JPH06320696A - Manufacture of epoxy resin laminated plate - Google Patents
Manufacture of epoxy resin laminated plateInfo
- Publication number
- JPH06320696A JPH06320696A JP5112610A JP11261093A JPH06320696A JP H06320696 A JPH06320696 A JP H06320696A JP 5112610 A JP5112610 A JP 5112610A JP 11261093 A JP11261093 A JP 11261093A JP H06320696 A JPH06320696 A JP H06320696A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- heating
- temperature
- hole
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 53
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 230000009477 glass transition Effects 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000004745 nonwoven fabric Substances 0.000 abstract 1
- 239000002759 woven fabric Substances 0.000 abstract 1
- 239000004744 fabric Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はスルホールに導電路を有
するプリント配線板に用いられるエポキシ樹脂積層板の
製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an epoxy resin laminated board used for a printed wiring board having a conductive path in a through hole.
【０００２】[0002]
【従来の技術】電子機器等のプリント配線板に用いられ
るエポキシ樹脂積層板は、ガラス布等の基材にエポキシ
樹脂を含浸し半硬化したプリプレグに、必要により銅箔
等の金属箔を積層し、加熱加圧して成形される。近年の
電子機器の進歩に伴って、プリント配線板の高密度化が
進みプリント配線板の導電路に対する信頼性の要求が厳
しくなってきている。特に、スルホールに形成した導電
路の信頼性に対する要求が厳しい。しかし、従来のエポ
キシ樹脂積層板を用い、スルホールに導電路を形成した
プリント配線板を、例えば、１２５℃とマイナス６５℃
の温度サイクル試験等繰り返し温度差の大きな環境下で
使用すると、上記スルホール内の導電路は、断線し易い
欠点がある。2. Description of the Related Art Epoxy resin laminated boards used for printed wiring boards of electronic devices are such that a base material such as glass cloth is impregnated with epoxy resin and a semi-cured prepreg is laminated with a metal foil such as a copper foil if necessary. , Is heated and pressed to be molded. With the progress of electronic devices in recent years, the density of printed wiring boards has increased, and the requirements for reliability of the conductive paths of the printed wiring boards have become strict. In particular, there is a severe demand for the reliability of the conductive paths formed in the through holes. However, using a conventional epoxy resin laminated board, a printed wiring board in which a conductive path is formed in a through hole is, for example, 125 ° C. and −65 ° C.
When used in an environment where the temperature difference is large, such as the temperature cycle test, the conductive paths in the through holes have the drawback of being easily broken.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記事実に鑑
みてなされたもので、その目的とするところは、スルホ
ールに形成した導電路の信頼性が向上するエポキシ樹脂
積層板の製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and an object thereof is to provide a method for manufacturing an epoxy resin laminated plate in which the reliability of a conductive path formed in a through hole is improved. To do.
【０００４】[0004]
【課題を解決するための手段】本発明のエポキシ樹脂積
層板の製造方法は、スルホールに導電路を有するプリン
ト配線板に用いられるエポキシ樹脂積層板の製造方法に
おいて、基材にエポキシ樹脂を含浸したプリプレグを積
層し、加熱加圧の成形をした後に、無加圧で、１００℃
以上であって、且つこのエポキシ樹脂のガラス転移温度
より３０℃アップの温度範囲で加熱することを特徴とす
る。The method for producing an epoxy resin laminate of the present invention is the method for producing an epoxy resin laminate used for a printed wiring board having a conductive path in a through hole, wherein the base material is impregnated with an epoxy resin. After laminating the prepregs and molding by heating and pressurizing, press at 100 ℃
The heating is performed in the temperature range of 30 ° C. higher than the glass transition temperature of the epoxy resin.
【０００５】[0005]
【作用】本発明においては、無加圧で、１００℃以上で
あって、且つこのエポキシ樹脂のガラス転移温度より３
０℃アップの温度範囲で加熱すると、成形の際に生じた
エポキシ樹脂の分子鎖のひずみを除去することができ、
エポキシ樹脂積層板として、厚さ方向の熱膨張率を小さ
くすることができるので、このエポキシ樹脂積層板を用
いてスルホールに導電路を有するプリント配線板を作成
し、温度差の大きな環境下で使用しても断線しにくく、
スルホールに形成した導電路の信頼性が増す。In the present invention, no pressure is applied, the temperature is 100 ° C. or higher, and the epoxy resin has a glass transition temperature of 3 or more.
By heating in the temperature range of 0 ° C up, the strain of the molecular chain of the epoxy resin generated during molding can be removed,
As an epoxy resin laminated board, the coefficient of thermal expansion in the thickness direction can be made small, so using this epoxy resin laminated board, a printed wiring board with a conductive path in the through hole is created and used in an environment with a large temperature difference. Even if it is hard to break,
The reliability of the conductive path formed in the through hole is increased.
【０００６】以下、本発明を詳細に説明する。本発明の
製造方法で得られるのは、エポキシ樹脂積層板である。
このエポキシ樹脂積層板は、エポキシ樹脂を基材に含浸
したプリプレグが用いられる。上記エポキシ樹脂は、単
独、変成物、混合物等、特に制限されない。上記基材
は、ガラス織布、不織布、マット等が挙げられ、特に制
限されない。このエポキシ樹脂を上記基材に含浸し半硬
化したプリプレグを数枚積層し、必要により銅箔等の金
属箔を重ねて、成形プレート等に挟み加熱加圧すると、
プリプレグのエポキシ樹脂が完全に硬化して、成形され
る。The present invention will be described in detail below. What is obtained by the manufacturing method of the present invention is an epoxy resin laminate.
For this epoxy resin laminate, a prepreg in which a base material is impregnated with an epoxy resin is used. The above-mentioned epoxy resin is not particularly limited and may be a single substance, a modified product, a mixture or the like. Examples of the base material include woven glass cloth, non-woven cloth, and mat, and are not particularly limited. This epoxy resin is impregnated into the above base material and several semi-cured prepregs are laminated, metal foils such as copper foil are overlapped if necessary, and sandwiched in a molding plate or the like and heated and pressed,
The epoxy resin of the prepreg is completely cured and molded.
【０００７】本発明においては、この成形した後に、無
加圧の状態で加熱する。上記加熱する温度は、１００℃
以上であって、且つこのエポキシ樹脂積層板のガラス転
移温度より３０℃アップの温度範囲である。１００℃未
満であると、エポキシ樹脂積層板の厚さ方向の熱膨張率
の低減する程度が少なかったり、或いは上記熱膨張率の
低減するに多大の時間を要して、生産効率が劣ってく
る。又、上記温度範囲より高い温度では、エポキシ樹脂
の可撓性が低くなり、スルホールを明ける際のドリル加
工に悪影響を及ぼす。加熱する時間としては、１０〜１
８０分が好ましい。上記温度範囲で加熱すると、成形の
際に生じたエポキシ樹脂の分子鎖のひずみを除去するこ
とができ、厚さ方向の熱膨張率が小さいエポキシ樹脂積
層板が得られる。In the present invention, after this molding, heating is performed in a non-pressurized state. The heating temperature is 100 ° C
The above is the temperature range of 30 ° C. higher than the glass transition temperature of the epoxy resin laminate. If the temperature is lower than 100 ° C, the thermal expansion coefficient of the epoxy resin laminate in the thickness direction is reduced to a small extent, or a large amount of time is required to reduce the thermal expansion coefficient, resulting in poor production efficiency. . Further, at a temperature higher than the above temperature range, the flexibility of the epoxy resin becomes low, which adversely affects the drilling process for drilling through holes. The heating time is 10 to 1
80 minutes is preferred. By heating within the above temperature range, the strain of the molecular chain of the epoxy resin generated during molding can be removed, and an epoxy resin laminate having a small coefficient of thermal expansion in the thickness direction can be obtained.
【０００８】このようにして得られたエポキシ樹脂積層
板は、表面及びスルホールに導電路を形成して、プリン
ト配線板に用いられる。上記エポキシ樹脂積層板の表面
に導電路を形成する方法は、金属箔をエッチングして形
成しても、メッキ等により形成しても、制限はない。上
記スルホールの導電路の形成は、公知の各種スルホール
メッキにより形成される。上記エポキシ樹脂積層板の厚
さ方向の熱膨張率が小さいので、上記スルホールに導電
路を有するプリント配線板として用いても、例えば、１
２５℃とマイナス６５℃の温度サイクル試験等繰り返し
温度差の大きな環境下の使用しても、スルホールに形成
された導電路の断線が起きにくく、スルホールの導電路
の信頼性が向上する。The epoxy resin laminate thus obtained is used as a printed wiring board by forming conductive paths on the surface and through holes. The method for forming the conductive path on the surface of the epoxy resin laminated plate is not limited to a method of forming a metal foil by etching or a method of plating. The conductive path of the through hole is formed by various known through hole plating. Since the epoxy resin laminate has a small coefficient of thermal expansion in the thickness direction, even if it is used as a printed wiring board having a conductive path in the through hole, for example, 1
Even when used in an environment with a large temperature difference such as a temperature cycle test of 25 ° C. and −65 ° C., the conductive path formed in the through hole is less likely to be broken, and the reliability of the conductive path of the through hole is improved.
【０００９】[0009]
実施例１ 厚さ０．２ｍｍのガラス布基材に、硬化後のガラス転移
温度が１３５℃のエポキシ樹脂を含浸、乾燥したプリプ
レグを８枚重ね、３５μｍの銅箔を両側に配し、成形プ
レートに挟み圧力５０ｋｇ／ｃｍ2 、温度１７０℃で６
０分間加熱加圧して成形した。その後成形プレートより
取り出し、成形した板を１枚づつ、平置きの状態で１４
５℃で３０分加熱し、エポキシ樹脂積層板を得た。な
お、エポキシ樹脂のガラス転移温度はサーマルメカニカ
ルアナライザ（ＴＭＡ）を用いて測定した値である。Example 1 A glass cloth substrate having a thickness of 0.2 mm was impregnated with an epoxy resin having a glass transition temperature after curing of 135 ° C., eight dried prepregs were stacked, and 35 μm copper foils were arranged on both sides to form a molding plate. Sandwiched between 50kg / cm 2 and 170 ℃ for 6
Molded by heating and pressing for 0 minutes. After that, take out from the forming plate, and place the formed plates one by one in a flat state.
It heated at 5 degreeC for 30 minutes, and obtained the epoxy resin laminated board. The glass transition temperature of the epoxy resin is a value measured using a thermal mechanical analyzer (TMA).
【００１０】得られたエポキシ樹脂積層板は、厚さが
１．６ｍｍであった。このエポキシ樹脂積層板の熱膨張
係数と温度サイクル試験でのスルホール信頼性を評価し
た。熱膨張係数は、７５℃から１２０℃に加温した際の
膨張率を測定し、求めた。The obtained epoxy resin laminate had a thickness of 1.6 mm. The coefficient of thermal expansion of this epoxy resin laminate and the through hole reliability in a temperature cycle test were evaluated. The coefficient of thermal expansion was obtained by measuring the coefficient of expansion when heated from 75 ° C to 120 ° C.
【００１１】スルホール信頼性の試験は、測定試料とし
て、得たエポキシ樹脂積層板に直径０．４ｍｍの穴をド
リルで２００個明けた。積層板の表面には導体幅０．２
ｍｍ、導電路間隔２．５４ｍｍ、ランド径１．０ｍｍの
導電路をエッチングにより形成した。スルホールには、
スルホールメッキ法を用いて導電路を形成した。導電路
形成した後に、１２５℃３０分とマイナス６５℃３０分
の環境下を１サイクルとし、この環境下に繰り返し保存
し、断線するまでのサイクルを測定した。In the test of the reliability of through holes, as a measurement sample, 200 holes having a diameter of 0.4 mm were drilled in the obtained epoxy resin laminated plate. Conductor width 0.2 on the surface of the laminate
mm, conductive path spacing 2.54 mm, and land diameter 1.0 mm were formed by etching. Throughhole,
Conductive paths were formed using the through-hole plating method. After forming the conductive path, an environment of 125 ° C. for 30 minutes and −65 ° C. for 30 minutes was defined as one cycle, and the cycle was repeatedly stored in this environment and the cycle until disconnection was measured.
【００１２】結果は表２のとおり、熱膨張係数は７０ｐ
ｐｍ／℃、スルホール信頼性の試験で断線が発生したの
は、４０５サイクルであった。The results are shown in Table 2, and the coefficient of thermal expansion is 70 p.
It was 405 cycles that the disconnection occurred in the pm / ° C and through hole reliability test.
【００１３】実施例２〜５ 硬化後のガラス転移温度が１７５℃のエポキシ樹脂を用
いたことと、成形した後の加熱温度と時間を表１に示す
条件としたこと以外は実施例１と同様に実施して、エポ
キシ樹脂積層板を得た。Examples 2 to 5 Same as Example 1 except that an epoxy resin having a glass transition temperature after curing of 175 ° C. was used and the heating temperature and time after molding were set to the conditions shown in Table 1. Then, the epoxy resin laminate was obtained.
【００１４】このエポキシ樹脂積層板を実施例１と同様
に、熱膨張係数と温度サイクル試験でのスルホール信頼
性を評価した。結果は表２のとおりであった。This epoxy resin laminate was evaluated for thermal expansion coefficient and through hole reliability in a temperature cycle test in the same manner as in Example 1. The results are shown in Table 2.
【００１５】比較例１ 実施例１と同様にして、厚さ０．２ｍｍのガラス布基材
に、硬化後のガラス転移温度が１３５℃のエポキシ樹脂
を含浸、乾燥したプリプレグを８枚重ね、３５μｍの銅
箔を両側に配し、成形プレートに挟み圧力５０ｋｇ／ｃ
ｍ2 、温度１７０℃で６０分間加熱加圧して成形して、
エポキシ樹脂積層板を得た。Comparative Example 1 In the same manner as in Example 1, a glass cloth base material having a thickness of 0.2 mm was impregnated with an epoxy resin having a glass transition temperature of 135 ° C. after curing, and eight dried prepregs were stacked to form 35 μm. Place the copper foil on both sides and sandwich it between the molding plates. Pressure 50kg / c
m 2 at a temperature of 170 ° C. for 60 minutes under heat and pressure to mold,
An epoxy resin laminate was obtained.
【００１６】このエポキシ樹脂積層板を実施例１と同様
にして、熱膨張係数と温度サイクル試験でのスルホール
信頼性を評価した。結果は表２のとおり、熱膨張係数は
８３ｐｐｍ／℃、スルホール信頼性試験は、３０２サイ
クルで断線した。This epoxy resin laminate was evaluated in the same manner as in Example 1 for the coefficient of thermal expansion and the reliability of through hole in a temperature cycle test. The results are shown in Table 2. The thermal expansion coefficient was 83 ppm / ° C, and the through-hole reliability test was broken at 302 cycles.
【００１７】比較例２ 実施例２と同様にして、厚さ０．２ｍｍのガラス布基材
に、硬化後のガラス転移温度が１７５℃のエポキシ樹脂
を含浸、乾燥したプリプレグを８枚重ね、３５μｍの銅
箔を両側に配し、成形プレートに挟み圧力５０ｋｇ／ｃ
ｍ2 、温度１７０℃で６０分間加熱加圧して成形して、
エポキシ樹脂積層板を得た。Comparative Example 2 In the same manner as in Example 2, a glass cloth base material having a thickness of 0.2 mm was impregnated with an epoxy resin having a glass transition temperature after curing of 175 ° C., and eight dried prepregs were stacked to form 35 μm. Place the copper foil on both sides and sandwich it between the molding plates. Pressure 50kg / c
m 2 at a temperature of 170 ° C. for 60 minutes under heat and pressure to mold,
An epoxy resin laminate was obtained.
【００１８】このエポキシ樹脂積層板を実施例１と同様
にして、熱膨張係数と温度サイクル試験でのスルホール
信頼性を評価した。結果は表２のとおり、熱膨張係数は
７４ｐｐｍ／℃、スルホール信頼性試験は、３３０サイ
クルで断線した。This epoxy resin laminate was evaluated in the same manner as in Example 1 to evaluate the coefficient of thermal expansion and the reliability of through holes in a temperature cycle test. The results are shown in Table 2. The coefficient of thermal expansion was 74 ppm / ° C, and the through hole reliability test was broken at 330 cycles.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【表２】 [Table 2]
【００２１】成形した後に、無加圧で加熱したエポキシ
樹脂積層板は、比較例に比べ熱膨張係数が小さく、温度
サイクル試験でのスルホール信頼性が向上した。After molding, the epoxy resin laminate heated without pressure had a smaller coefficient of thermal expansion than the comparative example, and the through hole reliability in the temperature cycle test was improved.
【００２２】[0022]
【発明の効果】本発明の製造方法によって得られるエポ
キシ樹脂積層板を用いると、スルホールに形成した導電
路の信頼性が向上したプリント配線板を得られる。By using the epoxy resin laminate obtained by the manufacturing method of the present invention, it is possible to obtain a printed wiring board in which the reliability of the conductive paths formed in the through holes is improved.
Claims (2)
線板に用いられるエポキシ樹脂積層板の製造方法におい
て、基材にエポキシ樹脂を含浸したプリプレグを積層
し、加熱加圧の成形をした後に、無加圧で、１００℃以
上であって、且つこのエポキシ樹脂のガラス転移温度よ
り３０℃アップの温度範囲で加熱することを特徴とする
エポキシ樹脂積層板の製造方法。1. A method of manufacturing an epoxy resin laminate used for a printed wiring board having a conductive path in a through hole, wherein a prepreg impregnated with an epoxy resin is laminated on a base material, and the mixture is heated and pressed before being applied with no load. A method for producing an epoxy resin laminate, which comprises heating at a temperature of 100 ° C. or higher and a temperature range of 30 ° C. higher than the glass transition temperature of the epoxy resin.
囲であることを特徴とする請求項１のエポキシ樹脂積層
板の製造方法。2. The method for producing an epoxy resin laminate according to claim 1, wherein the heating time is in the range of 10 to 180 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5112610A JPH06320696A (en) | 1993-05-14 | 1993-05-14 | Manufacture of epoxy resin laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5112610A JPH06320696A (en) | 1993-05-14 | 1993-05-14 | Manufacture of epoxy resin laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06320696A true JPH06320696A (en) | 1994-11-22 |
Family
ID=14591047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5112610A Pending JPH06320696A (en) | 1993-05-14 | 1993-05-14 | Manufacture of epoxy resin laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06320696A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104276477A (en) * | 2013-07-03 | 2015-01-14 | 株式会社日立制作所 | Emergency brake device and elevator |
-
1993
- 1993-05-14 JP JP5112610A patent/JPH06320696A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104276477A (en) * | 2013-07-03 | 2015-01-14 | 株式会社日立制作所 | Emergency brake device and elevator |
| JP2015013696A (en) * | 2013-07-03 | 2015-01-22 | 株式会社日立製作所 | Emergency stop device and elevator |
| CN104276477B (en) * | 2013-07-03 | 2017-07-18 | 株式会社日立制作所 | Emergency braking apparatus and elevator |
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