JPH06207261A - Method and device for soldering in inert gaseous atmosphere - Google Patents
Method and device for soldering in inert gaseous atmosphereInfo
- Publication number
- JPH06207261A JPH06207261A JP210493A JP210493A JPH06207261A JP H06207261 A JPH06207261 A JP H06207261A JP 210493 A JP210493 A JP 210493A JP 210493 A JP210493 A JP 210493A JP H06207261 A JPH06207261 A JP H06207261A
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- inert gas
- soldering
- atmosphere
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 60
- 239000011261 inert gas Substances 0.000 claims abstract description 59
- 239000001301 oxygen Substances 0.000 claims abstract description 25
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 description 10
- 230000004907 flux Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 239000003463 adsorbent Substances 0.000 description 5
- 238000010405 reoxidation reaction Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910017784 Sb In Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、不活性ガス雰囲気中で
噴流溶融半田にて半田付けする方法及び装置に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for soldering with jet melt solder in an inert gas atmosphere.
【０００２】[0002]
【従来の技術】従来、被半田付け物特にプリント配線基
板の配線の半田付けに当たっては、噴流半田付装置が用
いられている。その際、Ｓｎ，Ｐｂ，Ｂｉ，Ｉｎ，Ｓｂ
等の低融点金属及びこれらの合金を溶解した溶融半田を
半田付ける際に酸化を防ぐため、不活性ガス雰囲気とし
て半田付けを行っていた。2. Description of the Related Art Conventionally, a jet soldering apparatus has been used for soldering an object to be soldered, especially wiring of a printed wiring board. At that time, Sn, Pb, Bi, In, Sb
In order to prevent oxidation when soldering a molten solder in which a low melting point metal such as the above and alloys thereof are melted, soldering is performed in an inert gas atmosphere.
【０００３】この種の半田付装置として、特開昭６２−
１０１１３７２号公報に示すような装置があり、図３
に、その従来の低酸素雰囲気の半田付装置を示す。図３
において、１３はトンネル構造の容器である半田付け装
置本体であり、この装置本体１３の内部に、図示しない
液体圧シリンダにより上下方向に開閉操作される４枚の
ゲート２４，２５，２６，２７により前室１８、半田付
け室１９および後室２０を区画形成する。さらに、装置
本体１０の外部および内部の各室にプリント配線基板等
の被半田付け物を搬送するためのコンベア５，取込みコ
ンベア２１，半田付けコンベア２２，取出しコンベア２
３，コンベア５を設ける。この各コンベアにより被半田
付け物を順次搬送するが、その際、各ゲート２４，２
５，２６，２７は被半田付け物の通過時にのみ開くよう
にする。また、コンベア５の下部にスプレ−式フラック
ス塗布装置１５を設け、このフラックス塗布装置１５の
ノズルから発泡するフラックスを被半田付け物に塗布
し、また半田付け室１９の内部の半田付けコンベア２２
の下部にプリヒータ１４と、半田槽１とを設け、プリヒ
ータ１４により被半田付け物を予熱し、半田槽１のノズ
ルから噴流する溶融半田を被半田付け物に付けるように
する。As a soldering device of this type, Japanese Patent Laid-Open No. 62-
There is a device as shown in Japanese Patent No. 1011372, and FIG.
The conventional low oxygen atmosphere soldering apparatus is shown in FIG. Figure 3
In the figure, 13 is a soldering device body which is a container of a tunnel structure, and inside the device body 13 are four gates 24, 25, 26, 27 which are opened and closed by a liquid pressure cylinder (not shown) in the vertical direction. The front chamber 18, the soldering chamber 19 and the rear chamber 20 are defined. Further, a conveyor 5 for carrying the objects to be soldered such as a printed wiring board to each room outside and inside the apparatus body 10, a take-in conveyor 21, a soldering conveyor 22, and a take-out conveyor 2
3, the conveyor 5 is provided. The objects to be soldered are sequentially conveyed by the respective conveyors, and at that time, the respective gates 24, 2 are
5, 26, 27 should be opened only when the object to be soldered passes. Further, a spray-type flux applying device 15 is provided below the conveyor 5, a flux foaming from a nozzle of the flux applying device 15 is applied to an object to be soldered, and a soldering conveyor 22 inside the soldering chamber 19 is provided.
A preheater 14 and a solder bath 1 are provided in the lower part of the preheater 14 to preheat the object to be soldered by the preheater 14 so that the molten solder jetted from the nozzle of the solder bath 1 is attached to the object to be soldered.
【０００４】次に、トンネル構造の装置本体１３の前室
１８および後室２０にガス出口２８，２９を設け、この
ガス出口２８，２９を酸素吸着剤装置３０に連通する。
この酸素吸着剤装置３０の内部には酸素吸着剤が充填さ
れている。さらにこの酸素吸着剤装置３０をフィルタ３
１を介してポンプ３２の吸込口に連通する。フィルタ３
１とポンプ３２との間の管路にはバルブ３３を介して不
活性ガス供給源７が接続されている。Next, gas outlets 28, 29 are provided in the front chamber 18 and the rear chamber 20 of the device body 13 having a tunnel structure, and the gas outlets 28, 29 are connected to the oxygen adsorbent device 30.
The oxygen adsorbent device 30 is filled with an oxygen adsorbent. Further, the oxygen adsorbent device 30 is installed in the filter 3
1 through the suction port of the pump 32. Filter 3
An inert gas supply source 7 is connected to a pipeline between the pump 1 and the pump 32 via a valve 33.
【０００５】ポンプ３２の吐出口は、循環ガスを所定温
度まで加熱する温調装置３４を経て、半田槽１の下部お
よび上部に対して設けた温風ガス入口３５，３６に連通
するとともに、循環ガスを所定温度まで冷却する空調装
置３７を経て、後室２０に対して設けた冷風ガス入口３
８に連通する。このようにして、半田付け槽１に対して
不活性ガスを供給し循環する流体回路を形成する。不活
性ガスとしては、窒素、二酸化炭素、アルゴン、ヘリウ
ム等が適し、さらには化学合成された不活性ガスでもよ
い。以上のように従来の不活性ガス雰囲気半田付装置
は、装置の出入口にシーリング構造を備え予熱加熱部及
び半田槽全体に不活性ガスを供給して半田付けに係わる
雰囲気全部を低酸素濃度に保つようにしたものであっ
た。The discharge port of the pump 32 communicates with warm air gas inlets 35 and 36 provided in the lower and upper parts of the solder bath 1 through a temperature controller 34 for heating the circulating gas to a predetermined temperature, and circulates the hot air gas. A cold air gas inlet 3 provided for the rear chamber 20 via an air conditioner 37 for cooling the gas to a predetermined temperature.
Connect to 8. In this way, a fluid circuit for supplying and circulating the inert gas to the soldering tank 1 is formed. Nitrogen, carbon dioxide, argon, helium and the like are suitable as the inert gas, and further, chemically synthesized inert gas may be used. As described above, the conventional inert gas atmosphere soldering apparatus has a sealing structure at the entrance and exit of the apparatus and supplies an inert gas to the preheating heating section and the entire solder bath to keep the atmosphere related to soldering at a low oxygen concentration. It was like that.
【０００６】さらにこの種の装置としては実開昭５７−
９０１０号に開示されているものがあり、この半田槽装
置は装置本体内にヒータにより溶解した半田を入れ、か
つ本体にカバーを設け、カバーに形成した開口部に半田
噴流部を形成し、半田面とカバー間に不活性ガスを充満
させる不活性ガス充満機構を設け、充満された不活性ガ
スが半田噴流部とカバーの開口間の隙間を通して流出す
る不活性ガス流出口を形成してなものである。この装置
は要するに半田槽内の溶融半田及び幅の狭い噴流面の半
田を不活性ガス雰囲気で覆うものであり、不活性ガス雰
囲気確保の一例で、半田槽を密閉しその内部に不活性ガ
スを供給している。Further, as an apparatus of this kind, the actual exploitation method is 57-
No. 9010 discloses a solder bath device in which solder melted by a heater is put in the main body of the apparatus, a cover is provided on the main body, and a solder jet portion is formed in an opening formed in the cover. An inert gas filling mechanism that fills an inert gas between the surface and the cover is provided, and an inert gas outlet through which the filled inert gas flows out through the gap between the solder jet part and the opening of the cover is formed. Is. In short, this device covers the molten solder in the solder bath and the solder on the narrow jet surface with an inert gas atmosphere.As an example of securing an inert gas atmosphere, the solder bath is hermetically sealed with an inert gas inside. We are supplying.
【０００７】以上述べた従来技術の解決し得ない問題点
を示すと以下の通りである。 (1)不活性ガス雰囲気を確保するためのシーリング機構
が必要となり、従来装置への半田付け技術の適用が困難
である。 (2)フラックスを使用する半田付けにおいては、そのフ
ラックス固形分により予備加熱時の半田付部の再酸化は
低減できるにもかかわらず、予備加熱を含む装置全体に
不活性ガスを供給するため、その消費量が多く、ランニ
ングコストが高くなる。 (3)不活性ガス雰囲気を確保する範囲が半田槽内部の溶
融半田及び幅の狭い噴流面の溶融半田であり、プリント
配線基板の半田付部の仕上げに用いられる幅の広い噴流
面では、充分な不活性ガス雰囲気が得られないという問
題点があった。そのため、ブリッジ／ツララ等の原因と
なるプリント配線基板引上げ時のピールバック部再酸化
防止は、大気中半田付け同様、多量のフラックス塗布に
頼らざる得なかった。The problems that cannot be solved by the conventional techniques described above are as follows. (1) A sealing mechanism for securing an inert gas atmosphere is required, and it is difficult to apply the soldering technology to conventional devices. (2) In soldering using flux, since the solidification of the flux can reduce reoxidation of the soldered portion during preheating, an inert gas is supplied to the entire device including preheating, The consumption amount is large and the running cost is high. (3) The range that secures the inert gas atmosphere is the molten solder inside the solder bath and the molten solder on the narrow jet surface, and the wide jet surface used for finishing the soldered part of the printed wiring board is sufficient. There is a problem in that an inert gas atmosphere is not obtained. Therefore, in order to prevent re-oxidation of the peel-back portion when pulling up the printed wiring board, which causes bridges, flicker, etc., it is necessary to apply a large amount of flux as in the soldering in the air.
【０００８】[0008]
【発明が解決しようとする課題】本発明は 従来装置への適用が可能 不活性ガスの消費量減少 半田消費量の低減 を可能とする不活性ガス雰囲気半田付け方法及び装置を
提供することを目的とする。DISCLOSURE OF THE INVENTION The present invention is applicable to a conventional apparatus. It is an object of the present invention to provide an inert gas atmosphere soldering method and apparatus capable of reducing the consumption of inert gas and the consumption of solder. And
【０００９】[0009]
【課題を解決するための手段】この発明の第１は、被半
田付け物を噴流溶融半田にて半田付けする方法におい
て、被半田付け物を溶融半田より引上げ時に被半田付け
物下部の最小範囲内へ不活性ガスを吹き込み、不活性ガ
ス吹込み部の雰囲気を酸素濃度１０００ｐｐｍ以下の低
酸素雰囲気とすることを特徴とする不活性ガス雰囲気半
田付け方法である。この発明の第２は、被半田付け物を
噴流溶融半田にて半田付けする装置において、溶融半田
の加熱溶解、噴流部を有する半田槽と、半田槽上に被半
田付け物を移送する装置と、不活性ガス供給源と接続さ
れている不活性ガス注入ノズルとからなり、前記被半田
付け物を前記溶融半田より引上げ時に被半田付け物下部
の最小範囲内へ不活性ガスを吹き込むための位置に不活
性ガス注入ノズルを設け、被半田付け物下部の最小範囲
内部の雰囲気を酸素濃度１０００ｐｐｍ以下の低酸素雰
囲気とすることを特徴とする不活性ガス雰囲気半田付け
装置である。そして前記被半田付け物がプリント配線基
板であり、前記被半田付け物下部がピ−ルバック部であ
る上記方法並びに装置である。A first object of the present invention is to provide a method for soldering an object to be soldered with a jet molten solder, and when pulling the object to be soldered from the molten solder, the minimum range of the lower part of the object to be soldered is The inert gas atmosphere soldering method is characterized in that an inert gas is blown into the atmosphere and the atmosphere of the inert gas blown portion is a low oxygen atmosphere having an oxygen concentration of 1000 ppm or less. A second aspect of the present invention is, in a device for soldering an object to be soldered with a jet molten solder, a device for transferring the object to be soldered onto the solder bath, which has a solder bath having a jet portion and heating and melting of the molten solder. A position for blowing an inert gas into the minimum range of the lower part of the object to be soldered when the object to be soldered is pulled up from the molten solder, comprising an inert gas injection nozzle connected to an inert gas supply source. An inert gas atmosphere soldering apparatus, characterized in that an inert gas injection nozzle is provided in the above, and the atmosphere inside the minimum range under the object to be soldered is a low oxygen atmosphere with an oxygen concentration of 1000 ppm or less. Further, the above-mentioned method and apparatus, wherein the object to be soldered is a printed wiring board, and the lower part of the object to be soldered is a peel back portion.
【００１０】[0010]
【作用】本発明においては、半田付装置の溶融半田から
被半田付け物溶融半田より引上げ時に被半田付け物下部
の最小範囲内部例えばプリント配線基板が離れる部分で
あるピールバック部へ不活性ガスを吹付け、その部分の
雰囲気を１０００ｐｐｍ以下の低酸素濃度としたので、
被半田付け物（プリント配線基板）が半田付装置の２次
噴流口の溶融半田から引上られる時に生ずるブリッジ／
ツララの生成が防止され、良質な半田付けが可能となっ
た。In the present invention, when the molten solder of the soldering apparatus is pulled up from the molten solder to be soldered by the molten solder, the inert gas is supplied to the peelback portion which is the minimum range inside the soldered solder lower part, for example, the portion where the printed wiring board is separated. Spraying, because the atmosphere of that part was a low oxygen concentration of 1000 ppm or less,
A bridge / which is generated when the object to be soldered (printed wiring board) is pulled up from the molten solder at the secondary jet port of the soldering device.
Generation of flicker was prevented, and good quality soldering became possible.
【００１１】[0011]
【実施例】以下に、本発明の実施例を被半田付け物とし
てプリント配線基板にとり、詳細に説明する。図１は本
発明の実施態様例の説明図であり、図２は図１のＡ部の
拡大説明図である。図において、１は半田槽であり、２
は半田付けを目的とした１次噴流口、３は仕上げを目的
とした２次噴流口、４は溶融半田、５はプリント配線基
板を搬送するコンベア、６は不活性ガス注入ノズル、７
は不活性ガス供給源、８はピ−ルバック部（溶融半田４
とプリント配線基板９が離れる部分）、１０は流体加熱
器、１１減圧弁である。Embodiments of the present invention will be described in detail below with reference to a printed wiring board as an object to be soldered. FIG. 1 is an explanatory view of an embodiment of the present invention, and FIG. 2 is an enlarged explanatory view of a portion A of FIG. In the figure, 1 is a solder bath, and 2
Is a primary jet port for soldering, 3 is a secondary jet port for finishing, 4 is molten solder, 5 is a conveyer for carrying a printed wiring board, 6 is an inert gas injection nozzle, 7
Is an inert gas supply source, 8 is a peel back portion (molten solder 4
And a portion where the printed wiring board 9 separates) 10 is a fluid heater and 11 a pressure reducing valve.
【００１２】半田槽１内に設けられている１次噴流口２
は細径で溶融半田４が表面張力が大きいので圧力をか
け、２次噴流口３では溶融半田４をゆっくりと出さない
と他とつながるので比較的に大きい径から構成されてい
る。不活性ガス注入ノズル６は、図２に示す如く、コン
ベア５上を移動するプリント配線基板９が２次噴流口３
の溶融半田４から引上られる時のピールバック部８へ窒
素ガス等の不活性ガスを吹付けるよう設置されており、
不活性ガス供給源７より減圧弁１１、流体加熱器１０を
介して配管にて連結されている。A primary jet port 2 provided in the solder bath 1
Since the molten solder 4 has a small diameter and the surface tension of the molten solder 4 is large, a pressure is applied to the molten solder 4 and the molten solder 4 is connected to the other unless the molten solder 4 is slowly ejected from the secondary jet port 3. As shown in FIG. 2, in the inert gas injection nozzle 6, the printed wiring board 9 moving on the conveyor 5 has the secondary jet port 3
It is installed so as to spray an inert gas such as nitrogen gas to the peel back part 8 when the molten solder 4 is pulled up,
The inert gas supply source 7 is connected by a pipe via a pressure reducing valve 11 and a fluid heater 10.
【００１３】本発明は、以上のように構成され、不活性
ガスを不活性ガス注入ノズル６からピールバック部８へ
不活性ガスを吹付けることにより、その周辺の最小範囲
の雰囲気の酸素濃度が１０００ｐｐｍ以下となるような
り、カバ−で覆わなくても低酸素雰囲気が得られる。吹
付ける不活性ガスは、流体加熱器１０を通すことで加熱
され、２次噴流口３の溶融半田４の冷却を防止している
が、加熱のための流体加熱器１０の代わりに半田槽１の
熱源を用いてもよい。前述のプリント配線基板９が２次
噴流口３の溶融半田４から引上られる時に生ずるブリッ
ジ／ツララ等の原因となる、プリント基板引上時のピー
ルバック部８の再酸化防止に必要な酸素濃度は１０００
ｐｐｍ以下であり、本発明によると消費する不活性ガス
の量は１２Ｎｍ3 ／ｈ以下で従来の消費量の約１／４と
なることが実験により確かめられている。本実施例では
プリント配線基板の半田付けについて説明したが他の被
半田付け物にも本発明は適用できることは言うまでもな
い。The present invention is configured as described above, and by spraying the inert gas from the inert gas injection nozzle 6 to the peel back section 8, the oxygen concentration of the atmosphere in the minimum range around the inert gas is reduced. It becomes 1000 ppm or less, and a low oxygen atmosphere can be obtained without covering with a cover. The inert gas to be sprayed is heated by passing through the fluid heater 10 to prevent the molten solder 4 in the secondary jet port 3 from being cooled, but instead of the fluid heater 10 for heating, the solder bath 1 is used. Other heat sources may be used. Oxygen concentration necessary for preventing reoxidation of the peelback portion 8 when the printed circuit board is pulled up, which causes a bridge / crawler or the like that occurs when the printed wiring board 9 is pulled up from the molten solder 4 of the secondary jet port 3. Is 1000
It has been confirmed by experiments that the amount is less than ppm, and the amount of the inert gas consumed according to the present invention is 12 Nm 3 / h or less, which is about 1/4 of the conventional consumption amount. In this embodiment, the soldering of the printed wiring board has been described, but it goes without saying that the present invention can be applied to other objects to be soldered.
【００１４】[0014]
【発明の効果】この発明の不活性雰囲気半田付方法及び
装置によれば、従来の被半田付け物（プリント配線基
板）の噴流半田付け装置への簡単な取り付けにより、低
消費量の不活性ガスで不活性ガス雰囲気半田付が適用可
能となる。特に１０００ｐｐｍ以下の低酸素濃度雰囲気
では、ブリッジ／ツララ等の原因となる、プリント基板
引上げ時のピールバック部の再酸化が防止できるため、
フラックス塗布量を半田付け部の酸化物除去及び予備加
熱時の再酸化防止に必要な最低限度に抑えられ、低残渣
化によりプリント配線基板の無洗浄化が可能となる。According to the inert atmosphere soldering method and apparatus of the present invention, a low consumption inert gas can be obtained by simply attaching a conventional soldering object (printed wiring board) to the jet soldering apparatus. Therefore, soldering in an inert gas atmosphere can be applied. In particular, in a low oxygen concentration atmosphere of 1000 ppm or less, reoxidation of the peelback portion at the time of pulling up the printed circuit board, which causes bridge / crawler, etc.
The amount of flux applied can be kept to the minimum necessary to remove oxides from the soldered part and prevent reoxidation during preheating, and the residue can be reduced to eliminate the need for cleaning the printed wiring board.
【図１】本発明の実施態様例を示す説明図である。FIG. 1 is an explanatory diagram showing an example of an embodiment of the present invention.
【図２】図１のＡ部のピ−ルバック部の拡大説明図であ
る。FIG. 2 is an enlarged explanatory view of a peel back portion of section A in FIG.
【図３】従来の低酸素雰囲気の半田付装置の説明図であ
る。FIG. 3 is an explanatory diagram of a conventional soldering device in a low oxygen atmosphere.
１ 半田槽 ２ １次噴流口 ３ ２次噴流口 ４ 溶融半田 ５ コンベア ６ 不活性ガス注入ノズル ７ 不活性ガス供給源 ８ ピ−ルバック部 ９ プリント配線基板 10 流体加熱器 11 減圧弁 18 前室 19 半田付け室 20 後室 21 取込みコンベア 22 半田付けコンベア 23 取出しコンベア 24，25，26，27 ゲ−ト 28，29 ガス出口 30 酸素吸着剤装置 31 フイルタ 32 ポンプ 33 バルブ 34 温調装置 35，36 温風ガス入口 37 空調装置 38 冷風ガス入口 1 Solder Tank 2 Primary Jet Port 3 Secondary Jet Port 4 Molten Solder 5 Conveyor 6 Inert Gas Injection Nozzle 7 Inert Gas Supply Source 8 Peel Back Section 9 Printed Wiring Board 10 Fluid Heater 11 Pressure Reduction Valve 18 Front Chamber 19 Soldering room 20 Rear room 21 Intake conveyor 22 Soldering conveyor 23 Outgoing conveyor 24, 25, 26, 27 Gate 28, 29 Gas outlet 30 Oxygen adsorbent device 31 Filter 32 Pump 33 Valve 34 Temperature controller 35, 36 Temperature Wind gas inlet 37 Air conditioner 38 Cold air gas inlet
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/34 Ｍ 7128−4Ｅ (72)発明者 中村 公彦 東京都港区虎ノ門１丁目７番12号 沖電気 工業株式会社内 (72)発明者 金澤 秀 東京都港区虎ノ門１丁目７番12号 沖電気 工業株式会社内 (72)発明者 安岡 敏一 東京都港区虎ノ門１丁目７番12号 沖電気 工業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number in the agency FI technical display location H05K 3/34 M 7128-4E (72) Inventor Kimihiko Nakamura 1-7-12 Toranomon, Minato-ku, Tokyo No. Oki Electric Industry Co., Ltd. (72) Inventor Hide Kanazawa 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd. (72) Inventor Toshikazu Yasuoka 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.
Claims (4)
けする方法において、 前記被半田付け物を前記溶融半
田より引上げ時に被半田付け物下部の最小範囲内へ不活
性ガスを吹き込み、該不活性ガス吹込み部の雰囲気を酸
素濃度１０００ｐｐｍ以下の低酸素雰囲気とすることを
特徴とする不活性ガス雰囲気半田付け方法。1. A method of soldering an object to be soldered with a jet melted solder, wherein an inert gas is blown into a minimum range of a lower part of the object to be soldered when the object to be soldered is pulled up from the molten solder, An inert gas atmosphere soldering method, characterized in that an atmosphere of an inert gas blowing portion is a low oxygen atmosphere having an oxygen concentration of 1000 ppm or less.
あり、前記被半田付け物下部がピ−ルバック部であるこ
とを特徴とする請求項１記載の不活性ガス雰囲気半田付
け方法。2. The soldering method according to claim 1, wherein the object to be soldered is a printed wiring board, and the lower part of the object to be soldered is a peel back portion.
けする装置において、 前記溶融半田の加熱溶解、噴流
部を有する半田槽と、該半田槽上に被半田付け物を移送
する装置と、不活性ガス供給源と接続されている不活性
ガス注入ノズルとからなり、前記被半田付け物を溶融半
田より引上げ時に被半田付け物下部の最小範囲内へ不活
性ガスを吹き込むための位置に前記不活性ガス注入ノズ
ルを設け、該被半田付け物下部の最小範囲内部の雰囲気
を酸素濃度１０００ｐｐｍ以下の低酸素雰囲気とするこ
とを特徴とする不活性ガス雰囲気半田付け装置。3. A device for soldering an object to be soldered with jet molten solder, comprising: a solder bath having a jetting portion for heating and melting the molten solder; and a device for transferring the soldered object onto the solder bath. , An inert gas injection nozzle connected to an inert gas supply source, at a position for blowing the inert gas into the minimum range under the soldered object when pulling the soldered object from the molten solder. An inert gas atmosphere soldering device, characterized in that the inert gas injection nozzle is provided, and the atmosphere inside the minimum range under the object to be soldered is a low oxygen atmosphere having an oxygen concentration of 1000 ppm or less.
あり、前記被半田付け物下部がピ−ルバック部であるこ
とを特徴とする請求項３記載の不活性ガス雰囲気半田付
け装置。4. The inert gas atmosphere soldering device according to claim 3, wherein the object to be soldered is a printed wiring board, and the lower part of the object to be soldered is a peel back portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP210493A JPH06207261A (en) | 1993-01-08 | 1993-01-08 | Method and device for soldering in inert gaseous atmosphere |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP210493A JPH06207261A (en) | 1993-01-08 | 1993-01-08 | Method and device for soldering in inert gaseous atmosphere |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06207261A true JPH06207261A (en) | 1994-07-26 |
Family
ID=11520043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP210493A Pending JPH06207261A (en) | 1993-01-08 | 1993-01-08 | Method and device for soldering in inert gaseous atmosphere |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06207261A (en) |
-
1993
- 1993-01-08 JP JP210493A patent/JPH06207261A/en active Pending
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