JPH0636470B2 - Method for treating copper circuit of circuit board for inner layer - Google Patents
Method for treating copper circuit of circuit board for inner layerInfo
- Publication number
- JPH0636470B2 JPH0636470B2 JP5152389A JP5152389A JPH0636470B2 JP H0636470 B2 JPH0636470 B2 JP H0636470B2 JP 5152389 A JP5152389 A JP 5152389A JP 5152389 A JP5152389 A JP 5152389A JP H0636470 B2 JPH0636470 B2 JP H0636470B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- circuit
- circuit board
- inner layer
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010949 copper Substances 0.000 title claims description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 70
- 229910052802 copper Inorganic materials 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 14
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 58
- 239000002253 acid Substances 0.000 claims description 22
- 239000005751 Copper oxide Substances 0.000 claims description 14
- 229910000431 copper oxide Inorganic materials 0.000 claims description 14
- 230000003647 oxidation Effects 0.000 claims description 11
- 238000007254 oxidation reaction Methods 0.000 claims description 11
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 5
- 239000005695 Ammonium acetate Substances 0.000 claims description 5
- 229940043376 ammonium acetate Drugs 0.000 claims description 5
- 235000019257 ammonium acetate Nutrition 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 description 14
- 229960004643 cupric oxide Drugs 0.000 description 14
- 125000001475 halogen functional group Chemical group 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010306 acid treatment Methods 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 229940112669 cuprous oxide Drugs 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 2
- 229960002218 sodium chlorite Drugs 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 1
- -1 cupric oxide Chemical compound 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
本発明は、多層プリント配線板の製造に用いる内層用回
路板の銅回路の処理方法に関するものである。The present invention relates to a method for treating a copper circuit of an inner layer circuit board used for manufacturing a multilayer printed wiring board.
多層プリント配線板は、片面乃至両面に銅箔等で回路を
形成した内層用回路板にプリプレグを介して外層用回路
板もしくは銅箔を重ね、これを加熱加圧成形して内層用
回路板と外層用回路板もしくは銅箔とを積層することに
よって製造されるのが一般的である。 そして、内層用回路板に形成した銅の回路と外層用回路
板もしくは銅箔を積層させるプリプレグの樹脂との接着
性を確保することが必要である。特に内層用回路板の回
路を電解銅箔によって形成する場合、銅箔の片面は粗面
に形成されるが他の片面は平滑面に形成されており、内
層用回路板の製造に際しては粗面で銅箔を接着させてい
るために、内層用回路板の銅回路の表面は銅箔の平滑面
となり、銅回路とプリプレグの樹脂との接着性は非常に
低くなるものであって、接着性を高める工夫が必要とな
るのである。 そこで、従来から種々の方法で銅の回路と樹脂との接着
性を高めることが検討されており、銅回路の表面に酸化
物層を形成して接着性を高めることが一般になされてい
る。この銅回路の表面に酸化物層を形成する方法として
は、過硫酸カリウムを含むアルカリ水溶液、あるいは亜
塩素酸ナトリウムを含むアルカリ水溶液を用いて処理す
ることによっておこなうことが一般的である。A multilayer printed wiring board is a circuit board for inner layer, which has a circuit formed of copper foil or the like on one or both sides, is overlaid with a circuit board for outer layer or copper foil via a prepreg, and then heat-pressed to form a circuit board for inner layer. It is generally manufactured by laminating an outer layer circuit board or a copper foil. Then, it is necessary to secure the adhesiveness between the copper circuit formed on the inner layer circuit board and the outer layer circuit board or the resin of the prepreg on which the copper foil is laminated. In particular, when the circuit of the inner layer circuit board is formed by electrolytic copper foil, one side of the copper foil is formed as a rough surface, but the other side is formed as a smooth surface. Since the copper foil is adhered with, the surface of the copper circuit of the inner layer circuit board becomes a smooth surface of the copper foil, and the adhesiveness between the copper circuit and the resin of the prepreg is extremely low. It is necessary to devise to improve Therefore, it has been studied to improve the adhesiveness between the copper circuit and the resin by various methods, and it is generally performed to form an oxide layer on the surface of the copper circuit to enhance the adhesiveness. As a method for forming an oxide layer on the surface of the copper circuit, it is general to perform treatment by using an alkaline aqueous solution containing potassium persulfate or an alkaline aqueous solution containing sodium chlorite.
上記のように銅回路の表面に酸化物層を形成させること
によって、銅回路と樹脂との接着性を十分に確保するこ
とができる。しかしながら、特開昭５６−１５３７９７
号公報や特開昭６１−１７６１９２号公報においても報
告されているように、銅酸化物、特に酸化第二銅は酸に
溶解し易いために、スルーホールをドリル加工したあと
スルーホールメッキをする際に化学メッキ液に浸漬する
と、スルーホールの内周に露出する銅回路の断面部分の
酸化物層がメッキ液の酸（塩酸）等に溶解し、スルーホ
ールの内周から銅回路と樹脂との界面を酸が浸入する溶
解侵食が発生するいわゆるハロー現象が起こり易くな
り、多層プリント配線板の信頼性が低下することになる
ものであった。 本発明は上記の点に鑑みて為されたものであり、銅回路
と樹脂との接着性を高める効果を保持しつつハロー現象
の発生を防止することができる内層用回路板の銅回路の
処理方法を提供することを目的とするものである。By forming the oxide layer on the surface of the copper circuit as described above, sufficient adhesion between the copper circuit and the resin can be ensured. However, JP-A-56-153797
As reported in Japanese Patent Laid-Open No. 61-176192 and Japanese Patent Laid-Open No. 61-176192, since copper oxide, particularly cupric oxide, is easily dissolved in acid, the through hole is drilled and then plated through the through hole. When immersed in the chemical plating solution, the oxide layer of the cross-section of the copper circuit exposed at the inner circumference of the through hole dissolves in the acid (hydrochloric acid) of the plating solution, and the copper circuit and resin are removed from the inner circumference of the through hole. The so-called halo phenomenon, in which the acid penetrates into the interface to cause dissolution and erosion, is likely to occur, and the reliability of the multilayer printed wiring board decreases. The present invention has been made in view of the above points, treatment of the copper circuit of the inner layer circuit board capable of preventing the occurrence of the halo phenomenon while maintaining the effect of enhancing the adhesiveness between the copper circuit and the resin It is intended to provide a method.
本発明に係る内層用回路板の銅回路の処理方法は、内層
用回路板に設けた銅の回路を酸化処理して回路の表面に
Ｃｕ2Ｏを主成分とする銅酸化物層を形成した後、この
銅の回路の表面を酸で処理して銅酸化物相中のＣｕＯを
除去することを特徴とするものである。 また本発明にあって、Ｃｕ2Ｏを主成分とする銅酸化物
層を形成するために、銅の回路の酸化処理は酢酸アンモ
ニウム系溶液を用いておこなうのが好ましい。 以下本発明を詳細に説明する。 内層用回路板としては、銅箔を張った銅張ガラスエポキ
シ樹脂積層板、銅張ガラスポリイミド樹脂積層板などを
用いて銅箔をエッチング処理等することによって、片面
もしくは両面に銅の回路を設けて形成したものを用いる
ことができるが、さらに積層板に化学メッキや電気メッ
キで銅の回路を片面もしくは両面に形成したものを用い
ることもできる。そしてまずこの内層用回路板の表面を
粗面化処理するのが好ましい。粗面化処理は、バフ研
摩、ソフトエッチング等による化学薬品処理、電解処
理、液体ホーニング等によっておこなうことができる。
銅箔として両面が粗面に予め形成されたものを用いる場
合には、このような粗面化処理は省略することができ
る。 次に、この内層用回路板の銅回路の表面を酸化処理す
る。酸化処理はたとえば酢酸アンモニウム系水溶液など
を用いておこなうことができる。酸化処理することによ
って銅回路の表面に銅酸化物を形成することができる。
銅酸化物層は酸化第一銅(Ｃｕ2Ｏ)及び酸化第二銅(Ｃｕ
Ｏ)によって形成されるが、酢酸アンモニウム系水溶液
などを用いて酸化をおこなうことによって、銅の酸化物
層はＣｕ2Ｏ(亜酸化銅)を主成分とする組成で形成する
ことができる。本発明においてこの酸化処理で形成され
る銅酸化物層は、ＣｕＯ／Ｃｕ2Ｏ＝０．５以下の組成
(重量比)となるようにするのが好ましい。ちなみに、酸
化処理を従来から汎用されている過硫酸カリウムを含む
アリカリ水溶液や亜塩素酸ナトリウムを含むアルカリ水
溶液を用いておこなうと、銅の酸化物層はＣｕＯを主成
分とする組成で形成される。 このように内層用回路板の銅回路の表面にＣｕ2Ｏを主
成分とする酸化物層を形成させて乾燥した後に、内層用
回路板の銅回路の表面を酸処理し、酸化処理で形成され
る銅回路の表面の銅酸化物のうちＣｕＯ成分を除去す
る。特開昭６１−１７６１９２号公報においても紹介さ
れているように、銅酸化物のなかでもＣｕ2Ｏは酸に溶
解しにくいのに対してＣｕＯは酸に溶解し易いものであ
り、このＣｕＯを銅回路の表面から除去することによっ
て、酸に溶解することで発生するハロー現象を防ぐこと
が可能になるのである。ここで、ＣｕＯはこのように酸
に溶解し易いので酸によって処理することで容易に溶解
除去することができる。この酸処理に用いる酸としては
pH＝２以下の強酸が好ましく、塩酸等の無機酸を使用す
ることができるが、このような無機酸以外に有機酸を使
用することもできる。ＣｕＯの除去は、銅回路の表面の
酸化物層の組成が、ＣｕＯ／(Ｃｕ2Ｏ＋Ｃu)＝０．０３
以下になるようにおこなえば実用的に十分である。 上記のように酸で処理をおこなったのちに、直ちに水洗
や湯洗等して内層用回路板から酸を洗い流して乾燥す
る。そしてあとはこの内層用回路板を用いて、通常の工
程で多層プリント配線板を製造することができる。すな
わち、この内層用回路板にプリプレグを介して外層用回
路板(あるいは他の内層用回路板)やもしくは銅箔を重
ね、これを加熱加圧して積層成形することによってプリ
プレグをボンディング層として多層に積層し、さらにス
リーホールをドリル加工して設けると共に化学メッキ等
によってスルーホールメッキを施し、さらにエッチング
等の処理をして外層回路を形成することによって、多層
プリント配線板を製造することができる。In the method for treating a copper circuit of an inner layer circuit board according to the present invention, a copper circuit provided on the inner layer circuit board is oxidized to form a copper oxide layer containing Cu 2 O as a main component on the surface of the circuit. After that, the surface of the copper circuit is treated with an acid to remove CuO in the copper oxide phase. Further, in the present invention, in order to form the copper oxide layer containing Cu 2 O as a main component, it is preferable that the oxidation process of the copper circuit is performed using an ammonium acetate-based solution. The present invention will be described in detail below. As the circuit board for the inner layer, a copper clad glass-epoxy resin laminated board, a copper clad glass polyimide resin laminated board, etc. are used to etch the copper foil, etc., to provide a copper circuit on one side or both sides. However, it is also possible to use a laminate having a copper circuit formed on one side or both sides by chemical plating or electroplating. Then, it is preferable to first roughen the surface of the inner layer circuit board. The roughening treatment can be performed by buffing, chemical treatment such as soft etching, electrolytic treatment, liquid honing and the like.
When a copper foil having both surfaces formed with rough surfaces in advance is used, such a roughening treatment can be omitted. Next, the surface of the copper circuit of this inner layer circuit board is oxidized. The oxidation treatment can be performed using, for example, an ammonium acetate-based aqueous solution. By the oxidation treatment, copper oxide can be formed on the surface of the copper circuit.
The copper oxide layer is composed of cuprous oxide (Cu 2 O) and cupric oxide (Cu).
O), but the copper oxide layer can be formed with a composition containing Cu 2 O (cuprous oxide) as a main component by performing oxidation using an ammonium acetate-based aqueous solution or the like. In the present invention, the copper oxide layer formed by this oxidation treatment has a composition of CuO / Cu 2 O = 0.5 or less.
(Weight ratio) is preferable. By the way, when the oxidation treatment is performed using an aqueous alkaline solution containing potassium persulfate or an alkaline aqueous solution containing sodium chlorite, which has been conventionally used, the copper oxide layer is formed with a composition containing CuO as a main component. . Thus, after forming an oxide layer containing Cu 2 O as a main component on the surface of the copper circuit of the inner layer circuit board and drying it, the surface of the copper circuit of the inner layer circuit board is acid-treated and formed by oxidation treatment. The CuO component of the copper oxide on the surface of the copper circuit is removed. As disclosed in Japanese Patent Application Laid-Open No. 61-176192, among the copper oxides, Cu 2 O is difficult to dissolve in an acid, whereas CuO is easily dissolved in an acid. By removing it from the surface of the copper circuit, it becomes possible to prevent the halo phenomenon caused by dissolution in acid. Here, since CuO is easily dissolved in an acid as described above, it can be easily dissolved and removed by treating it with an acid. The acid used for this acid treatment is
A strong acid having a pH of 2 or less is preferable, and an inorganic acid such as hydrochloric acid can be used, but an organic acid can also be used in addition to such an inorganic acid. To remove CuO, the composition of the oxide layer on the surface of the copper circuit is CuO / (Cu 2 O + Cu) = 0.03.
It is practically sufficient if the following is done. After the treatment with acid as described above, the acid is washed from the inner layer circuit board immediately by washing with water or hot water and then dried. Then, using this inner layer circuit board, a multilayer printed wiring board can be manufactured by a normal process. That is, an outer layer circuit board (or another inner layer circuit board) or a copper foil is overlaid on the inner layer circuit board via a prepreg, and this is heat-pressed and laminated to form a multi-layered prepreg as a bonding layer. It is possible to manufacture a multilayer printed wiring board by stacking layers, further drilling three holes, performing through-hole plating by chemical plating or the like, and further performing processing such as etching to form an outer layer circuit.
内層用回路板の銅回路の表面を酸化処理して酸化物層を
形成することによって、銅回路の表面に微細な突起を形
成させて粗面化して、銅回路と樹脂との接着性を高める
ことができる。また酸化処理して形成されるＣｕ2Ｏを
主成分とする銅酸化物のうち酸に溶解し易いＣｕＯを除
去する処理をおこなうことによって、銅回路の酸化物層
がメッキ処理の際などに溶解してハロー現象が生じるこ
とを防止することができる。By oxidizing the surface of the copper circuit of the inner layer circuit board to form an oxide layer, fine protrusions are formed on the surface of the copper circuit to roughen the surface and enhance the adhesion between the copper circuit and the resin. be able to. In addition, the oxide layer of the copper circuit is dissolved during the plating process by removing the CuO that is easily dissolved in acid from the copper oxide mainly composed of Cu 2 O formed by the oxidation process. As a result, it is possible to prevent the halo phenomenon from occurring.
次い本発明を実施例によって説明する。 実施例 両面に７０μ厚の銅箔を張って形成した厚み１．０
mmのガラス布基材エポキシ樹脂積層板(松下電工株式会
社製品番１７６６)を用いて内層用回路板を作成し、内
層用回路板の銅回路の表面をバフ研摩して粗面化処理し
た。 次に、 ＮＨ4ＣＨ3ＣＯＯ …６０ｇ／ ＮＨ4Ｃｌ …５ｇ／ ＮＨ4ＯＨ(35％) …１０ｇ／ Ｃｕ(ＣＨ3ＣＯＯ)2Ｈ2Ｏ …２０ｇ／ ＣｕＳＯ4５Ｈ2Ｏ …３ｇ／ の組成の酢酸アンモニウム浴を８３℃に調整し、この酸
化処理浴に６０秒間浸漬して銅回路の表面を酸化処理し
た。この処理をした後における銅回路の表面のＣｕＯ／
Ｃｕ2Ｏは０．０５であった。 次に、水：ＨＣｌが１：１の容積比の酸性浴を２５
℃に調整し、この酸性浴に１０秒間浸漬して、酸化処理
した銅回路の表面を酸で処理し、銅回路の表面の銅酸化
物のうちＣｕＯを溶解除去した。この処理をした後にお
ける銅回路の表面のＣｕＯ／Ｃｕ2Ｏ≒０であった。 このように酸で処理した後、直ちに内層用回路板を
流水で水洗して乾燥した。 そしてこのように処理した内層用回路板１の両面に、第
１図に示すようにガラス布基材にエポキシ樹脂を含浸乾
燥して調製した厚み０．１mmのプリプレグ(松下電工株
式会社製１６６１ＪＭ)２を三枚ずつ重ねると共に、さ
らにその外側に厚み１８μｍの銅箔３を重ねてビルドア
ップし、５０Ｔorrに減圧した雰囲気下で、１７０℃、
２０kgf／cm2、１２０分間の条件で二次積層成形するこ
とによって多層板を得た。 比較例１ 実施例１においての工程での酸化処理を、 Ｋ2Ｓ2Ｏ8 …１３ｇ／ ＮaＯＨ …５５ｇ／ の組成で６０℃に調整した過硫酸カリウム浴に３分間浸
漬することによっておこなった。この処理をした後にお
ける銅回路の表面のＣｕＯ／Ｃｕ2Ｏは０．８であっ
た。あとは流水洗浄して乾燥した後、の酸処理をする
ことなく、実施例１と同様に二次積層成形をして多層板
を得た。 比較例２ 実施例１においての酸処理をおこなわないようにした
他は、実施例１と同様にして多層板を得た。 上記実施例及び比較例１，２で得た多層板に、０．４mm
φのドリルビットを用いて８万rpmの回転速度及び１．
６ｍ／minの送り速度の条件でスルーホール加工をおこ
なった。これを水：ＨＣｌが１：１の容積比の酸溶液に
３０分間浸漬して、ハローの発生状態を顕微鏡で観察し
た。ハローの大きさ(スルーホールの内周から酸溶液の
浸入幅寸法で測定)を次表に示す。 実施例は銅回路にＣｕ2Ｏを主成分とする酸化物層を形
成したのちに酸処理してＣｕＯを除去するようにしたも
のであるのに対して、比較例１は銅回路にＣｕＯを主成
分とする酸化物層を形成すると共にＣｕＯの除去処理を
おこなわないもの、比較例２は銅回路にＣｕ2Ｏを主成
分とする酸化物層を形成するがＣｕＯの除去処理をしな
いものである。そして前表にみられるように、実施例の
ものは比較例１や比較例２のものに比べて、ハローの発
生を大幅に低減できることが確認される。The present invention will be described below with reference to examples. Example A thickness of 1.0 formed by stretching a copper foil having a thickness of 70 μm on both sides.
A circuit board for the inner layer was prepared by using a glass cloth substrate epoxy resin laminated plate (Product No. 1766, Matsushita Electric Works, Ltd.) having a thickness of mm, and the surface of the copper circuit of the circuit board for the inner layer was subjected to buffing for roughening treatment. Then, NH 4 CH 3 COO ... 60g / NH 4 Cl ... 5g / NH 4 OH (35%) ... 10g / Cu (CH 3 COO) 2 H 2 O ... 20g / CuSO 4 5H 2 O ... 3g / composition The ammonium acetate bath was adjusted to 83 ° C. and immersed in this oxidation treatment bath for 60 seconds to oxidize the surface of the copper circuit. CuO / on the surface of the copper circuit after this treatment
Cu 2 O was 0.05. Next, 25 times the acidic bath of water: HCl at a volume ratio of 1: 1
The temperature was adjusted to 0 ° C., the surface of the oxidized copper circuit was treated with an acid by immersing it in this acidic bath for 10 seconds, and CuO of the copper oxide on the surface of the copper circuit was dissolved and removed. After this treatment, CuO / Cu 2 O on the surface of the copper circuit was approximately 0. Immediately after the acid treatment, the inner layer circuit board was washed with running water and dried. Then, as shown in FIG. 1, both surfaces of the inner-layer circuit board 1 treated in this way were prepared by impregnating and drying a glass cloth base material with an epoxy resin, and a prepreg having a thickness of 0.1 mm (Matsushita Electric Works, Ltd. 1661JM). While stacking 2 pieces each 3 times, and further stacking a copper foil 3 with a thickness of 18 μm on the outer side, build up, 170 ° C. in an atmosphere depressurized to 50 Torr,
A multilayer board was obtained by carrying out secondary lamination molding under the conditions of 20 kgf / cm 2 and 120 minutes. Comparative Example 1 The oxidation treatment in the process of Example 1 was carried out by immersing in a potassium persulfate bath adjusted to 60 ° C. for 3 minutes with a composition of K 2 S 2 O 8 ... 13 g / NaOH ... 55 g /. The CuO / Cu 2 O on the surface of the copper circuit after this treatment was 0.8. After that, after washing with running water and drying, the secondary lamination molding was carried out in the same manner as in Example 1 without performing the acid treatment to obtain a multilayer board. Comparative Example 2 A multilayer board was obtained in the same manner as in Example 1 except that the acid treatment in Example 1 was omitted. On the multilayer boards obtained in the above-mentioned Examples and Comparative Examples 1 and 2, 0.4 mm
Rotation speed of 80,000 rpm and 1.
Through hole processing was performed under the condition of a feed rate of 6 m / min. This was immersed in an acid solution of water: HCl at a volume ratio of 1: 1 for 30 minutes, and the halo generation state was observed with a microscope. The size of the halo (measured by the penetration width of the acid solution from the inner circumference of the through hole) is shown in the following table. In the example, an oxide layer containing Cu 2 O as a main component was formed on the copper circuit and then CuO was removed by acid treatment, whereas in Comparative example 1, CuO was added to the copper circuit. The one in which the oxide layer containing the main component is not formed and CuO is not removed, and the comparative example 2 is the one in which the oxide layer containing Cu 2 O as the main component is formed in the copper circuit but the CuO is not removed. is there. Then, as seen in the above table, it is confirmed that the halo of the example can be significantly reduced as compared with those of the comparative examples 1 and 2.
上述のように本発明にあっては、内層用回路板に設けた
銅の回路を酸化処理して回路の表面にＣｕ2Ｏを主成分
とする酸化物層を形成した後、この銅の回路の表面を酸
で処理して酸化物層中のＣｕＯを除去するようにしたの
で、銅回路の表面を酸化処理して酸化物層を形成するこ
とで銅回路の表面に微細な突起を形成させて表面を粗面
化して銅回路と樹脂との接着性を高めることができるも
のであり、また銅回路の酸化物層のＣｕＯを除去するこ
とによって酸に溶解し易い成分を低減することができ、
多層プリント配線板に加工するにあたって銅回路の酸化
物層がメッキ処理の際などに酸に溶解してハロー現象が
生じるようなことを防止することができるものである。As described above, according to the present invention, the copper circuit provided on the inner layer circuit board is oxidized to form an oxide layer containing Cu 2 O as a main component on the surface of the circuit. Since the surface of the copper was treated with acid to remove CuO in the oxide layer, the surface of the copper circuit was oxidized to form the oxide layer, thereby forming fine protrusions on the surface of the copper circuit. The surface of the copper circuit can be roughened to enhance the adhesiveness between the copper circuit and the resin, and by removing CuO in the oxide layer of the copper circuit, the components that are easily dissolved in acid can be reduced. ,
When processing into a multilayer printed wiring board, it is possible to prevent the halo phenomenon from occurring due to the oxide layer of the copper circuit being dissolved in acid during the plating process or the like.
第１図は多層板を成形する際の積層構成を示す概略分解
図であり、１は内層用回路板、２はプリプレグ、３は銅
箔である。FIG. 1 is a schematic exploded view showing a laminated structure when molding a multilayer board, 1 is an inner layer circuit board, 2 is a prepreg, and 3 is a copper foil.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 赤松 資幸 大阪府門真市大字門真1048番地 松下電工 株式会社内 (56)参考文献 特開 昭60−133794（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshiyuki Akamatsu 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (56) Reference JP-A-60-133794 (JP, A)
Claims (2)
して回路の表面にＣｕ2Ｏを主成分とする銅酸化物層を
形成した後、この銅の回路の表面を酸で処理して銅酸化
物中のＣｕＯを除去することを特徴とする内層用回路板
の銅回路の処理方法。1. A copper circuit provided on an inner-layer circuit board is oxidized to form a copper oxide layer containing Cu 2 O as a main component on the surface of the circuit, and then the surface of the copper circuit is treated with an acid. A method for treating a copper circuit of a circuit board for an inner layer, which comprises treating to remove CuO in the copper oxide.
溶液でおこなうことを特徴とする請求項１に記載の内層
用回路板の銅回路の処理方法。2. The method for treating a copper circuit of a circuit board for an inner layer according to claim 1, wherein the oxidation treatment of the copper circuit is performed with an ammonium acetate-based solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5152389A JPH0636470B2 (en) | 1989-03-03 | 1989-03-03 | Method for treating copper circuit of circuit board for inner layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5152389A JPH0636470B2 (en) | 1989-03-03 | 1989-03-03 | Method for treating copper circuit of circuit board for inner layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02230794A JPH02230794A (en) | 1990-09-13 |
| JPH0636470B2 true JPH0636470B2 (en) | 1994-05-11 |
Family
ID=12889373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5152389A Expired - Lifetime JPH0636470B2 (en) | 1989-03-03 | 1989-03-03 | Method for treating copper circuit of circuit board for inner layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636470B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10296942A (en) * | 1997-04-23 | 1998-11-10 | Matsushita Electric Works Ltd | Manufacture of laminate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04208596A (en) * | 1990-11-30 | 1992-07-30 | Toppan Printing Co Ltd | Manufacture of multilayer printed circuit board |
| US5289630A (en) * | 1991-07-22 | 1994-03-01 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
| KR101268145B1 (en) * | 2008-10-27 | 2013-05-27 | 히타치가세이가부시끼가이샤 | Method for surface treatment of copper and copper |
-
1989
- 1989-03-03 JP JP5152389A patent/JPH0636470B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10296942A (en) * | 1997-04-23 | 1998-11-10 | Matsushita Electric Works Ltd | Manufacture of laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02230794A (en) | 1990-09-13 |
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