JPH06246743A - Prepreg - Google Patents
PrepregInfo
- Publication number
- JPH06246743A JPH06246743A JP5038621A JP3862193A JPH06246743A JP H06246743 A JPH06246743 A JP H06246743A JP 5038621 A JP5038621 A JP 5038621A JP 3862193 A JP3862193 A JP 3862193A JP H06246743 A JPH06246743 A JP H06246743A
- Authority
- JP
- Japan
- Prior art keywords
- yarn
- prepreg
- woven fabric
- base material
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000002759 woven fabric Substances 0.000 claims abstract description 28
- 238000009941 weaving Methods 0.000 claims abstract description 12
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 3
- 239000000057 synthetic resin Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 abstract description 10
- 239000012784 inorganic fiber Substances 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 239000003365 glass fiber Substances 0.000 description 21
- 239000010410 layer Substances 0.000 description 18
- 239000004744 fabric Substances 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Woven Fabrics (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリプレグに関し、特に
電子、電気分野で使用される多層プリント配線基板用プ
リプレグに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg, and more particularly to a prepreg for a multilayer printed wiring board used in the electronic and electrical fields.
【０００２】[0002]
【従来の技術】従来の多層プリント配線基板は、所要枚
数の内層材の上面および下面に、プリプレグを介して外
層用金属箔を配置した多層体を、金型プレートに挟んで
積層成型しているが、最近の高密度実装の傾向の中、イ
ンナービアホールの増加、内層銅箔の厚みの増加によ
り、ボンディングシート層の樹脂不足による多層基板の
耐熱性の低下が問題となってきている。2. Description of the Related Art In a conventional multilayer printed wiring board, a multilayer body in which a metal foil for an outer layer is arranged on the upper surface and the lower surface of a required number of inner layer materials via prepregs is sandwiched between mold plates and laminated. However, in the recent trend of high-density packaging, the increase in the number of inner via holes and the increase in thickness of the inner layer copper foil has caused a problem that the heat resistance of the multilayer substrate is deteriorated due to a shortage of resin in the bonding sheet layer.
【０００３】ボンディングシートであるプリプレグの高
樹脂含量化の手段として、プリプレグの基材を不織布に
する方法（特開平３−２８５３８９号公報）等が考案さ
れているが、この場合補強効果の低下が問題となる。こ
の場合、薄いガラス繊維織物基材を複数枚使用すること
も考えられるが、コストの上昇を招き、好ましくない。As a means for increasing the resin content of a prepreg which is a bonding sheet, a method of making a prepreg base material a non-woven fabric (Japanese Patent Laid-Open No. 3-285389) and the like have been devised, but in this case, the reinforcing effect is lowered. It becomes a problem. In this case, it is conceivable to use a plurality of thin glass fiber woven fabric substrates, but this is not preferable because it causes an increase in cost.
【０００４】[0004]
【発明が解決しようとする課題】プリプレグ中の樹脂量
を多くすることにより、上記問題は解決されると考えら
れるが、樹脂量を増やすために単に基材となる無機繊維
織物の表面に樹脂を局在させたプリプレグを用いて多層
基板を成型しようとしても、プリプレグ表層の樹脂によ
るスリップが発生し、また積層成型を低圧で行った場
合、成型不良が多数発生する。It is thought that the above problem can be solved by increasing the amount of resin in the prepreg, but in order to increase the amount of resin, the resin is simply added to the surface of the inorganic fiber woven fabric as the base material. Even if an attempt is made to mold a multi-layer substrate using a localized prepreg, slippage occurs due to the resin on the surface layer of the prepreg, and if the lamination molding is performed at low pressure, many molding defects occur.
【０００５】本発明の目的は、上述したようにボンディ
ングシートであるプリプレグ中の補強材の分布を均一に
し、かつプリプレグ中の樹脂量を増加させ、多層成型を
容易にするとともに、多層プリント配線基板の耐熱性の
低下を解決することができるプリプレグを提供すること
にある。As described above, the object of the present invention is to make the distribution of the reinforcing material in the prepreg, which is a bonding sheet, uniform, and to increase the amount of resin in the prepreg, to facilitate multilayer molding, and to make a multilayer printed wiring board. An object of the present invention is to provide a prepreg capable of solving the decrease in heat resistance of the prepreg.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明者らは鋭意研究した結果、プリプレグ中の織
物基材を構成する糸束および樹脂量を所定範囲にするこ
とにより、上記多層基板の問題点が解消することを見出
し、本発明に到達した。すなわち、本発明は、連続無機
長繊維よりなるタテ糸およびヨコ糸を織成して得られた
織物基材に合成樹脂を含浸したプリプレグにおいて、該
プリプレグの織物基材含量が４０重量％以下で、該プリ
プレグを構成する織物基材のタテ糸およびヨコ糸の少な
くとも一方または両方の糸断面形状が下記式（１）を満
たすことを特徴とするプリプレグである。[Means for Solving the Problems] In order to achieve the above object, the inventors of the present invention have conducted extensive studies and as a result, as a result of setting the yarn bundle and the resin amount constituting the woven fabric base material in the prepreg within predetermined ranges, The present invention has been accomplished by finding that the problem of the substrate is solved. That is, the present invention is a prepreg obtained by weaving a warp yarn and a weft yarn made of continuous inorganic long fibers and impregnated with a synthetic resin, wherein the prepreg has a fabric base material content of 40% by weight or less, The prepreg is characterized in that at least one or both of the warp yarn and the weft yarn of the fabric base material constituting the prepreg satisfy the following formula (1).
【０００７】[0007]
【数２】 （（Ｒ１／２）×（Ｒｓ／２）×π）／（ｄ×ｄ×π／４×Ｎ）≧２ （１） Ｒ１：糸断面形状の長軸の長さ Ｒｓ：糸断面形状の短軸の長さ ｄ ：糸を構成する単糸の平均径 Ｎ ：糸を構成する単糸の本数 ここでいう糸断面形状の長軸および短軸とは、該プリプ
レグを常温硬化のエポキシ樹脂等に包埋し、プリプレグ
中の基材織物の断面を切り出し、研磨し、顕微鏡でその
糸断面の長軸と短軸のそれぞれの長さを測定して得られ
るものである。(2) ((R1 / 2) × (Rs / 2) × π) / (d × d × π / 4 × N) ≧ 2 (1) R1: Length of major axis of yarn cross-sectional shape Rs: yarn Length of minor axis of cross-sectional shape d: average diameter of single yarn constituting yarn N: number of single yarns constituting yarn Here, the major axis and the minor axis of the yarn cross-sectional shape mean that the prepreg is cured at room temperature. It is obtained by embedding in epoxy resin or the like, cutting out the cross section of the base fabric in the prepreg, polishing, and measuring the major axis and minor axis of the thread cross section with a microscope.
【０００８】本発明者らの検討結果によれば、０．８mm
厚み内層材において表面銅箔に７０μｍの厚みのものを
使用し、残銅率５０％のモデルパターンを両面ともに作
成し、黒化処理した後、両表層にプリプレグを配して多
層成型した多層基板の耐熱性は表層プリプレグの樹脂含
量に依存し、織物基材含量を４０重量％以下、好ましく
は３５重量％以下にすることにより、耐熱性が大幅に改
良されることがわかった。評価結果を表１に示す。その
際用いたプリプレグは、タテ糸にＥＣＧ７５１／０を使
用し、ヨコ糸はＥＣＧ７５ １／０ ２本を織機上でエ
ア加工し、２本同時に打ち込み、タテ糸４４本／２５m
m、ヨコ糸２０本／２５mmの織り密度でエアージェット
ルームを用いて作成したガラス繊維織物にエポキシ樹脂
を含浸し、乾燥して得たものである。また、その織物基
材含量はエポキシ樹脂の溶剤量を調整することにより変
化させた。According to the result of examination by the present inventors, 0.8 mm
In the inner layer material, a surface copper foil with a thickness of 70 μm was used, a model pattern with a residual copper rate of 50% was created on both sides, blackened, and then prepregs were placed on both surface layers to form a multi-layer board. It was found that the heat resistance of No. 1 depends on the resin content of the surface layer prepreg, and the heat resistance is significantly improved by setting the content of the textile base material to 40% by weight or less, preferably 35% by weight or less. The evaluation results are shown in Table 1. The prepreg used at that time uses ECG751 / 0 for the warp yarn, and ECG75 1/0 for the weft yarn is air-processed on the loom, and two warp yarns are driven at the same time, and 44 warp yarns / 25m
It was obtained by impregnating a glass fiber woven fabric prepared by using an air jet loom at a weaving density of m and 20 weft threads / 25 mm with an epoxy resin and drying. Further, the content of the textile base material was changed by adjusting the amount of the solvent of the epoxy resin.
【０００９】上式（１）中の（（Ｒ１／２）×（Ｒｓ／
２）×π）の項は糸断面の見掛けの断面積を示してお
り、また（ｄ×ｄ×π／４×Ｎ）の項は実際の基材の占
める断面積を示している。この比率を２以上にすること
により糸束中の樹脂の体積が無機繊維の体積以上にな
り、無機繊維と樹脂の分布は良好となり、積層成型時の
スリップは発生しなくなる。上式の比率が２．５以上に
すると積層板中の樹脂の半分以上が糸束内にあり、分布
の状態はより良好になる。In the above equation (1), ((R1 / 2) × (Rs /
The term 2) × π) indicates the apparent cross-sectional area of the yarn cross section, and the term (d × d × π / 4 × N) indicates the actual cross-sectional area occupied by the substrate. By setting this ratio to 2 or more, the volume of the resin in the yarn bundle becomes equal to or more than the volume of the inorganic fibers, the distribution of the inorganic fibers and the resin becomes good, and slips during lamination molding do not occur. When the ratio of the above equation is 2.5 or more, more than half of the resin in the laminated plate is in the yarn bundle, and the distribution state becomes better.
【００１０】本発明のプリプレグを作成するには、上式
で規定された織物基材を用いる以外は常法に従えばよ
く、例えばガラス繊維織物にエポキシ樹脂のようなマト
リックス樹脂を含浸させればよい。この際用いられる無
機繊維織物は製織する際に、タテ糸に対してはエッジ加
工を、ヨコ糸に対しては織機上でヨコ糸のエア加工をす
ると、樹脂含量を上げることができるので好ましい。さ
らにヨコ糸の場合、２本の糸をエア加工し、同時に１本
として打ち込むことにより、その樹脂保持性および樹脂
保持量をより均一化することができる。また、製織され
た織物に対してさらにエッジ加工等の物理的加工を加え
ることにより、樹脂含量を向上させることが可能とな
る。To prepare the prepreg of the present invention, a conventional method may be used except that the woven fabric substrate defined by the above formula is used. For example, a glass fiber woven fabric may be impregnated with a matrix resin such as an epoxy resin. Good. When weaving the inorganic fiber woven fabric used at this time, it is preferable to edge-process the warp yarns and air-process the weft yarns for the weft yarns because the resin content can be increased. Furthermore, in the case of a weft yarn, by air-processing two yarns and driving them into one yarn at the same time, the resin holding property and the resin holding amount can be made more uniform. Further, the resin content can be improved by further subjecting the woven fabric to physical processing such as edge processing.
【００１１】プリプレグの基材として使用される織物は
前述したように、ガラス繊維織物、炭素繊維織物、芳香
族ポリアミド繊維織物等があり、通常は同じ材料がタテ
方向、ヨコ方向に使用される。プリント基板用プリプレ
グ基材としてはガラス繊維織物が広く使用されており、
ここでは基材がガラス織物である多層基板についてさら
に詳細に本発明の構成を記載する。As described above, the woven fabric used as the base material of the prepreg includes a glass fiber woven fabric, a carbon fiber woven fabric, an aromatic polyamide fiber woven fabric, and the same material is usually used in the vertical direction and the horizontal direction. Glass fiber fabrics are widely used as prepreg base materials for printed circuit boards.
Here, the constitution of the present invention will be described in more detail for a multilayer substrate whose base material is a glass fabric.
【００１２】通常、プリプレグ用基材ガラス繊維織物に
使用されている糸は片撚糸で、番手範囲は５〜３００Ｔ
ｅｘ、好ましくは２０〜１４０Ｔｅｘである。糸を構成
する単糸の形状、太さ等については特に限定されない。
糸の撚り数は通常３回／インチ以下である。織物密度は
２０〜１００本／インチ、質量は３０〜４００ｇ／ｍ 2
であり、織り方は平織り、朱子織り、綾織り、ななこ織
り等が使用できる。[0012] Usually, the base glass fiber woven fabric for prepreg
The yarn used is a single-twisted yarn, and the count range is 5 to 300T.
ex, preferably 20 to 140 Tex. Make up thread
The shape and thickness of the single yarn to be used are not particularly limited.
The number of twists of the yarn is usually 3 times / inch or less. Fabric density is
20-100 pieces / inch, mass is 30-400 g / m 2
The weaves are plain weave, satin weave, twill weave, and Nanako weave.
Ri etc. can be used.
【００１３】本発明で使用される樹脂としては、エポキ
シ樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂、Ｂ
Ｔ樹脂、シアネート樹脂等の熱硬化性樹脂や、ＰＰＯ樹
脂、ポリエーテルイミド樹脂、フッ素樹脂等の熱可塑性
樹脂、またはそれらの混合樹脂のいずれもが使用でき
る。また、樹脂中に水酸化アルミニウム等の充填剤を混
在させて使用してもよい。The resin used in the present invention includes epoxy resin, unsaturated polyester resin, polyimide resin, B
Any of thermosetting resins such as T resin and cyanate resin, thermoplastic resins such as PPO resin, polyetherimide resin and fluororesin, or a mixed resin thereof can be used. Further, a filler such as aluminum hydroxide may be mixed and used in the resin.
【００１４】以下、実施例によって本発明の具体的構成
を説明する。The specific construction of the present invention will be described below with reference to examples.
【００１５】[0015]
〔実施例１〕ガラス繊維織物として、タテ糸にガラス繊
維ＥＣＧ７５ １／０（ｄ＝９．２μｍ、Ｎ＝４０８
本）を使用し、ヨコ糸は同じガラス繊維ＥＣＧ７５ １
／０２本を織機上でエア加工したものを、２本同時に打
ち込み、タテ糸４４本／２５mm、ヨコ糸２０本／２５mm
の織り密度でエアージェットルームを用いて重量２３２
ｇ／ｍ2 、厚み０．２７mmのガラス繊維織物を準備し
た。このガラス繊維織物にエポキシ樹脂を含浸し、乾燥
してプリプレグを得た。 〔実施例２〕ガラス繊維織物として、タテ糸にガラス繊
維ＥＣＧ７５ １／０を使用し、製織時にエッジ加工を
施し、ヨコ糸はＥＣＧ６８ １／０（ｄ＝９．５μｍ、
Ｎ＝４０８本）２本を織機上でエア加工したものを、２
本同時に打ち込み、タテ糸４４本／２５mm、ヨコ糸２０
本／２５mmの織り密度でエアージェットルームを用いて
重量２４４ｇ／ｍ2 、厚み０．２８mmのガラス繊維織物
を準備した。以下、実施例１と同様にプリプレグを作成
した。 〔実施例３〕ガラス繊維織物として、タテ糸にガラス繊
維ＥＣＧ７５ １／０を使用し、ヨコ糸は同じガラス繊
維ＥＣＧ７５ １／０を織機上でエア加工したものを使
用し、タテ糸４４本／２５mm、ヨコ糸３２本／２５mmの
織り密度でエアージェットルームを用いて製織し、さら
に得られたガラス繊維織物にエッジ加工を施し、重量２
１０ｇ／ｍ2 、厚み０．２６mmのガラス繊維織物を準備
した。以下、実施例１と同様にプリプレグを作成した。 〔比較例１〕ガラスクロスとして、タテ糸およびヨコ糸
に前述のＥＣＧ７５ １／０を使用して、タテ糸４４本
／２５mm、ヨコ糸３２本／２５mmの織り密度でエアージ
ェットルームを使用して重量２１０ｇ／ｍ2 、厚み０．
１８mmのガラス繊維織物を準備した。以下、実施例１と
同様にプリプレグを作成した。 〔比較例２〕ガラスクロスとして、タテ糸およびヨコ糸
に前述のＥＣＧ７５ １／０を使用して、タテ糸４４本
／２５mm、ヨコ糸３２本／２５mmの織り密度でエアージ
ェットルームを使用して重量２１０ｇ／ｍ2 、厚み０．
１８mmのガラス繊維織物を準備した。このガラス繊維織
物に実施例１のエポキシ樹脂の１．５倍の粘度のエポキ
シ樹脂を含浸し、乾燥してプリプレグを得た。[Example 1] As a glass fiber woven fabric, a glass fiber ECG75 1/0 (d = 9.2 μm, N = 408) was used as a warp yarn.
Book) and the weft is the same glass fiber ECG75 1
/ 02 yarns that have been air-processed on the loom are hammered in at the same time, 44 vertical yarns / 25mm, 20 horizontal yarns / 25mm
Weight 232 using air jet loom with a weaving density of
A glass fiber woven fabric having g / m 2 and a thickness of 0.27 mm was prepared. This glass fiber woven fabric was impregnated with an epoxy resin and dried to obtain a prepreg. [Example 2] As a glass fiber woven fabric, glass fiber ECG75 1/0 was used for the warp yarn, and edge processing was applied at the time of weaving, and the weft yarn was ECG68 1/0 (d = 9.5 μm,
N = 408) 2 pieces of air processed on the loom
Strike at the same time, 44 warp threads / 25mm, weft thread 20
A glass fiber woven fabric having a weight of 244 g / m 2 and a thickness of 0.28 mm was prepared by using an air jet loom at a weaving density of book / 25 mm. Hereinafter, a prepreg was prepared in the same manner as in Example 1. [Example 3] As a glass fiber woven fabric, glass fibers ECG75 1/0 were used as warp yarns, and the same weft yarn was obtained by air-processing the same glass fiber ECG75 1/0 on a loom, and 44 warp yarns / Weaving was performed using an air jet loom at a weaving density of 25 mm and 32 weft threads / 25 mm, and the resulting glass fiber woven fabric was edge-processed and weighed 2
A glass fiber woven fabric having a weight of 10 g / m 2 and a thickness of 0.26 mm was prepared. Hereinafter, a prepreg was prepared in the same manner as in Example 1. [Comparative Example 1] As the glass cloth, the above-mentioned ECG75 1/0 was used for the warp yarn and the weft yarn, and the air jet loom was used at a weaving density of 44 warp yarns / 25 mm and 32 weft yarns / 25 mm. Weight 210 g / m 2 , thickness 0.
An 18 mm glass fiber fabric was prepared. Hereinafter, a prepreg was prepared in the same manner as in Example 1. [Comparative Example 2] As a glass cloth, the above-mentioned ECG75 1/0 was used for the warp yarn and the weft yarn, and the air jet loom was used at a weaving density of 44 warp yarns / 25 mm and 32 weft yarns / 25 mm. Weight 210 g / m 2 , thickness 0.
An 18 mm glass fiber fabric was prepared. This glass fiber woven fabric was impregnated with an epoxy resin having a viscosity 1.5 times that of the epoxy resin of Example 1 and dried to obtain a prepreg.
【００１６】実施例１〜３および比較例１〜２のプリプ
レグの性能を表２に示す。なお、表２中の多層板の評価
は以下の方法で行った。 （１）多層板耐熱性評価 内層材 ：厚み０．８mmガラス織物基材にエポキシ樹脂
を含浸し、両面に７０μｍ厚の銅箔を張った積層板を用
い、残銅率５０％のモデル回路を作成し、黒化処理をし
て内層材とした。Table 2 shows the performance of the prepregs of Examples 1 to 3 and Comparative Examples 1 and 2. In addition, the evaluation of the multilayer boards in Table 2 was performed by the following methods. (1) Evaluation of heat resistance of multi-layer board Inner layer material: A model circuit with a residual copper rate of 50% was used by using a laminated board in which a 0.8 mm-thick glass fabric base material was impregnated with epoxy resin and copper foil of 70 μm thickness was spread on both sides. It was created and blackened to obtain an inner layer material.
【００１７】積層 ：内層材の上下面に評価プリプレ
グ１枚をそれぞれ介して厚さ１８μｍの銅箔を配置し、
成型圧力３０kg／cm2 、１７５℃で６０分間積層成型
し、多層基板を得た。 評価方法：同じ組合わせで多層基板を１２枚作成し、表
層銅箔を全面エッチアウトした後、沸騰水中で３時間吸
水処理し、２６０℃ハンダ中に２０秒間浸漬し、表面の
欠点発生状態を観察し、 ○：欠点なし、×：欠点発生、 で評価した。 （２）多層積層成型時のスリップ性の評価 内層材 ：厚み０．５mmガラス織物基材にエポキシ樹脂
を含浸し、両面に７０μｍ厚の銅箔を張った積層板を用
い、両面に回路を作成し、内層材とした。Lamination: A copper foil having a thickness of 18 μm is arranged on the upper and lower surfaces of the inner layer material through one evaluation prepreg respectively.
Laminating was performed at a molding pressure of 30 kg / cm 2 and 175 ° C. for 60 minutes to obtain a multilayer substrate. Evaluation method: Twelve multi-layer boards were prepared with the same combination, the surface copper foil was completely etched out, followed by water absorption treatment in boiling water for 3 hours and then immersed in solder at 260 ° C for 20 seconds to confirm the surface defect occurrence state. It was observed and evaluated by ◯: no defect, ×: defect occurred. (2) Evaluation of slip property during multi-layer lamination molding Inner layer material: 0.5 mm thick glass fabric base material impregnated with epoxy resin, and a circuit board is created on both sides using a laminated board with 70 μm thick copper foil Was used as the inner layer material.
【００１８】積層 ：内層材を２枚用い、その間およ
び上下面に評価プリプレグを各１枚、計３枚を配置し、
成型圧力４０kg／cm2 、１７５℃で１５分間積層成型
し、多層基板を得た。 評価方法：同じ組合わせで１０枚の多層基板を作成し、
成型性に問題の生じた多層基板の発生率で評価した。Lamination: Two inner layer materials are used, and one evaluation prepreg is provided between each of the inner layer materials and each of the upper and lower surfaces, and a total of three pieces are arranged.
A multilayer substrate was obtained by laminating and molding at a molding pressure of 40 kg / cm 2 and 175 ° C. for 15 minutes. Evaluation method: 10 multi-layer boards are created with the same combination,
The rate of occurrence of a multilayer substrate having a problem in moldability was evaluated.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【表２】 プリプレ 中織物基材含量の測定 プリプレグの重量を測定し（Ａ）、６３０℃の炉中で２
０分間 強熱し、残物の重量を測定し（Ｂ）、基材含量として求
めた。[Table 2] Measurement of the content of the fabric base material in the prepreg The weight of the prepreg was measured (A), and 2 in a furnace at 630 ° C.
It was ignited for 0 minutes, the weight of the residue was measured (B), and the content of the base material was determined.
【００２１】 基材含量（重量％）＝（Ｂ）／（Ａ）×１００Base material content (% by weight) = (B) / (A) × 100
【００２２】[0022]
【発明の効果】本発明のプリプレグは、織物基材含量が
４０重量％以下であり、構成している無機繊維織物基材
中に基材と同量以上の体積の樹脂が分布しているため、
積層成型時にスリップ等の問題を発生することなく、耐
熱性に優れた多層プリント配線基板を作成することがで
きる。また、本発明のプリプレグは構成するボンディン
グシート基材の枚数を減少することが可能であり、多層
基板の低コスト化にも有効である。INDUSTRIAL APPLICABILITY The prepreg of the present invention has a fabric base material content of 40% by weight or less, and the inorganic fiber fabric base material constituting the resin has a volume of resin equal to or greater than that of the base material. ,
It is possible to produce a multilayer printed wiring board having excellent heat resistance without causing problems such as slip during lamination molding. In addition, the prepreg of the present invention can reduce the number of bonding sheet base materials to be configured, and is also effective in reducing the cost of a multilayer substrate.
Claims (1)
コ糸を織成して得られた織物基材に合成樹脂を含浸した
プリプレグにおいて、該プリプレグの織物基材含量が４
０重量％以下で、該プリプレグを構成する織物基材のタ
テ糸およびヨコ糸の少なくとも一方または両方の糸断面
形状が下式を満たすことを特徴とするプリプレグ。 【数１】 （（Ｒ１／２）×（Ｒｓ／２）×π）／（ｄ×ｄ×π／４×Ｎ）≧２ Ｒ１：糸断面形状の長軸の長さ Ｒｓ：糸断面形状の短軸の長さ ｄ ：糸を構成する単糸の平均径 Ｎ ：糸を構成する単糸の本数1. A prepreg in which a synthetic resin is impregnated into a woven fabric substrate obtained by weaving a warp yarn and a weft yarn made of continuous inorganic long fibers, and the woven fabric substrate content of the prepreg is 4
A prepreg characterized in that, in an amount of 0% by weight or less, the yarn cross-sectional shape of at least one or both of the warp yarn and the weft yarn of the woven fabric base material constituting the prepreg satisfies the following formula. ## EQU00001 ## ((R1 / 2) .times. (Rs / 2) .times..pi.) / (D.times.d.times./4.times.N).gtoreq.2 R1: Length of major axis of yarn cross-section shape Rs: Yarn cross-section shape Minor axis length d: Average diameter of single yarn forming yarn N: Number of single yarn forming yarn
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03862193A JP3461523B2 (en) | 1993-02-26 | 1993-02-26 | Prepreg |
| BE9400223A BE1007324A3 (en) | 1993-02-26 | 1994-02-25 | Woven fibreglass material and process for manufacturing same |
| KR1019940003596A KR970008880B1 (en) | 1993-02-26 | 1994-02-26 | Glass fiber woven fabric and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03862193A JP3461523B2 (en) | 1993-02-26 | 1993-02-26 | Prepreg |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06246743A true JPH06246743A (en) | 1994-09-06 |
| JP3461523B2 JP3461523B2 (en) | 2003-10-27 |
Family
ID=12530317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03862193A Expired - Lifetime JP3461523B2 (en) | 1993-02-26 | 1993-02-26 | Prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3461523B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021004424A (en) * | 2019-06-26 | 2021-01-14 | 旭化成株式会社 | Glass cloth, prepreg, and printed wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3308999B2 (en) | 1993-02-26 | 2002-07-29 | 旭シュエーベル株式会社 | Laminated board |
-
1993
- 1993-02-26 JP JP03862193A patent/JP3461523B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021004424A (en) * | 2019-06-26 | 2021-01-14 | 旭化成株式会社 | Glass cloth, prepreg, and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3461523B2 (en) | 2003-10-27 |
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