JPH06349983A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To incorporate a heat dissipating member in a package even when a resin material is used for the package. CONSTITUTION:A semiconductor device uses a resin material as a package material, and the method for manufacturing the device comprises the steps of adhering a heat dissipating plate 10 through an adhesive material 9 to a rear surface of one semiconductor wafer 8 on which an integrated circuit is formed and before dicing is conducted, and packaging a semiconductor chip obtained by dicing it.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is effective in manufacturing a semiconductor device such as an IC, and more particularly in a semiconductor device having a structure in which a heat dissipation plate is arranged inside a package made of a resin material such as plastic. It is about.

[0002]

2. Description of the Related Art For example, in a DIP (dual in-line package) type semiconductor device, a lead frame and bump electrodes of a semiconductor chip are wire-bonded, and then the semiconductor chip and its peripheral portion are molded with a resin material to form a package. I'm playing.

[0003]

According to a study made by the present inventor, the conventional packaging technology using a plastic package has a structure in which the entire semiconductor chip is covered with an insulating material having a poor heat dissipation property. There is a problem in that it is difficult to take heat dissipation measures as the electric power increases.

Recently, QFP (Quad Flat
The package) type semiconductor device also tends to be required to have a heat dissipation structure. However, even in this case, the heat dissipation structure used in the conventional power IC cannot be adopted.

Therefore, an object of the present invention is to provide a technique capable of incorporating a heat dissipation structure even when a resin material is used for the package.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0007]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, in a semiconductor device in which a resin material is used as a packaging material, a heat dissipation plate is attached to the back surface of one semiconductor wafer before the formation of integrated circuits and before dicing, and then dicing is performed. The formed semiconductor chip is packaged.

[0009]

According to the above-mentioned means, the heat radiating plate is attached in the wafer state, the semiconductor chip is diced, and then bonded, and further packaged. Therefore, it is possible to manufacture a package with a built-in heat sink using a normal assembly line, and to manufacture a semiconductor device capable of required heat dissipation at low cost.

[0010]

1 and 2 are front views showing a part of a manufacturing process of a semiconductor device according to the present invention, FIG. 1 is a front view in a wafer state, and FIG. 2 is a front view showing a state immediately after dicing. . 3 is a cross-sectional view showing the semiconductor device after completion of assembly.

As shown in FIG. 3, a heat radiating plate 3 is attached to one surface of the semiconductor chip 1 (the surface where the bump electrodes are not provided) using an adhesive material 2. As the adhesive material 2, a heat-resistant adhesive tape or adhesive can be used. Also,
For the heat dissipation plate 3, a material having excellent thermal conductivity, such as a copper alloy, an aluminum alloy, or an alumina substrate, can be used. When assembling such a semiconductor chip 1, first, the heat dissipation plate 3 is fixed on the tab 4, and then a bump electrode (not shown) of the semiconductor chip 1 is formed using a wire bonder.
And the lead 5 are connected by the wire 6.

After that, in the cavity of the molding die,
The semiconductor chip 1 including the ends of the leads 5, the heat sink 3 and the tab 4 are arranged, and the molten resin 7 (eg epoxy resin) is press-fitted into the cavity to seal the semiconductor chip 1. Be seen. Further, after the resin 7 is solidified, the leads 5 exposed from the package are bent into a predetermined shape to complete the assembly of the semiconductor device.

When the semiconductor chip 1 is installed in the apparatus and enters the operating state, in the case of the semiconductor chip 1 which consumes a large amount of power, the heat generated by the semiconductor chip 1 is conducted to the radiator plate 3 through the adhesive material 2, resulting in improvement of the transient thermal resistance. The semiconductor chip 1 does not cause thermal destruction.

Next, a method of attaching the heat sink to the semiconductor chip will be described with reference to FIGS.

First, as shown in FIG. 1, one semiconductor wafer 8 on which integrated circuit formation has been completed and before dicing has been completed.
The adhesive 9 is applied to the entire back surface of the adhesive (for example, diameter of 5 inches and 8 inches). Then, a heat radiating plate 10 having the same size as the semiconductor wafer 8 is attached via the adhesive material 9.

Next, as shown in FIG. 2, a dicing saw (not shown) is diced along the dicing line 11 (set in the XY directions so as to divide the integrated circuits from each other). Separate into individual semiconductor chips. One of them is the semiconductor chip 1 shown in FIG.

As shown in FIG. 1, since the semiconductor wafer to which the heat dissipation plate 10 is attached can be handled as a normal single semiconductor wafer, it can be performed using a normal assembly line. Further, as compared with the case where the heat dissipation plate is attached to the semiconductor chip after dicing, the attaching process can be simplified and the product cost can be reduced.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the gist thereof. Needless to say.

For example, although the SOP type semiconductor device is shown in the above embodiment, the present invention is not limited to this, and the present invention can be applied to all semiconductor devices using a resin-based material for a semiconductor chip. it can.

[0020]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

That is, in a semiconductor device in which a resin material is used as a packaging material, a heat dissipation plate is attached to the back surface of one semiconductor wafer after the formation of integrated circuits and before dicing, and then dicing is performed. Since the formed semiconductor chip is packaged, a package with a built-in heat sink can be packaged using a normal assembly line, and a required semiconductor device capable of releasing heat can be manufactured at low cost. Like

[Brief description of drawings]

FIG. 1 is a front view showing one step in a method for manufacturing a semiconductor device of the present invention.

FIG. 2 is a front view showing a state in which dicing is performed from the state of FIG.

FIG. 3 is a cross-sectional view showing the semiconductor device after completion of assembly.

[Explanation of symbols]

 1 Semiconductor Chip 2 Adhesive Material 3 Heat Sink 4 Tab 5 Lead 6 Wire 7 Resin 8 Semiconductor Wafer 9 Adhesive 10 Heat Sink 11 Dicing Line

Claims (3)

[Claims] 1. A semiconductor device using a resin material as a packaging material, wherein a heat dissipation plate is attached to the back surface of one semiconductor wafer after the formation of integrated circuits and before dicing, and then dicing is performed. A method of manufacturing a semiconductor device, which comprises packaging the obtained semiconductor chip. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the heat dissipation plate is a metal plate having a high thermal conductivity or an alumina substrate. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the heat dissipation plate is attached using an adhesive tape or an adhesive.