JPH0632439B2 - Substrate supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention is designed such that a large number of conductor pins used for electrical continuity and the like are driven into a board for mounting electronic components, such as a printed wiring board. In a manufacturing apparatus for forming an electronic component mounting substrate having a conductor pin, supplying the substrate,
The present invention relates to a board supply device used for fitting a large number of conductor pins.

(Prior Art) As a substrate for mounting electronic parts, there is a type of so-called pin grid array as shown in FIG. 6, for example. This type of electronic component mounting substrate is formed by implanting a large number of conductor pins (about 70 to 200 pins for one so-called IC chip) for electrical connection to the substrate that constitutes the electronic component mounting substrate. That is, the electronic component mounting board in which the conductor pins are driven is used for mounting electronic components, which have been abundantly integrated in recent years, on a large-sized board called a mother board through the conductor pins. In order to electrically connect the electronic component on the electronic component mounting board to the conductor circuit on the mother board, the conductor circuit is formed on the board and a large number of conductor pins are connected to the conductor circuit.

There are various conductor pins used for such an electronic component mounting board, and for example, those having a shape as shown in FIG. The conductor pin (40) shown on the left side of FIG. 7 is called a standard pin, and the conductor pin (40) and the head fitted into the hole formed in the substrate that constitutes the electronic component mounting substrate described above. It is composed of one flange for positioning the board with respect to the board, and a support fitted to the above-mentioned mother board. Further, the conductor pin (41) shown on the right side of FIG. 7 is called a standoff pin, and unlike the standard pin (40) described above, it has two flange portions. The flange portion located on the lower side is for supporting the board, into which these conductor pins (41) are inserted, at a predetermined position with respect to the motherboard. In any case,
These conductor pins (40) or (41) have a length of about several mm and a diameter of about 0.5 mm, which is very small, and is very difficult to handle.

Conventionally, the substrate is supplied to the conductor pin (40) or (41) as described above, and the conductor pin (40) or (4) is supplied to the substrate.
When fitting 1), most of the work had to rely on manual work. That is, the worker
Conductor pin visually inserted at a specified position on the pallet
The head of (40) or (41) and the hole for conductor pin fitting formed in the board were positioned, and the conductor pin (40) or (41) was fitted to the board using a press. .

There are various inconveniences in performing such manual work.

It is very difficult to position the head of the small conductor pin and the hole for fitting the conductor pin formed on the substrate.

When the positioning check is visually performed, the operator is very tired.

Therefore, its workability is very poor.

(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and the problems to be solved are
This is the poor workability of the conventional work when the substrate of the electronic component mounting substrate is supplied and the conductor pins are fitted to the substrate.

And, an object of the present invention is to firstly supply the substrate, and to make it possible to automatically perform the work of fitting a large number of conductor pins to the substrate,
A second object of the present invention is to provide a substrate supply device capable of improving its workability. Secondly, it can be easily attached to another device and can automatically manufacture an electronic component mounting substrate. It is to provide a substrate supply device.

(Means for Solving Problems) Means adopted by the present invention for solving the above problems are
Explaining with reference to FIGS. 1 to 9 corresponding to the embodiment, “a magazine (13) in which a large number of boards (61) constituting a board (60) for mounting electronic parts are stacked outside the apparatus is provided. , Support it in place on the table (11) and place the magazine (13) on this table (11)
The magazine positioning device (10) for arranging the board under the substrate transfer device (20) at a predetermined position, and the substrate positioning device (10) located next to the magazine positioning device (10).
A positioning jig (31) corresponding to the shape of 1) is provided, and the positioning jig (31) is moved to perform the first-stage positioning of the substrate (61) sent from the magazine (13). A board positioning first device (30) and a positioning device that is positioned next to the board positioning first device (30) and is vertically movable and positioned with respect to a pallet (50) in which conductor pins are arranged at predetermined positions. It is equipped with a jig (71), and when this positioning jig (71) descends, the board positioning first device
A board positioning second device (70) for final positioning of the board (61) sent from (30) with respect to the pallet (50), each magazine positioning device (10), a board positioning first device (30) and It is provided on the upper side of the second device (70) and is provided with a transfer arm (22) for taking out and loading each substrate (61), and the magazine positioning device (10) for the substrate (61) is provided by this transfer arm (22). ) To the substrate positioning first device (30),
And the board positioning first device to the board positioning second device (7
Board transfer device (20) that moves to (0) at the same time, and the board that has been finally positioned with respect to the pallet (50).
The substrate supply device (100) is characterized by comprising: a substrate pressing device (80) for pressing the (61) toward the pallet (50) in which the conductor pins are inserted.

The magazine positioning device (10) in this case is, for example, a table (11) having a positioning pin (12) for magazine positioning.
The magazine (13) positioned on the table (11) is sequentially supplied to predetermined positions.

The board positioning first device (30) has, for example, a board outer shape positioning portion using a cam mechanism or an air cylinder, and the positioning jig (3
This is done using 1).

Furthermore, the board positioning second device (70) uses the outer shape positioning jig (71) of the board (61) to place the conductor pins (40) or (41) of the pallet (50) corresponding to the board (61). On the other hand, the substrate (61) is finally positioned.

(Operation of the Invention) The present invention adopts the above-mentioned means and has the following operation.

First, when operating the substrate supply device (100), a large number of substrates (61) are stacked in a magazine (13) outside the device as shown in FIG. In this case, the magazine (13) has a pair and these magazines
(13) is supported by one support base 14.

Each magazine (13) that stacks many boards (61) in this way
Is positioned on the table (11) of the magazine positioning (10) via the positioning pins (12) as shown in FIG.
Boards in the magazine (13) positioned as described above
The (61) is sucked and taken out by using the suction pad 21 attached to the tip of the substrate transfer device (20), and the substrate transfer device (2
It is moved to the substrate positioning first device (30) by (0).

In this board positioning first device (30), the board (61) is a board
A positioning jig (31) having a shape corresponding to (61) performs positioning to some extent. Furthermore, this substrate (61)
Substrate positioning device (70) for the next substrate positioning device (20)
Moved to.

In the board (61) moved to the board positioning second device (70), the conductor pin inserted in the predetermined position of the pallet (50) by the positioning jig (71) of the second device (70). (40) or
Head of (41) and conductor pin fitting hole formed in board (61)
The final positioning with (62) is made.

The board (61) finally positioned in this way is provided with a board pressing device (80) for the conductor pins (40) or (41) inserted into the holes (62) of the pallet (50). Pressed against the head, conductor pins (40) or (41) against each board (61)
Are fitted together.

As described above, the conductor pin (40) or (41) inserted in the predetermined position of the pallet (50) is the electronic component mounting substrate (60).
The electronic pin mounting board (60) can be manufactured by fitting the conductor pin into the conductor pin fitting hole (62) of the board (61).

(Example) Next, the present invention will be described in detail based on an example shown in the drawings.

FIG. 1 shows an overall perspective view of a substrate supply device (100) according to the present invention. This substrate supply device (100) is mainly a substrate (61) constituting an electronic component mounting substrate (60). Magazine positioning device (10) that positions magazines (13) that are stacked in layers and sequentially supplies the magazines to predetermined positions
Then, the board (61) is taken out from the magazine (13), supplied to the board positioning first device (30), and further supplied and positioned second device.
Substrate transfer device (20) for supplying to (70) and this substrate transfer device
A substrate positioning first device (30) which is disposed below the (20) and performs the first stage positioning of the substrate (61) (herein referred to as "some positioning"). , Board (6
1) Insert the conductor pin (40) into the pallet (50) in place.
Alternatively, the board positioning second device (70) for final positioning with respect to (41) and the board (61) finally positioned.
And a board pressing device (80) for fitting and pressingly inserting the conductor pin (40) or (41).

This substrate supply device (100) is an automatic manufacturing device for electronic component mounting substrates as shown in FIG. 9 in order to form an electronic component mounting substrate (60) as shown in FIG. It is also used as a part of. In the case of the device shown in FIG. 9, a predetermined number of conductor pins (40) or (41) are automatically accommodated in a pallet (50) which is sequentially and continuously conveyed. The substrate (61) constituting the electronic component mounting substrate (60) is supplied to the pallet (50) by the substrate supply device (100) according to the present invention, and the substrate (61)
The conductive pin (40) on the board (61) by positioning, fitting, and pressing with respect to the conductive pin (40) or (41) of the pallet (50).
Alternatively, it is used to insert (41) and automatically form the electronic component mounting substrate (60).

Now, the magazine positioning device (10) that constitutes the substrate supply device (100) includes a substrate positioning device (10) for efficiently supplying the substrate (61).
In order to position the magazine (13) in which the (61) are stacked in a stack with respect to the substrate positioning first device (30) described later, this magazine (1
It is a device that sequentially supplies 3) to a predetermined position. Magazine (1
3) is a substrate (61) outside the device, for example, as shown in FIG.
The magazines (13) are stacked one above the other in the vertical direction, and the substrates (61) can be stored and taken out one by one from above the magazine (13). In this embodiment, a pair of magazines (13) are supported on a single support base 14, so that two substrates (61) can be taken out at the same time. A positioning pin (12) attached to the table (11) is fitted into the support base 14 through a positioning hole (not shown) so that the magazine (13) is positioned with respect to the table (11). Has become. The table (11) applied in this example is, for example, rotated, and rotation of the table (11) positions the magazine (13) at a predetermined position with respect to the substrate positioning first device (30). Then, the substrate (61) is taken out from the magazine (13). Further, by rotating the table (11) to an appropriate position, the empty magazine (13) can be discharged to the outside of the apparatus.

The board positioning first device (30), for example, as shown in FIG. 3, when the board transfer device (20) puts two boards (61) near a predetermined position, the board positioning second device (30) Equipment (70)
The direction of the positioning jig (3 that can move in the direction of arrow A and B in FIG.
The substrate (61) is positioned at a predetermined position by means of 1).

The positioning by the board positioning first device (30) is carried out to some extent on the board (61), that is, in the board positioning second device (70) described later, the board (61) is finally the conductor of the pallet (50). The positioning is such that it can be positioned with respect to the pins (40) or (41). As shown in FIG. 3, the positioning jig (31) has a tapered surface on the substrate (61) side.
It is natural that the structure of (61) is easy to put in.

The board positioning second device (70) is a board positioning first device (3
Positioned in the next stage of (0), it is provided with a positioning jig (71) that is vertically movable and positioned with respect to the pallet (50) in which the conductor pins (40) or (41) are arranged at predetermined positions, By lowering the positioning jig (71), final positioning of the substrate (61) sent from the first substrate positioning device (30) with respect to the pallet (50) is performed. That is, as shown in FIGS. 4 and 5, the board positioning second device (70) is provided with a conductor pin (40) or a conductor pin (40) inserted in a predetermined position of the pallet (50).
The two substrates (61) inserted by the substrate transfer device (20) are positioned with respect to the (41) by using the positioning jig (71) as a guide jig. As shown in FIG. 5, the positioning jig (71) is provided with a positioning portion having a shape corresponding to each board (61) for positioning each board (61), and is also capable of freely rising. It is clear that the structure is such that the structure and functions around the positioning jig (71) are not hindered. Further, as shown in FIG. 5, the positioning jig (71) has a structure in which the guide surface for each substrate (61) is tapered so that the substrate (61) can be easily inserted. Is natural.

The substrate transfer device (20) is the magazine positioning device (1
0), which is located on the upper side of the substrate positioning first device (30) and the substrate positioning second device (70), and has a reciprocating transfer arm (22) as shown in FIG. There is. The transfer arm (22) of the substrate transfer device (20) includes a predetermined position between the magazine positioning device (10) and the first substrate positioning device (30), a first substrate positioning device (30) and a second substrate positioning device. It is configured to reciprocate between a predetermined position of (70). Further, the substrate transfer device (20) has a transfer arm (2
A pair of suction pads (21) are provided at the lower end of the tip of 2), and using these suction pads (21), the substrate positioning first device (30) is moved from a predetermined position of the magazine positioning device (10).
To the predetermined position of the second substrate positioning device (70) from the predetermined position of the first substrate positioning device (30).
It is possible to feed and supply 1) at a time two by two.

The substrate pressing device (80) is disposed above the second substrate positioning device (70) and presses the substrate (61) from above as shown in FIGS. 1, 4, and 5, for example. As a result, the conductor pin (40) or (41) inserted at a predetermined position of the pallet (50) is inserted into the conductor pin fitting hole (62) of the substrate (61) positioned by the substrate positioning second device (70). ) Head can be fitted.

(Effects of the Invention) As described in detail above, in the present invention, as illustrated in the above embodiment, "a large number of boards (61) constituting the electronic component mounting board (60) are provided outside the apparatus." A magazine positioning device (10) that supports the stacked magazines (13) at a predetermined position on the table, and arranges the magazine (13) on the table at a predetermined position below the substrate transfer device (20), and this magazine. Located on the next stage of the positioning device (10),
A positioning jig corresponding to the shape of 1) is provided, and by moving the positioning jig, the board positioning first device (1) for positioning the first stage of the board (61) sent from the magazine (13) ( 30) and a positioning jig (71) that is positioned next to the board positioning first device (30) and is vertically movable and positioned with respect to the pallet (50) in which conductor pins are arranged at predetermined positions. Prepare the board positioning first device by lowering the positioning jig (71).
A board positioning second device (70) for final positioning of the board (61) sent from (30) with respect to the pallet (50), each magazine positioning device (10), a board positioning first device (30) and It is provided on the upper side of the second device (70) and is provided with a transfer arm (22) for taking out and loading each substrate (61), and the magazine positioning device (10) for the substrate (61) is provided by this transfer arm (22). ) To the substrate positioning first device (30),
And the board positioning first device to the board positioning second device (7
Substrate that has been finally positioned with respect to the pallet (50) and the substrate transfer device (20) that simultaneously moves to (0)
(61) is provided with a board pressing device (80) for pressing the pallet (50) into which the conductor pins are inserted ''. The supply of the substrate can improve the workability by automatically supplying the conductive pins (40) or (41) to the substrate (61). The device (100) can be provided.

That is, the board (61) constituting the electronic component mounting board (60) is supplied to an appropriate position with respect to the conductor pin (40) or (41) inserted at a predetermined position of the pallet (50), It is possible to automatically fit the conductor pins (40) or (41) to the board (61). Therefore, the substrate (61) that constitutes the electronic component mounting substrate (60) is automatically supplied to the conductor pin (40) or (41), and the conductor pin (40) or ( 41)
Therefore, it is possible to provide the substrate supply device (100) that can easily and surely perform the work of fitting the two.

In addition, the substrate supply device (100) can be easily attached to an automatic manufacturing device for electronic component mounting substrates as shown in FIG. 9, and is of course a highly versatile substrate supply device. It is possible to further enhance the automation of the automatic manufacturing apparatus and manufacture a board for mounting electronic parts, which is highly reliable in terms of quality.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate supply device according to the present invention, FIG. 2 is a perspective view showing an example of a magazine which constitutes a magazine positioning device, and FIG. 3 mainly shows a positioning jig which constitutes a substrate positioning first device. FIG. 4 is a perspective view centering on a positioning jig which constitutes the second substrate positioning apparatus and also shows a main part of the substrate pressing apparatus, and FIG. 5 is a positioning jig which constitutes the second substrate positioning apparatus. It is a figure centering on the suction pad which comprises a tool and a board | substrate conveyance apparatus, and is an expanded sectional view which also showed the principal part of a board | substrate press apparatus. Further, FIG. 6 is a perspective view showing an example of an electronic component mounting board having conductor pins, FIG. 7 is an enlarged front view showing the conductor pins, and FIG. 8 is a conductor pin of a board constituting the electronic component mounting board. FIG. 9 is an enlarged cross-sectional view showing the fitting holes and the conductor pin insertion holes of the pallet, and FIG. 9 is a perspective view showing an automatic manufacturing apparatus for electronic component mounting boards showing an example in which the board supply apparatus is adopted. Reference numeral 100 ... Substrate supply device, 10 ... Magazine positioning device, 11 ...
Table, 12 ... Positioning pins, 13 ... Magazine, 14 ... Supporting base, 20 ... Substrate transfer device, 21 ... Suction pad, 22 ... Transfer arm, 30 ... Substrate positioning device, 31 ... Positioning jig, 40
… Conductor pin (standard pin), 41… Conductor pin (standoff pin), 50… Pallet, 51… Conductor pin insertion hole,
60 ... Electronic component mounting board, 61 ... Board, 62 ... Conductor pin fitting hole, 70 ... Board positioning second device, 71 ... Positioning jig,
80… Substrate press machine, 90… Pallet carrier machine.

Continuation of the front page (56) Reference JP-A-62-277800 (JP, A) Actually opened 57-48672 (JP, U) Actually opened 61-200824 (JP, U) JP-B 61-58274 (JP , B2)

Claims (1)

[Claims] 1. A magazine in which a large number of substrates constituting electronic component mounting substrates are stacked outside the apparatus is supported at a predetermined position on a table, and the magazine on the table is set at a predetermined position below the substrate transfer device. A magazine positioning device to be placed and a positioning jig positioned next to the magazine positioning device and corresponding to the shape of the substrate are provided. By moving the positioning jig, the first substrate of the substrate sent from the magazine is moved. A board positioning first device for positioning the first stage, and a positioning jig that is positioned next to the board positioning first device and is vertically movable and positioned with respect to a pallet in which conductor pins are arranged at predetermined positions. And a substrate positioning first for performing final positioning of the substrate sent from the substrate positioning first device with respect to the pallet by lowering the positioning jig. The apparatus and the magazine positioning apparatus, the substrate positioning first apparatus, and the carrier arm located above the second apparatus for picking up and loading the respective boards, and the magazine positioning apparatus for the substrates by the carrier arm. From the substrate positioning first device to the substrate positioning first device and from the substrate positioning first device to the substrate positioning second device at the same time; A substrate pressing device that presses the pallet into which the pins are inserted.