JPH0637155A - Electrode bonder - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide an electrode bonding apparatus that requires almost no position correction of the bonding tool during the work. [Structure] A through hole is provided in an ultrasonic horn 1 having a bonding tool 8 attached to its tip, or the ultrasonic horn 1
Blow pipe 11 that blows cold or hot air close to
Is provided, the through hole of the ultrasonic horn 1 or the blow pipe 1
The temperature of the ultrasonic horn 1 is kept constant by flowing cold air, hot air, or air of which temperature is kept constant by mixing them into No. 1 as necessary.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode used for joining an electrode provided on a semiconductor device and an external lead, or for joining a conductive protrusion to an electrode provided on a semiconductor device. Regarding the joining device.

[0002]

2. Description of the Related Art In recent years, the number of electrodes for connecting to external leads has increased due to higher integration and higher density of semiconductor devices, and the electrode interval has become narrower. On the other hand, as the method for connecting the electrodes of the semiconductor device to the external leads, a film carrier method, a flip chip method, etc. have been put to practical use in addition to the wire bonding method. Under these circumstances,
There is also a strong demand for higher performance in electrode joining devices for connecting electrodes of semiconductor devices to external leads and electrode joining devices for joining conductive protrusions to electrodes of semiconductor devices. .

A conventional electrode joining device will be described below. FIG. 7 is a perspective view of a conventional electrode bonding apparatus, showing a wire bonding apparatus. In FIG. 7, 1 is an ultrasonic horn, 2 is a circuit board, 3 is an IC chip, 4 is a heat block for mounting and heating the circuit board 2, 5 is a thin metal wire (generally a gold wire is used), and 6a is IC chip 3
The upper electrode, 6b are electrode wirings on the circuit board 2, 7 is a heater for heating the heat block 4, and 8 is a bonding tool.

The operation of the wire bonding apparatus having the above structure will be described below. First, the circuit board 2 on which the IC chip 3 is mounted is placed on the heat block 4 and fixed mechanically or by vacuuming.
Next, a metal ball (not shown) is formed at the tip of the thin metal wire 5 which is passed through the through hole of the bonding tool 8. The metal sphere is pressed against the electrode 6a, and ultrasonic waves are applied to the electrodes through the ultrasonic horn 1 to bond them. Next, while drawing out the thin metal wire 5 from the bonding tool 8, the electrode wiring 6 on the circuit board 2
The metal thin wire 5 is pressed against b, and ultrasonic waves are applied through the ultrasonic horn 1 to bond them. This operation is repeated by the number of electrodes 6a to complete the joining.

Next, an example in which a conductive protrusion (hereinafter referred to as a protrusion electrode) is bonded to an electrode of a semiconductor device will be described. FIG. 8 is a perspective view of a conventional protruding electrode forming apparatus. As shown in FIG. 8, a wafer 9 having a large number of IC chips 3 formed thereon is placed on a heat block 4, and a metal ball (not shown) is attached to the tip of a thin metal wire 5 which is passed through a through hole of a bonding tool 8. The metal ball is formed and the electrode 6a of the IC chip 3 is formed.
(Not shown in FIG. 8), ultrasonic waves are applied through the ultrasonic horn 1 to bond them. After that, the protruding electrode 10 is formed by cutting the metal thin wire 5 in the vicinity of the joined metal sphere.

[0006]

However, in the above-mentioned conventional structure, the ultrasonic horn expands due to the radiant heat from the heat block that mounts and heats the circuit board, and the displacement of the bonding tool occurs. There was a problem that the position had to be corrected frequently. As a result, work efficiency is lowered, which causes defects.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an electrode bonding apparatus which requires almost no position correction of the bonding tool during the work, and which is almost unnecessary during the work.

[0008]

In order to achieve this object, the electrode bonding apparatus of the present invention is provided in the vicinity of an ultrasonic horn having a bonding tool attached to the tip thereof, or cold air provided in the ultrasonic horn itself. The temperature control means controls the temperature of the ultrasonic horn with hot air.

[0009]

With this configuration, expansion of the ultrasonic horn due to radiant heat from the heat block can be prevented, positional displacement due to thermal expansion of the ultrasonic horn can be eliminated, and work efficiency can be improved and defects can be reduced.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electrode bonding apparatus according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the electrode bonding apparatus. In FIG. 1, the same parts as those in the conventional example shown in FIG. Reference numeral 11 is a blow pipe installed beside the ultrasonic horn 1 for blowing air. The heat block 4 is fixed on an XY table (not shown) that can be positioned in the X and Y directions that are orthogonal to each other on a horizontal plane. The circuit board 2 having the IC chip 3 mounted thereon is placed on the heat block 4 and heated. The ultrasonic horn 1 has a bonding tool 8 attached to its tip,
The rear end is supported so that it can swing up and down around the support shaft.
It is designed to be driven by a servo motor. A blow pipe 11 for blowing out air is installed beside the ultrasonic horn 1, and cool air is blown to the ultrasonic horn 1 to keep the temperature constant.

FIG. 2 is a front view of FIG. 1, showing a state in which the cooling air is blown onto the ultrasonic horn 1. The blowing direction of air from the blow pipe 11 is set obliquely upward so as not to change the heating state of the circuit board 2. Further, by providing a sensor (not shown) that detects the temperature of the ultrasonic horn 1 and controlling the amount of air blown out by the output thereof, the temperature of the ultrasonic horn 1 can be further stabilized.

The blow pipe 11 is used in this embodiment.
Although an example of cooling the ultrasonic horn by blowing cold air has been described, it may be changed according to the installation situation of the electrode joining device such as blowing hot air or air having a desired temperature in which hot air and cold air are mixed in some cases. Is desirable.

Although the blow pipe 11 is installed only on the left side of the ultrasonic horn 1 in FIG. 1, the circuit board 2
The air may be blown out from two or more directions within a range that does not affect the temperature.

Next, an electrode bonding apparatus according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a perspective view of the electrode bonding apparatus. In FIG. 3, the same parts as those in the conventional example shown in FIG. In FIG. 3, 12 is an electromagnetic induction coil for supplying electric power to the ultrasonic horn 1 to heat it, and 13 is a non-contact type temperature detector for detecting the temperature of the ultrasonic horn 1.

With the above structure, the temperature detector 13 measures the temperature of the ultrasonic horn 1, the current to the electromagnetic induction coil 12 is adjusted by the output from the temperature detector 13, and the current is supplied to the ultrasonic horn 1. Adjust the power and control the temperature.

Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a perspective view of the electrode bonding apparatus, and FIG. 5 is a flowchart for explaining the operation of the electrode bonding apparatus. In FIG. 4, the same parts as those in the conventional example shown in FIG. As shown in these figures, the temperature of the ultrasonic horn 1 is detected by the temperature detector 13, and the expansion / contraction amount is calculated based on the difference from the reference temperature. The positional deviation is calculated from this expansion / contraction amount, and the result is fed back to the drive system of the XY table for bonding. By doing so, especially the blow pipe 11 in FIG. 1 and the electromagnetic induction coil 12 in FIG.
It is possible to correct the positional deviation of the bonding tool 8 even without providing.

Next, a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a perspective view of an electrode bonding apparatus according to the fourth embodiment of the present invention. In FIG. 6, the same parts as those of the conventional example shown in FIG. Reference numeral 14 is a heat insulating plate. With such a configuration, the heat insulating plate 14 can prevent radiant heat from the heat block 4 and prevent the temperature of the ultrasonic horn 1 from rising. The configuration of this embodiment is the same as that of the first embodiment.
Further effects can be obtained by using together with the third embodiment.

In each of the above-described first to fourth embodiments, the case where the electrodes of the IC chip are connected to the electrode wiring or the lead frame on the circuit board by using the fine metal wires, and the wire bonding apparatus is diverted. Although the example of forming the protruding electrodes on the IC chip has been described above, other than this, it is effective when applied to an electrode bonding apparatus for connecting inner leads one by one in TAB method inner lead bonding. is there.

[0019]

As described above, according to the present invention, a blow pipe for blowing air to prevent the temperature of the ultrasonic horn from rising due to radiant heat from the heat block, an electromagnetic induction coil for raising the temperature of the ultrasonic horn, or a supersonic horn. By providing the heat insulating plate between the sound wave horn and the heat block, it is possible to work without displacement of the bonding tool, and it is possible to improve work efficiency and realize an excellent electrode bonding device without misalignment. .

[Brief description of drawings]

FIG. 1 is a perspective view of an electrode joining device according to a first embodiment of the present invention.

FIG. 2 is a front view of the electrode joining device according to the first embodiment of the present invention.

FIG. 3 is a perspective view of an electrode joining device according to a second embodiment of the present invention.

FIG. 4 is a perspective view of an electrode joining device according to a third embodiment of the present invention.

FIG. 5 is a flowchart for explaining the operation of the electrode bonding apparatus.

FIG. 6 is a perspective view of an electrode joining device according to a fourth embodiment of the present invention.

FIG. 7 is a perspective view of a conventional electrode joining device.

FIG. 8 is a perspective view of a conventional protruding electrode forming apparatus.

[Explanation of symbols]

 1 Ultrasonic horn 8 Bonding tool 11 Blow pipe (temperature control means)

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Makoto Imanishi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (6)

[Claims] 1. An electrode bonding apparatus having temperature control means for controlling the temperature of an ultrasonic horn by means of cold air or hot air provided near an ultrasonic horn having a bonding tool attached to its tip or provided on the ultrasonic horn itself. 2. An electrode joining device provided with an electromagnetic induction coil in the vicinity of an ultrasonic horn having a bonding tool attached to its tip. 3. A temperature control means for controlling the temperature of the ultrasonic horn by cold air or hot air provided near the ultrasonic horn having a bonding tool attached to the tip thereof or provided on the ultrasonic horn itself, and the ultrasonic horn. An electrode joining device having an electromagnetic induction coil provided close to the electrode. 4. A temperature detection means for detecting the temperature of the ultrasonic horn is provided, and at least one of cold air, hot air and current of an electromagnetic induction coil supplied to the temperature control means is controlled by an output from the temperature detection means. Claims 1 and 2
Alternatively, the electrode bonding apparatus according to item 3. 5. An electrode joining apparatus comprising: a temperature detecting means for detecting the temperature of an ultrasonic horn; and a calculating means for calculating and outputting a positional deviation of a bonding tool based on an output from the temperature detecting means. 6. The electrode bonding apparatus according to claim 1, wherein a heat insulating plate is provided below the ultrasonic horn without contacting the ultrasonic horn.