JPH0637210A - Semiconductor device and manufacture thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] In a resin-sealed semiconductor device with heat dissipation fins,
Reduce the cost by shortening the assembly process. [Structure] A radiation fin having a groove and a package substrate are temporarily fixed and pelletized, and a resin for sealing is injected in a state where wires are connected to fix both. [Effect] The assembly work is simplified by simultaneously performing pellet sealing and heat radiation fin assembly, and low thermal resistance can be obtained by directly attaching the pellet to the fin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure in a semiconductor device.

[0002]

2. Description of the Related Art A structure in which a radiation fin is combined with a semiconductor substrate or a package base material is known as a cooling means for operating a semiconductor device. For example, JP-A-59-1787
In the 55 publication, the structure of the semiconductor device in which the mechanical coupling between the heat radiation fin and the semiconductor package substrate is fixed by an adhesive or screws is described.

[0003]

However, the conventional plastic pin grid array (P
In the PGA) package, since the structure for mounting the heat radiation fins on the semiconductor device (package) is complicated, the work time for assembling the heat radiation fins is long and the cost of the members is high, resulting in cost reduction of the semiconductor device. Is limited. Further, according to the conventional technique, since the semiconductor chip (pellet) is not always directly attached to the heat radiation fin, the heat generated during the operation is hard to be transmitted to the heat radiation fin, and the heat radiation efficiency is low.

Therefore, in the present invention, the structure is such that the radiation fin can be directly fixed to the semiconductor substrate, thereby simplifying the assembling work and further reducing the cost by integrating it with the step of sealing the semiconductor chip. It aims to provide a semiconductor device manufacturing technology.

[0005]

The present invention comprises a semiconductor chip, a package base having a plurality of lead members electrically connected to respective electrodes of the chip, and a heat dissipation member thermally connected to the chip. In the semiconductor device, the semiconductor chip is directly connected to the heat dissipation member through the window of the package base material, and the package base material is tightly coupled to the heat dissipation member via the resin material that enters the groove. Characterize. As a result, a semiconductor device with extremely good heat dissipation efficiency and easy assembly was realized.

The present invention also uses a package member in which a frame-shaped substrate is provided with a window hole, and the semiconductor chip is connected to the projecting portion with the projecting portion of the heat dissipation member inserted in the window hole, After electrically connecting each electrode of the chip and each lead of the package base material, the semiconductor chip is sealed with resin, and at the same time, the package base material and the heat dissipation member are bonded via the resin. The present invention provides a method for manufacturing a semiconductor device. Further, in the above manufacturing method, a groove or irregularity is formed in a part of the heat dissipation member, and the semiconductor chip is sealed with a resin molding material in such a manner that the resin enters the groove or the like, thereby shortening the assembly work time, The cost could be reduced.

[0007]

FIG. 1 is a front sectional view of a semiconductor device with a radiation fin according to an embodiment of the present invention. This semiconductor device is called a plastic pin grid array (PPGA) type, in which a plurality of inner leads (not shown) are arranged in the insulating package substrate 1, and a plurality of pins (outer pins) which are respectively connected to the ends of the leads (outer leads). Leads 2 are planted vertically to the substrate surface. Reference numeral 3 is a heat radiation fin made of metal, and a semiconductor chip (pellet) 4 is directly connected to the base thereof, and gold wires 5 are provided between each electrode terminal (pad) of the chip and the inner lead on the insulating package substrate 1. Wire bonding is done by. A part of the space between the heat radiation fin 3 and the insulating package substrate 1 is temporarily fixed with an adhesive 6, and is sealed with a resin 7 so as to cover the semiconductor chip 4 and the wire. 8 is filled through the through hole 9 of the package substrate so as to fill the gap between the package substrate and the radiation fin. Grooves (or recesses) 10 are formed on the surface where the heat radiation fins come into contact with the resin 8.

FIG. 3 is a sectional view showing a part of main assembling steps for manufacturing the semiconductor device of FIG. In FIG. 3, the vertical direction is opposite to that in FIG. With respect to the concave portion 11 of the insulating package substrate 1 with the pin (outer lead) 2 facing upward, the protruding portion 1 which is the base portion of the heat radiation fin
Insert 2. A sheet-shaped adhesive 6 is applied to the surface of the heat radiation fin that comes into contact with the package substrate. A groove (or an uneven portion) 10 is formed on a part of the surface of the heat dissipation fin. The groove has a rectangular cross section, and also has a groove 13 having a semicircular cross section as shown in FIG. It may be formed like the widened groove 14 of FIG.

FIG. 4 is a sectional view showing an assembly process after the state of FIG. The heat dissipating fins 3 are brought into contact with the insulating package substrate 1, and the semiconductor pellets 4 are pelletized by resin paste or soldering on the surface of the projecting portion of the heat dissipating fins through the window holes of the package substrate while being temporarily fixed with the adhesive 6. The electrodes (pads) on the surface are wire-bonded to the inner leads exposed in a wiring pattern on the package substrate. At the same time or after this, the heat radiation fins and the lower part of the package substrate are set in a metal mold (lower mold) 15 for resin molding. Further, with a mold (upper mold) (not shown) set from above, resin is injected into a portion surrounded by a dotted line. At this time, at the same time, the resin is filled into the space between the board and the heat radiation fin through the through hole 9 of the package board, whereby
The PPGA semiconductor device having the shape shown in FIG. 1 is completed.

FIG. 2 is a front sectional view of a semiconductor device with a radiation fin according to another embodiment of the present invention. In this semiconductor device, the insulating package substrate 1 is formed in a flat plate shape, and the structure of inner leads and outer leads (pins) is exactly the same as that of the package substrate of FIG. In this case, the radiation fins are temporarily fixed and fixed by a sheet-shaped adhesive 6 around the window hole of the package substrate.

FIG. 5 is a front sectional view of a semiconductor device with a radiation fin according to still another embodiment of the present invention. In this semiconductor device, a heat sink (radiating plate) 16 for connecting the semiconductor pellets 4 is screwed and fixed to a separate radiating fin 3 by a screw 17, and a resin for sealing enters into a gap between them. The heat generated in the semiconductor pellets escapes to the radiation fins through these screws.

FIGS. 7 and 8 show a modification of the heat radiation fin 3 in which the fins are formed in the vertical direction in the present invention. FIG. 7 is a top view thereof, in which the individual fins vertically implanted are formed in a cylindrical shape. FIG. 8 is a front view.

[0013]

As described above, according to the present invention described in the embodiments, the following effects can be obtained. That is, the use of pellet-sealing resin for the means or process for joining the heat radiation fin and the package substrate significantly reduces the working time, improves mass productivity, and reduces cost. Further, since the pellets are directly attached to the radiation fins, the heat generated from the pellets is directly transferred to the radiation fins, which facilitates the reduction of the thermal resistance. Providing unevenness or a groove on a part of the fin makes the mechanical coupling with the package substrate through the resin large.

[Brief description of drawings]

FIG. 1 is a front sectional view of a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a front sectional view of a semiconductor device according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a partial assembly step of the method for manufacturing the semiconductor device according to the embodiment of the present invention.

FIG. 4 is a process cross-sectional view subsequent to the process of FIG.

FIG. 5 is a front sectional view of a semiconductor device according to another embodiment of the present invention.

FIG. 6 is a cross-sectional view of a groove that is a part of a radiation fin in the embodiment of the present invention.

FIG. 7 is a plan view of a radiation fin according to a modified example of the present invention.

8 is a front cross-sectional view of a heat radiation fin corresponding to FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulator package substrate 2 Outer leads (pins) 3 Radiating fins 4 Semiconductor pellets 5 Bonding wires 6 Sheet adhesives 7 Sealing resin moldings 8 Resin moldings (filling gaps) 9 Through holes 10 Grooves (or Unevenness)

Claims (3)

[Claims] 1. A semiconductor device comprising a semiconductor chip, a package base having a plurality of lead members electrically connected to respective electrodes of the chip, and a heat dissipation member thermally connected to the chip, A semiconductor device characterized in that a semiconductor chip is directly connected to a heat dissipation member through a window of a package base material, and the package base material is tightly coupled to the heat dissipation member via a resin material that enters the groove. 2. A chip base is used in which a package base material having a frame-shaped package substrate provided with a window hole is used, and a semiconductor chip is connected to the projecting portion with the projecting portion of the heat dissipation member inserted in the window hole. After electrically connecting each of the electrodes to each lead of the package base material, the semiconductor chip is sealed with the resin molding material, and at the same time, the package base material and the heat dissipation member are bonded via the resin molding material. A method for manufacturing a semiconductor device, comprising: 3. The method of manufacturing a semiconductor device according to claim 2, wherein a groove or an unevenness is formed in a part of the heat dissipation member, and the semiconductor chip is sealed with a resin molding material in such a manner that the resin enters the groove or the like.