JPH06310859A - Manufacture of multilayer thin-film wiring substrate - Google Patents

Abstract

PURPOSE:To manufacture a multilayer wiring board in less positional error by a method wherein a conductor in triangular shape as an outer peripheral is simultaneously arranged on the outer periphery of an inner layer circuit when the circuit of the inner layer circuit board is formed. CONSTITUTION:An etching resist is stuck on both surface of a 0.2mm thick glass epoxy resin Cu plating laminated board. Next, specific pattern and triangular outer peripheral conductor frame are formed on both surfaces of an inner layer board by patterning the etching resist to be etched using a negative film arranging a triangular outer peripheral frame pattern on a circuit pattern and the outer periphery. Next, 0.1mm thick glass fiber epoxy resin prepreg is inserted into the inner layer circuit plate. Furthermore, successive inner layer circuit plate is aligned to be arranged. Next, a bonding sheet and a 18 micron copper foiled mirror plate are arranged on both sides of the inner layer circuit. Next, the whole body is thermal pressure fixed for 90min at molding temperature of 170 deg.C and forming pressure of 4 MPa to obtain a 0.8mm thick six layer multilayer wiring board. Through these procedures, the multilayer wiring board in less positional error to be manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an electronic computer, a wireless device,
The present invention relates to a method for manufacturing a multilayer wiring board used for electric transmission equipment and the like.

[0002]

2. Description of the Related Art Generally, in a multilayer wiring board, a plurality of inner layer circuit boards on which desired conductor circuits are formed are prepared in advance, and an adhesive sheet is interposed therebetween, and if necessary, an adhesive sheet or a copper foil is further provided outside the inner layer board. Are arranged, and they are heated and pressed to be laminated and adhered to each other. In order to maintain the dimensional accuracy and the board thickness accuracy of the multilayer wiring board, it is necessary to prevent deformation of the inner layer circuit during various processes and to improve the dimensional accuracy. Is especially important for quality. In order to prevent this shift, a method of providing a strip-shaped conductor portion on the outer peripheral portion of the inner layer circuit board is generally used.

[0003]

In the generally used method of providing a strip-shaped conductor portion, the inner-layer circuit board is deformed to reduce the dimensional accuracy when laminated and bonded, and the pattern between the inner-layer circuit boards is further reduced. It has a serious problem of reducing the position accuracy.

The present invention provides a method for manufacturing a multilayer wiring board in which the pattern position accuracy of a plurality of inner layer circuit boards is high.

[0005]

A method for manufacturing a multilayer wiring board according to the present invention is a method for manufacturing a multilayer wiring board in which a plurality of inner layer circuit boards are thermocompression-bonded via an adhesive sheet. At the time of formation, a triangular conductor portion is simultaneously formed as an outer peripheral frame on the outer peripheral portion of the inner layer circuit, and is arranged.

The present invention will be described with reference to FIG. An inner layer plate is prepared as shown in FIG. 1-A. At this time, the inner layer plate may be a double-sided copper-clad laminated plate, or may be a single-sided copper-clad laminated plate. Next, as shown in FIG. 1-B, after laminating an etching resist on the inner layer plate, baking and development are performed.
At this time, an etching resist may be directly printed on the surface of the inner layer plate to draw a circuit. At the same time as this circuit drawing, it is desirable to form one triangular outer peripheral portion on the outer peripheral portion of the inner layer plate.
Next, as shown in FIG. 1-C, etching is performed to form a desired circuit pattern and a triangular conductor outer peripheral frame. Next, Fig. 1-
As shown in D, an adhesive sheet is placed on the inner layer circuit board. Further, an inner layer circuit board is arranged, and an adhesive sheet and a copper foil or a copper clad laminate on one side, a multilayer wiring board, a heat resistant sheet, etc. are arranged on both sides, and sandwiched between mirror plates. Thereafter, as shown in FIG. 1-E, heating and pressurization are performed to laminate and adhere. The heating and pressurizing means and conditions may be the same as conventional ones. As a result, the multilayer wiring board shown in FIG. 1-F can be manufactured.

[0007]

With the triangular outer peripheral frame provided on the inner layer circuit board of the present invention, the dimensional accuracy of the inner layer circuit board and the deformation of the inner layer circuit board due to the conventional method of providing the strip-shaped conductor portion are suppressed.
It is possible to improve dimensional accuracy and pattern position accuracy.

[0008]

Example 1 Glass cloth epoxy resin copper-clad laminate M having a thickness of 0.2 mm
CL-E-67 (manufactured by Hitachi Chemical Co., Ltd., trade name) is laminated with etching resist on both surfaces. An etching resist was patterned using a negative film having a circuit pattern and a triangular outer peripheral frame pattern arranged on the outer peripheral portion, and etching was performed to form a desired pattern and a triangular outer peripheral conductor frame on both surfaces of the inner layer plate. Next, 0.
1mm glass cloth epoxy resin prepreg GE-67N
(Manufactured by Hitachi Chemical Co., Ltd., trade name). Furthermore, the next inner layer circuit board was aligned and arranged. An adhesive sheet, an 18-micron copper foil, and a mirror plate were sequentially arranged on both sides of this. 90 at a molding temperature of 170 ° C. and a forming pressure of 4 MPa
After thermocompression bonding, a 6-layer multilayer wiring board having a board thickness of 0.8 mm was obtained.

Example 2 Instead of the 0.2 mm thick glass cloth epoxy resin copper clad laminate of Example 1, a 0.1 mm thick glass cloth epoxy resin copper clad laminate MCL-E-67 (Hitachi Chemical Co., Ltd.) was used. A 6-layer multilayer wiring board having a board thickness of 0.6 mm was obtained in the same manner as in Example 1 except that the product name was manufactured by Co., Ltd. Table 1 shows the positional deviation amounts in the first and second embodiments according to the method of the present invention in comparison with the conventional method.

[0010]

[Table 1]

[0011]

As described above, according to the method of the present invention, it is possible to provide a method for manufacturing a multilayer wiring board with a small amount of displacement.

[Brief description of drawings]

FIG. 1 is a perspective view of each manufacturing process showing an embodiment of the present invention.

Claims (1)

[Claims] 1. A method for manufacturing a multilayer wiring board, which comprises thermocompression-bonding a plurality of inner-layer circuit boards through an adhesive sheet, and at the same time when forming a circuit of the inner-layer circuit boards, at the same time, a triangular conductor portion is provided on an outer peripheral portion of the inner-layer circuit. Is used as an outer peripheral frame, and is arranged.