JPH06340896A - Liquid cleaner for solder flux - Google Patents
Liquid cleaner for solder fluxInfo
- Publication number
- JPH06340896A JPH06340896A JP5252475A JP25247593A JPH06340896A JP H06340896 A JPH06340896 A JP H06340896A JP 5252475 A JP5252475 A JP 5252475A JP 25247593 A JP25247593 A JP 25247593A JP H06340896 A JPH06340896 A JP H06340896A
- Authority
- JP
- Japan
- Prior art keywords
- solder flux
- flux
- printed circuit
- cleaning agent
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0026—Low foaming or foam regulating compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3227—Ethers thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Extraction Or Liquid Replacement (AREA)
Abstract
(57)【要約】
【構成】 化１の一般式（Ｉ）で表わされる炭鎖アルコ
ールのアルキレンオキシド１〜１０モル付加物を含む半
田フラックス用液体洗浄剤。
【効果】 フロン系等の溶媒を必要とすることなく水系
で半田フラックスに対して優れた洗浄性能を示し、特に
プリント配線板、プリント回路板のようなプリント基板
の半田付けの際に使用されるロジンフラックスの除去に
極めて有効である。また、透明安定性に優れ、低泡性で
あるので、取り扱いも容易である。
【化１】Ｒ1−Ｏ(ＣnＨ2nＯ)mＨ …（Ｉ）
（Ｒ1 ：炭素数１〜５のアルキル基またはアルケニル基
ｎ：２〜４の数
ｍ：１〜１０の数）(57) [Outline] A liquid cleaning agent for solder flux, containing 1 to 10 mol of an alkylene oxide of a carbon chain alcohol represented by the general formula (I). [Effect] It shows excellent cleaning performance against solder flux in an aqueous system without the need for a CFC-based solvent, and is especially used when soldering printed circuit boards such as printed wiring boards and printed circuit boards. It is extremely effective in removing rosin flux. Further, since it has excellent transparency stability and low foaming property, it is easy to handle. Embedded image R 1 —O (C nH 2 nO) mH (I) (R 1 : an alkyl or alkenyl group having 1 to 5 carbon atoms n: a number of 2 to 4 m: a number of 1 to 10)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半田付けに際して用い
られるフラックスを洗浄する液体洗浄剤に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid cleaning agent for cleaning flux used for soldering.
【０００２】[0002]
【従来の技術】エレクトロニクス産業においては、プリ
ント基板の半田付けの際にフラックスが使用されてい
る。このようなフラックスは、プリント基板および最終
製品の高品質を維持するために、半田付け作業の終了後
に、高清浄度に洗浄することが要求されている。フラッ
クス用洗浄剤としては、従来から種々のものが開示され
ており、例えば、特開昭５９−２２７９９８号公報、同
６１−３７３６３号公報、同６１−４２４７４号公報等
に報告されている。しかしながら、これら洗浄剤はいず
れもフロン系溶剤、塩素系溶剤を骨格とした組成物であ
り、近年、これら溶剤の環境への安全性が問題となって
いることから、溶剤系に代わる水系洗浄剤の要望が高ま
っている。BACKGROUND OF THE INVENTION In the electronics industry, flux is used in soldering printed circuit boards. In order to maintain the high quality of the printed circuit board and the final product, such a flux is required to be cleaned with high cleanliness after the soldering work is completed. Various types of flux cleaners have been disclosed so far, and are reported in, for example, JP-A-59-227998, JP-A-61-37363, and JP-A-61-42474. However, all of these detergents are compositions having a chlorofluorocarbon-based solvent and a chlorine-based solvent as a skeleton, and in recent years, the environmental safety of these solvents has become a problem. Are increasing in demand.
【０００３】[0003]
【発明が解決しようとする課題】本発明は半田フラック
スに対して優れた洗浄性能を有し、しかも、環境への安
全性に対して全く問題がない水系の液体洗浄剤を提供す
るものである。DISCLOSURE OF THE INVENTION The present invention provides a water-based liquid cleaning agent which has excellent cleaning performance for solder flux and has no problem with respect to environmental safety. .
【０００４】[0004]
【課題を解決するための手段】本発明の半田フラックス
用液体洗浄剤は、下記の化２の一般式（Ｉ）で表わされ
る化合物を含むことを特徴とする。The liquid cleaner for solder flux according to the present invention is characterized by containing a compound represented by the following general formula (I).
【０００５】[0005]
【化２】Ｒ1−Ｏ(ＣnＨ2nＯ)mＨ …（Ｉ） （Ｒ1 ：炭素数１〜５のアルキル基またはアルケニル基 ｎ：２〜４の数 ｍ：１〜１０の数）Embedded image R 1 —O (C nH 2 nO) mH (I) (R 1 : alkyl group or alkenyl group having 1 to 5 carbon atoms, n: number of 2 to 4, m: number of 1 to 10)
【０００６】[0006]
【発明の実施態様】以下、本発明についてさらに詳細に
説明する。上記一般式（Ｉ）の化合物は、炭素数１〜５
の飽和または不飽和アルコールのアルキレンオキシド付
加物である。式中のＣnＨ2nＯ は、オキシエチレン、オ
キシプロピレン、オキシブチレンが単独または混合物と
して付加していることを示し、特に、オキシエチレンと
オキシプロピレンのブロック付加物が好適である。ｎは
アルキレンオキシドの平均付加モル数を示し、１〜１
０、好ましくは２〜６である。オキシエチレンとオキシ
プロピレンとのブロック付加の場合、オキシエチレン１
〜３モル、オキシプロピレン１〜５モルが好適である。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail below. The compound of the general formula (I) has 1 to 5 carbon atoms.
Is an alkylene oxide adduct of the saturated or unsaturated alcohol. CnH 2 nO in the formula indicates that oxyethylene, oxypropylene, and oxybutylene are added alone or as a mixture, and particularly, a block adduct of oxyethylene and oxypropylene is preferable. n represents the average number of moles of alkylene oxide added, 1 to 1
It is 0, preferably 2 to 6. In the case of block addition of oxyethylene and oxypropylene, oxyethylene 1
-3 mol and oxypropylene 1-5 mol are suitable.
【０００７】本発明の半田フラックス用液体洗浄剤は、
一般式（Ｉ）の化合物そのままでもよいが、通常、水に
て希釈し５〜７０重量％の透明均一な水溶液とする。本
発明の液体洗浄剤は、その他必要に応じて、液安定性を
保持するためにエチレングリコール、プロピレングリコ
ール、メタノール、エタノール、プロパノール等のハイ
ドロトロープ剤などを配合することもできる。The liquid cleaning agent for solder flux of the present invention is
The compound of general formula (I) may be used as it is, but it is usually diluted with water to give a transparent and uniform aqueous solution of 5 to 70% by weight. If necessary, the liquid detergent of the present invention may contain a hydrotrope agent such as ethylene glycol, propylene glycol, methanol, ethanol, propanol or the like in order to maintain liquid stability.
【０００８】[0008]
【発明の効果】本発明の液体洗浄剤は、フロン系等の溶
媒を必要とすることなく水系で半田フラックスに対して
優れた洗浄性能を示し、特にプリント配線板、プリント
回路板のようなプリント基板の半田付けの際に使用され
るロジンフラックスの除去に極めて有効である。また、
透明安定性に優れ、低泡性であるので、取り扱いも容易
である。EFFECTS OF THE INVENTION The liquid cleaning agent of the present invention exhibits excellent cleaning performance against solder flux in an aqueous system without the need for a solvent such as a CFC system, and particularly in a printed circuit board, a printed circuit board or the like. It is extremely effective in removing the rosin flux used when soldering the board. Also,
It has excellent transparency stability and low foaming properties, so it is easy to handle.
【０００９】以下、実施例により本発明の液体洗浄剤に
ついてさらに具体的に説明するが、それに先立って実施
例で用いた評価方法を示す。 （１） 洗浄剤の透明性 １００ｍｌガラスビンに洗浄剤を入れ、２５℃恒温室内
に２４時間静置し、目視によって下記の基準で透明性を
評価する。○を合格とする。 評価基準 ○：透明 △：やや白濁 ×：沈澱・二層分離 （２） フラックスの洗浄性 ガラス板に半田フラックスを塗布し、２００℃、１５分
間焼成を行なって汚垢板とし、各々の洗浄剤を水で５倍
希釈した洗浄液中で４０℃、５分間の浸漬洗浄を行な
う。洗浄中のフラックスの溶解状態を目視で判定し、次
の基準により評価する。○以上を合格とする。 評価基準 ◎：溶解力が強い ○：溶解力がある △：溶解力がやや劣る ×：溶解力がないHereinafter, the liquid detergent of the present invention will be described in more detail with reference to Examples. Prior to that, the evaluation method used in the Examples will be described. (1) Transparency of Cleaning Agent A cleaning agent is put in a 100 ml glass bottle, left standing in a thermostatic chamber at 25 ° C. for 24 hours, and the transparency is visually evaluated according to the following criteria. Pass ○. Evaluation Criteria ○: Transparent Δ: Slightly cloudy ×: Precipitation / separation of two layers (2) Flux cleaning property Solder flux is applied to a glass plate and baked at 200 ° C for 15 minutes to make a dirt plate, and each cleaning agent is used. Immersion cleaning is carried out at 40 ° C. for 5 minutes in a cleaning solution obtained by diluting 5 times with water. The dissolved state of the flux during cleaning is visually judged and evaluated according to the following criteria. ○ Pass the above. Evaluation Criteria ◎: Strong dissolving power ○: Having dissolving power Δ: Slightly inferior dissolving power ×: No dissolving power
【００１０】[0010]
実施例１（洗浄剤の調製） 以下の処方の各液体洗浄剤１〜９を調製した。なお、組
成中のアルキレンオキシド付加の記載で(Ｃ2Ｈ4Ｏ)1(Ｃ
3Ｈ6Ｏ)2Ｈのようにあるのはその順番にブロック付加さ
せた事を意味し、 ［（Ｃ2Ｈ4Ｏ）1／（Ｃ3Ｈ6Ｏ）2］
はランダム付加を示す。また、洗浄剤９は比較例であ
り、他は実施例である。 洗浄剤１ Ｃ4Ｈ9−Ｏ(Ｃ2Ｈ4Ｏ)1(Ｃ3Ｈ6Ｏ)2Ｈ 30wt％ エチルアルコール 35wt％ 水 35wt％ 洗浄剤２ Ｃ4Ｈ9−Ｏ[(Ｃ2Ｈ4Ｏ)1／(Ｃ3Ｈ6Ｏ)2]Ｈ 30wt％ エチルアルコール 35wt％ 水 35wt％ 洗浄剤３〜９ Ｃ4Ｈ9−Ｏ(Ｃ2Ｈ4Ｏ)j(Ｃ3Ｈ6Ｏ)kＨ 30wt％ (ｊ，ｋの値は表１に記載） エチルアルコール 35wt％ 水 35wt％Example 1 (Preparation of detergent) Liquid detergents 1 to 9 having the following formulations were prepared. In addition, in the description of alkylene oxide addition in the composition, (C 2 H 4 O) 1 (C
“3 H 6 O) 2 H means that blocks are added in that order, and [(C 2 H 4 O) 1 / (C 3 H 6 O) 2 ]
Indicates random addition. Further, the cleaning agent 9 is a comparative example, and the others are examples. Detergent 1 C 4 H 9 -O (C 2 H 4 O) 1 (C 3 H 6 O) 2 H 30wt% ethyl alcohol 35 wt% Water 35 wt% detergent 2 C 4 H 9 -O [( C 2 H 4 O) 1 / (C 3 H 6 O) 2] H 30wt% ethyl alcohol 35 wt% water 35 wt% detergent 3~9 C 4 H 9 -O (C 2 H 4 O) j (C 3 H 6 O) kH 30wt% (j and k values are listed in Table 1) Ethyl alcohol 35wt% Water 35wt%
【００１１】[0011]
【表１】 [Table 1]
【００１２】実施例２(洗浄剤の性能評価) 実施例１で調製した各洗浄剤の性能を評価し、結果を表
２に示した。Example 2 (Evaluation of performance of cleaning agent) The performance of each cleaning agent prepared in Example 1 was evaluated, and the results are shown in Table 2.
【００１３】[0013]
【表２】 [Table 2]
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ２３Ｇ 5/032 9352−4Ｋ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C23G 5/032 9352-4K
Claims (1)
を含むことを特徴とする半田フラックス用液体洗浄剤。 【化１】Ｒ1−Ｏ(ＣnＨ2nＯ)mＨ …（Ｉ） （Ｒ1 ：炭素数１〜５のアルキル基またはアルケニル基 ｎ：２〜４の数 ｍ：１〜１０の数）1. A liquid cleaner for solder flux, comprising a compound represented by the general formula (I) of Chemical formula 1. Embedded image R 1 —O (C nH 2 nO) mH (I) (R 1 : alkyl group or alkenyl group having 1 to 5 carbon atoms n: number of 2 to 4 m: number of 1 to 10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5252475A JP2684319B2 (en) | 1993-09-13 | 1993-09-13 | Liquid cleaner for solder flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5252475A JP2684319B2 (en) | 1993-09-13 | 1993-09-13 | Liquid cleaner for solder flux |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23668989A Division JPH0397792A (en) | 1989-09-11 | 1989-09-11 | Liquid detergent for solder flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06340896A true JPH06340896A (en) | 1994-12-13 |
| JP2684319B2 JP2684319B2 (en) | 1997-12-03 |
Family
ID=17237904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5252475A Expired - Lifetime JP2684319B2 (en) | 1993-09-13 | 1993-09-13 | Liquid cleaner for solder flux |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2684319B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6007638A (en) * | 1996-02-13 | 1999-12-28 | Lion Corporation | Detergent composition and cleaning method using the same |
| US6762159B2 (en) | 2000-10-17 | 2004-07-13 | Mitsubisi Chemical Corporation | Polyglycerol fatty acid ester for detergent and detergent containing the same |
| JP2009041094A (en) * | 2007-08-10 | 2009-02-26 | Kao Corp | Detergent composition for solder flux |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3886099A (en) * | 1972-03-13 | 1975-05-27 | Griffin Bros Inc | Water soluble flux remover |
-
1993
- 1993-09-13 JP JP5252475A patent/JP2684319B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3886099A (en) * | 1972-03-13 | 1975-05-27 | Griffin Bros Inc | Water soluble flux remover |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6007638A (en) * | 1996-02-13 | 1999-12-28 | Lion Corporation | Detergent composition and cleaning method using the same |
| US6762159B2 (en) | 2000-10-17 | 2004-07-13 | Mitsubisi Chemical Corporation | Polyglycerol fatty acid ester for detergent and detergent containing the same |
| JP2009041094A (en) * | 2007-08-10 | 2009-02-26 | Kao Corp | Detergent composition for solder flux |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2684319B2 (en) | 1997-12-03 |
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