JPH062993U - Inverter element cooling device - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a reliable cooling device that is inexpensive, does not generate noise. [Structure] The heat sink 2 for cooling the inverter element 4 is mounted on the outer surface of the board 5.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an inverter element cooling device for efficiently cooling an inverter element in a high frequency power supply device or the like.

[0002]

[Prior art]

 Generally, the inverter element generates heat when energized, and when the temperature of the inverter element exceeds a predetermined value, sufficient specifications cannot be exhibited. Therefore, as a means for cooling the inverter element, the inverter element cooling device shown in FIGS. 3 and 4 has been conventionally used.

That is, a plurality of inverter elements 4 are mounted on the front surface 3 of a cooling heat sink 2 having a plurality of air passages 1 formed in the vertical direction, the heat sink 2 is housed in a board 5, and the heat sink 2 is placed under the heat sink 2. An air-cooling fan 6 is provided in the heat sink 2 to forcibly air-cool the heat sink 2 to cool the inverter element 4. Since this series of operations is performed in the board 5, the temperature in the board 5 rises. Therefore, another ventilation fan 7 is attached to the board 5 to ventilate the inside of the board 5.

[0004]

[Problems to be solved by the device]

 In the case of the conventional cooling device, since the air cooling fan 6 and the ventilation fan 7 are used, it is expensive, and since it is a rotating machine, noise is generated and the reliability of the device decreases. There is. The present invention has been made in consideration of the above points, and an object thereof is to provide an inexpensive inverter device cooling device which does not generate noise.

[0005]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, the inverter element cooling device of the present invention has a heat sink for cooling the inverter element mounted on the outer surface of the board.

[0006]

[Action]

 In the inverter element cooling device of the present invention configured as described above, since the heat sink for cooling the inverter element is mounted on the outer surface of the board, the heat sink is cooled by the outside air temperature due to the convection of the air outside the board. As a result, the inverter element is cooled, the fan for air cooling and the fan for ventilation are not used, the cost is low, the noise is not generated, the failure is not caused, and the reliability is improved.

[0007]

【Example】

 One embodiment will be described with reference to FIGS. 1 and 2. In these drawings, the same reference numerals as those in FIGS. 3 and 4 denote the same or corresponding ones, and a notch 8 facing upward and downward is formed at one corner of the board 5, and the notch 8 is formed on the outer surface of the board 5. The front surface 3 of the cooling heat sink 2 having the inverter element 4 mounted thereon is mounted. In this case, a through hole in which the inverter element 4 is located may be formed in the wall plate of the board body 5, and the heat sink 2 may be attached to the outer surface of the wall board of the board body 5 to attach the inverter element 4 to the board body 5. The inverter element 4 may be mounted on the inner surface of the wall plate so that the inverter element 4 is positioned with respect to the front surface 3 of the heat sink 2 via the wall plate. In addition, 9 is a front door of the board 5.

The larger the difference in temperature of the heat sink 2 with respect to the temperature of the inverter element 4, the greater the cooling effect, and the faster the diffusion speed of the heat transferred to the heat sink 2, the better.

[0009]

[Effect of device]

 Since the present invention is configured as described above, it has the following effects. In the inverter element cooling device of the present invention, since the cooling heat sink 2 for the inverter element 4 is mounted on the outer surface of the board 5, the heat sink 2 is cooled by the outside air temperature due to the convection of the air outside the board 5, and the inverter is cooled. Since the element 4 can be cooled and there is no need to use conventional air-cooling fans and ventilation fans, the cost is low, noise is not generated, failure does not occur, and reliability is improved. it can.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a perspective view of a part of FIG. 1 viewed from the back.

FIG. 3 is a perspective view of a conventional example.

FIG. 4 is a perspective view of a part of FIG.

[Explanation of symbols]

 2 Cooling heat sink 4 Inverter element 5 Board

Claims (1)

[Scope of utility model registration request] 1. An inverter element cooling device in which a heat sink for cooling an inverter element is mounted on the outer surface of a board.