JPH06267923A - Cleaning device for semiconductor substrate - Google Patents

Abstract

PURPOSE:To prevent a semiconductor substrate from being contaminated on contact with the atmosphere at the time of cleaning. CONSTITUTION:As the depth of a cleaning bath 1 is two times larger than the height of a semiconductor substrate 55, the substrate 55 is first fixed at a position in the upper half of the interior of the bath 1 and a cleaning of the substrate is performed. When this cleaning operation ends, the substrate 55 is sunk at a position in the lower half of the interior of the bath 1 this time and drainage parts 4 and 5 are opened. Whereupon, cleaning water existing in the upper half of the interior of the bath 1 is discharged through the drainage parts 4 and 5 along with dirts on the substrate 55. After that, the parts 4 and 5 are shut and when cleaning water being fed within the bath 1 is brought in such a state that it overflows the upper end of the bath 1, the substrate 55 is again moved upward and the final cleaning of the substrate is performed. Thereby, the substrate 55 can be cleaned two times without coming in touch with the atmosphere.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cleaning a semiconductor substrate.

[0002]

2. Description of the Related Art In the process of manufacturing a semiconductor device, there is a step of treating a semiconductor substrate with a chemical solution and then washing it with pure water to remove the chemical solution. This pure water cleaning device is as shown in FIG. That is, the pure water supplies 52, 53 are provided at the bottom of the cleaning tank 51.
During cleaning, pure water is supplied from the supply units 52 and 53 and overflows from the upper end of the cleaning tank 51. The semiconductor substrate 55 held by the holder 54 is immersed in the cleaning tank 51. Reference numeral 56 is a drain valve for discharging pure water after cleaning.

The cleaning process is performed as shown in FIG. After the semiconductor substrate 55 is immersed in the chemical solution tank 57 for chemical treatment, it is cleaned by the first deionized water cleaning device 58, and then transferred to another deionized water cleaning device 59 for cleaning in order to improve the water cleaning effect. After that, it is dried.

[0004]

In the conventional example, since a plurality of pure water cleaning devices are required, there is a problem that the equipment area becomes large. Also, when a semiconductor substrate is moved between a plurality of deionized water cleaning devices, the substrate is exposed to the atmosphere and dust is likely to adhere to the substrate. There is a problem that the dust is easily attached to the substrate.

The present invention relates to an improvement of a semiconductor substrate cleaning apparatus, and solves such a problem.

[0006]

According to the present invention, there is provided a semiconductor substrate processing apparatus in which a semiconductor substrate is accommodated in a cleaning tank, and a cleaning liquid is supplied into the tank from a lower portion of the cleaning tank while overflowing from the upper portion. Cleaning the depth of the cleaning tank at least twice the size of the semiconductor substrate and at a position higher than the size of the semiconductor substrate from the bottom of the cleaning tank, the cleaning liquid in the cleaning tank. It is provided with a drainage part that can be opened and closed to discharge the water.

[0007]

That is, since the depth of the cleaning tank is more than twice that of the semiconductor substrate, the semiconductor substrate is first fixed to the upper half position in the cleaning tank and cleaning is performed. At this time, the cleaning water flows from the bottom to the top of the cleaning layer and overflows from the upper end of the cleaning tank, so that dirt on the semiconductor substrate is unlikely to settle down in the cleaning tank.

When this cleaning operation is completed, the semiconductor substrate is then submerged in the lower half position in the cleaning tank, and the drainage section is opened. Then, the cleaning water in the upper half of the cleaning tank is discharged from the drain together with the dirt on the semiconductor substrate. After that, the drain part is closed, and when the cleaning water supplied into the cleaning tank overflows from the upper end of the cleaning tank, the semiconductor substrate is again moved upward and the final cleaning is performed.

The final cleaning may be performed while overflowing from the upper end of the cleaning tank, without draining the semiconductor substrate and moving the semiconductor substrate without overflowing the upper end of the cleaning tank. The method of using the cleaning apparatus of the present invention may be appropriately determined by the user.

[0010]

Embodiments of the present invention will be described with reference to the drawings.
In FIG. 1, reference numeral 1 is a cleaning tank for washing off the chemical solution after the semiconductor substrate is treated with the chemical solution. This cleaning tank 1
Pure water supplies 2 and 3 are provided at the bottom of the cleaning tank 1. Pure water is supplied from the supplies 2 and 3 during cleaning and overflows from the upper end of the cleaning tank 1. The depth of the cleaning tank 1 is about 2.5 times the diameter of the semiconductor substrate 55 to be cleaned.

Numerals 4 and 5 are 1 / on the side wall of the cleaning tank 1.
The drainage portion is provided at a depth of 2 and can be opened and closed by drainage valves 6 and 7, respectively. Reference numeral 8 is a drain valve for discharging pure water after cleaning. In the cleaning device having such a configuration, the cleaning process is performed as shown in FIGS.
The cleaning process includes a preliminary cleaning process and a final cleaning process.

In the preliminary cleaning step, first, the semiconductor substrate 55
Is fixed to the upper half position in the cleaning tank 1 and cleaning is performed (FIG. 2A). At this time, the wash water flows from the bottom to the top of the wash layer,
Since it overflows from the upper end of the cleaning tank, dirt on the semiconductor substrate is unlikely to settle down in the cleaning tank. When this preliminary cleaning operation is completed, the semiconductor substrate 55 is then submerged in the lower half position in the cleaning tank 1, and the drainage parts 4 and 5 are opened (FIG. 2B). Then, the cleaning water in the upper half of the cleaning tank 1 is discharged from the drainage sections 4 and 5 together with the dirt on the semiconductor substrate (FIG. 2C).

After that, when the drainage parts 4 and 5 are closed and the cleaning water supplied into the cleaning tank 1 overflows from the upper end of the cleaning tank 1 (FIG. 3D), the semiconductor substrate 55 is moved upward again. And a final wash is performed (Fig. 3E). Drying is performed after cleaning. As described above, in the cleaning apparatus of this embodiment, the cleaning process can be performed twice in succession without exposing the semiconductor substrate to the atmosphere.

[0014]

In the semiconductor substrate cleaning apparatus of the present invention, dust floating in the atmosphere or cleaning water can be prevented from adhering to the substrate. Moreover, since the cleaning can be performed a plurality of times in a single tank, it is possible to save space in the apparatus.

[Brief description of drawings]

FIG. 1 is an internal mechanism diagram of a semiconductor substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a cleaning process of the same.

FIG. 3 is an explanatory diagram showing a cleaning process of the same.

FIG. 4 is a view corresponding to FIG. 1 in a conventional example.

FIG. 5 is a view corresponding to FIGS. 2 and 3 in a conventional example.

[Explanation of symbols]

 1 Cleaning tank 4, 5 Drainage 55 Semiconductor substrate

Claims (1)

[Claims] 1. An apparatus for storing a semiconductor substrate in a cleaning tank and cleaning the substrate while supplying a cleaning liquid into the tank from a lower portion of the cleaning tank and overflowing the cleaning liquid from an upper portion of the cleaning tank. The size of the semiconductor substrate is set to be at least twice the size of the semiconductor substrate, and a drainage part for discharging the cleaning liquid in the cleaning tank is provided at a position higher than the size of the semiconductor substrate from the bottom of the cleaning tank. Cleaning equipment for semiconductor substrates.