JPH0630448Y2 - Optical print head - Google Patents
Optical print headInfo
- Publication number
- JPH0630448Y2 JPH0630448Y2 JP1987201448U JP20144887U JPH0630448Y2 JP H0630448 Y2 JPH0630448 Y2 JP H0630448Y2 JP 1987201448 U JP1987201448 U JP 1987201448U JP 20144887 U JP20144887 U JP 20144887U JP H0630448 Y2 JPH0630448 Y2 JP H0630448Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode array
- wiring
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
【考案の詳細な説明】 (イ)産業上の利用分野 本考案は発光ダイオードアレイを用いた光プリントヘッ
ドに関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an optical print head using a light emitting diode array.
(ロ)従来の技術 以前より発光ダイオードアレイを光プリントヘッドに用
いることが検討されてきたが、発光ダイオードアレイや
その駆動素子は点灯駆動により発熱し、高温になると発
光出力が低下するので、特に高解像度印写用ヘッドやＡ
３版用〜ＡＯ版用等の長尺ヘッドにおいては放熱につい
て配慮が必要であった。そして放熱特性を良くする方法
の１つとして特開昭６２−２００７７６号公報等に示さ
れている如く、ヘッド基板として金属板を用いることが
提案されている。これは第２図に示すように金属の基板
(10)の上に発光ダイオードアレイ(20)や駆動素子(30)を
載置するのであるが、発光ダイオードアレイ(20)の共通
電極と駆動素子(30)の裏面とは電位が異なる場合が多い
ので、両者の間に電気的な絶縁を行ったうえ熱的に良伝
導体で基板に固着しなければならないが、それを効果的
に行う方法がなかった。(B) Conventional technology It has been considered to use a light emitting diode array in an optical print head for a long time.However, since the light emitting diode array and its driving element generate heat due to lighting drive and the light emission output decreases at high temperature, High resolution printing head and A
It was necessary to consider heat dissipation in the long heads for the 3rd plate to the AO plate. Then, as one of the methods for improving the heat dissipation characteristics, as disclosed in Japanese Patent Laid-Open No. 62-200776, it is proposed to use a metal plate as a head substrate. This is a metal substrate as shown in FIG.
The light emitting diode array (20) and the driving element (30) are mounted on (10), but the common electrode of the light emitting diode array (20) and the back surface of the driving element (30) may have different potentials. Since many of them have to be electrically insulated from each other and thermally fixed to the substrate with a good conductor, there is no effective way to do so.
また、発光ダイオードアレイは光プリンタの解像度に対
応した発光部を有するので配線が高密度になる。そこで
発光ダイオードアレイ(20)と駆動素子(30)を直接に配線
手段(40)で配線すると高精度パターン配線技術等の高度
でかつ高価な技術を用いなくともよい。しかし乍ら発光
ダイオードアレイ(20)も駆動素子(30)も基板(10)上に固
着されていると、各々の発熱量の差等によって配線手段
(40)に応力が加わり接続不良を生じたりするなどの欠点
を有する。Further, since the light emitting diode array has the light emitting portion corresponding to the resolution of the optical printer, the wiring has a high density. Therefore, if the light emitting diode array (20) and the driving element (30) are directly wired by the wiring means (40), it is not necessary to use a sophisticated and expensive technique such as a high precision pattern wiring technique. However, if both the light emitting diode array (20) and the driving element (30) are fixed on the substrate (10), the wiring means may be different due to the difference in the amount of heat generated from each.
There is a defect that stress is applied to (40) and connection failure may occur.
(ハ)考案が解決しようとする問題点 本考案は上述の点を考慮してなされたもので、効率よく
放熱され高密度配線があっても熱による配線不良の生じ
ない光プリントヘッドを提供するものである。(C) Problems to be solved by the present invention The present invention has been made in consideration of the above points, and provides an optical print head that efficiently radiates heat and does not cause wiring failure due to heat even with high-density wiring. It is a thing.
(ニ)問題点を解決するための手段 本考案は駆動素子を基板に固着することなく発光ダイオ
ードアレイの近傍に配置し、発光ダイオードアレイと駆
動素子とを直接に配線し、駆動素子上の配線手段の接続
部を覆うように駆動素子表面に熱伝導性の良い絶縁樹脂
を設けたものである。(D) Means for solving the problems In the present invention, the driving element is arranged in the vicinity of the light emitting diode array without being fixed to the substrate, the light emitting diode array and the driving element are directly wired, and the wiring on the driving element is An insulating resin having good thermal conductivity is provided on the surface of the driving element so as to cover the connecting portion of the means.
(ホ)作用 これにより熱は配線手段を伝播したり絶縁樹脂表面から
効率良く放出され、しかも局部的な発熱が生じても駆動
素子は固着されていない上配線手段の接続部を絶縁樹脂
が覆っているので接続不良に至らない。(E) Function As a result, heat propagates through the wiring means and is efficiently radiated from the surface of the insulating resin, and even if local heat is generated, the drive element is not fixed and the insulating resin covers the connection part of the upper wiring means. It does not lead to poor connection.
(ヘ)実施例 第１図は本考案実施例の光プリントヘッドの要部斜視図
で、(1)は基板であり、両側部に配線部(11)(11)を有し
た好ましくは金属、より好ましくは発光ダイオードアレ
イと熱膨張係数が同等のニッケル鋼板等からなる。(2)
はＧａＡｓＰ／ＧａＡｓ等からなる発光ダイオードアレ
イで、表面に整列された発光領域(21)(21)…と個別電極
(22)(22)…を有し、基板(1)の略中央部に導電性接着材
等で固着されている。この様な発光ダイオードアレイ
(2)は図示していないが光プリンタの主走査長にわたる
様複数個が整列して設けられている。(3)(3)は発光ダイ
オードアレイ(2)の近傍に配置された駆動素子で、後述
する配線手段によって中空に保持されるか、又は基板
(1)上に設けた絶縁物の上に載せられるなど、固着され
ずに可動な状態で配置されている。(4)(4)は発光ダイオ
ードアレイ(2)の個別電極と駆動素子(3)の出力パットを
直接に配線する第１の配線手段で、金属細線が絶縁シー
トで保持されたフィルムキャリアを図示しているが、転
写バンプ法とか、ギャングボンド法等で配線が施こされ
る。(5)(5)は駆動素子(3)の入力パットや電源パットと
配線部(11)(11)とを接続することにより、駆動素子(3)
に点灯信号や電力を供給する第２の配線手段である。
(6)(6)は駆動素子(3)(3)上の配線手段(4)(5)の接続部を
覆う様に駆動素子(3)(3)の表面全面に設けられた熱伝導
性の良い絶縁樹脂である。この様な絶縁樹脂(6)(6)は３
×10-3cal/cm sec℃程度の放熱性樹脂でもよいが、良熱
伝導性シリコングリス（例えば信越化学工業（株）Ｇ７
４６、熱伝導率１１×10-3cal/cm sec℃）等であればよ
り好ましい。(F) Embodiment FIG. 1 is a perspective view of an essential part of an optical print head according to an embodiment of the present invention, in which (1) is a substrate, preferably a metal having wiring parts (11) and (11) on both sides, More preferably, the light emitting diode array is made of a nickel steel plate or the like having the same thermal expansion coefficient. (2)
Is a light emitting diode array made of GaAsP / GaAs, etc., and the light emitting regions (21) (21) ... and individual electrodes aligned on the surface
(22), (22), and the like, which are fixed to the substantially central portion of the substrate (1) with a conductive adhesive or the like. Such a light emitting diode array
Although not shown in the drawing, a plurality of (2) are provided so as to extend over the main scanning length of the optical printer. (3) (3) is a driving element arranged in the vicinity of the light emitting diode array (2), which is held in the hollow by a wiring means described later or a substrate
(1) It is placed in a movable state without being fixed, such as being placed on an insulator provided above. (4) (4) is the first wiring means for directly wiring the individual electrodes of the light emitting diode array (2) and the output pad of the driving element (3), and is a film carrier in which thin metal wires are held by an insulating sheet. Although shown, wiring is applied by a transfer bump method, a gang bond method, or the like. (5) (5) is a drive element (3) by connecting the input pad and power pad of the drive element (3) and the wiring section (11) (11)
It is a second wiring means for supplying a lighting signal and electric power to.
(6) (6) is a thermal conductivity provided on the entire surface of the drive element (3) (3) so as to cover the connection part of the wiring means (4) (5) on the drive element (3) (3) It is a good insulating resin. Such insulating resin (6) (6) is 3
A heat-dissipating resin with a temperature of about 10 -3 cal / cm sec ℃ may be used, but a good heat conductive silicon grease (for example, Shin-Etsu Chemical Co., Ltd. G7
46, thermal conductivity 11 × 10 −3 cal / cm sec ° C.) or the like is more preferable.
(ト)考案の効果 以上の如くにより絶縁樹脂は、駆動素子表面（概ね平
面）にあって配線手段との熱の授受を行って配線手段か
らの放熱あるいは配線手段を伝播しての放熱を効率よく
行わしめる他、盛り上りにより表面積が増えるから絶縁
樹脂からの放熱量も多い。これにより光プリントヘッド
を標準原稿にあわせて駆動した時ヘッド温度５５℃以下
に維持できた。また駆動素子は基板に固着しないので大
気もしくは充分な厚みの絶縁物を配置することが出来、
しかも局部的な発熱やそれに伴う配線材料の伸縮等が生
じても駆動素子の微動や配線接続部を絶縁樹脂が覆って
補強していることにより接続不良は生じない。(G) Effect of the invention As described above, the insulating resin transfers heat to and from the wiring means on the surface of the driving element (generally flat surface) to efficiently dissipate heat from the wiring means or from the wiring means. In addition to being performed frequently, the surface area increases due to swelling, so the amount of heat released from the insulating resin is large. As a result, when the optical print head was driven according to the standard document, the head temperature could be maintained at 55 ° C. or lower. In addition, since the driving element does not adhere to the substrate, it is possible to place air or an insulator of sufficient thickness.
Moreover, even if local heat generation or expansion / contraction of the wiring material occurs due to it, fine movement of the drive element and the wiring connection portion are covered with the insulating resin to reinforce, so that no connection failure occurs.
第１図は本考案実施例の光プリントヘッドの要部斜視
図、第２図は従来の光プリントヘッドの断面図である。 (1)……基板、(2)……発光ダイオードアレイ、(3)(3)…
…駆動素子、(4)(4)……第１の配線手段、(5)(5)……第
２の配線手段、(6)(6)……絶縁樹脂。FIG. 1 is a perspective view of an essential part of an optical print head according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional optical print head. (1) ... Substrate, (2) ... Light emitting diode array, (3) (3) ...
... drive element, (4) (4) ... first wiring means, (5) (5) ... second wiring means, (6) (6) ... insulating resin.
Claims (1)
イオードアレイと、発光ダイオードアレイの近傍に可動
状態で配置された駆動素子と、発光ダイオードアレイと
駆動素子に直接配線を施こす第１の配線手段と、駆動素
子に点灯信号や電力を供給する第２の配線手段と、第
１、第２の配線手段の駆動素子上の接続部を覆う様に駆
動素子表面に設けられた熱伝導性の良い絶縁樹脂とを具
備した事を特徴とする光プリントヘッド。1. A substrate, a light emitting diode array mounted and fixed on the substrate, a driving element movably arranged near the light emitting diode array, and a wiring is directly provided to the light emitting diode array and the driving element. It is provided on the surface of the drive element so as to cover the first wiring means, the second wiring means for supplying a lighting signal and electric power to the drive element, and the connection portion on the drive element of the first and second wiring means. An optical print head comprising an insulating resin having good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987201448U JPH0630448Y2 (en) | 1987-12-28 | 1987-12-28 | Optical print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987201448U JPH0630448Y2 (en) | 1987-12-28 | 1987-12-28 | Optical print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104343U JPH01104343U (en) | 1989-07-13 |
| JPH0630448Y2 true JPH0630448Y2 (en) | 1994-08-17 |
Family
ID=31491806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987201448U Expired - Lifetime JPH0630448Y2 (en) | 1987-12-28 | 1987-12-28 | Optical print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0630448Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007097281A1 (en) * | 2006-02-22 | 2007-08-30 | Stanley Electric Co., Ltd. | Illuminating apparatus |
| JP5195476B2 (en) * | 2009-02-04 | 2013-05-08 | 日立電線株式会社 | Optical transmission module |
-
1987
- 1987-12-28 JP JP1987201448U patent/JPH0630448Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01104343U (en) | 1989-07-13 |
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