JPH06224339A - Solder dipping device - Google Patents

Abstract

(57) [Summary] [Purpose] To efficiently dip a large number of electronic components. [Structure] A chuck mechanism for collectively gripping a large number of electronic components (1) derived by arranging a plurality of leads (3) in the width direction (w) from a component body (2) having a substantially flat rectangular shape ( 11), the plurality of leads (3) hanging from the component body (2) with the chuck mechanism (11) gripping the component body (2) are immersed in the solder in the solder bath. In a solder dipping device for dipping, a chuck mechanism (11) is attached to two chuck arms (12) arranged in parallel at a predetermined interval and rotatable about an axis, and the tip ends of the chuck arms (12). A holding plate (13) of a predetermined length is provided, and by this holding plate (13), a large number of electronic components (1) are closely aligned along the thickness direction (d) of each component body (2). Hold it in the open position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder dipping device, and more particularly to a solder dipping device used in the manufacture of electronic parts and for solder-plating a plurality of leads derived from a resin-molded component body by dipping. .

[0002]

2. Description of the Related Art An electronic component (1) such as a semiconductor device has, for example, a structure including a plurality of leads (3) led out in the same direction from a resin-molded component body (2) as shown in FIG. There is one. The component body (2) has a substantially flat rectangular parallelepiped shape, and a plurality of leads (3) are arranged at a predetermined pitch along the longitudinal direction of the rectangular cross section as the width direction (w). This type of electronic component (1) is generally subjected to solder plating for these leads (3) in order to obtain good solderability when soldering at the time of mounting on a printed circuit board. In the figure, (4) is a mounting hole for mounting a printed circuit board, which is formed in a part of the component body (2) in the thickness direction (d) orthogonal to the width direction (w).

In this solder plating process, it is usual to carry out a dipping process collectively while holding a large number of electronic components (1). Therefore, the following chuck mechanism is used.

As shown in FIG. 6, a conventional chuck mechanism (5) includes two chuck arms (6) which are arranged in parallel at predetermined intervals and which are rotatable about an axis, and the chuck arms (6).
A holding plate (7) of a predetermined length attached to the tip of the, and a state in which a large number of electronic components (1) are closely aligned along the width direction (w) of each component body (2). Hold with.

A large number of electronic parts (1) transferred from the previous process by a transfer rail (not shown) have their respective component bodies (2) closely contacted on the transfer rail along the width direction (w). Positioning is stopped in a state of juxtaposition, and in this state, it is supplied to the solder dip bath by the chuck mechanism (5) described above. That is, when gripping a large number of electronic components (1) on the transport rail, the chuck arm (6) of the chuck mechanism (5)
Place the holding plate (7) in the open state (broken line in the figure) near the component body (2) on the transport rail, and then rotate the chuck arm (6) to close the holding plate (7). The state is changed to the solid line in the figure, so that the holding plate (7) sandwiches the component body (2) from both sides in the thickness direction (d). After that, by raising the chuck mechanism (5), the electronic component (1) gripped by the holding plate (7) is detached from the transfer rail, transferred to the next solder bath, and in the gripped state, The leads (3) derived from the component body (2) are solder-plated by dipping treatment.

[0006]

By the way, in the chuck mechanism (5) of the conventional solder dipping device, the electronic component (1)
Are gripped in a state of being aligned along the width direction (w) of the component body (2), so the number of pieces that can be sandwiched by the sandwiching plates (7) is small. )
Must be lengthened and the device becomes large.

On the other hand, the leads (3) of the electronic component (1) held by the chuck mechanism (5) are immersed in the solder in the solder bath. Normally, an oxide film is generated on the solder liquid surface, and if such an oxide film is present, the oxide film will adhere to the lead surface when the leads (3) are subjected to dipping processing, and during mounting on a printed circuit board in a later process. However, there is an inconvenience that the solderability deteriorates and the electrical connection becomes defective. Therefore, in the solder bath, each time the lead (3) is dipped,
The surface of the solder liquid is scraped to expose the fresh liquid surface of the solder.

However, as described above, when the number of electronic components (1) that can be gripped by the chuck mechanism (5) is small, the number of times the solder liquid surface is scraped by the scraping plate is large, so that the generated oxide film A large amount, and a large amount of wasted solder.

Further, as shown in FIG. 7, in the electronic component (1) which is solder-plated in the solder bath, the lead (3) hanging from the component body (2) is immersed in the solder (8). At this time, when the component body (2) may be grasped by the chuck mechanism (5) in a state where the component body (2) is tilted in the width direction (w), a plurality of leads () are formed along the width direction (w) of the component body (2). Due to the arrangement of 3), the solder (8) may not adhere well to some of the leads (3).

Therefore, the present invention has been proposed in view of the above problems, and an object thereof is to provide a solder dipping device capable of efficiently and reliably dipping a large number of electronic components.

[0011]

As a technical means for achieving the above-mentioned object, the present invention chucks a large number of electronic parts derived by arranging a plurality of leads along a straight line from one wall surface of a part body. In a solder dipping device in which a lead is hung down and gripped by a mechanism, and the lead is dipped in solder in a solder bath and covered with solder, the chuck mechanism stacks a large number of electronic components in a direction orthogonal to the lead arrangement direction. It is characterized by being closely aligned and gripped.

It is desirable that the chuck mechanism has a holding plate that sandwiches both side walls in the arrangement direction of the leads.

Further, the chuck mechanism has a core rod that is horizontally installed and inserted into a mounting hole formed in a part of the component body, and a component body that is suspended and held by the core rod. It is also possible to have a structure including a sandwiching portion sandwiched in the direction. In that case, it is desirable to have guides for restricting the suspension posture on both sides in the width direction of the component body suspended and held by the core rod.

[0014]

In the present invention, a large number of electronic components derived by arranging a plurality of leads in the width direction from a component body having a substantially flat rectangular parallelepiped shape are closely attached along the thickness direction orthogonal to the width direction of each component body. Since they are gripped in the state of being aligned with each other, the thickness dimension thereof is smaller than the width dimension of the component body, so that the number of electronic components that can be gripped by the chuck mechanism increases.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a solder dipping device according to the present invention will be described with reference to FIGS. In the electronic component (1) shown in FIG. 5, the same parts are designated by the same reference numerals, and duplicate description will be omitted.

The chuck mechanism (11) of the embodiment shown in FIG.
Are two chuck arms (12) which are arranged in parallel at a predetermined interval and which are rotatable about an axis, and the chuck arms (12).
A holding plate (13) of a predetermined length attached to the tip of the holding plate, and the holding plate (13) allows a large number of electronic components (1).
Are gripped in a state of being closely aligned along the thickness direction (d) of each component body (2).

A large number of electronic components (1) transferred from the previous process by a transport rail (not shown) are closely attached to each other along the thickness direction (d) of each component body (2). Positioning is stopped in a state of juxtaposition, and in this state, it is supplied to the solder bath by the chuck mechanism (11) described above. That is, when gripping a large number of electronic components (1) on the transport rail, the chuck arm (12) of the chuck mechanism (11) is placed in the vicinity of the component body (2) on the transport rail, and the holding plate (13) is open. The chuck arm (12) is rotated to move the holding plate (13) to the closed state (solid line in the drawing), so that the holding plate (13) can be used as a component. Insert the body (2) from both sides in the width direction (w). afterwards,
By raising the chuck mechanism (11), the electronic component (1) gripped by the holding plate (13) is detached from the transport rail and transferred to the next solder bath, and the component body is held in the gripped state. The leads (3) derived from (2) are solder plated by dipping.

At this time, the electronic component (1) to be solder-plated in the solder bath has a state in which the leads (3) hanging from the component body (2) are immersed in the solder (8) as shown in FIG. Become. At this time, even if the component body (2) is tilted in the thickness direction (d), compared to the case where the component body (2) is aligned in the width direction (w) as in the conventional case (see FIG. 7). Then, since the arrangement direction of the plurality of leads (3) is the width direction (w) orthogonal to the thickness direction (d) where the component body (2) is aligned, the solder (8) is good on all the leads (3). Adhere to.

The chuck mechanism (11) of the embodiment shown in FIGS. 3 (a) and 3 (b) has a mounting hole (4) formed in a part of the component body (2) of the electronic component (1). Core rod to be inserted (1
4), which has a holding part (15) for sandwiching the component body (2) suspended and held by the core rod (14) from both sides in the thickness direction (d). Specifically, the core rod (14) is
The chuck arm (16) is erected so as to project horizontally, and an L-shaped holding portion (15) is pivotally attached to the tip of the chuck arm (16) in a state of being elastically biased in the closing direction, In the closed state of the holding portion (15), as will be described later, the L-shaped tip of the holding portion (15) holds the component body (2) of the electronic component (1) suspended and held by the core rod (14). Press elastically.

First, as shown in FIG. 3 (a), the holding portion (15) at the tip of the chuck arm (16) is set in an open state against the elastic force, and the tip of the core rod (14) is opened. . In this state, the electronic component (1) is sent to the core rod (14) by an appropriate means such as a pusher (not shown), and the core rod (14) is inserted into the mounting hole (4) of the component body (2). Let it hang and hold. Then, when a predetermined number of electronic components (1) are suspended and held, as shown in FIG.
Is rotated to press the component body (2) in its thickness direction (d) with its tip by elastic force. As a result, a large number of electronic components (1) are suspended and held by the core rod (14), and are pressed by the holding section (15) in close contact with each other along the thickness direction (d) of the component body (2). It is grasped in a posture aligned with. After that, as in the above-mentioned embodiment, the chuck mechanism (11) is moved to the solder bath, and the plurality of leads (3) hanging from the component body (2) are subjected to dipping treatment and solder plating.

In this case, as described above with reference to FIG. 2, the electronic component (1) to be solder-plated in the solder bath presses the component body (2) in the thickness direction (d) with the holding portion (15). Therefore, the component body (2) does not tilt in the thickness direction (d), and all the leads (3) hanging from the component body (2) can be surely immersed in the solder (8). it can.

In the above-mentioned embodiment, the core rod (14) is temporarily arranged because the electronic component (1) is suspended and held on the core rod (14).
Even if the electronic component (1) is swung in the width direction (w) of the component body (2) around the center and is pressed by the holding section (15), as shown in FIG. If the guides (17) that restrict the swinging of the component body (2) in the width direction (w) on both sides of the core rod (14) are attached to (16), the inclination of the electronic component (1) can be reduced. It can be prevented.

[0023]

According to the present invention, since a large number of electronic components are gripped in a state of being closely aligned along the thickness direction of the component body, the thickness dimension is smaller than the width dimension of the component body. Therefore, the number of electronic components that can be gripped by the chuck mechanism is increased, the processing capacity is improved, and the productivity is significantly improved.

Further, since the number of electronic components that can be gripped by the chuck mechanism increases, the number of times of scraping the solder liquid surface by the scraping plate can be reduced, the amount of oxide film produced can be reduced, and the minimum necessary amount can be obtained. The amount of solder is good and the economy is improved.

Further, since the electronic component to be plated with solder in the solder bath presses the component body in the thickness direction by the holding section,
It is possible to prevent the component main body from being inclined in the thickness direction, and it is possible to improve the quality by solder-plating all the leads in good condition.

[Brief description of drawings]

FIG. 1 is a perspective view of a chuck mechanism showing an embodiment of a solder dipping device according to the present invention.

FIG. 2 is a side view showing an electronic component immersed in a solder bath by the device of the present invention.

FIG. 3 is a view for explaining another embodiment of the present invention,
(A) is a side view showing the chuck mechanism with the holding part in an open state, and (b) is a side view showing the chuck mechanism with the holding part in a closed state.

FIG. 4 is a sectional view showing a chuck mechanism in which a guide is attached to the chuck arm of FIG.

FIG. 5 is a perspective view showing a specific example of an electronic component.

FIG. 6 is a perspective view of a chuck mechanism showing a conventional example of a solder dipping device.

FIG. 7 is a side view showing an electronic component immersed in a solder bath by a conventional device.

[Explanation of symbols]

 1 Electronic component 2 Component body 3 Lead 11 Chuck mechanism 13 Holding plate 14 Core rod 15 Holding part 17 Guide

Claims (4)

[Claims] 1. A large number of electronic components derived by arranging a plurality of leads along a straight line from one wall surface of a component body are hung by a chuck mechanism and held, and the leads are dipped in solder in a solder bath. In the solder dipping device for covering with solder, the chuck mechanism is characterized in that a large number of electronic components are superposed and closely aligned and gripped in a direction orthogonal to the arrangement direction of the leads. 2. The solder dipping device according to claim 1, further comprising a sandwiching plate sandwiching both side walls of the lead in the arrangement direction. 3. The chuck mechanism according to claim 1, wherein the chuck body is horizontally installed and is inserted into a mounting hole formed in a part of the component body, and the component body is suspended and held by the core rod. A solder dipping device, comprising: a sandwiching portion that sandwiches the core in the axial direction of the core rod. 4. The solder dipping device according to claim 3, wherein the chuck mechanism has guides on both sides in the width direction of the component body suspended and held by the core rod, the guides regulating the suspending posture.