JPH06196620A - Method and apparatus for forming pin holding part for lead frame - Google Patents

Abstract

(57) [Summary] [Purpose] The pin holding part made of resin of the lead frame is extremely thin and flat without rising on the surface of each pin, and it does not swell by flowing from between each pin to the back surface and is almost the same as the thickness of the pin. (EN) Provided are a method and an apparatus capable of forming a desired shape to a desired degree quickly and reliably. [Structure] On a lead frame 2 on a table 1, a resin material 4 is applied from a dispenser to a surface of each pin at a predetermined position and between each pin, and is cured to form a pin holding portion 7 made of resin. In the means for forming the pin holding portion on the lead frame, the ultraviolet ray curable resin material 4 having elasticity and non-conductivity, low impurities and small thermal expansion is accurately measured from the needle portion 8 at the lower end of the dispenser per unit time. The ink is well discharged and applied, and the ultraviolet irradiation light 9 is provided downward and integrally with the needle portion 8 to apply the resin material 4 to the lead frame 2 and at the same time to irradiate the ultraviolet light 3 and immediately cure it. .

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner lead pin or an outer lead pin of a lead frame which is deformed in an assembly / manufacturing process of electronic parts such as IC and LSI.
The present invention relates to a method for forming a pin holding portion that prevents unevenness, and a forming apparatus used for implementing the method.

[0002]

2. Description of the Related Art As lead frames have a large number of pins and are densely packed, it is necessary to hold and fix each pin in order to prevent deformation and misalignment of each lead pin (hereinafter referred to simply as a pin). As a means for holding and fixing it, a pin holding tape made by cutting a polyimide film coated with a heat resistant adhesive into an appropriate width, size, and shape has been widely used as a means for holding and fixing it. Each block is attached to a predetermined location of each pin.

However, in order to attach the tape to the lead frame, it is necessary to prepare many kinds of expensive dies according to the type of the lead frame, and when the type of the lead frame changes, the dies are changed. It takes time to replace and lacks responsiveness. Further, when the tape base material is punched into a width, size, and shape according to the type of the lead frame, many unusable parts remain, but this tape base material is expensive, so there is a problem in terms of economy.

As an alternative thereto, it has been considered to form a pin holding portion made of a resin material between each pin of the lead frame and each pin. For example, the actual development 61-241953
There is one described in the publication. In this structure, a pin holding portion made of synthetic resin is formed on each of a plurality of pins extending from the frame portion of the lead frame toward the center so that the tips of the pins are connected to each other.

In the above publication, the means for forming the resin pin holding portion on the lead frame is not always clear. As a concrete means for forming the resin pin holding portion, for example, there is one described in Japanese Patent Application Laid-Open No. 63-283054 filed by the same person as the present application. This is a photo-curable resin material that has heat resistance, high purity, non-conductivity, and a small coefficient of linear expansion, applied between the pins of the lead frame with a dispenser and an XY table. Is sent to a curing treatment step, at least one of which is pressed between transparent pressing plates so that each pin surface is thin and flat, and sufficiently enters between the pins, and in that state, light is irradiated to perform a curing treatment, The pin holding portion is formed.

[0006]

By the way, in the above-mentioned resin pin holding portion, the resin material is generally thin and flat on the surface of each pin so as not to hinder the transportation or stacking of the lead frame. Further, it is desirable that the pins be formed so as not to flow from the space between the pins to the back surface.

However, in the above-described conventional resin pin holding portion forming means, a resin material is applied to each block of one lead frame in a desired shape between each pin and then the lead frame. Is sent to a curing treatment chamber and irradiated with light for curing treatment.

Therefore, after the resin material is applied between the pins of the lead frame and between the pins, a certain amount of time elapses until the resin material is cured, and during that time the surface of the pins is applied. The liquid resin material rises due to surface tension, and becomes a semi-circular shape with a slightly flat cross section and hardens (see FIG. 12 and FIG. 13, the same reference numerals as those in the drawings relating to the present invention are used. 14 and 15 are also the same). In addition, between the pins, the resin material often flows out downward, and a pin holding portion in a state of bulging downward is often formed (FIGS. 14 and 1).
5).

If the amount of resin material to be applied is reduced, the amount of resin material between the pins is reduced (see FIGS. 12 and 13 above), resulting in a pin holding portion having a weak pin holding force. I will end up. Further, when the lower end of the dispenser is applied close to the lead frame to apply the resin material, the resin material flows out from between the pins to the back surface, and it becomes easier to form the pin holding portion in a state of swelling downward (see FIGS. 14 and 15 above). .

Therefore, in the above-mentioned Japanese Patent Laid-Open No. 63-283054, the resin material is applied and then pressed between the pressing plates to carry out the curing treatment. As a result, it became possible to form the pin holding portion with the resin material being thin and flat on the surface of each pin and sufficiently inserted between the pins. However, in this pin holding portion forming means, it has been found that transfer and reattachment of the resin material to the pressing plate may occur, which sometimes causes defective products.

The present invention relates to a means for forming a pin holding portion on a lead frame, and was developed as a result of research to solve the above-mentioned problems of the prior art. That is, the object of the present invention is to make the resin pin holding portion extremely thin and flat without rising on the surface of each pin of the lead frame, and to prevent the pin from bulging by flowing from between the pins to the back surface. It is to provide a method and a device for forming a pin holding portion on a lead frame that can be formed into a desired shape quickly and reliably with a thickness substantially equal to the above.

[0012]

First, a method for forming a pin holding portion on a lead frame according to the present invention is described in Table 1.
A resin material 4 is applied from an upper dispenser onto the surface of each pin 5 at a predetermined location and between each pin 6, and the lead frame 2 placed on the top is cured to form a resin pin holding portion 7. In the method for forming the pin holding portion on the lead frame,

A UV curable resin material 4 having elasticity and non-conductivity, low impurities and small thermal expansion is discharged from the needle portion 8 at the lower end of the dispenser with high accuracy per unit time, and then is discharged to the lead frame 1. The resin material 4 is applied and the resin material 4 is applied to the lead frame 2 by irradiating the resin material 4 with the ultraviolet light 3 from the ultraviolet irradiation light 9 provided downward integrally with the needle portion 8. However, the curing process is performed at the same time.

Secondly, the apparatus for forming a pin holding portion on a lead frame according to the present invention is provided with a table 1 on which the lead frame 2 is placed and a dispenser for applying a resin material above the table 1. In a device for forming a pin holding portion on a lead frame, which is provided with at least one of a dispenser and a dispenser so as to be horizontally movable, and which is provided with a resin material curing means 9,

The dispenser is filled with an ultraviolet curable resin material 4 having elasticity and non-conductivity, low impurities and small thermal expansion, and the resin material 4 is provided at the lower end of the dispenser per unit time. A needle portion 8 capable of discharging accurately is provided, and an ultraviolet irradiation light 9 as a resin material curing means is provided downwardly and integrally with the needle portion 8.

In the above structure, the predetermined portion of the lead frame 2 to which the resin material 4 is applied is not limited to the inner pin but may be the outer pin. The table 1 and the dispenser are moved by one or both of them to move the lead frame 2 in the width direction, that is, the X direction, and in the longitudinal direction, that is, the Y direction.
It is possible to move in the horizontal direction and also in the vertical direction, that is, in the Z direction. The property of the resin material 4 before curing is liquid such as paste or cream. In the figure, 15 indicates an island portion of the lead frame 2.

[0017]

The operation of the method and apparatus for forming the pin holding portion on the lead frame according to the present invention is as follows.

A) The lead frame 2 on which the island portion 18 and the large number of pins 5 are formed is conveyed and placed on the table 1 in the forming method and the forming apparatus according to the present invention. Then, the pin holding portion 7 corresponding to the lead frame 2
Position, shape, thickness, etc. of the pin holding part are set by the movement of the table 1, the dispenser needle part 8, the distance between the needle part 8 and the lead frame 2, the discharge amount of the resin material 4, etc. deep.

In this state, the resin material 4 is precisely discharged per unit time from the needle portion 8 while moving the table 1 and the dispenser needle portion 8 in a predetermined manner. With this, the ultraviolet curable resin material 4 is applied in a thin string shape on the surfaces of the pins 5 at predetermined positions of the lead frame 2 and between the pins 6, and the pin holding portions 7 are drawn.

At the same time that the resin material 4 is applied to the lead frame 2, ultraviolet rays 3 are applied to the applied resin material 4 from an ultraviolet irradiation lamp 9 provided downward integrally with the needle portion 8. It is irradiated. With this, the needle part 8
The UV-curable resin material 4 discharged from the heater and applied onto the lead frame 2 is called a conventional applying process and a curing process.
Unlike the one that goes through a step process, UV 3
The curing reaction is initiated by the irradiation of and is cured.

Therefore, although the resin material 4 applied to the surface of each pin 5 is liquid, the resin material 4 is hardened from the surface before the pin 5 rises due to surface tension. Even if the pin 5 of the lead frame 2 is not pressed by a conventional pressing plate, a thin and flat pin holding portion 7 made of the resin material 4 still applied by the needle portion 8 at the lower end of the dispenser. Will be formed (see FIGS. 8 and 9).

Similarly, the resin material 4 flowing into the space 6 between the pins from the needle portion 8 at the lower end of the dispenser is hardened from the surface before flowing out through the space 6 between the pins even though it is liquid. Become. The resin material 4 does not swell downward even if it is not pressed by a pressing plate as in the conventional case, and a pin holding portion 7 having a thickness substantially equal to the thickness of the pin 5 is formed (FIG. 10 and FIG. 10). 11).

B) In the above case, the ultraviolet irradiation light 9 is provided integrally with the needle portion 8 at the lower end of the dispenser. Therefore, by moving at least one of the table 1 and the dispenser needle portion 8, the lead frame 2
When the resin material 4 is applied to the predetermined position of the needle portion 8 in a predetermined shape, the ultraviolet irradiation light 9 always follows the movement of the needle portion 8, and the applied resin material 4 Then, ultraviolet rays 3 are immediately irradiated on the surface, and a quick and reliable curing reaction is performed (see FIG. 4).

Further, as described above, the resin material 4 applied to the surface of each pin 5 does not rise and is cured in a thin and flat state by the rapid curing treatment as described above. The surface can be infinitely approached, and in that state, the resin material 4 can be applied to the surface of each pin 5. Therefore, also from this point, the resin material can be applied to the surfaces of the pins 5 extremely thinly, and the resin material 4 can be sufficiently filled between the pins 6. The other side,
When it is necessary to apply the resin material 4 thickly to the surface of each pin 5, the distance between the needle portion 8 and the surface of each pin 5 may be increased, and the thick pin holding portion 7 can be formed.

Further, since the resin material 4 can be discharged from the needle portion 8 at the lower end of the dispenser with high precision per unit time, the thickness of the resin material 4 can be arbitrarily adjusted by adjusting the discharge time or the discharge amount per unit time. It is easy to form the pin holding portion 7 having a desired thickness. Further, the amount of the resin material 4 in the space 6 between the pins can be adjusted, and the amount of the resin material 4 flowing out to the back surface can be reduced to easily form the pin holding portion 7 having substantially the same thickness as the pin 6.

Since the resin material 4 used here has elasticity even after being hardened, the pin holding portion 7 with high precision by a dispenser near the tip of the inner pin.
It is possible to regulate the plating area at the time of the plating process with this pin holding portion 7 by applying and forming.
Further, even without using an expensive mask made of silicon rubber and having high dimensional accuracy as in the prior art, a sufficient sealing action can be obtained even with a mask made of, for example, hard vinyl chloride, and highly accurate partial plating can be performed.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the illustrated embodiment, the table 1 on which the lead frame 2 is mounted is not shown in the drawing, but a feed screw,
By means of a reciprocating means such as a hydraulic or pneumatic cylinder, the lead frame 2 can be moved in the width direction, that is, in the X direction, and can be moved in the Z direction, that is, in the vertical direction. On the other hand, the dispenser provided above the table 1 can also be moved in the longitudinal direction of the lead frame 2, that is, the Y direction via the arm module 23 by a reciprocating means (not shown) such as a feed screw, a hydraulic or pneumatic cylinder. There is. In the figure, reference numeral 24 denotes a conveyor belt, which conveys the lead frame 2 before forming the pin holding portion 7 to the lower portion of the dispenser, applies the resin material 4 and forms the lead frame 2 after forming the pin holding portion 7 to the next step. It is to be transported.

The needle portion 8 at the lower end of the dispenser is not in direct communication with the resin container 10, but is in communication with the syringe 12 via a switchable three-way valve 11. That is, the three-way valve 11 is made of the resin material 4
Before applying, the supply pipe 13 from the resin container 10 and the syringe 12 are made to communicate with each other (see FIG. 2), and at the time of applying, the three-way valve switching means 16 is used to make the syringe 12 and the needle portion 8 communicate with each other. Yes (see FIG. 3). Further, the resin material 4 in the resin container 10 before coating is the resin container 10
It is possible to flow out by applying air pressure to (see FIG. 1), and the plunger portion 14 in the syringe 12 can be reciprocated by a required length by a servomotor and a feed screw (not shown).

An ultraviolet irradiation light 9 for curing a resin material is integrally provided downwardly on the needle portion 8, and a ring-shaped one surrounding the needle portion 8 is used in the illustrated example (FIG. 1).・ See Fig. 2, Fig. 3, and Fig. 5.) The ring-shaped UV irradiation light 9 is provided with a large number of glass fibers 17 communicating with an external UV light source (not shown).
Is radiated in a ring shape as a whole (see FIGS. 3 and 4).

As described above, the ring-shaped ultraviolet irradiation lamp 9 is used.
What was used is that when the resin material 4 is applied to the lead frame 2 by the movement of the table 1 and the dispenser / needle portion 8, the resin material 4 is always irradiated with ultraviolet rays at the same time regardless of the application direction. This is to enable irradiation of 3 (see FIG. 4). However, although not shown, for example, if the needle portion 8 or the ultraviolet irradiation light 9 is rotatable about the vertical axis and the ultraviolet irradiation light 9 is always movable after the needle portion 8 advances, a ring shape is provided. You may use a spot-like thing instead of using it.

It is desirable that each glass fiber 17 in the ultraviolet irradiation light 9 is provided in the ring-shaped ultraviolet irradiation light 9 in a radial direction, in other words, in an inclined shape from the center side to the outside (FIG. 2 and Fig. 3). this is,
This is because when the ultraviolet ray 3 from the ultraviolet ray irradiating light 9 is radiated to the tip of the needle portion 8, the resin material 4 before coating is cured at the outlet of the needle portion 8 so that the ultraviolet ray 3 escapes to the outside (FIG. 3). In this case, since the ultraviolet irradiation light can be installed close to the needle portion, the needle portion with the ultraviolet irradiation light can be downsized. However, if the ultraviolet irradiation light 9 is attached at a distance from the needle portion 8, the ultraviolet ray 3 is not irradiated to the tip of the needle portion 8, so that each glass fiber 17 may be arranged vertically in the ultraviolet irradiation light 9. (See Figure 5).

In the operating state of the above embodiment, first, the resin material 4
Before applying, the resin material 4 in the resin container 10 is pushed out by sending air into the resin container 10, and once flows into the syringe 12 from the supply pipe 13 by the three-way valve 11 to be filled. (See Figure 2). The supply of the resin material 4 to the syringe 12 is not limited to the above pneumatic pressure, and may be a gear pump or other means.

When the resin material 4 is applied, the three-way valve 11 is switched, the syringe 12 and the needle portion 8 at the lower end of the dispenser communicate with each other, and the plunger portion 14 in the syringe 12 has a required length by a servomotor / feed screw. Only move forward. As a result, the resin material 4 in the syringe 12 is accurately supplied to the needle portion 8 per unit time, and is discharged from the needle portion 8 in a thin string shape (see FIG. 3). At this time, the dispenser / needle portion 8 moves in the Y direction, and the table 1 on which the lead frame 2 is mounted moves to the X direction.
In order to move in the direction, the resin material 4 is applied from the needle portion 8 to a predetermined portion of the lead frame 2 in a thin string shape in a desired shape and a desired thickness. If the moving speed of the plunger portion 14 of the syringe 12 or the moving speed of the table 1 or the depenser / needle portion 8 is variable, application with a desired thickness can be easily performed.

At the same time that the resin material 4 is applied, the ultraviolet light 3 is applied from the lower end of each glass fiber 9 of the ultraviolet irradiation light 9 provided integrally with the needle portion 8, so that the ultraviolet light applied to the lead frame 2 is applied. The curable resin material 4 is
The hardening action starts immediately and the hardening quickly. On this occasion,
Since the ultraviolet irradiation light 9 is integrally provided on the needle portion 8, the resin material 4 applied onto the lead frame 2 by the movement of the table 1 and the dispenser needle portion 8
The ultraviolet ray 3 is immediately radiated immediately following. Further, since the ring-shaped ultraviolet light 9 is used as described above, the resin material 4 and the ultraviolet light 3 after the coating are always irradiated regardless of the coating direction, so that the curing treatment can be performed quickly and surely. Is done.

In the illustrated embodiment, the ultraviolet irradiation light 9 is provided integrally with the needle portion 8 and the resin material 4 is applied simultaneously with the application.
Is cured, and this curing means is usually sufficient. However, in order to accelerate the curing of the resin material 4 on the back and side portions of the pins 5 of the lead frame 2 or to increase the efficiency of the curing treatment of the resin material 4 when the coating is performed at high speed, the ultraviolet irradiation light 9 described above is used. After the curing process by
Then, the ultraviolet irradiation lamp 19 may be passed through the curing auxiliary chamber 18 (see FIG. 6) surrounded by the upper and lower reflection plates 20. In FIG. 6, 21 is an air intake port, 22 is an exhaust port,
It removes ozone gas generated by ultraviolet irradiation and outgas generated by the polymerization reaction of the resin.

In the illustrated embodiment, only one needle portion 8 with the ultraviolet irradiation light 9 is shown, but one needle portion 8 is provided for each block centering on the island portion 15 of the lead frame 2. May be. If the width of the needle portion 8 with the ultraviolet irradiation light 9 is large and there is a possibility that the adjacent needle portions 8 interfere with each other, the needle portion 8 is provided corresponding to every other block of the lead frame 2 twice. It is sufficient to perform the coating work of.

The application of the resin material curing means integrally provided with the ultraviolet irradiation light 9 downward on the needle portion 8 is not limited to the method and apparatus for forming the pin holding portion on the lead frame, For example, when an ultraviolet curable resin material is used to seal a component to be incorporated in a printed circuit board or a tab (TAB), it can be used as a resin material curing means, and in this case also, the device can be simplified and downsized. it can.

[0038]

The method and apparatus for forming the pin holding portion on the lead frame according to the present invention have the following effects.

1) The resin pin holding portion can be formed thin and flat without rising on the pin surface. That is, in the present invention, the ultraviolet curable resin material is applied to the lead frame by the needle portion at the lower end of the dispenser, and at the same time, the ultraviolet ray is emitted from the ultraviolet ray irradiation light provided integrally with the needle portion. Therefore, unlike the conventional two-step process of applying a resin material and curing step, the resin material applied to the surface of each pin immediately starts the curing reaction, and the surface tension of the material is liquid even though it is liquid. It is hardened from the surface while it does not rise. With this, it is possible to form a thin and flat pin holding portion as it is applied by the needle portion on each pin surface.

Further, since the resin material applied to the surface of each pin as described above is cured while it does not rise and is thin and flat, the needle portion is infinitely close to the surface of each pin of the lead frame. , A resin material can be applied. Therefore, also from this point, the pin holding portion can be formed by applying the resin material to the pin surface extremely thinly. Moreover, it is not necessary to press with a pressing plate as in the prior art, and it is possible to prevent the generation of defective products due to transfer or re-adhesion of the resin material to the pressing plate.

2) The resin-made pin holding portion can be formed to have a thickness substantially equal to the thickness of the pin, without significantly bulging on the back side of the pin. That is, in the present invention, as described above, the ultraviolet ray curing type resin material is applied, and at the same time, the ultraviolet ray is irradiated by the ultraviolet ray irradiation light. Therefore, unlike the conventional two-step process of applying and curing, the resin material that flows between the pins immediately starts the curing reaction, and even though it is liquid, it does not flow down before it flows out. To cure. As a result, the resin material can be prevented from flowing downward, and a thin pin holding portion having a thickness substantially equal to the thickness of the pin can be formed. Here again, there is no need to press with a pressing plate as in the prior art, and the inconvenience associated therewith is eliminated.

3) It is easy to form the pin holding portion made of resin thickly on the surface of each pin as needed, or to fill the resin sufficiently between the pins, or to form it to a desired thickness. That is, in the present invention, if the distance between the needle portion at the lower end of the dispenser and the surface of each pin of the lead frame is increased, the resin material can be applied thickly to each pin surface, so that a thick pin holding portion can also be formed. Further, by coating the resin material by bringing the needle portion close to the surface of each pin as described above, it is possible to sufficiently coat the resin material between the pins. Therefore, it is easy to form the pin holding portion having a desired thickness.

4) The resin material applied to the lead frame can always be immediately followed and irradiated with ultraviolet rays to be cured regardless of the shape of the applied resin material. That is, in the present invention, the ultraviolet irradiation light is provided integrally with the needle portion at the lower end of the dispenser. Therefore, when the resin material is applied to the lead frame by moving the table or the dispenser / needle portion, it is possible to always follow the application and simultaneously irradiate the resin material with ultraviolet rays. As a result, a quick and reliable curing treatment can be performed, and it is possible to prevent the resin material from rising on the surface of each pin due to the surface tension of the resin material and from flowing down the resin material from between the pins.

5) When the lead frame is partially plated, highly accurate partial plating can be performed even when an inexpensive mask is used. That is, in the present invention, the pin holding portion can be applied and formed with high precision by a dispenser near the tip of the inner pin, but a resin material that is elastic even after curing is used. Therefore, the pin holding portion can regulate the plating area at the time of partial plating, and the elastic pin holding portion can obtain a sufficient sealing action even with a mask made of, for example, a hard vinyl chloride. As a result, highly accurate partial plating can be performed without using an expensive mask made of silicon rubber and having high dimensional accuracy as in the prior art.

6) As in the illustrated embodiment, if the ultraviolet irradiation light provided integrally with the needle portion is such that ultraviolet rays are irradiated in a ring shape, the resin material can be directed in any direction of the lead frame. Even if it is painted,
A part of the ring-shaped ultraviolet rays can always irradiate the resin material immediately after being applied, and a reliable curing process can be performed.

7) Further, as shown in the illustrated embodiment, if the irradiation of ultraviolet rays is performed in an inclined manner from the center side of the ultraviolet irradiation light toward the outside, the ultraviolet rays irradiate the tip of the needle portion before coating. It is possible to prevent the inconvenience of curing the resin material. In this case, since the ultraviolet irradiation light can be installed close to the needle portion, the needle portion with the ultraviolet irradiation light can be downsized.

8) Further, as in the illustrated embodiment, the resin container and the needle portion at the lower end of the dispenser are not directly connected,
Once the resin material before coating is filled into the syringe,
If the plunger portion that advances with high accuracy by the servo motor or feed screw during coating is used to discharge and apply from the needle portion, the resin material can be applied to the lead frame with extremely high accuracy. Further, if the moving speed of the plunger part, the table or the dispenser needle part is variable, the pin holding part having a desired thickness can be formed very easily.

[Brief description of drawings]

FIG. 1 is a partially longitudinal side view showing the outline of an embodiment of an apparatus for forming a pin holding portion on a lead frame according to the present invention.

FIG. 2 is a partially enlarged vertical side view of the forming apparatus shown in FIG. 1 when a resin material is supplied to a syringe.

FIG. 3 is a partially enlarged vertical side view of the forming apparatus shown in FIG. 2 when a resin material is applied at a needle portion.

FIG. 4 is a plan view showing a relationship between application of a resin material onto a lead frame and ring-shaped irradiation of ultraviolet rays.

FIG. 5 is a partially longitudinal side view showing another embodiment of the needle portion with the ultraviolet irradiation light.

FIG. 6 is a partially cutaway front view showing an embodiment of a curing auxiliary chamber.

FIG. 7 is an enlarged plan view of a part of the lead frame with the pin holding portion formed by the forming method and the forming apparatus according to the present invention.

FIG. 8 is an enlarged cross-sectional view taken along the line AA in FIG. 7 in the case where the pin holding portion is formed by applying a resin material in a slightly small amount.

9 is a B- in FIG. 7 of what is shown in FIG. 8;
It is a B line expanded sectional view.

10 is an enlarged cross-sectional view taken along the line AA in FIG. 7 in the case where the pin holding portion is formed by applying a slightly larger amount of resin material.

11 B in FIG. 7 for what is shown in FIG.
It is a -B line expanded sectional view.

FIG. 12 is an enlarged vertical cross-sectional view of a case where a pin holding portion is formed by applying a resin material in a slightly small amount by a conventional means.

FIG. 13 is an enlarged vertical cross-sectional view of what is shown in FIG. 12 from another angle.

FIG. 14 is an enlarged vertical cross-sectional view when a pin holding portion is formed by applying a resin material in a slightly larger amount by a conventional means.

FIG. 15 is an enlarged vertical cross-sectional view of the thing shown in FIG. 14 from another angle.

[Explanation of symbols]

1-table 2-lead frame 3-ultraviolet 4-resin material 5-pin 6-between pins 7-pin holding part 8-needle part 9-ultraviolet irradiation light 10-resin container 11-three way valve 12-syringe 13-supply pipe 14-plunger part 15-island part 16-three-way valve switching means 17-glass fiber 18-cure auxiliary chamber 19-ultraviolet irradiation lamp 20-reflector 21-air inlet 22-exhaust 23-arm module 24-conveyor belt

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location H01L 23/31

Claims (2)

[Claims] 1. A lead frame 2 mounted on a table 1.
In addition, a resin material 4 is applied from an upper dispenser to the surface of each pin 5 at a predetermined location and between each pin 6, and the resin material 4 is cured to form a resin pin holding portion 7. In the method of forming a pin holding portion on a pin, a UV curable resin material 4 having elasticity and non-conductivity, low impurities and small thermal expansion is accurately discharged from a needle portion 8 at the lower end of the dispenser per unit time. do it,
The lead frame 1 is coated with the resin material 4, and the coated resin material 4 is integrated with the needle portion 8 downward from the ultraviolet irradiation light 9 to the ultraviolet ray 3.
And a resin material 4 is applied to the lead frame 2 while being simultaneously cured, and a method for forming a pin holding portion on the lead frame. 2. A table 1 on which a lead frame 2 is placed.
And a dispenser for applying a resin material above the table, at least one of the table 1 and the dispenser is provided so as to be horizontally movable, and the resin material curing means 9 is provided.
In a device for forming a pin holding portion on a lead frame, the dispenser is filled with an ultraviolet curable resin material 4 having elasticity and non-conductivity, low impurities and small thermal expansion, and the dispenser A needle portion 8 capable of accurately discharging the resin material 4 per unit time is provided at the lower end of the, and an ultraviolet irradiation light 9 as a resin material curing means
An apparatus for forming a pin holding portion on a lead frame, characterized by being integrally provided with the needle portion 8 downward.