JPH0637359A - Light emitting device - Google Patents
Light emitting deviceInfo
- Publication number
- JPH0637359A JPH0637359A JP4187964A JP18796492A JPH0637359A JP H0637359 A JPH0637359 A JP H0637359A JP 4187964 A JP4187964 A JP 4187964A JP 18796492 A JP18796492 A JP 18796492A JP H0637359 A JPH0637359 A JP H0637359A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- light emitting
- package
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、複写機やレーザービー
ムプリンタ等に使用される表面実装用のリードレス発光
装置に関し、特に組立後の全体の厚みをできるだけ薄く
したい場合に使用される発光装置にかかる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounting leadless light emitting device used in a copying machine, a laser beam printer or the like, and more particularly to a light emitting device used when it is desired to reduce the overall thickness after assembly. Take
【０００２】[0002]
【従来の技術】従来の発光装置を図７〜９に示す。従来
では、プリント基板のパターン配線面に平行な方向へ光
照射を行う場合、プリント基板に発光装置を上向きにし
て直接搭載し、反射ケース等を用いて上向きの光を反射
させて光照射を行っていた（従来例１）。図中、１は絶
縁性ケース、２は半田付け用電極、３は透明封止樹脂、
４は発光素子としてのＬＥＤチップ、５は金ワイヤー、
６はダイレクトボンディングパット、７は金ワイヤー用
セカンド側パットである。2. Description of the Related Art A conventional light emitting device is shown in FIGS. Conventionally, when irradiating light in a direction parallel to the pattern wiring surface of the printed circuit board, the light emitting device is mounted directly on the printed circuit board with the light emitting device facing upward, and the light is radiated by reflecting the upward light using a reflection case or the like. (Prior art example 1). In the figure, 1 is an insulating case, 2 is a soldering electrode, 3 is a transparent sealing resin,
4 is an LED chip as a light emitting element, 5 is a gold wire,
6 is a direct bonding pad, and 7 is a second side pad for gold wire.
【０００３】また、電極部を側面に形成した発光装置を
使用し、それを横置きにしてプリント基板に取り付ける
といったものもあった（従来例２：図示せず）。There has also been a method in which a light emitting device having an electrode portion formed on its side surface is used, and it is placed horizontally and attached to a printed circuit board (conventional example 2: not shown).
【０００４】[0004]
【発明が解決しようとする課題】従来例１では、プリン
ト基板のパターン配線面と水平方向への光照射をする場
合、反射光を利用するため、どうしても反射ケースが必
要となり、コスト、作業性の点で不利になってしまう。
また、反射光の為、光出力が直接光の場合に比べ、減衰
してしまうといった問題が発生してしまう。In the prior art example 1, when the light is irradiated in the horizontal direction with respect to the pattern wiring surface of the printed circuit board, the reflected light is used, so that the reflection case is inevitably required, which results in cost and workability. You will be at a disadvantage.
In addition, the reflected light causes a problem that the light output is attenuated as compared with the case of direct light.
【０００５】従来例２では、電極部を側面に形成してい
るが、プリント基板への搭載具合や半田ペーストの状態
から、発光素子の位置及び方向のずれが発生し、光照射
がうまくいかないことがある。In the conventional example 2, the electrode portion is formed on the side surface, but the position and the direction of the light emitting element may be deviated from the mounting state on the printed circuit board or the state of the solder paste, and the light irradiation may not be successful. is there.
【０００６】また、上記両従来例とも、プリント基板へ
の搭載後の部品高さが絶縁性ケース１の高さに等しく高
くなり、全体の厚みが厚くなってしまい、より薄い形状
を要求される場合には不適となっていた。Further, in both of the above-mentioned conventional examples, the height of the component after mounting on the printed circuit board becomes equal to the height of the insulating case 1, and the overall thickness becomes thicker, and a thinner shape is required. In that case it was unsuitable.
【０００７】さらに、上記両従来例とも、反射ケース部
をそれぞれ外部あるいは内部にもっていることから、い
ずれも組立品の全体厚みが厚くなってしまう。Further, in both the above-mentioned conventional examples, since the reflection case portion is provided outside or inside, respectively, the total thickness of the assembly becomes thick.
【０００８】本発明は、上記課題に鑑み、プリント基板
のパターン配線面と水平方向への光照射を直接光で行
え、容易に、位置精度が高く確実に搭載でき、また、部
品高さを低く抑えることができる発光装置の提供を目的
とする。In view of the above-mentioned problems, the present invention can directly and directly irradiate the pattern wiring surface of the printed circuit board with light, and can be easily and accurately mounted with high accuracy, and the height of the component can be reduced. An object is to provide a light emitting device that can be suppressed.
【０００９】[0009]
【課題を解決するための手段】本発明請求項１による課
題解決手段は、図１〜６の如く、プリント基板１１のパ
ターン配線面１２に平行な方向へ光照射を行う発光装置
であって、成形品としてのパッケージ２１の素子搭載面
２４に、素子収納用凹部２５が形成され、該素子収納用
凹部２５からパッケージ２１の底面２６にかけて、薄膜
状の金属配線電極部２２，２３が形成され、該金属配線
電極部２２に発光素子２９が搭載され、前記パッケージ
２１の底面２６に、前記プリント基板１１の端部に係合
する係合凹部２７が形成されたものである。The means for solving the problems according to claim 1 of the present invention is a light emitting device for irradiating light in a direction parallel to a pattern wiring surface 12 of a printed circuit board 11, as shown in FIGS. A device housing recess 24 is formed on a device mounting surface 24 of a package 21 as a molded product, and thin-film metal wiring electrode parts 22, 23 are formed from the device housing recess 25 to a bottom surface 26 of the package 21, A light emitting element 29 is mounted on the metal wiring electrode portion 22, and an engaging concave portion 27 that engages with an end portion of the printed board 11 is formed on a bottom surface 26 of the package 21.
【００１０】本発明請求項２による課題解決手段は、プ
リント基板１１のパターン配線面１２に垂直に光照射を
行う発光装置であって、成形品としてのパッケージ２１
の素子搭載面２４に、素子収納用凹部２５が形成され、
該素子収納用凹部２５からパッケージ２１の底面２６に
かけて、薄膜状の金属配線電極部２２，２３が形成さ
れ、該金属配線電極部２２に発光素子２９が搭載され、
前記パッケージ２１の底面２６に、前記プリント基板１
１の表面の係合孔４１に係合する段差２７が形成された
ものである。The means for solving the problems according to claim 2 of the present invention is a light emitting device for irradiating light perpendicularly to the pattern wiring surface 12 of the printed circuit board 11, and a package 21 as a molded product.
The element mounting recess 24 is formed on the element mounting surface 24 of
Thin-film metal wiring electrode portions 22 and 23 are formed from the element housing recess 25 to the bottom surface 26 of the package 21, and a light emitting element 29 is mounted on the metal wiring electrode portion 22.
The printed circuit board 1 is provided on the bottom surface 26 of the package 21.
The step 27 that engages with the engaging hole 41 on the surface of No. 1 is formed.
【００１１】[0011]
【作用】上記請求項１による課題解決手段において、Ｍ
ＩＤプロセスにより、成形品としてのパッケージ２１に
薄膜状の金属配線電極部２２，２３を形成し、パッケー
ジ２１の底面２６に係合凹部２７を形成しているので、
プリント基板１１の端部に容易に半田付けでき、プリン
ト基板１１のパターン配線面と平行方向への光照射が容
易に行える。In the means for solving the problems according to claim 1, M
By the ID process, the thin-film metal wiring electrode portions 22 and 23 are formed on the package 21 as a molded product, and the engaging recess 27 is formed on the bottom surface 26 of the package 21.
It can be easily soldered to the end portion of the printed board 11, and light irradiation can be easily performed in the direction parallel to the pattern wiring surface of the printed board 11.
【００１２】また、請求項２では、プリント基板１１の
表面に係合孔４１を形成し、これに段差凹部２７を嵌込
することで、容易に位置決めおよび搭載ができる。これ
は、組立後の全体の厚みを抑えることになり、また、プ
リント基板１１の両面に電極が表れることから、両面ど
ちら側からでも半田付けを行えることで、生産工程の効
率化が可能である。According to the second aspect of the present invention, the engaging hole 41 is formed on the surface of the printed board 11 and the step recess 27 is fitted into the engaging hole 41, so that the positioning and mounting can be easily performed. This reduces the overall thickness after assembly, and since the electrodes appear on both sides of the printed circuit board 11, soldering can be performed from either side of both sides, thus making the production process more efficient. .
【００１３】[0013]
【実施例】図１は本発明の一実施例を示す発光装置の斜
視図、図２は図１のＡ−Ａ断面図、図３は図１のＢ−Ｂ
断面図、図４は複数の発光装置をプリント基板の端部に
嵌め込んだ状態を示す斜視図、図５は発光装置をプリン
ト基板の係合孔に嵌め込んで表側に半田付けした状態を
示す図、図６は発光装置をプリント基板の係合孔に嵌め
込んで裏側に半田付けした状態を示す図である。1 is a perspective view of a light emitting device showing an embodiment of the present invention, FIG. 2 is a sectional view taken along the line A--A of FIG. 1, and FIG. 3 is taken along the line BB of FIG.
FIG. 4 is a cross-sectional view, FIG. 4 is a perspective view showing a state in which a plurality of light emitting devices are fitted in an end portion of a printed circuit board, and FIG. 5 is a state in which the light emitting devices are fitted in engaging holes of the printed circuit board and soldered to the front side. FIG. 6 and FIG. 6 are views showing a state in which the light emitting device is fitted into the engaging hole of the printed board and soldered to the back side.
【００１４】本実施例の発光装置は、複写機やレーザー
ビームプリンタ等に使用され、両面プリント基板１１の
両パターン配線面１２に平行な方向へ光照射を行う発光
装置であって、リードフレームを用いずに、小型、薄型
の一体化した部品を得るためのＭｏｌｄｅｄ Ｉｎｔｅ
ｒｃｏｎｎｅｃｔｉｏｎ Ｄｅｖｉｃｅ（以下、ＭＩＤ
と称す）プロセスを用いたものである。ここで、ＭＩＤ
法とは、射出成形または押出し成形によつて得られた成
形品としてのパッケージ２１に、化学めつき等の方法で
薄膜状の一対の金属配線電極部２２，２３が形成された
ものである。The light emitting device of this embodiment is used for a copying machine, a laser beam printer, or the like, and emits light in a direction parallel to both pattern wiring surfaces 12 of the double-sided printed circuit board 11 and has a lead frame. Molded Inte for obtaining small and thin integrated parts without using
rconnection Device (hereinafter MID
(Referred to as) process is used. Where MID
The method is a method in which a pair of thin-film metal wiring electrode portions 22 and 23 are formed on a package 21 as a molded product obtained by injection molding or extrusion molding by a method such as chemical plating.
【００１５】前記パツケージ２１は、耐熱性のある液晶
ポリマー、ポリフェニレンサルファイド（ＰＰＳ）、ポ
リエーテルスルフォン（ＰＥＳ）等の電気的絶縁性を有
する遮光性樹脂やセラミックス材が使用され、一枚の有
機樹脂基板に数百個のデバイスが規則正しく配列される
よう金型成形され、後に図１〜３のような個別のデバイ
スにダイシング分割される。The package 21 is made of a heat-resistant liquid crystal polymer, polyphenylene sulfide (PPS), polyether sulfone (PES), or other electrically insulating light-shielding resin or ceramic material. Several hundred devices are die-molded on the substrate so that they are regularly arranged, and are subsequently diced into individual devices as shown in FIGS.
【００１６】該パッケージ２１の素子搭載面２４（上
面）には、素子収納用凹部２５が形成され、該パッケー
ジ２１の底面２６には、両面プリント基板１１の端部に
係合する係合凹部２７が形成されている。An element housing recess 24 (upper surface) of the package 21 is formed with an element housing recess 25, and a bottom surface 26 of the package 21 is provided with an engaging recess 27 for engaging with an end of the double-sided printed circuit board 11. Are formed.
【００１７】前記素子収納用凹部２５は、ＬＥＤチップ
２９を収納してこれが上方にはみ出ないよう充分な深さ
に形成されている。該素子収納用凹部２５は、発光素子
としてのＬＥＤチップ２９を収納した後、透光性封止樹
脂２８にて封止される。The recess 25 for housing the element is formed to have a sufficient depth so that the LED chip 29 is housed therein and does not protrude upward. The recess 25 for storing the element is sealed with a translucent sealing resin 28 after accommodating the LED chip 29 as a light emitting element.
【００１８】前記係合凹部２７の幅は、両面プリント基
板１１の厚みより若干大きく形成され、両面プリント基
板１１の端部と係合する際に生じる間隙は半田充填域と
される。The width of the engaging concave portion 27 is formed to be slightly larger than the thickness of the double-sided printed circuit board 11, and the gap generated when engaging with the end of the double-sided printed circuit board 11 is a solder filling area.
【００１９】前記金属配線電極部２２，２３は、スズ、
半田、金、銀等のめっき材が用いられ、前記パッケージ
２１の素子収納用凹部２５からパッケージ２１の底面２
６の係合凹部２７内にかけてめっき形成されている。凹
部２５内の一側の金属配線電極部２２には、ＬＥＤチッ
プ２９が上向きに搭載される。凹部２５内の他側の金属
配線電極部２３には、ボンデイングワイヤ３１を介して
ＬＥＤチップ２９に接続される。なお、該金属配線電極
部２２，２３は、ＬＥＤチップ２９を搭載するためのみ
ならず、ＬＥＤチップ２９からの照射光を凹部２５の傾
斜壁面で反射させることにより光指向特性を高める機能
を有する。The metal wiring electrode portions 22 and 23 are made of tin,
A plating material such as solder, gold, silver or the like is used, and from the recess 25 for housing the element of the package 21 to the bottom surface 2 of the package 21.
The engagement recess 27 of No. 6 is plated. The LED chip 29 is mounted upward on the metal wiring electrode portion 22 on one side in the recess 25. The other side of the metal wiring electrode portion 23 in the recess 25 is connected to the LED chip 29 via a bonding wire 31. The metal wiring electrode portions 22 and 23 have a function not only for mounting the LED chip 29 but also for improving the light directivity characteristic by reflecting the irradiation light from the LED chip 29 on the inclined wall surface of the recess 25.
【００２０】上記構成の発光装置を両面プリント基板１
１に実装する際、図１，４の如く、発光装置の凹部２７
を両面プリント基板１１の端部に嵌込み、半田付けを行
う。この場合、電極はプリント基板１１の表面と裏面の
両面にくる。したがって、両面プリント基板１１の各面
の配線パターンに半田付けしてやればよい。The light emitting device having the above-mentioned structure is applied to the double-sided printed circuit board 1.
1 and 4, the light emitting device is recessed 27 as shown in FIGS.
Is fitted into the end portion of the double-sided printed circuit board 11 and soldered. In this case, the electrodes are on both the front surface and the back surface of the printed circuit board 11. Therefore, it suffices to solder the wiring pattern on each surface of the double-sided printed circuit board 11.
【００２１】そうすると、発光装置をプリント基板１１
の端部に容易に半田付けでき、プリント基板１１のパタ
ーン配線面と平行方向への光照射が容易に行える。Then, the light emitting device is mounted on the printed circuit board 11
Can be easily soldered to the end portion of, and light irradiation can be easily performed in the direction parallel to the pattern wiring surface of the printed board 11.
【００２２】この場合、従来のように反射ケースを用い
てパターン配線面と平行方向へ光照射するのに比べ、光
の減衰無しに照射可能となり、コスト、作業性の点で優
位になる。In this case, compared with the conventional case where light is irradiated in the direction parallel to the pattern wiring surface using a reflection case, light can be irradiated without attenuation, which is advantageous in terms of cost and workability.
【００２３】また、図５，６の如く、プリント基板１１
の表面に一対の係合孔４１を形成し、これに段差凹部２
７を嵌込することで、容易に位置決めおよび搭載ができ
る。図中、４２は半田、４３は他の搭載部品である。こ
の場合、組立後の全体の厚みを抑えることになり、ま
た、プリント基板１１の両面に電極が表れることから、
両面どちら側からでも半田付けを行えることで、生産工
程の効率化が可能である。Further, as shown in FIGS.
A pair of engagement holes 41 are formed on the surface of the stepped concave portion 2 and
By inserting 7, the positioning and mounting can be performed easily. In the figure, 42 is solder, and 43 is another mounted component. In this case, the total thickness after assembly is suppressed, and since electrodes appear on both surfaces of the printed circuit board 11,
Since soldering can be performed from either side of both sides, the efficiency of the production process can be improved.
【００２４】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.
【００２５】例えば、上記実施例では、各配線電極部２
２，２３をめっき法にて形成していたが、金属蒸着等の
他の方法で形成してもよい。For example, in the above embodiment, each wiring electrode portion 2
Although 2 and 23 are formed by a plating method, they may be formed by another method such as metal vapor deposition.
【００２６】また、発光装置をプリント基板１１の端部
に嵌込む場合、上記実施例では、プリント基板１１の両
面に配線パターンを形成していたが、発光装置の配線電
極部２２，２３を凹部２７の片側に集めて形成すれば、
片面プリント基板での半田付けも可能となる。Further, when the light emitting device is fitted into the end portion of the printed circuit board 11, the wiring patterns are formed on both surfaces of the printed circuit board 11 in the above embodiment, but the wiring electrode portions 22 and 23 of the light emitting device are recessed. If formed on one side of 27,
Soldering on a single-sided printed circuit board is also possible.
【００２７】[0027]
【発明の効果】以上の説明から明らかな通り、本発明請
求項１によると、ＭＩＤプロセスにより、成形品として
のパッケージに薄膜状の金属配線電極部を形成し、パッ
ケージの底面に係合凹部を形成しているので、プリント
基板の端部に容易に半田付けでき、プリント基板のパタ
ーン配線面と平行方向への光照射が容易に行える。As is apparent from the above description, according to claim 1 of the present invention, a thin film metal wiring electrode portion is formed on a package as a molded product by the MID process, and an engaging recess is formed on the bottom surface of the package. Since it is formed, it can be easily soldered to the end portion of the printed circuit board, and light irradiation in the direction parallel to the pattern wiring surface of the printed circuit board can be easily performed.
【００２８】請求項２によると、プリント基板の表面に
係合孔を形成し、これに段差凹部を嵌込することで、容
易に位置決めおよび搭載ができる。これは、組立後の全
体の厚みを抑えることになり、取付装置の小型化を図り
得る。また、プリント基板の両面に電極が表れることか
ら、両面どちら側からでも半田付けを行えることで、生
産工程の効率化が可能となるといった優れた効果があ
る。According to the second aspect, the engaging hole is formed on the surface of the printed board, and the stepped recess is fitted into the engaging hole, whereby the positioning and the mounting can be easily performed. This suppresses the overall thickness after assembly, and can reduce the size of the mounting device. Further, since the electrodes appear on both sides of the printed circuit board, soldering can be performed from either side of both sides, which has an excellent effect that the efficiency of the production process can be improved.
【図１】本発明の一実施例を示す発光装置の斜視図FIG. 1 is a perspective view of a light emitting device showing an embodiment of the present invention.
【図２】図１のＡ−Ａ断面図FIG. 2 is a sectional view taken along line AA of FIG.
【図３】図１のＢ−Ｂ断面図FIG. 3 is a sectional view taken along line BB of FIG.
【図４】複数の発光装置をプリント基板の端部に嵌め込
んだ状態を示す斜視図FIG. 4 is a perspective view showing a state in which a plurality of light emitting devices are fitted in an end portion of a printed circuit board.
【図５】発光装置をプリント基板の係合孔に嵌め込んで
表側に半田付けした状態を示す図FIG. 5 is a diagram showing a state in which the light emitting device is fitted into an engaging hole of a printed circuit board and soldered to the front side.
【図６】発光装置をプリント基板の係合孔に嵌め込んで
裏側に半田付けした状態を示す図FIG. 6 is a diagram showing a state in which the light emitting device is fitted into an engaging hole of a printed circuit board and soldered to the back side.
【図７】従来の発光装置の斜視図FIG. 7 is a perspective view of a conventional light emitting device.
【図８】図７のＣ−Ｃ断面図FIG. 8 is a sectional view taken along line CC of FIG.
【図９】図７のＤ−Ｄ断面図9 is a sectional view taken along line DD of FIG.
１１ プリント基板 １２ パターン配線面 ２１ パッケージ ２４ 素子搭載面 ２５ 素子収納用凹部 ２６ 底面 ２２，２３ 金属配線電極部 ２７ 係合凹部 ４１ 係合孔 11 printed circuit board 12 pattern wiring surface 21 package 24 element mounting surface 25 element accommodating recess 26 bottom surface 22, 23 metal wiring electrode portion 27 engaging recess 41 engaging hole
Claims (2)
方向へ光照射を行う発光装置であって、成形品としての
パッケージの素子搭載面に、素子収納用凹部が形成さ
れ、該素子収納用凹部からパッケージの底面にかけて、
薄膜状の金属配線電極部が形成され、該金属配線電極部
に発光素子が搭載され、前記パッケージの底面に、前記
プリント基板の端部に係合する係合凹部が形成されたこ
とを特徴とする発光装置。1. A light emitting device for irradiating light in a direction parallel to a pattern wiring surface of a printed circuit board, wherein an element housing concave portion is formed on a device mounting surface of a package as a molded article, and the element housing concave portion is formed. From the bottom of the package
A thin-film metal wiring electrode portion is formed, a light emitting element is mounted on the metal wiring electrode portion, and an engaging concave portion that engages with an end portion of the printed circuit board is formed on a bottom surface of the package. Light emitting device.
光照射を行う発光装置であって、成形品としてのパッケ
ージの素子搭載面に、素子収納用凹部が形成され、該素
子収納用凹部からパッケージの底面にかけて、薄膜状の
金属配線電極部が形成され、該金属配線電極部に発光素
子が搭載され、前記パッケージの底面に、前記プリント
基板の表面の係合孔に係合する段差が形成されたことを
特徴とする発光装置。2. A light emitting device for irradiating light perpendicularly to a pattern wiring surface of a printed circuit board, wherein an element housing recess is formed on an element mounting surface of a package as a molded product, and the package is formed from the element housing recess. A thin-film metal wiring electrode portion is formed on the bottom surface of the package, a light emitting element is mounted on the metal wiring electrode portion, and a step is formed on the bottom surface of the package that engages with an engagement hole on the surface of the printed circuit board. A light-emitting device characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4187964A JP2915706B2 (en) | 1992-07-15 | 1992-07-15 | Light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4187964A JP2915706B2 (en) | 1992-07-15 | 1992-07-15 | Light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0637359A true JPH0637359A (en) | 1994-02-10 |
| JP2915706B2 JP2915706B2 (en) | 1999-07-05 |
Family
ID=16215242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4187964A Expired - Fee Related JP2915706B2 (en) | 1992-07-15 | 1992-07-15 | Light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2915706B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002223002A (en) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | Package molding and light emitting device |
| JP2007155714A (en) * | 2005-11-10 | 2007-06-21 | Honeywell Internatl Inc | Small package for moving the sensor sensing axis |
| EP1717871A3 (en) * | 2005-04-15 | 2008-11-19 | OSRAM Opto Semiconductors GmbH | Optoelectronic surface-mountable component |
| US8614456B2 (en) | 2003-07-11 | 2013-12-24 | Tridonic Optoelectronics Gmbh | LED and LED light source |
| JP2021015867A (en) * | 2019-07-11 | 2021-02-12 | 日亜化学工業株式会社 | Light-emitting device and light-emitting module |
| JP2021068775A (en) * | 2019-10-21 | 2021-04-30 | 株式会社小糸製作所 | Optical semiconductor device, optical sensor manufacturing method, and computer program |
-
1992
- 1992-07-15 JP JP4187964A patent/JP2915706B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002223002A (en) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | Package molding and light emitting device |
| US8614456B2 (en) | 2003-07-11 | 2013-12-24 | Tridonic Optoelectronics Gmbh | LED and LED light source |
| EP2398080A3 (en) * | 2003-07-11 | 2014-04-23 | Tridonic Jennersdorf GmbH | Light emitting diode and light emitting diode based light source |
| EP1717871A3 (en) * | 2005-04-15 | 2008-11-19 | OSRAM Opto Semiconductors GmbH | Optoelectronic surface-mountable component |
| JP2007155714A (en) * | 2005-11-10 | 2007-06-21 | Honeywell Internatl Inc | Small package for moving the sensor sensing axis |
| JP2021015867A (en) * | 2019-07-11 | 2021-02-12 | 日亜化学工業株式会社 | Light-emitting device and light-emitting module |
| JP2021068775A (en) * | 2019-10-21 | 2021-04-30 | 株式会社小糸製作所 | Optical semiconductor device, optical sensor manufacturing method, and computer program |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2915706B2 (en) | 1999-07-05 |
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