JPH0620004B2 - Electronic component carrier - Google Patents
Electronic component carrierInfo
- Publication number
- JPH0620004B2 JPH0620004B2 JP62103576A JP10357687A JPH0620004B2 JP H0620004 B2 JPH0620004 B2 JP H0620004B2 JP 62103576 A JP62103576 A JP 62103576A JP 10357687 A JP10357687 A JP 10357687A JP H0620004 B2 JPH0620004 B2 JP H0620004B2
- Authority
- JP
- Japan
- Prior art keywords
- forming
- electronic component
- lead wire
- belt
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品をリードフォーミングし、連続的に
搬送する装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for lead forming and continuously conveying electronic components.
従来の技術 従来において、電子部品をリードフォーミングし連続的
に搬送する方法としては、第３図に示すようにリードフ
ォーミング前の電子部品４ｃがリード線搬送ベルト３に
より、フォーミング金型５のフォーミング位置まで搬送
される際に、フォーミング後の電子部品４ａ，４ｂを押
し出す方法か、あるいは電子部品４ａ，４ｂにノズル１
１よりエアーを吹き付けることより取り出す方法をとっ
ていた。2. Description of the Related Art Conventionally, as a method of lead-forming and continuously carrying an electronic component, as shown in FIG. 3, an electronic component 4c before lead forming is formed by a lead wire carrying belt 3 at a forming position of a forming die 5. When the electronic components 4a and 4b after forming are pushed out, the nozzle 1
The method of taking out by blowing air from No. 1 was adopted.
発明が解決しようとする問題点 これらの方法によると、リードフォーミングした際に金
型側面に付着するリード線表面の半田メッキにより、電
子部品を搬送する抵抗が増大し、電子部品搬送が不安定
になるとともに、フォーミング時リード線のからみを生
じ、確実な搬送取り出しが困難であった。またエアー吹
き付けによる取り出し方法においては、上記問題点とと
もに電子部品が飛散する欠点があった。Problems to be Solved by the Invention According to these methods, the solder plating on the surface of the lead wire that adheres to the side surface of the mold during lead forming increases the resistance for carrying electronic components, and makes the electronic component transportation unstable. In addition, the lead wire was entangled during forming, and it was difficult to reliably carry out and take out the lead wire. Further, in the taking-out method by blowing air, there is a drawback that electronic parts are scattered along with the above-mentioned problems.
本発明は、上記問題点を解消し電子部品をフォーミング
後安定して連続的に搬送できるようにすること目的とす
る。SUMMARY OF THE INVENTION It is an object of the present invention to eliminate the above-mentioned problems and enable electronic parts to be stably and continuously conveyed after forming.
問題点を解決するための手段 この目的を達成するために、本発明は、従来のリード線
搬送用ベルトに電子部品ボディ搬送用としてベルトを追
加し、さらにリードフォーミング後毎回金型側面に接触
したプレートを前後にスライドさせ、リード線による付
着異物を除去するとともに、電子部品のリード線を確実
に押し出す機構を備えたものである。Means for Solving the Problems In order to achieve this object, according to the present invention, a belt is added to a conventional lead wire carrying belt for carrying an electronic component body, and after the lead forming, the belt is brought into contact with the side surface of the mold every time. The plate is slid back and forth to remove foreign matter adhering to the lead wire and to reliably push out the lead wire of the electronic component.
作用 この機構により、リードフォーミングした際に金型側面
に異物が付着しても、プレートにより除去されるととも
に、フォーミング後のリード線がプレートにより押出さ
れるため、電子部品の搬送を円滑に行うことができる。Function With this mechanism, even if foreign matter adheres to the side surface of the mold during lead forming, it is removed by the plate and the lead wire after forming is pushed out by the plate, so that electronic components can be transported smoothly. You can
実施例 以下本発明の一実施例を第１図，第２図により説明す
る。リード線搬送ベルト３及び電子部品ボディ搬送ベル
ト６によりユニット内を搬送される電子部品４は、フォ
ームング位置にて上下運動するリード線カッター１，リ
ードフォーミングピン２，フォーミング金型５にてリー
ドフォーミングされ、フォーミング位置から搬送される
際同期してレバー１０ａ及びワイヤー９に連結されたプ
レート７が電子部品４の搬送方向に作動し、付着異物
（半田カス）除去並びにリード線押し出しを行なう。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. The electronic component 4 conveyed in the unit by the lead wire conveying belt 3 and the electronic component body conveying belt 6 is lead forming by a lead wire cutter 1, a lead forming pin 2, and a forming die 5 which move up and down at a forming position. The plate 7 connected to the lever 10a and the wire 9 operates in the carrying direction of the electronic component 4 in synchronism with the carrying from the forming position to remove foreign matter (solder residue) and push out the lead wire.
動作完了後、圧縮ばね８によりプレート７は元の位置に
復帰する。After the operation is completed, the compression spring 8 returns the plate 7 to the original position.
発明の効果 以上のように本発明によれば、次のような効果が得られ
る。EFFECTS OF THE INVENTION As described above, according to the present invention, the following effects can be obtained.
フォーミング後、電子部品を整列させて搬送でき、
さらに次セクションにおける計数作業などにおいても有
益である。After forming, electronic parts can be aligned and transported,
It is also useful for counting work in the next section.
フォーミング金型側面に付着する異物（半田カス）
を除去できるため、ユニット内から金型を取りはずす頻
度が半減し、さらに製品寸法精度の向上も図れる。Foreign matter (solder residue) attached to the side of the forming die
Since the mold can be removed, the frequency of removing the mold from the unit is halved, and the product dimensional accuracy can be improved.
フォーミング金型からの搬送取り出しが確実に行な
えるため、リードフォーミング時に発生するリード線の
からみが解消できる。Since the transfer from the forming die can be reliably performed, the entanglement of the lead wire that occurs during lead forming can be eliminated.
第１図は本発明の一実施例による搬送装置を示す斜視
図、第２図はその要部の概略図、第３図は従来例を示す
斜視図である。 ３……リード線搬送ベルト、４……電子部品、５……フ
ォーミング金型、６……電子部品ボディ搬送ベルト、７
……プレート。FIG. 1 is a perspective view showing a carrying device according to an embodiment of the present invention, FIG. 2 is a schematic view of the main part thereof, and FIG. 3 is a perspective view showing a conventional example. 3 ... Lead wire conveyor belt, 4 ... Electronic component, 5 ... Forming die, 6 ... Electronic component body conveyor belt, 7
……plate.
Claims (1)
分を搬送するベルトを有し、フォーミング後ベルトと同
期して、フォーミングされた電子部品のリード線を押し
出すとともに、フォーミング金型に付着する異物を除去
する機構を備えたことを特徴とする電子部品の搬送装
置。1. A belt for carrying a body part as a belt for carrying electronic parts, which pushes out a lead wire of a formed electronic part in synchronism with a belt after forming and adheres to a forming die. An apparatus for transporting electronic components, which is provided with a mechanism for removing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62103576A JPH0620004B2 (en) | 1987-04-27 | 1987-04-27 | Electronic component carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62103576A JPH0620004B2 (en) | 1987-04-27 | 1987-04-27 | Electronic component carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63269503A JPS63269503A (en) | 1988-11-07 |
| JPH0620004B2 true JPH0620004B2 (en) | 1994-03-16 |
Family
ID=14357613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62103576A Expired - Fee Related JPH0620004B2 (en) | 1987-04-27 | 1987-04-27 | Electronic component carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0620004B2 (en) |
-
1987
- 1987-04-27 JP JP62103576A patent/JPH0620004B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63269503A (en) | 1988-11-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |