JPH0636768U - Whetstone - Google Patents

Abstract

(57) [Summary] [Purpose] A grindstone that discharges cutting chips smoothly, prevents heat generation, etc., and can be applied to heavy grinding, has a long life, and can obtain a good quality ground surface. To suggest. [Structure] Abrasive surface 6 is provided on outer peripheral surface 2 of the substantially cylindrical grindstone body
And spiral grooves 3a and 3b are formed, and the angle θ between the spiral grooves 3a and 3b and the rotation direction A is set in the range of about 6 degrees to about 15 degrees. The chips are smoothly discharged by the spiral grooves 3a and 3b, and the abrasive surface 6 can be effectively used. Also, the polishing surface 6
Since it continuously contacts the work piece, a good quality ground surface can be obtained.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to improvement of the outer shape of a grindstone. More specifically, it relates to a grindstone intended to improve the working efficiency of an electrodeposited grindstone and to expand the working range (grinding of unheated steel).

[0002]

[Prior art]

 In the case of a grindstone which is formed in a cylindrical shape and grinds by rotating, in consideration of the life of the grindstone and the like, as shown in FIG. 5, the surface 51 of the grindstone 50 is usually not subjected to any uneven treatment such as grooves. is there. However, some grindstones have been devised in which grooves are provided on the surface of the grindstone depending on the object to be ground.

FIG. 4 is an example of a conventional grindstone (segment grindstone) having grooves. The grindstone 40 is a grinding surface formed by electrodepositing abrasive grains on the outer peripheral surface 41 of the main body formed in a cylindrical shape, and the main body rotates about a rotary shaft 42 to perform grinding. ing. On the grinding surface 41, a plurality of vertical grooves 43 are formed in parallel with the axial direction of the rotary shaft 42 at predetermined intervals in the circumferential direction of the grinding surface 41. These vertical grooves 43 have a function as so-called escape grooves for chips (including chips on the grindstone side) ground by the grinding surface 41, and at the same time, the edges of the outer peripheral surface 41 and the grooves 41 are cut portions. It has the function of cutting the workpiece.

[0004]

[Problems to be solved by the device]

 There are some problems to be solved in the grindstone having such grooves. One of them is that chips from the work piece and the grindstone side (such as an electrodeposited portion) adhere to the cut parts (groove edges) of the grindstone, impeding the chip discharging function. Especially when it is used for grinding unheated steel, etc., the chips of the electrodeposition grindstone are relatively large and heavy, and peeling of the electrodeposited part is likely to occur. Adhere to. Therefore, even if the grooves are formed, clogging occurs, heat is generated, and the life of the grindstone cannot be extended to the extent expected.

Second, since the longitudinal groove is formed in the axial direction, that is, at the right angle to the rotation direction, the grinding resistance becomes non-uniform, and when this grindstone is used for grinding, the work piece is not The shock will increase. In addition, the contact between the grindstone and the work piece becomes unstable, which causes deterioration of the grinding quality.

The present invention solves the above problems, and proposes a grindstone that improves the discharge property of chips, prolongs the life of the grindstone, improves the grinding efficiency, and dramatically improves the grinding quality. To serve.

Another object of the present invention is to provide a grindstone capable of reducing cutting resistance, preventing the grindstone from falling off during grinding, and performing good heavy grinding.

[0008]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, in the present invention, the abrasive surface formed on the outer peripheral surface of the substantially cylindrical rotating body and the abrasive surface formed so as to form a predetermined angle with the rotating direction of the rotating body. Further, in the grindstone having at least one spiral groove, the angle of the spiral groove is set between about 6 degrees and about 15 degrees. When a groove is formed at right angles to the rotation direction like a conventional grindstone, problems such as dischargeability and vibration occur, but by forming a groove with an acute angle to the rotation direction, the chips in the groove The movement force along the groove is generated in the groove, and the dischargeability is improved. At the same time, the problem of vibration is solved because the abrasive surface is always in contact with the work piece. Furthermore, the spiral groove allows the groove to be formed at a predetermined angle even when the outer peripheral surface has a wide width. In such a spiral groove, if the angle formed by the direction of rotation and the spiral groove is too small, the moving force generated in the chips decreases and discharge becomes impossible. On the other hand, if it is too large, continuous contact between the grinding surface and the work piece is hindered, which leads to occurrence of vibrations and the like, and deterioration of grinding quality. Therefore, in the present invention, by setting the angle of the spiral groove between about 6 degrees and about 15 degrees, it is possible to maintain a good discharge of chips and to realize a grinding device that does not cause vibrations or other problems. ing. This angle may be either clockwise or counterclockwise with respect to the direction of rotation. By selecting clockwise or counterclockwise, the chips are selectively discharged to the front or the rear of the grinding machine. It is particularly desirable that this angle be between about 7 degrees and about 12 degrees.

Further, in consideration of clogging when discharging chips, it is effective that the width of the spiral groove is 1 mm or more. Then, the spiral grooves are formed such that the intervals between the adjacent spiral grooves are equal to each other, and when the width of each spiral groove and the width of the grinding surface sandwiched between the adjacent spiral grooves are substantially equal to each other, A spiral groove having a sufficient width can be formed, and the efficiency of chip discharge can be improved. At the same time, since the area of the entire grinding surface is constant with respect to the rotation direction, the grinding resistance is constant and the grinding quality is improved. Further, since the chips can be efficiently discharged, the effective area of the polishing surface is less likely to decrease due to clogging. Therefore, even if the grinding surface is narrowed to reduce the cutting resistance, the working efficiency in grinding can be maintained or improved.

In such a grindstone, it is sufficient if the abrasive grains are electrodeposited at least on the grinding surface between the adjacent spiral grooves. Also, by selecting borazone abrasive grains as the abrasive grains, it is possible to inexpensively realize a stone having a performance equal to or higher than that of the diamond stone. Furthermore, depending on the material to be processed, it is possible to exert more effective performance by selecting either borazon abrasive grains or diamond abrasive grains as the abrasive grains.

[0011]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of a grindstone according to the present invention. The grindstone 1 of this example has a cylindrical shape, and a rotary shaft 4 is coaxially attached to one end surface of the grindstone 1. The rotary shaft 4 is attached to a rotary drive means (not shown). By rotating this rotary shaft at high speed in the direction of arrow A, the cylindrical grindstone 1 rotates, and grinding is performed by the outer peripheral surface 2.

As shown in FIGS. 1 and 2, the outer peripheral surface 2 of the grindstone 1 of the present example is formed with two spiral grooves 3a 3 and 3b. As shown in FIG. 3, the spiral grooves 3a and 3b are formed so as to form an angle θ with the rotation direction A. Then, in the region sandwiched by the spiral grooves 3a and 3b, borazon abrasive grains 7 are electrodeposited to form a polishing surface 6. Such a grindstone 1 is called a so-called horazon electrodeposition grindstone, has good heat resistance, and is also used for grinding steel (heat treated steel).

Each of the spiral grooves 3a and 3b in this example is a V groove having a V-shaped cross section, and the angle R of the V groove is selected to be about 60 degrees. The cross section of the spiral groove is not limited to the V groove as in this example, and it goes without saying that the spiral groove may be a U-shaped groove or a rectangular groove. However, when performing a large amount of work such as cutting with a grinding device having a spiral groove, grinding is performed around the ridgeline of the spiral groove. Therefore, since a spiral ridgeline is formed along the spiral groove, wear of the ridgeline is small. However, wear is further suppressed by selecting an obtuse angle, that is, an angle narrowing toward the center of the spiral grooves 3a, 3b, as the angle of the ridge line 8 that is the boundary between the grinding surface 6 and the spiral grooves 3a, 3b. You can

Further, in the grindstone 1 of this example, the angle θ formed by the spiral groove 3 and the rotation direction A is set to 7.5 degrees in the clockwise direction from the rotation direction A. As a result, the chips 9 discharged into the spiral groove 3 are given a force to move along the groove 3, move in the direction of arrow B, and are discharged in front of the grindstone 1 on the opposite side of the rotary shaft 4. It Contrary to this example, when the spiral groove 3 is formed in the counterclockwise direction, the chips 9 are discharged in the direction of the rotating shaft 4. If this angle θ is too small, the discharge speed of the chips 9 is reduced, and the chips 9 are clogged in the spiral groove 3. As a result, the chips 9 are present on the polishing surface 6, so that the effective area of the polishing surface 6 is reduced and the grinding efficiency is reduced. Further, since the frictional heat is increased, the life of the grindstone 1 is shortened. From the experimental results by the applicant, it has been found that the angle θ is preferably set to at least about 6 degrees or more, more preferably about 7 degrees or more in order to smoothly discharge the chips 9.

On the other hand, when the angle θ between the spiral groove 3 and the rotation direction A is too large, the spiral groove 3 and the grinding surface 6 intermittently contact the work piece to cause vibration or the work piece. Problems such as roughened grinding surface occur. There is also a problem that the ridgeline 8 of the spiral groove 3 is greatly worn during cutting and the life of the grindstone 1 is shortened. From the experimental results by the present applicant, it has been found that the angle θ at which the occurrence of vibration can be suppressed and there is no problem such as increase in roughness of the ground surface is about 15 degrees or less, preferably about 12 degrees or less. Therefore, by selecting the angle θ from about 6 degrees to about 15 degrees, preferably from about 7 degrees to 12 degrees, the chips 9 can be discharged smoothly, and at the same time, the occurrence of vibration etc. is prevented. The whetstone 1 that can be realized can be realized. Therefore, in this embodiment, the angle θ is set to 7.5 degrees.

Further, when the chips 9 are discharged, the width 10 of the spiral groove 3 also becomes a problem. That is, when the width 10 is 1 mm or less, the resistance at the time of discharging increases, and it becomes difficult to smoothly discharge the chips 9. Therefore, the grinding efficiency is reduced similarly to the above. Therefore, it is desirable that the width 10 of the spiral groove is wide. On the other hand, if the width 10 of the spiral groove is wide, the width of the grinding surface 6 is inevitably narrowed. Is reduced, and the grinding surface 6 is effectively used. Further, when the number of the grinding surfaces 6 decreases, the cutting resistance decreases, and further, since the cutting dust 9 does not remain on the grinding surfaces 6, the friction resistance during grinding is greatly reduced. Therefore, the grindstone 1 of this example can reduce the grinding resistance and save energy while maintaining the grinding ability. In this embodiment, the width 10 of the spiral groove and the width 11 of the grinding surface 6 are set to be substantially the same so that the chips 9 can be discharged smoothly and the grinding ability can be improved. Further, if the width 10 of the spiral groove and the width 11 of the grinding surface 6 are made substantially the same, the width of the whole grinding surface 6 appearing along the rotation direction A can be made constant, so that the grinding resistance is constant. Becomes Therefore, unevenness in the rotation speed of the grindstone 1 is eliminated, and it becomes possible to obtain a ground surface of higher quality.

As described above, in the grindstone 1 of this example, the chips 9 can be discharged smoothly, and the grinding surface 6 can be effectively utilized. Therefore, the grinding resistance can be suppressed, heat generation can be prevented, and distortion of the rotary shaft 4 due to the effect of the grinding resistance can be suppressed. For this reason, it can be applied to a wide range of processing including heavy grinding from unheated materials to heat treated steel. Moreover, it has a long life because clogging and peeling of abrasive grains are extremely small and the generation of frictional heat is suppressed, and the life is extended to more than twice, or about 10 times that of conventional grindstones. It is possible to In addition, since the grinding resistance is low, it saves energy and can reduce power consumption. Furthermore, by changing the angle of the spiral groove, it is possible to set the chip discharge direction in front of and behind the grindstone, and it is also possible to process in the dust direction. Further, since the heat generated during grinding is small, the cooling time after processing the workpiece can be shortened.

In this example, the description is based on a cylindrical grindstone, but if it is a grindstone that grinds a workpiece by rotating, such as a cone, the spiral groove as described above is formed. Therefore, the same effect can be obtained.

Further, in this example, the borazon abrasive grains are used as the abrasive grains, but the same effect can be obtained even when the diamond abrasive grains are used depending on the work material.

[0021]

[Effect of device]

 As described above, the grindstone according to the present invention has one or more spiral grooves formed on the grinding surface, and by setting the angle between the spiral groove and the rotating direction within a predetermined range With the rotation of the grinding machine, it can be relatively moved along the groove and discharged smoothly to the outside. Therefore, it is possible to prevent clogging of the grinding surface and to effectively utilize the grinding surface, so that heat generation and the like can be prevented, the grinding efficiency can be improved, and the life of the grinding device can be extended. Further, in the grindstone according to the present invention, since the grinding surface can continuously contact the surface to be processed, a grinding surface of good quality can be obtained.

Further, since it is possible to reduce and uniformize the grinding resistance, it is possible to save power, dramatically improve the quality of grinding, and effectively prevent falling of the grindstone during grinding. It can be used for processing in the direction. The grindstone with improved grinding ability is particularly suitable for grinding unheat-treated steel, and when applied to an electrodeposition grindstone or the like, peeling of the electrodeposition layer can be prevented and the life can be greatly extended.

[Brief description of drawings]

FIG. 1 is an outline view showing an outline of a grindstone according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a cross section of the grindstone shown in FIG.

FIG. 3 is an enlarged view showing details of a D portion near the grinding surface of the grindstone shown in FIG.

FIG. 4 is an outline view showing a conventional grindstone having grooves formed therein.

FIG. 5 is an outline view showing a conventional grindstone in which no groove is formed.

[Explanation of symbols]

 1 ・ ・ Whetstone 2 ・ ・ Outer peripheral surface 3 ・ ・ Spiral groove 4 ・ ・ Rotation axis 6 ・ ・ Grinding surface 7 ・ ・ Abrasive grain 8 ・ ・ Spiral groove edge 9 ・ ・ Chip 10 ・ ・ Spiral groove width 11・ Width of grinding surface

Claims (7)

[Scope of utility model registration request] 1. A grinding surface formed on an outer peripheral surface of a substantially cylindrical rotating body, and at least one spiral groove formed on the grinding surface so as to form a predetermined angle with a rotation direction of the rotating body. In the grindstone having the angle of the spiral groove is about 6 degrees to about 1
A grindstone characterized by being within a range of 5 degrees. 2. The grindstone according to claim 1, wherein the angle of the spiral groove is in the range of about 7 degrees to about 12 degrees. 3. The grindstone according to claim 1, wherein the spiral groove has a width of at least 1 mm. 4. The method according to any one of claims 1 to 3,
The spiral grooves are formed such that the intervals between the adjacent spiral grooves are equal to each other, and the width of the spiral grooves and the width of the grinding surface between the adjacent spiral grooves are substantially equal to each other. Whetstone 5. The method according to any one of claims 1 to 4,
Abrasive grains are electrodeposited on at least the abrasive surface between the adjacent spiral grooves. 6. The grindstone according to claim 5, wherein the abrasive grains are borazone abrasive grains. 7. The grindstone according to claim 5, wherein the abrasive grains are diamond abrasive grains.