhesive such as solder. At this time, by containing a part of the conductive adhesive inside, a good meniscus is formed between the wiring metallization layer 4 and the wiring conductor of the external electric circuit board.

The notch 1a of the insulating substrate 1 has a semicircular shape, and when the radius is 0.2 mm or less, a good meniscus is formed between the wiring metallization layer 4 and the wiring conductor of the external electric circuit board. Since it is difficult to form the shape, it is preferable to form a semicircular shape with a radius of 0.2 mm or more,
Considering the entire shape of the insulating base 1, 0.2 to 1.0 m
It is preferable to set m.

The cutout portion 1a is formed by subjecting the ceramic green sheet to be the insulating substrate 1 to a semicircular punching process by a punching process in advance.
Is formed on the side surface of.

An insulating frame 2 is joined to the outer peripheral portion of the upper surface of the insulating base 1 so as to surround the electronic element mounting portion 1a.

The insulating frame 2 is made of an electrically insulating material such as an alumina sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, and a glass-ceramic sintered body. For example, in the case of an alumina-based sintered body, alumina, silica, calcia, magnesia and other raw material powders are mixed by adding an appropriate binder and solvent to form a slurry, which is conventionally known as a doctor blade method or a calendar roll method. A ceramic green sheet (ceramic green sheet) is obtained by adopting a sheet forming technique, and then the ceramic green sheet is formed into a predetermined frame shape by a punching method and placed on the ceramic green sheet which becomes the insulating substrate 1. Then, the insulating substrate 1
And a frame-shaped ceramic green sheet serving as the insulating frame body 2 are fired at a high temperature of about 1600 ° C., and the both are sintered and integrated to be bonded to the upper peripheral portion of the upper surface of the insulating base 1.

On the upper surface of the insulating frame body 2, a frame-shaped sealing metallization layer 6 is adhered and formed. The sealing metallization layer 6 has a metallic lid body 8 on the insulating frame body 2. It acts as a base metal layer at the time of joining, and the sealing metallization layer 6
The electronic element 3 is hermetically sealed inside the container composed of the insulating base body 1, the insulating frame body 2 and the lid body 8 by joining the metallic lid body 8 with the sealing material 9 such as solder.

The encapsulating metallization layer 6 is made of metal powder such as tungsten, molybdenum, manganese, copper and silver, and is formed in a frame shape on the upper surface of the insulating frame body 2 by the same method as the wiring metallization layer 4. To be done.

Further, the insulating frame 2 is formed with a notch 2b on its side surface, and the notch 2b connects the metallizing layer 6 for sealing and the metallizing layer 4 for wiring, which will be described later, to each other. Acts as a passage for 7.

Notch 2 formed on the side surface of the insulating frame 2
b is formed in a semicircular shape on the side surface of the insulating frame body 2 by punching a semicircular shape on the ceramic green sheet to be the insulating frame body 2 in advance by a punching method, and its radius exceeds 0.15 mm. And notch 2 of insulating frame 2
The width of the position where b is formed becomes narrow, and the metal lid 8 is bonded to the sealing metallization layer 6 on the upper surface of the insulating frame 2 via the sealing material 9 to place the electronic element 3 in the electronic element housing package. When housed, there is a risk that the amount of the sealing material 9 interposed between the insulating frame body 2 and the metal lid body 8 becomes small, and the hermetic sealing of the package becomes unreliable. Therefore, it is preferable that the cutout portion 2b formed in the insulating frame body 2 has a semicircular shape with a radius of 0.15 mm or less, and if the formation of the connection metallization layer 7 in the cutout portion 2b is taken into consideration, it is 0.0.
It is preferable to set it to 5 to 0.15 mm.

Further, a connection metallized wiring layer 7 is adhered to the notch 2b formed on the side surface of the insulating frame 2, and the connection metallized layer 7 is sealed by the insulating frame 2. The stop metallization layer 6 and a part of the wiring metallization layer 4 adhered to the insulating substrate 1 are electrically connected to each other, so that unnecessary static electricity is not provided between the sealing metallization layer 6 and the wiring metallization layer 4. Acts to effectively prevent the formation of bonds,
As a result, the operation of the electronic element 3 mounted by the electrostatic coupling is never unstable.

The connecting metallization layer 7 is made of a metal powder such as tungsten, molybdenum, manganese, copper, silver, etc., and is deposited in the side surface notch 2b of the insulating frame 2 by the same method as the sealing metallization layer 6. It is formed.

Thus, according to the electronic element housing package of the present invention, the electronic element 3 is adhered and fixed to the electronic element mounting portion 1a of the insulating substrate 1 through an adhesive such as solder, glass or resin. Each electrode is connected to the wiring metallization layer 4 through the bonding wire 5, and then the metal lid 8 is attached to the metallization layer 6 for sealing on the upper surface of the insulating frame 2 with a sealing material such as gold-tin solder. The electronic device 3 is completed by hermetically sealing the electronic element 3 inside the container composed of the insulating base body 1, the insulating frame body 2 and the lid body 8 by joining them via 9.

The present invention is not limited to the above-mentioned embodiments, but various modifications can be made without departing from the scope of the present invention. For example, in the above-mentioned embodiments, the electronic element storing package is provided. Although the insulating base 1 and the insulating frame 2 are each formed of one ceramic green sheet, they may be formed by stacking a plurality of ceramic green sheets.

Further, in the above-mentioned embodiment, the metallic lid 8 is bonded to the sealing metallization layer 6 adhered to the upper surface of the insulating frame 2 through the sealing material 9 such as gold-tin solder. However, the metal frame body may be joined to the sealing metallization layer 6 through a brazing material such as silver brazing, and the metal lid body 8 may be welded and joined to the metal frame body by the seam weld method. .

Further, in the above-described embodiment, both the notch 1b formed on the side surface of the insulating substrate 1 and the notch 2b formed on the side surface of the insulating frame body 2 are semicircular, but they are semicircular. The shape is not limited, and may be elliptical or U-shaped.

Furthermore, in the above-described embodiment, the cutout portion 1b of the insulating base body 1 and the cutout portion 2b of the insulating frame body 2 are both formed in the center portions of the sides of the insulating base body 1 and the insulating frame body 2, respectively. The insulating base 1 is not limited to the central portion of each side.
Alternatively, it may be formed at a corner of the insulating frame 2. In this case, the cutouts 1b and 2b have a fan-shaped or L-shaped cross-section.

[0032]

According to the electronic element storage package of the present invention, the notch cross-sectional area of the notch provided on the side surface of the insulating frame is smaller than the notch cross-sectional area of the notch provided on the side surface of the insulating base. The width of the cutout portion of the insulating frame body can be widened, and when the insulating frame body and the metal lid body are joined to each other through the sealing material, the insulating frame body and the metal lid body are provided with a space between the insulating frame body and the metal lid body. The amount of intervening encapsulant is increased, and the reliability of hermetic sealing of the package is significantly improved.

Further, since the notch cross-sectional area of the notch formed on the side surface of the insulating base is large, the wiring metallization layer led out to the lower surface of the insulating base is electrically conductive such as solder to the wiring conductor of the external electric circuit board. Between the wiring metallization layer located in the notch on the side surface of the insulating substrate and the wiring conductor of the external electric circuit board when the electronic element accommodated inside is electrically connected to the external electric circuit by bonding via an adhesive. A pool of conductive adhesive is formed on the surface (a meniscus is formed), which strengthens the connection between the metallization layer for wiring and the wiring conductor of the external electric circuit board, and ensures that the electronic element is securely and firmly electrically connected to the external electric circuit. It becomes possible to make a physical connection.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a package for housing an electronic element of the present invention.

FIG. 2 is a plan view of the electronic element housing package shown in FIG.

FIG. 3 is a cross-sectional view of a conventional electronic element housing package.

FIG. 4 is a plan view of the electronic element housing package shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 1a ... Mounting part 1b ... Cutout formed in insulating base 2 ... Insulating frame 2b ... Cutout formed in insulating frame 3 ... Electronic element 4 ... Wiring Metallization layer 6 ... Sealing metallization layer 7 ... Connection metallization layer

Claims (1)

[Claims] 1. An insulating base having a notch on a side surface and having a wiring metallization layer extending from the upper surface to the lower surface through the notch, and an insulating base bonded to an upper peripheral portion of the upper surface.
What is claimed is: 1. An electronic element storage package comprising an insulating frame body having a cutout portion on a side surface and a sealing metallization layer on an upper surface, wherein a cutout cross-sectional area of the cutout portion provided on the side surface of the insulating frame body is a side surface of an insulating substrate. A connection metallization layer for electrically connecting the metallization layer for sealing and the metallization layer for wiring to the notch provided on the side surface of the insulating frame, and having a size smaller than the notch cross-sectional area of the notch provided at A package for storing electronic elements characterized by: