JPH0623533A - Micro dipping tank equipment - Google Patents

Abstract

PURPOSE:To automate soldering of super-micro electronic parts by mounting rod-shaped electrodes in a dipping tank, and feeding the required amount of solder to the dipping tank whenever the electrodes are electrified and heated. CONSTITUTION:A micro-dipping tank equipment 10 consists of rod-shaped electrodes 11, 12, a solder feeding device l3, a power source 14 or the like. Electrification from the power source 14 allows the contact part of the electrodes 11, 12 to generate heat, and an upper part lid of the electrode 11 to be heated. At the same time, the solder feeding device 13 is activated, and feeds the solder 20 to a dipping tank 18. The fed solder 20 is instantaneously melted. Then, a work such as a coil 5 is carried into the dipping tank 18, and dipped in the molten solder 20'. The molten solder 20' is hot, and the insulation coating on the end of the coil 5 is separated, executing the soldering on the terminal 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microdip tank device.

[0002]

2. Description of the Related Art Conventionally, a small electronic component, for example, a small resin bobbin 1 having a shape as shown in FIG.
Winding and connecting both ends 2a, 2b to the terminals 3, 3'which are integrally fixed to the flange 1a of the bobbin 1 by soldering, respectively, especially the leg portion 1 of the flange 1a.
b, 1b is longer than the terminals 3, 3 ', or the coil 5 is wound around a microminiature resin bobbin 4 having a shape as shown in FIG. 2, and the terminals 6, provided on the flanges 4a, 4b,
7, 7'and other terminals 8, 9 and 9'are provided at a slight distance from these terminals, and both ends 5a and 5b of the coil 5 and the intermediate tap 5c are provided at the terminals 6, 7 and 7 '. , Etc., by soldering, in order to prevent the terminals 8, 9, 9 ', etc., from being soldered without damaging the resin bobbins 1, 4, etc., a soldering iron must be used. I didn't get it.

[0003]

However, connection with a soldering iron, particularly soldering of the above-mentioned ultra-small parts, is very troublesome, and moreover, as a wire rod, a polyester coated wire (PEW) or an ester imide coated wire ( EI
When a heat resistant wire such as W) is used, it is not easy to peel off these coatings. For this reason it is inevitable really rely on human power, not only it is difficult to reduce the labor-saving, is possible to perform mass production can not be incorporated into an automated line there is a problem that it is difficult.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a micro dip bath device capable of automating the soldering of microelectronic components.

[0005]

In order to achieve the above object, according to the present invention, a solder which is disposed substantially vertically and has a dip tank formed on the upper surface thereof is heated by electric heating and fed to the dip tank. A rod-shaped electrode for melting the metal, a solder feeding means for feeding a necessary amount of solder to the dip tank, and a power source for heating the electrode by energizing it for a short time. The solder is fed to the dip bath each time the electrode is electrically heated, and the dip bath has an inner diameter of 0.6 to 10 mm.

[0006]

A predetermined amount of solder is supplied to the dip bath on the upper surface of the electrode, and the electrode is heated by electric heating to melt the solder. In the dip tank where this solder melts, for example,
Insert the coiled end of the coil and immerse it. The coil end wound around the terminal is soldered to the terminal while the coating is peeled off by solder that melts. The dip tank has an appropriate size of 0.6 to 10 mm according to the work, is very small, and only the terminals to be connected can be immersed.
It is possible to prevent attachment of solder to other places or damage to parts due to heat.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. In FIG. 3, the micro dip tank device 10
Is an electrode 11, 12, a solder supply device 13 and a power supply 14.
The electrode 11 has a cylindrical rod shape, and a hole 11a is concentrically formed from the lower end in the center.
Then, a small-diameter pipe 15 is loosely inserted into the hole 11a,
The upper end thereof is separated from the end surface of the hole 11a, and an annular space 11b is formed between the pipe 15 and the hole 11a. The lower end of the hole 11a is liquid-tightly closed, and a hole 16c communicating with the annular space 11b is formed in the lower part of the side wall, and the base 16 is attached. Pipe 15 and annular space 11b
Is a cooling water passage, and the lower end of the pipe 15 and the base 16
Are each connected to a cooling device (not shown) so that cooling water circulates as indicated by arrows. This electrode 11
Are arranged substantially vertically on a base (not shown). Further, the electrode 12 is formed such that the tip 12a is slanted and has a concave surface corresponding to the outer diameter of the electrode 11, and is pressed and electrically connected to the outer peripheral surface of the upper portion 11d of the electrode 11. Therefore, the contact resistance between the electrodes 11 and 12 is large.

The case 17 has a thick-walled cylindrical shape, and a hole 17a in a substantially lower half thereof can be fitted into the electrode 11, and an inner diameter of the hole 17b in a substantially upper half is slightly smaller than an outer diameter of the electrode 11. Has been done. The lower part of the case 17 is press-fitted onto the upper part 11d of the electrode 11 and is connected to the upper part 11d of the electrode 11 by, for example, a Ni wire. Has been done. The dip tank 18 is selected to have an optimum size according to the work. The size of the dip tank 18 is set by the inner diameter of the hole 17b of the case 17, and is set to, for example, about 0.6 to 10 mm.

The electrode 11 is made of, for example, titanium or zirconium, which has a large specific heat when the work is large and requires heat storage, and is small, for example, tungsten, which has a small specific heat when the work is small and heat storage is not required. It is preferably formed of molybdenum or the like. In addition, case 17
Has a high wettability when pure iron is used and a low wettability when titanium or the like is used. When soldering
Case 17 when using the flux of thread solder
It is preferable that the wettability is high, and if the wettability is high, the meltable solder is unlikely to spill from the dip tank 18. When the flux is applied to the work, the case 17 may have low wettability, and if the wettability is low, the molten solder is likely to spill from the dip tank 18. Therefore, the electrode 11, the case 17, etc. may be made of a suitable material according to the work.

The solder supply device 13 comprises a guide 21 for guiding the thread solder 20 to the dip tank 18, a feeding mechanism 22, a reel (not shown) around which the solder 20 is wound, and the like. Solder 20 as much as necessary
To send. For example, the solder supply device 13 may include the electrode 11
The solder 20 is fed to the dip tank 18 every time the is heated with electricity. In addition, when the coating of the wire is not peeled off, it is preferable to use the flux-cored yarn solder, and when peeling off the coating, it is preferable to use a non-chlorine low residue flux as the flux.

The power source 14 is connected between the lower ends of the electrode 11 and the electrode 12, and heats the upper portion 11d of the electrode 11 by supplying a predetermined current. That is, the contact portion between the outer surface of the upper portion 11d of the electrode 11 and the tip 12a of the electrode 12 has large contact resistance, and heat is generated at the contact portion. This heat heats the upper part 11d of the electrode 11 and the case 17 to melt the solder in the dip tank 18 to 340 ° C to 480 ° C. Thereby, the heat resistant coating such as the polyester coated wire (PEW) and the ester imide coated wire (EIW) can be peeled off. The energization condition at this time is, for example, 1.5.
It is about (V) × 2000 (A) × 1 to 3 (sec). still,
From low temperature solder to high temperature solder can be used by changing the energization conditions.

The operation will be described below. When energized by the power source 14, the contact parts between the electrodes 11 and 12 generate heat and the electrodes 11 and 12 are heated.
11d is heated. At the same time, the solder feeding device 13
Is activated to feed the solder 20 to the dip tank 18 as indicated by the arrow. The solder 20 fed to the dip tank 18
It is instantly melted and the dip tank 18 is filled up. At this time, the temperature of the solder in the dip tank 18 is 340 to 4
It is 80 degrees Celsius. The solder feeding device 13 feeds the solder 20 to the dip tank 18 and then immediately pulls the solder 20 back to the position shown in the figure.

Next, the work is carried into the dip tank 18 as shown by the chain double-dashed line. This work, for example,
The terminal 5b of the coil 5 wound around the bobbin 4 of FIG. 2 is wound around the terminal 7 several times, and is conveyed to a position above the dip tank 18 by an automatic conveying device (not shown), and is predetermined as indicated by an arrow A. It is lowered to the position and immersed in the melting solder 20 ′ in the dip tank 18. This molten solder 2
0'is high temperature as described above, and the terminal 5b of the coil 5 is soldered to the terminal 7 after the insulating coating is peeled off. The power supply 14 stops energizing after the completion of soldering. Then, the bobbin 4 is pulled up from the dip tank 18.

The upper portion 11d of the electrode 11 is cooled by cooling water, and is rapidly cooled after the soldering, that is, after completion of energization. This enhances the cooling effect of the dip tank 18 and prevents the dip tank 18 from being oxidized. Also, damage to the flange 4b of the resin bobbin 4 is prevented. By the way, as described above, when the electrode 11 is fixed, that is, the dip tank 18 side is fixed and the work side is moved up and down for soldering, the solder 20 'that melts when the dip tank 18 is formed of a member having high wettability is used. Even if it rises like a two-dot chain line, it will be difficult to spill, and depending on the workpiece, the flange 4b of the bobbin 4 will be difficult to contact the dip tank 18,
convenient.

Contrary to the above, when the electrode 11 side, that is, the dip tank 18 side is moved up and down while the work side is held at a predetermined position, the molten solder 2 is used.
In order to make it difficult for 0 ′ to spill from the dip tank 18, the dip tank 18 is provided with a member having high wettability as described above.
Is preferably formed. If the work to be soldered is large and the heat storage of the electrode 11 is used, the electrode 1
No cooling of 1 is performed. In this case, it is preferable to use a simple rod-shaped electrode as the electrode 11 in terms of heat capacity. Moreover, since there is no cooling water passage, the structure is simple and the cost of the electrode can be reduced.

FIG. 4 shows another example of the work, the covered wire 2
5, both ends of the core wire 26 are stripped off, a crimp terminal 27 is attached to one end 26a of the core wire 26, and a spare solder is put on the other end 26b. 5 and 6 for such a work.
Dip tank 29 formed by case 28 as shown in FIG.
To use. The case 28 is formed with notches 28b and 28b 'at both ends on the diameter of the upper end surface 28a so that the width becomes narrower from the opening end to the lower part. The notches 28b and 28b' have opening ends. The core wire 26 is sufficiently wider than the outer diameter of the core wire 26, and the lower portion has a width that allows the core wire 26 to be inserted with a slight gap. The case 28 is provided with the notch 28 in the state of being attached to the upper portion 11d of the electrode 11.
The lower ends of b and 28b 'are set to be flush with or slightly above the upper surface 11e of the electrode 11.

The dip bath 29 formed by the case 28 and the upper surface 11e of the electrode 11 is filled with the molten solder 20 'in the same manner as described above, and as shown in FIG.
The terminal 26b of No. 6 is lowered in a state of being substantially horizontal as shown by arrow B, and is pulled horizontally in the direction of arrow C while being sufficiently immersed in the dip tank 29 from the root through the notches 28b and 28b '. As a result, spare solder is put on the end 26b of the core wire 26. In this case, it is preferable that the case 28 is made of a material having high wettability.

Further, for example, as shown in FIG. 7, when the legs of the terminal 30 are long and the terminal 31a of the coil 31 is wound around the root to be soldered, holes are concentrically formed on the upper surface of the electrode 33. 33a and a hole 33b having a larger diameter than the hole 33a
And. The hole 33a has an inner diameter and a depth that allow the terminal 30 to be sufficiently inserted up to the root with a slight gap, and the hole 33b is a dip tank (hereinafter referred to as "dip tank 33b") and is the end 31a of the coil 31. Terminal 30 wound
Has a size that can be inserted with a sufficient margin.

The upper portion 33d and the lower portion 3 of the electrode 33 are
3e are provided with the respective tips 34a and 35a of the electrodes 34 and 35, respectively, similarly to the electrode 12 shown in FIG.
Each lower end of 5 is connected to the power supply 14. Then, the electrodes 34 to
When electricity is applied between 35, these electrodes 34, 35 and electrode 3
3 generates heat at each contact portion, and as a result, the upper portion 33d is well heated even if the electrode 33 is long, and the dip tank 33
The solder fed into b is melted. As a result, the terminal 30 immersed in the dip tank 33b and the terminal 31a of the coil 31 are soldered.

Further, in the above embodiment, the case where one dip tank is provided to solder the work has been described, but the present invention is not limited to this. For example, there are a plurality of soldering points on the work, and each soldering is performed. When the locations are separated, it is possible to solder at once by providing dip tanks corresponding to these locations, respectively, and work efficiency is improved. It can also be applied to a print substrate or the like.

[0021]

As described above, according to the present invention, it becomes possible to easily solder a particularly small-sized electronic component, improve the work efficiency, and to attach it to other parts not soldered. The quality is improved without damage. Further, it can be incorporated into an automatic device, which has excellent effects such as labor saving and improvement of productivity.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts showing an example of a small electronic component that requires soldering.

FIG. 2 is a side view showing another example of a small electronic component that requires soldering.

FIG. 3 is a sectional view of an essential part showing an embodiment of the microdip tank device according to the present invention.

FIG. 4 is a side view showing an example of a covered wire that requires a preliminary solder at the end of the core wire.

5 is a cross-sectional view of a dip tank for performing preliminary soldering of the covered wire of FIG.

6 is an explanatory view of a case where preliminary solder is applied to the end of the covered wire of FIG. 4 by the dip bath of FIG.

FIG. 7 is a cross-sectional view of another embodiment of the electrode and the dip tank of FIG. 3, which is particularly suitable for a case where a soldering terminal is long and soldering is performed near the root.

[Explanation of symbols]

 1, 4 Resin bobbin 2, 5 Coil 7-9, 31 Terminal 10 Micro dip tank device 11, 12, 33-35 Electrode 13 Solder feeder 14 Power supply 17, 28 Case 18, 29, 33b Dip tank 20 Solder 25 Covered wire 26 core wire

Claims (3)

[Claims] 1. A rod-shaped electrode that is disposed substantially vertically and has a dip tank formed on its upper surface, which is heated by electric heating to melt the solder fed to the dip tank, and a necessary amount of solder in the dip tank. A micro dip bath device, comprising: a solder feeding means for feeding and a power source for heating the electrodes by energizing them for a short time. 2. The micro dip bath device according to claim 1, wherein the solder is fed to the dip bath each time the electrode is electrically heated. 3. The dip tank has an inner diameter of 0.6 to 10 mm.
The size of the microdip tank device according to claim 1, wherein