JPH06268464A - Noise filter block - Google Patents
Noise filter blockInfo
- Publication number
- JPH06268464A JPH06268464A JP5056735A JP5673593A JPH06268464A JP H06268464 A JPH06268464 A JP H06268464A JP 5056735 A JP5056735 A JP 5056735A JP 5673593 A JP5673593 A JP 5673593A JP H06268464 A JPH06268464 A JP H06268464A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- ground electrode
- signal
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Filters And Equalizers (AREA)
Abstract
(57)【要約】
【目的】 全体形状を薄型にし、かつ信号線路間のピッ
チを狭くして小型化できる。また温度サイクル試験を実
施しても割れ等の発生がなく、静電容量の取得範囲が広
く、十分に高周波ノイズを除去できる。
【構成】 複数の端子挿入用孔１２が所定の間隔をあけ
て設けられた絶縁性基板１１の孔周縁の表面に信号用電
極１４が孔の内面の内面電極１２ａに連続して形成され
る。この電極１４と所定の絶縁間隙１５をあけて基板１
１の表面に第１アース電極１６が形成され、この電極１
６は内面電極１２ａと所定の絶縁間隙１８をあけて基板
１１の裏面に形成された第２アース電極１７に電気的に
接続される。基板表面の信号用電極と第１アース電極と
の間にはチップコンデンサ１９が架設され、コンデンサ
１９はベアチップ１９ａ両端に設けられた一対の端子電
極１９ｂ，１９ｃを信号用電極と第１アース電極にそれ
ぞれ接続する。
(57) [Summary] [Purpose] The overall shape can be made thin, and the pitch between signal lines can be narrowed to achieve miniaturization. Further, even if a temperature cycle test is carried out, no cracks or the like occur, the capacitance acquisition range is wide, and high frequency noise can be sufficiently removed. A signal electrode 14 is formed continuously on the inner surface electrode 12a on the inner surface of the hole on the surface of the periphery of the hole of an insulating substrate 11 in which a plurality of terminal insertion holes 12 are provided at a predetermined interval. The substrate 1 is provided with a predetermined insulating gap 15 from the electrode 14.
The first ground electrode 16 is formed on the surface of the electrode 1.
6 is electrically connected to a second ground electrode 17 formed on the back surface of the substrate 11 with a predetermined insulating gap 18 between the inner surface electrode 12a. A chip capacitor 19 is installed between the signal electrode on the surface of the substrate and the first ground electrode, and the capacitor 19 uses a pair of terminal electrodes 19b and 19c provided at both ends of the bare chip 19a as the signal electrode and the first ground electrode. Connect each.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、複数の信号線路におけ
る高周波ノイズを除去するためのノイズフィルタブロッ
クに関する。更に詳しくはコネクタ等に内蔵するに適し
たノイズフィルタブロックに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a noise filter block for removing high frequency noise in a plurality of signal lines. More specifically, it relates to a noise filter block suitable for being built in a connector or the like.
【０００２】[0002]
【従来の技術】コンピュータ等のデジタル機器では、信
号線路に高周波のノイズが混入すると誤動作を生じ易
く、しかも他の電子機器等に障害をもたらす恐れのある
不要な電磁波を配線から放射する問題点がある。このた
め、信号線路にはコンデンサ素子を用いた高周波ノイズ
を除去するノイズフィルタが多用されている。複数の信
号線路における高周波ノイズを除去するためのノイズフ
ィルタブロックとしては、金属製のアース板やシールド
ケースに形成された複数の取付孔にそれぞれ貫通コンデ
ンサをはんだ付けにより配列したものや、或いは印刷回
路基板にチップコンデンサをはんだ付けにより実装した
ものが知られている。2. Description of the Related Art In digital equipment such as computers, there is a problem that if electromagnetic waves of high frequency are mixed in a signal line, malfunctions are likely to occur, and that unnecessary electromagnetic waves that may damage other electronic equipment are radiated from wiring. is there. For this reason, a noise filter using a capacitor element for removing high frequency noise is often used in the signal line. As a noise filter block for removing high frequency noise in a plurality of signal lines, a feedthrough capacitor is arranged by soldering in a plurality of mounting holes formed in a metal ground plate or a shield case, or a printed circuit. It is known that a chip capacitor is mounted on a board by soldering.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記貫通コン
デンサを用いたノイズフィルタブロックには、 複数
の貫通コンデンサをアース板に取付けた場合、貫通コン
デンサの長さの分だけノイズフィルタブロックが厚くな
り、その薄型化が困難であり、また貫通コンデンサの外
径に相応して取付孔相互の間隔をあけなければならず、
信号線路の狭ピッチ化が困難であり、 コネクタに組
込まれた状態で温度サイクル試験を実施した場合、コネ
クタの絶縁性樹脂とアース板の熱膨張率の違いにより、
端子であるコネクタピンに応力が発生し、このコネクタ
ピンが挿通する貫通コンデンサに割れ等が発生すること
があり、 貫通コンデンサの静電容量の取得可能な範
囲が狭く限定される等の問題点があった。またチップコ
ンデンサを用いたノイズフィルタブロックには、基板上
の印刷パターンの引き回しや、アース電極の構造により
高周波ノイズを除去する性能が不十分であった。However, in the noise filter block using the feedthrough capacitor, when a plurality of feedthrough capacitors are attached to the ground plate, the noise filter block becomes thicker by the length of the feedthrough capacitor. It is difficult to make it thinner, and the mounting holes must be spaced apart according to the outer diameter of the feedthrough capacitor.
It is difficult to narrow the pitch of the signal line, and when the temperature cycle test is carried out in the state where it is installed in the connector, due to the difference in the coefficient of thermal expansion between the insulating resin of the connector and the ground plate,
The stress may occur in the connector pin that is the terminal, and the feedthrough capacitor through which this connector pin is inserted may be cracked, which limits the obtainable range of the capacitance of the feedthrough capacitor. there were. Further, the noise filter block using the chip capacitor is insufficient in the ability to route the printed pattern on the substrate and the structure of the ground electrode to remove high frequency noise.
【０００４】本発明の目的は、全体形状を薄型にし、か
つ信号線路間のピッチを狭くして小型化できるノイズフ
ィルタブロックを提供することにある。本発明の別の目
的は、温度サイクル試験を実施しても割れ等の発生がな
く、静電容量の取得範囲が広く、十分に高周波ノイズを
除去できるノイズフィルタブロックを提供することにあ
る。An object of the present invention is to provide a noise filter block which can be miniaturized by making the overall shape thin and narrowing the pitch between signal lines. Another object of the present invention is to provide a noise filter block which is free from cracks and the like even when a temperature cycle test is performed, has a wide electrostatic capacitance acquisition range, and can sufficiently remove high frequency noise.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
の本発明の構成を、実施例に対応する図１を用いて説明
する。本発明のノイズフィルタブロック１０は、複数の
端子挿入用孔１２が所定の間隔をあけて設けられた絶縁
性基板１１と、この基板１１の孔周縁の表面に孔の内面
の内面電極１２ａに連続して形成された信号用電極１４
と、この信号用電極１４と所定の絶縁間隙１５をあけて
基板１１の表面に形成された第１アース電極１６と、孔
１２の内面の内面電極１２ａと所定の絶縁間隙１８をあ
けて基板１１の裏面に形成され第１アース電極１６に電
気的に接続された第２アース電極１７と、ベアチップ１
９ａ両端に設けられた一対の端子電極１９ｂ，１９ｃを
信号用電極１４と第１アース電極１６にそれぞれ接続す
るように基板表面の信号用電極１４と第１アース電極１
６との間に架設されたチップコンデンサ１９とを備え
る。A configuration of the present invention for achieving the above object will be described with reference to FIG. 1 corresponding to an embodiment. In the noise filter block 10 of the present invention, an insulating substrate 11 having a plurality of terminal insertion holes 12 provided at a predetermined interval and a surface of a peripheral edge of the substrate 11 connected to an inner electrode 12a on the inner surface of the hole. Signal electrode 14 formed by
The first earth electrode 16 formed on the surface of the substrate 11 with a predetermined insulating gap 15 between the signal electrode 14 and the inner electrode 12a on the inner surface of the hole 12 and the substrate 11 with a predetermined insulating gap 18 therebetween. The second ground electrode 17 formed on the back surface of the substrate and electrically connected to the first ground electrode 16, and the bare chip 1
The signal electrode 14 and the first ground electrode 1 on the surface of the substrate are connected so that the pair of terminal electrodes 19b and 19c provided at both ends of 9a are connected to the signal electrode 14 and the first ground electrode 16, respectively.
6 and a chip capacitor 19 installed between the first and second terminals.
【０００６】[0006]
【作用】複数の端子挿入用孔１２にコネクタピンのよう
な信号線路Ｐを挿入し、これらの信号線路Ｐを基板表面
の信号用電極１４にそれぞれ接続するとともに、基板裏
面の第２アース電極１７をアース用シールドケースのア
ース電極に接続する。チップコンデンサ１９により僅か
なスペースで大きな静電容量が得られるため、ノイズフ
ィルタブロック１０を小型で薄くすることができるとと
もに、このブロック１０によりコネクタに実装した後の
アース側に発生する残留インダクタンスを極めて小さく
抑えることができ、しかも各信号線路を通る信号の高周
波ノイズを一括して確実に除去することができる。The signal lines P such as connector pins are inserted into the plurality of terminal insertion holes 12, the signal lines P are connected to the signal electrodes 14 on the front surface of the substrate, and the second ground electrode 17 on the rear surface of the substrate is connected. To the ground electrode of the ground shield case. Since the chip capacitor 19 can provide a large electrostatic capacity in a small space, the noise filter block 10 can be made small and thin, and the residual inductance generated on the ground side after being mounted on the connector can be extremely reduced by the block 10. It can be suppressed to a small value, and high-frequency noise of the signal passing through each signal line can be collectively and reliably removed.
【０００７】[0007]
【実施例】次に本発明の実施例を図面に基づいて詳しく
説明する。図１〜図４は本発明第１実施例ノイズフィル
タブロック１０を示す。図１〜図４に示すように、絶縁
性基板であるガラスエポキシ基板１１の両面に薄い銅箔
を貼付けた銅張積層板を出発材料とし、不要な部分をエ
ッチングで取去ることにより、信号用電極１４、第１及
び第２アース電極１６，１７を形成した。即ち、銅張基
板１１の中央には４個の端子挿入用孔１２を、また基板
１１の両端縁近傍には１０個のスルーホール１３をそれ
ぞれ等間隔に設けた。孔１２及びスルーホール１３の各
内面には銅めっきにより内面電極１２ａ及び１３ａを形
成した。Embodiments of the present invention will now be described in detail with reference to the drawings. 1 to 4 show a noise filter block 10 according to the first embodiment of the present invention. As shown in FIGS. 1 to 4, a copper clad laminate having thin copper foils attached to both sides of a glass epoxy substrate 11 which is an insulating substrate is used as a starting material, and unnecessary portions are removed by etching to obtain a signal. The electrode 14 and the first and second ground electrodes 16 and 17 were formed. That is, four terminal insertion holes 12 were provided at the center of the copper-clad substrate 11, and ten through holes 13 were provided at equal intervals in the vicinity of both edges of the substrate 11. Inner electrodes 12a and 13a were formed on the inner surfaces of the holes 12 and the through holes 13 by copper plating.
【０００８】基板１１の表面では孔１２を中心とする円
形状の信号用電極１４及びこの周囲の第１アース電極１
６の部分に、間隙１５を残してレジストが印刷され、基
板１１の裏面では孔１２の周囲の間隙１８を残して第２
アース電極１７の部分に、それぞれレジストが印刷され
た。エッチング処理して間隙１５と間隙１８の部分の銅
箔を除去した。この結果、信号用電極１４が基板１１の
孔周縁の表面に孔１２の内面の内面電極１２ａに連続し
て形成され、第１アース電極１６はこの信号用電極１４
を囲んでかつ電極１４と所定の絶縁間隙１５をあけて形
成された。また基板１１の裏面には第２アース電極１７
が孔１２の内面の内面電極１２ａを囲んでかつ電極１２
ａと所定の絶縁間隙１８をあけて形成され、この第２ア
ース電極１７はスルーホール１３の内面の内面電極１３
ａを介して第１アース電極１６に電気的に接続された。
基板１１の表面の信号用電極１４と第１アース電極１６
との間には、信号用電極１個当り２個のチップコンデン
サ１９が架設される。この例では２個のチップコンデン
サは同一の静電容量を有する。チップコンデンサ１９の
架設は、そのベアチップ１９ａの両端に設けられた一対
の端子電極１９ｂ，１９ｃを信号用電極１４と第１アー
ス電極１６にそれぞれはんだ付けすることにより、行わ
れる。チップコンデンサ１９はチップ型積層セラミック
コンデンサであって、ベアチップ１９ａは内部電極とチ
タン酸バリウム系又は鉛系の誘電体層を交互に積層した
後、焼成して得られた焼結体である。端子電極１９ｂ，
１９ｃはＡｇを含む導電性ペーストをベアチップの両端
面に塗布後、焼付けて形成され、端子電極表面にはんだ
めっきが施される。On the surface of the substrate 11, a circular signal electrode 14 centered on the hole 12 and the first ground electrode 1 around the signal electrode 14 are formed.
The resist is printed on the portion 6 at a gap 15 and the second portion is formed on the back surface of the substrate 11 at a gap 18 around the hole 12.
A resist was printed on each of the ground electrodes 17. The copper foil in the gaps 15 and 18 was removed by etching. As a result, the signal electrode 14 is continuously formed on the surface of the peripheral edge of the hole of the substrate 11 with the inner surface electrode 12a of the inner surface of the hole 12, and the first ground electrode 16 is the signal electrode 14
The electrode 14 and the electrode 14 are formed with a predetermined insulating gap 15 therebetween. The second earth electrode 17 is formed on the back surface of the substrate 11.
Surround the inner surface electrode 12a on the inner surface of the hole 12 and
The second ground electrode 17 is formed with a predetermined insulating gap 18 between the inner surface electrode 13 and the inner surface electrode 13 of the through hole 13.
It was electrically connected to the first ground electrode 16 via a.
The signal electrode 14 and the first ground electrode 16 on the surface of the substrate 11
Two chip capacitors 19 are provided for each signal electrode between and. In this example, the two chip capacitors have the same capacitance. The chip capacitor 19 is installed by soldering the pair of terminal electrodes 19b and 19c provided at both ends of the bare chip 19a to the signal electrode 14 and the first ground electrode 16, respectively. The chip capacitor 19 is a chip type monolithic ceramic capacitor, and the bare chip 19a is a sintered body obtained by alternately laminating internal electrodes and barium titanate-based or lead-based dielectric layers and firing them. Terminal electrode 19b,
19c is formed by applying a conductive paste containing Ag to both end faces of the bare chip and then baking it, and the surface of the terminal electrode is plated with solder.
【０００９】このように構成されたノイズフィルタブロ
ック１０を例えばコネクタ（図示せず）に内蔵する場合
について説明する。４個の端子挿入用孔１２に信号線路
である４本のコネクタピンＰ（図１）をそれぞれ挿入
し、これらのコネクタピンＰを内面電極１２ａに、また
基板１１の裏面の第２アース電極１７をアース用シール
ドケース（図示せず）にそれぞれはんだ付けにより電気
的に接続する。コネクタピンＰは内面電極１２ａ、信号
用電極１４及び２個のチップコンデンサ１９を介してア
ース電極１６，１７に接続される。チップコンデンサ１
９により僅かなスペースで大きな静電容量が得られるた
め、ノイズフィルタブロック１０を小型で薄くすること
ができるとともに、このブロック１０によりコネクタに
実装した後のアース側に発生する残留インダクタンスを
極めて小さく抑えることができ、しかも各信号線路を通
る信号の高周波ノイズを一括して確実に除去することが
できる。A case where the noise filter block 10 thus constructed is built in a connector (not shown) will be described. Four connector pins P (FIG. 1), which are signal lines, are inserted into the four terminal insertion holes 12, and these connector pins P are used as the inner surface electrode 12a and the second ground electrode 17 on the back surface of the substrate 11. Are electrically connected to a ground shield case (not shown) by soldering. The connector pin P is connected to the ground electrodes 16 and 17 via the inner surface electrode 12a, the signal electrode 14 and the two chip capacitors 19. Chip capacitor 1
Since a large electrostatic capacity can be obtained in a small space by means of 9, the noise filter block 10 can be made small and thin, and the residual inductance generated on the ground side after being mounted on the connector can be kept extremely small by this block 10. It is possible to remove the high frequency noise of the signal passing through each signal line collectively and surely.
【００１０】図５〜図８は本発明第２実施例ノイズフィ
ルタブロック２０を示す。図１〜図４と同一符号は同一
構成部品を示す。この例の特徴ある構成は、第１実施例
のスルーホール１３を設ける代わりに、絶縁性基板１１
の両端面に端面電極２１が形成され、第１アース電極１
６と第２アース電極１７が、内面電極１３ａの代わりに
端面電極２１を介して電気的に接続されたことにある。
この例では絶縁性基板１１としてアルミナセラミックス
基板を用いた。基板１１の中央に第１実施例と同様に４
個の端子挿入用孔１２を等間隔に設けた。これらの孔１
２の内面にはスルーホール印刷により内面電極１２ａを
形成した。基板１１の表面に信号用電極１４及び第１ア
ース電極１６をＡｇ又はＡｇ／Ｐｄなどを含む導電性ペ
ーストをスクリーン印刷して形成した。即ち、信号用電
極１４は基板１１の孔周縁の表面にこれらの孔１２の内
面の内面電極１２ａに連続して円形状に形成され、第１
アース電極１６はこの信号用電極１４を囲んでかつ電極
１４と所定の絶縁間隙１５をあけて形成された。5 to 8 show a noise filter block 20 according to the second embodiment of the present invention. 1 to 4 indicate the same components. The characteristic constitution of this example is that the insulating substrate 11 is replaced by the through hole 13 of the first embodiment.
End face electrodes 21 are formed on both end faces of the first ground electrode 1
6 and the second ground electrode 17 are electrically connected via the end face electrode 21 instead of the inner face electrode 13a.
In this example, an alumina ceramic substrate was used as the insulating substrate 11. In the center of the substrate 11, 4 as in the first embodiment.
The individual terminal insertion holes 12 were provided at equal intervals. These holes 1
An inner electrode 12a was formed on the inner surface of No. 2 by through-hole printing. The signal electrode 14 and the first ground electrode 16 were formed on the surface of the substrate 11 by screen-printing a conductive paste containing Ag or Ag / Pd. That is, the signal electrode 14 is formed in a circular shape on the surface of the peripheral edge of the hole of the substrate 11 so as to be continuous with the inner electrode 12a on the inner surface of the hole 12,
The ground electrode 16 is formed so as to surround the signal electrode 14 and leave a predetermined insulating gap 15 from the electrode 14.
【００１１】基板１１の裏面に第２アース電極１７を上
記と同じ導電性ペーストをスクリーン印刷して形成し
た。更に基板１１の端面に導電性ペーストをコーティン
グして焼付け端面電極２１を形成した。これにより、第
２アース電極１７は孔１２の内面の内面電極１２ａを囲
んでかつ電極１２ａと所定の絶縁間隙１８をあけて形成
され、第２アース電極１７が端面電極２１を介して第１
アース電極１６に電気的に接続された。基板１１の表面
の信号用電極１４と第１アース電極１６との間には、第
１実施例と同様にチップコンデンサ１９が架設された。
このノイズフィルタブロック２０の使用方法及び特性は
前記第１実施例と同様であるので繰り返しの説明を省略
する。A second ground electrode 17 was formed on the back surface of the substrate 11 by screen-printing the same conductive paste as above. Further, the end face of the substrate 11 was coated with a conductive paste to form a baked end face electrode 21. As a result, the second ground electrode 17 is formed so as to surround the inner surface electrode 12a on the inner surface of the hole 12 and to leave a predetermined insulating gap 18 from the electrode 12a, and the second ground electrode 17 is provided with the first surface electrode 21 via the end surface electrode 21.
It was electrically connected to the ground electrode 16. A chip capacitor 19 was installed between the signal electrode 14 and the first ground electrode 16 on the surface of the substrate 11 as in the first embodiment.
The method of use and characteristics of the noise filter block 20 are the same as those in the first embodiment, and the repeated description will be omitted.
【００１２】なお、上記例では絶縁性基板としてガラス
エポキシ基板及びアルミナセラミックス基板を示した
が、耐熱性のある、機械的強度の高い絶縁性基板であれ
ば、他の基板を用いてもよい。また、信号用電極の形状
は円形に限らず、角形、楕円形など他の形状でもよい。
また、チップコンデンサを信号用電極１個当り２個設け
たが、この数は一例であって、除去する周波数範囲に応
じてチップコンデンサを１個又は３個以上設けてもよ
く、或いは除去する周波数範囲に応じて静電容量を変え
てもよい。更に、端子挿入用孔の数、又はスルーホール
の数は一例であって、上記例に限るものではない。Although a glass epoxy substrate and an alumina ceramics substrate are shown as the insulating substrate in the above example, other substrates may be used as long as they are heat resistant and have high mechanical strength. Further, the shape of the signal electrode is not limited to a circular shape, but may be another shape such as a square shape or an elliptical shape.
Further, two chip capacitors are provided for each signal electrode, but this number is an example, and one or three or more chip capacitors may be provided depending on the frequency range to be removed, or the frequency to be removed. The capacitance may be changed according to the range. Furthermore, the number of terminal insertion holes or the number of through holes is an example, and is not limited to the above example.
【００１３】[0013]
【発明の効果】以上述べたように、本発明によれば、以
下の優れた効果を奏する。 (a) コンデンサ素子として従来の貫通コンデンサの代わ
りにチップコンデンサを用いるため、信号線路間を狭ピ
ッチ化でき、ノイズフィルタブロックの小型化、薄型化
が可能となり、これを内蔵するフィルタコネクタの小型
化が可能となる。 (b) コネクタ等に装着した後、コネクタピン等の端子に
荷重を加えてもコンデンサ素子であるチップコンデンサ
には直接荷重がかからないため、チップコンデンサを損
傷させることがない。また温度サイクル試験を実施して
も割れ等の発生がない。As described above, the present invention has the following excellent effects. (a) Since a chip capacitor is used as the capacitor element instead of the conventional feedthrough capacitor, the pitch between signal lines can be narrowed, and the noise filter block can be made smaller and thinner, and the filter connector incorporating this can be made smaller. Is possible. (b) Since the chip capacitor, which is a capacitor element, is not directly loaded even if a load is applied to the terminals such as connector pins after it is mounted on the connector, the chip capacitor is not damaged. Moreover, even if a temperature cycle test is performed, no cracks or the like occur.
【００１４】(c) チップコンデンサを搭載しているた
め、従来の貫通コンデンサと比べて静電容量の取得範囲
が広く、十分に高周波ノイズを除去できるとともに、チ
ップコンデンサを複数個搭載し、例えば高周波用、低周
波用のチップコンデンサを組合せれば、広い周波数範囲
のノイズ対策が可能となる。 (d) 絶縁性基板の表面及び裏面にそれぞれ第１及び第２
アース電極を設けて、基板端面又はスルーホールにより
両アース電極を電気的に接続するため、コネクタ等のア
ース用シールドケースに取り付けた場合、シールド効果
が高いとともに、アース側に発生する残留インダクタン
スが抑えられ、高周波除去効果に優れている。(C) Since the chip capacitor is mounted, the capacitance acquisition range is wider than that of the conventional feedthrough capacitor, and high-frequency noise can be sufficiently removed. By combining a chip capacitor for high frequency and low frequency, it is possible to take measures against noise in a wide frequency range. (d) First and second on the front and back of the insulating substrate, respectively.
Since a ground electrode is provided and both ground electrodes are electrically connected by the end face of the board or through holes, when installed in a ground shield case such as a connector, the shield effect is high and the residual inductance generated on the ground side is suppressed. And is excellent in high frequency removal effect.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明第１実施例のノイズフィルタブロックの
図２のＡ−Ａ線断面図。FIG. 1 is a sectional view of the noise filter block according to the first embodiment of the present invention taken along the line AA of FIG.
【図２】その平面図。FIG. 2 is a plan view thereof.
【図３】その外観斜視図。FIG. 3 is an external perspective view thereof.
【図４】その反転した外観斜視図。FIG. 4 is an inverted perspective view of the same.
【図５】本発明第２実施例のノイズフィルタブロックの
図６のＢ−Ｂ線断面図。5 is a cross-sectional view of the noise filter block of the second embodiment of the present invention taken along the line BB of FIG.
【図６】その平面図。FIG. 6 is a plan view thereof.
【図７】その外観斜視図。FIG. 7 is an external perspective view thereof.
【図８】その反転した外観斜視図。FIG. 8 is an inverted perspective view of the same.
Ｐ コネクタピン（信号線路） １０，２０ ノイズフィルタブロック １１ 絶縁性基板 １２ 端子挿入用孔 １２ａ，１３ａ 内面電極 １３ スルーホール １４ 信号用電極 １５，１８ 絶縁間隙 １６ 第１アース電極 １７ 第２アース電極 １９ チップコンデンサ １９ａ ベアチップ １９ｂ，１９ｃ 端子電極 ２１ 端面電極 P Connector pin (signal line) 10, 20 Noise filter block 11 Insulating substrate 12 Terminal insertion hole 12a, 13a Inner surface electrode 13 Through hole 14 Signal electrode 15, 18 Insulation gap 16 First earth electrode 17 Second earth electrode 19 Chip capacitor 19a Bare chip 19b, 19c Terminal electrode 21 End surface electrode
Claims (3)
あけて設けられた絶縁性基板(11)と、 前記基板(11)の孔周縁の表面に前記孔(12)の内面の内面
電極(12a)に連続して形成された信号用電極(14)と、 前記信号用電極(14)と所定の絶縁間隙(15)をあけて前記
基板(11)の表面に形成された第１アース電極(16)と、 前記孔(12)の内面の内面電極(12a)と所定の絶縁間隙(1
8)をあけて前記基板(11)の裏面に形成され前記第１アー
ス電極(16)に電気的に接続された第２アース電極(17)
と、 ベアチップ(19a)両端に設けられた一対の端子電極(19b,
19c)を前記信号用電極(14)と前記第１アース電極(16)に
それぞれ接続するように前記基板(11)の表面の前記信号
用電極(14)と前記第１アース電極(16)との間に架設され
たチップコンデンサ(19)とを備えたノイズフィルタブロ
ック。1. An insulative substrate (11) having a plurality of terminal insertion holes (12) provided at predetermined intervals, and an inner surface of the hole (12) on a surface of a hole periphery of the substrate (11). A signal electrode (14) continuously formed on the inner surface electrode (12a) of the electrode, and a predetermined insulating gap (15) from the signal electrode (14) formed on the surface of the substrate (11). A predetermined insulation gap (1) is formed between the first ground electrode (16) and the inner electrode (12a) on the inner surface of the hole (12).
A second ground electrode (17) which is formed on the back surface of the substrate (11) by opening 8) and is electrically connected to the first ground electrode (16).
And a pair of terminal electrodes (19b, 19b) provided on both ends of the bare chip (19a).
19c) is connected to the signal electrode (14) and the first ground electrode (16) respectively, and the signal electrode (14) and the first ground electrode (16) on the surface of the substrate (11) are connected to each other. A noise filter block including a chip capacitor (19) installed between the two.
3)が設けられ、第１アース電極(16)と第２アース電極(1
7)が前記スルーホール(13)の内面電極(13a)を介して電
気的に接続された請求項１記載のノイズフィルタブロッ
ク。2. A plurality of through holes (1) in an insulating substrate (11).
3) is provided, and the first ground electrode (16) and the second ground electrode (1
The noise filter block according to claim 1, wherein 7) is electrically connected through an inner surface electrode (13a) of the through hole (13).
形成され、第１アース電極(16)と第２アース電極(17)が
前記端面電極(21)を介して電気的に接続された請求項１
記載のノイズフィルタブロック。3. An end surface electrode (21) is formed on an end surface of an insulating substrate (11), and a first ground electrode (16) and a second ground electrode (17) are electrically connected via the end surface electrode (21). Claim 1 connected to
Noise filter block as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5056735A JPH06268464A (en) | 1993-03-17 | 1993-03-17 | Noise filter block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5056735A JPH06268464A (en) | 1993-03-17 | 1993-03-17 | Noise filter block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06268464A true JPH06268464A (en) | 1994-09-22 |
Family
ID=13035778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5056735A Pending JPH06268464A (en) | 1993-03-17 | 1993-03-17 | Noise filter block |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06268464A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100432361B1 (en) * | 2001-05-29 | 2004-05-22 | 김성열 | Lead-through type filter with improved function of shielding |
| TWI382633B (en) * | 2004-11-29 | 2013-01-11 | Tdk Corp | Noise filter and motor |
| JP2013065800A (en) * | 2011-09-20 | 2013-04-11 | Bosch Corp | Printed wiring board |
| EP2669915A1 (en) | 2012-05-30 | 2013-12-04 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| EP2669914A1 (en) | 2012-05-30 | 2013-12-04 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| EP2713378A1 (en) | 2012-09-27 | 2014-04-02 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| JP2014154395A (en) * | 2013-02-08 | 2014-08-25 | Auto Network Gijutsu Kenkyusho:Kk | Noise filter built-in joint connector |
| US8934215B2 (en) | 2012-07-20 | 2015-01-13 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| WO2018189226A1 (en) * | 2017-04-11 | 2018-10-18 | Enraf-Nonius B.V. | Electrical device comprising filter and feedthrough capacitor |
-
1993
- 1993-03-17 JP JP5056735A patent/JPH06268464A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100432361B1 (en) * | 2001-05-29 | 2004-05-22 | 김성열 | Lead-through type filter with improved function of shielding |
| TWI382633B (en) * | 2004-11-29 | 2013-01-11 | Tdk Corp | Noise filter and motor |
| JP2013065800A (en) * | 2011-09-20 | 2013-04-11 | Bosch Corp | Printed wiring board |
| KR20130135015A (en) | 2012-05-30 | 2013-12-10 | 삼성전기주식회사 | Laminated chip electronic component, board for mounting the same, packing unit thereof |
| EP2669914A1 (en) | 2012-05-30 | 2013-12-04 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| US20130321981A1 (en) | 2012-05-30 | 2013-12-05 | Young Ghyu Ahn | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| US9099242B2 (en) | 2012-05-30 | 2015-08-04 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| KR20130135014A (en) | 2012-05-30 | 2013-12-10 | 삼성전기주식회사 | Laminated chip electronic component, board for mounting the same, packing unit thereof |
| US8638543B2 (en) | 2012-05-30 | 2014-01-28 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| KR20140028092A (en) | 2012-05-30 | 2014-03-07 | 삼성전기주식회사 | Laminated chip electronic component, board for mounting the same, packing unit thereof |
| EP2669915A1 (en) | 2012-05-30 | 2013-12-04 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| US9576728B2 (en) | 2012-05-30 | 2017-02-21 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| EP2819134A2 (en) | 2012-05-30 | 2014-12-31 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| EP2827351A1 (en) | 2012-05-30 | 2015-01-21 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component and board for mounting the laminated component |
| US8934215B2 (en) | 2012-07-20 | 2015-01-13 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| EP2713378A1 (en) | 2012-09-27 | 2014-04-02 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| EP2849190A1 (en) | 2012-09-27 | 2015-03-18 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| US9155197B2 (en) | 2012-09-27 | 2015-10-06 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| JP2014154395A (en) * | 2013-02-08 | 2014-08-25 | Auto Network Gijutsu Kenkyusho:Kk | Noise filter built-in joint connector |
| WO2018189226A1 (en) * | 2017-04-11 | 2018-10-18 | Enraf-Nonius B.V. | Electrical device comprising filter and feedthrough capacitor |
| US11564339B2 (en) | 2017-04-11 | 2023-01-24 | Enraf-Nonius B.V. | Electrical device comprising filter and feedthrough capacitor |
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