JPH0625963Y2 - Electronic component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to an electronic component mounting apparatus, in which pins of a die ejector for pushing up an electronic component on a wafer can be easily replaced.

(Prior Art) An electronic device that pushes up an electronic component on a wafer by a pin of a die ejector arranged below the wafer and picks it up by a nozzle of a transfer head, and transfers and mounts the picked-up electronic component on a substrate. A component mounting apparatus is known. This type of ejector is configured by accommodating a pin holder in a cylindrical pepper pot so that the pin holder can be moved up and down. It is designed to be pushed up and down to push up electronic components.

(Problems to be solved by the invention) By the way, the tip of the pin gradually wears while repeatedly pushing up the electronic component, and in some cases it breaks, so that the pin must be replaced occasionally. This replacement work is performed by loosening the mounting screw of the pin, removing the pin from the pin holder, inserting a new pin into the insertion hole of the pin holder, and screwing the pin. However, the die ejector is placed in a narrow place where other devices and parts such as a wafer support table are densely packed,
Moreover, since the pin is extremely thin, it is extremely difficult to replace the pin with the insertion hole. Especially when the pin is replaced, it is necessary to adjust the protruding length of the pin from the upper surface of the pepper pot, but the tip of the pin is extremely sharp and hard to see.
It was quite difficult to adjust the protrusion length of the pin from the pepper pot while measuring it precisely in such a narrow place as described above.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus equipped with a die ejector that allows pins to be easily replaced.

(Means for Solving the Problems) For this purpose, the present invention provides a die ejector equipped in an electronic component mounting apparatus of this type, which is located in a pepper pot and is lifted and lowered by being driven by an elevating device. And a pin holder that detachably holds a pin that is detachably attached to the upper portion of the elevator, and a cover cap that has a pin hole that is detachably attached to the head of the pepper pot. By doing so, the pin and the pin holder can be integrally attached to and detached from the pepper pot.

(Operation) In the above configuration, when the tip of the pin is worn and the like is replaced, the cover cap is removed, the pin is pinched, and the pin together with the pin holder is taken out from the pepper pot. Then, the pin is replaced at a suitable place such as a workbench nearby where it is easy to replace, and when the replacement is completed, the pin is mounted on the pepper pot again together with the pin holder, and the cover cap is covered.

(Embodiment) Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus, in which 1 is a table, 2 is a main body box installed on the table 1, and 3 is a box.
Carries the board 4 on which the electronic parts are mounted onto the table 1,
Further, conveyors 5 carried out from here are positioning portions for the substrate 4 provided on the conveyor 3. A wafer 6 is provided in front of the positioning unit 5, and has electronic components mounted on its upper surface. Reference numerals 8 and 9 denote XY-direction moving devices provided in the main body box 2, and 10 and 11 denote drive motors for the movement devices. A transfer head 12 is vertically installed on the X-direction moving device 9, and a nozzle 13 is vertically installed on a lower surface thereof.
Reference numeral 19 denotes a case of the die ejector arranged below the wafer 5. Next, the structure of the die ejector 20 arranged inside the case 19 will be described with reference to FIGS. 2 and 3. To do.

Reference numeral 21 is a substantially cylindrical pepper pot in which an elevator 22 is housed. Reference numeral 23 is a lever that bends in a hook shape and is rotatably attached to a pin 24.
Further, the tip end portion is biased downward by the spring member 25.
The elevator 22 is connected to the lever 23 by a connecting pin 26. Reference numeral 27 is a cam that comes into contact with a roll 28 axially attached to the lower end of the lever 3, and when the cam 27 is driven by a motor M to rotate, the lever 23 moves to a pin 24.
The elevator 22 moves up and down in the pepper pot 21 by reciprocally rotating around.

Reference numeral 30 denotes a pin holder, which is formed of a substantially cylindrical body, has an insertion hole 32 for inserting the pin 31 at the center of the upper surface (see FIG. 4), and fixes the pin 31 on its side surface. A screw hole 34 for screwing the screw 33 is drilled. Reference numeral 35 denotes a mounting portion formed in the lower portion thereof, which is made of a cylindrical body, and a plurality of cut grooves 36 are formed in the lower edge portion thereof. A mounted portion 37 is recessed at the upper end of the elevator 22, and the pin holder 30 mounts the mounted portion 35 to the mounted portion 3.
Pepper pot 21
Set inside. When the cut groove is formed in the cylindrical body, it has a property of elastically expanding outward slightly. Therefore, by forming the cut groove 36 in the mounting portion 35 made of the cylindrical body as described above, a proper sliding contact can be achieved. It can be mounted on the mounted portion 37 with good moderation while obtaining friction.

Reference numeral 40 denotes a cover cap that is detachably attached to the upper end of the pepper pot 21, and has a pin 31 at the center of the upper surface.
Is formed with a pin hole 41, and the pin hole 4
Around the circumference of 1, there are formed a plurality of air suction holes 42.
In FIG. 3, reference numeral 6 denotes the above-mentioned wafer arranged above the die ejector 20, which is constituted by attaching a wafer sheet 6b to a ring 6a, and an electronic component 45 is mounted on the upper surface thereof. There is.

The pepper pot 21 rises and the upper surface of the cover cap 40 abuts the lower surface of the wafer sheet 6b, and the wafer sheet 6b is sucked by the suction pressure of the suction hole 42 to suck the electronic component 45.
With the above fixed, the cam 27 rotates and the pin 31 projects from the pin hole 41 to push up the electronic component 45 on the wafer sheet 6b, and the pushed electronic component 45 reaches the nozzle 13 of the upper transfer head 12. It is adsorbed, picked up, and transferred and mounted on the substrate 4.

The die ejector 20 is configured as described above,
When exchanging the tip of the pin 31 due to wear or the like, remove the cover cap 40 from the pepper pot 21, pinch the pin 31 and take it out from the pepper pot 21 integrally with the pin holder 30, and replace the work table or the like. The pin 31 is replaced by moving it to a suitable place where work is easy.
This pin exchange is performed by loosening the screw 33, taking out the pin 31, inserting a new pin into the insertion hole 32, and tightening the screw 33. When the pin replacement is completed, the pin 31 is pinched and the pin holder 30 is attached to the attached portion 37 in the pepper pot 21, and the cover cap 40 is covered from above.

FIG. 5 shows an example of a pin replacement method.
Reference numeral 0 is a jig, and a pin insertion hole 51 is formed in the center thereof. The height H of the jig 50 is equal to the protruding length of the pin 31, so that the pin 31 is inserted into the mounting hole 32 of the pin holder 30 and the pin 31 is inserted into the insertion hole 51 of the jig 50 placed on the work table 52. By inserting the tip end of the pin 31, the tip end of the pin 31 is landed on the workbench 52, and the screw 33 is tightened, the pin 31 can be fixed to the pin holder 30 in a properly projected state. According to this method, it is not necessary to measure the protruding length of the pin 31, the pin 31 can be easily replaced, and the correct protruding length can be obtained.

(Effects of the Invention) As described above, in the present invention, in this type of electronic component mounting apparatus, the die ejector is a pepper pot, and the elevator which is inside the pepper pot and is lifted and lowered by being driven by the lifting device. By comprising a pin holder detachably holding a pin detachably attached to the upper part of the elevator and a cover cap having a pin hole detachably attached to the head of the pepper pot, Since the pin and the pin holder can be integrally attached to and detached from the pepper pot, the pin can be easily replaced.

[Brief description of drawings]

1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an electronic component mounting apparatus, FIGS. 2 and 3 are front and sectional views of a die ejector, and FIG. 4 is an exploded view of a pin holder. FIG. 5 is a perspective view and FIG. 5 is a sectional view during pin replacement. 4 ... Substrate 6 ... Wafer 12 ... Transfer head 20 ... Die ejector 21 ... Pepper pot 22 ... Elevator 30 ... Pin holder 31 ... Pin 40 ... Cover cap 41 ... Pin hole 45 ... Electronic parts

Claims (1)

[Scope of utility model registration request] 1. A XY ejector, which is disposed below a wafer and has a pin for pushing up an electronic component on the wafer, and picks up the pushed electronic component to obtain an XY.
In an electronic component mounting apparatus equipped with a transfer head which is driven by a direction moving device and is transferred and mounted on a substrate, the die ejector is lifted up and down by being driven by a lifting device inside the pepper pot and the inside of the pepper pot. A child holder, a pin holder removably mounted on the upper and lower parts of the elevator, which holds the pin removably, and a cover cap having a pin hole removably mounted on the head of the pepper pot. By doing, the above pin and pin holder,
An electronic component mounting device characterized by being detachable integrally with a pepper pot.