JPH0637242A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH0637242A JPH0637242A JP19125092A JP19125092A JPH0637242A JP H0637242 A JPH0637242 A JP H0637242A JP 19125092 A JP19125092 A JP 19125092A JP 19125092 A JP19125092 A JP 19125092A JP H0637242 A JPH0637242 A JP H0637242A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island
- resin
- lead frame
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000725 suspension Substances 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 239000011800 void material Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はリードフレームに関し、
特に樹脂封止型半導体装置用のリードフレームに関す
る。FIELD OF THE INVENTION The present invention relates to a lead frame,
In particular, the present invention relates to a lead frame for a resin-sealed semiconductor device.
【０００２】[0002]
【従来の技術】従来のリードフレームは、図２に示すよ
うに、内部リード３に接着して内部リード３を互に連結
し固定する枠状の絶縁性テープ５と、吊りリード２に設
けた段差部４により内部リード３を含む平面と異なる平
面内に支持したアイランド１とを有して構成される。2. Description of the Related Art As shown in FIG. 2, a conventional lead frame is provided on a suspension lead 2 and a frame-shaped insulating tape 5 which is adhered to the inner lead 3 to connect and fix the inner leads 3 to each other. The island 1 is supported by the step portion 4 in a plane different from the plane including the internal leads 3.
【０００３】[0003]
【発明が解決しようとする課題】この従来のリードフレ
ームは、絶縁性テープが内部リード及び吊りリードの両
方を連結している為、樹脂封止時の封止温度により、リ
ードフレームと絶縁性テープの熱膨張率の相違で内部リ
ードが盛り上り、それに伴って絶縁性テープに連結され
た吊りリードとアイランドが浮き上がり、アイランドの
下面に流入する樹脂の流速が速くなり過ぎ、樹脂流の下
流から半導体チップの上面に流れ込んで空気の逃げ道を
塞いでボイドを発生させるという問題点があった。In this conventional lead frame, since the insulating tape connects both the internal lead and the suspension lead, the lead frame and the insulating tape are sealed depending on the sealing temperature at the time of resin sealing. The internal lead rises due to the difference in the coefficient of thermal expansion, and the hanging lead and the island connected to the insulating tape rise accordingly, and the flow velocity of the resin flowing into the bottom surface of the island becomes too high, and the semiconductor flows from the downstream of the resin flow. There is a problem that it flows into the upper surface of the chip to block the escape path of air and generate a void.
【０００４】[0004]
【課題を解決するための手段】本発明のリードフレーム
は、内部リードに接着して前記内部リードを互に連結す
る枠状の絶縁性テープと、吊りリードに段差部を設けて
前記内部リードを含む平面と異なる平面内に設けたアイ
ランドとを有するリードフレームにおいて、前記吊りリ
ードの段差部を前記テープの外側に設けている。A lead frame of the present invention comprises a frame-shaped insulating tape which is adhered to internal leads to connect the internal leads to each other, and a step portion is provided on a suspension lead to attach the internal leads to each other. In a lead frame having a plane including the plane and an island provided in a plane different from the plane including the plane, the step portion of the suspension lead is provided outside the tape.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【０００６】図１（ａ），（ｂ）は本発明の一実施例を
示すリードフレームの平面図及びＡ−０−Ａ′線断面図
である。1 (a) and 1 (b) are a plan view and a sectional view taken along line A-0-A 'of a lead frame showing an embodiment of the present invention.
【０００７】図１（ａ），（ｂ）に示すように、内部リ
ード３に接着して内部リード３を互に連結し固定する枠
状の絶縁性テープ５と、絶縁性テープ５の外側の吊りリ
ード２に段差部４を設けて内部リード３を含む平面と異
なる平面内に支持したアイランド１とを有して構成さ
れ、吊りリード２と絶縁性テープ５とは接続されていな
いため、樹脂封止の際の封止温度により、内部リード３
が盛上ってもアイランド１が浮上ることがないため、半
導体チップ上面にボイドを生ずることを防止できる。As shown in FIGS. 1 (a) and 1 (b), a frame-shaped insulating tape 5 that adheres to the inner leads 3 to connect and fix the inner leads 3 to each other, and Since the suspension lead 2 is provided with the step portion 4 and the island 1 supported in a plane different from the plane including the internal lead 3, the suspension lead 2 and the insulating tape 5 are not connected to each other, and thus the resin is used. Depending on the sealing temperature at the time of sealing, the internal lead 3
Since the island 1 does not float up even when it rises, it is possible to prevent the occurrence of voids on the upper surface of the semiconductor chip.
【０００８】[0008]
【発明の効果】以上説明したように本発明は、内部リー
ドに接着して内部リードを連結した絶縁性テープの外側
に段差部を設けた吊りリードによりアイランドを支持す
ることにより、吊りリードを絶縁性テープと連結してい
ないため、樹脂封止時の熱でアイランドが浮き上ること
を防ぎ、樹脂封止の際のアイランド下に流入する封止樹
脂の流速を抑えて半導体チップ上面に生じ易いボイドの
発生を防止できるという効果を有する。As described above, according to the present invention, the hanging lead is insulated by supporting the island by the hanging lead provided with the step portion on the outside of the insulating tape which is adhered to the inner lead and connected to the inner lead. Since it is not connected to the conductive tape, it prevents the island from floating due to the heat during resin encapsulation, and suppresses the flow velocity of the encapsulating resin that flows under the island during resin encapsulation, which tends to cause voids on the top surface of the semiconductor chip. This has the effect of preventing the occurrence of
【図１】本発明の一実施例を示す平面図及びＡ−０−
Ａ′線断面図。FIG. 1 is a plan view showing an embodiment of the present invention and A-0-
A'line sectional drawing.
【図２】従来のリードフレームの一例を示す平面図及び
Ｂ−Ｐ−Ｂ′線断面図。2A and 2B are a plan view and a cross-sectional view taken along the line BP-B 'showing an example of a conventional lead frame.
１ アイランド ２ 吊りリード ３ 内部リード ４ 段差部 ５ 絶縁性テープ 1 island 2 suspended lead 3 internal lead 4 step 5 insulating tape
Claims (1)
互に連結する枠状の絶縁性テープと、吊りリードに段差
部を設けて前記内部リードを含む平面と異なる平面内に
設けたアイランドとを有するリードフレームにおいて、
前記吊りリードの段差部を前記テープの外側に設けたこ
とを特徴とするリードフレーム。1. A frame-shaped insulating tape that adheres to an inner lead to connect the inner leads to each other, and an island provided with a step portion on the hanging lead and provided in a plane different from the plane containing the inner lead. In a lead frame having
A lead frame, wherein a step portion of the suspension lead is provided outside the tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19125092A JPH0637242A (en) | 1992-07-20 | 1992-07-20 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19125092A JPH0637242A (en) | 1992-07-20 | 1992-07-20 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0637242A true JPH0637242A (en) | 1994-02-10 |
Family
ID=16271408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19125092A Withdrawn JPH0637242A (en) | 1992-07-20 | 1992-07-20 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0637242A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0747942A3 (en) * | 1995-05-02 | 1998-07-29 | Texas Instruments Incorporated | Improvements in or relating to integrated circuits |
-
1992
- 1992-07-20 JP JP19125092A patent/JPH0637242A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0747942A3 (en) * | 1995-05-02 | 1998-07-29 | Texas Instruments Incorporated | Improvements in or relating to integrated circuits |
| US5891377A (en) * | 1995-05-02 | 1999-04-06 | Texas Instruments Incorporated | Dambarless leadframe for molded component encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991005 |