JPH0638440B2 - Probe card - Google Patents

Description

TECHNICAL FIELD The present invention relates to a probe card, and more particularly to a probe card used during a wafer test of an LSI.

[Conventional technology]

Conventionally, this type of probe card is tested by contacting a bump formed on the LSI with a probe during a wafer test of the LSI.

FIG. 8 is a plan view of an example of a conventional probe card, and FIG. 9 is a side view of the probe card of FIG.

As shown in FIGS. 8 and 9, a plurality of measuring probes 42 are provided on one surface of the multilayer ceramic substrate 41, and the probe device is provided on the other surface of the ceramic substrate 41. Connector pins 43 for connection are provided.

The probe 42 is connected to a predetermined one of the connector pins for connection, and the probe device performs a characteristic test of the LSI by contacting the bump with the bump of the LSI wafer.

[Problems to be solved by the invention]

The above-mentioned conventional probe card is a
Since it is in contact with the bumps, the probe card for LSI, which has a smaller number of bumps per side and has a larger number of bumps per side, uses a finer probe, which makes it difficult to manufacture.
Since it is a thin probe, its strength is reduced and it cannot withstand many uses.

In addition, if the probe for bump contact is damaged during the LSI test, it is difficult to repair and replace the probe, which makes it impossible to perform a test with a damaged probe card.

Further, there is a drawback that only one type of LSI can be tested with one probe card.

[Means for solving problems]

The probe card of the present invention comprises a multi-layered first ceramic substrate, a plurality of first contact pads provided on one surface of the first ceramic substrate, and the other surface of the first ceramic substrate. A base body having a plurality of connection connector pins connected to each of the provided first contact pads;
A second ceramic substrate and a plurality of second contact pads that are respectively in contact with a plurality of contact pads selected from the first contact pads provided on one surface of the second ceramic substrate.
A contact pad and a plurality of measurement pads that are arranged on the other surface of the second ceramic substrate and are connected to the second contact pads. , The corresponding second contact pads are superposed on and brought into contact with each of the selected plurality of first contact pads, and the second ceramic substrate is contacted with the first contact pads.
It is characterized in that it is attached to the ceramic substrate of (1) with screws.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a side view of the embodiment of FIG.

As shown in FIGS. 1 and 2, this embodiment includes a substrate 1 and a measuring section 2. The measuring part 2 is fixed to the base body 1 with a set screw 4 with the alignment hole 3 as a reference.

3 is a plan view of the base body of FIG. 1, and FIG. 4 is a side view of the base body of FIG.

As shown in FIGS. 3 and 4, the base 1 has a plurality of first contact pads 12 arranged on one surface of a multi-layered first ceramic substrate 11 and arranged on the other surface of the ceramic substrate 11. A plurality of connecting connector pins 13 for connecting to the probe device are provided, and the contact pads 12 are connected to the corresponding connecting connector pins 13 by wiring embedded in the ceramic substrate 11. The ceramic substrate 11 is provided with an alignment hole 3 and a mounting screw hole 14.

Next, FIG. 5 is a plan view of the measuring section of FIG. 1, and FIG.
It is a side view of the measurement part of the figure.

As shown in FIGS. 5 and 6, the measuring unit 2 includes a plurality of selected contact pads 12 of the base 1 on one surface of a second ceramic substrate 21 which is smaller than the ceramic substrate 11. Second contact pad 22 corresponding to the contact pad
Are arranged, and a plurality of measurement pads 23 corresponding to the bumps of the LSI to be measured are provided on the other surface of the ceramic substrate 21 and are connected to the contact pads 22 by wiring embedded in the ceramic substrate 21. The ceramic substrate 21 has alignment holes 24 corresponding to the alignment holes 3.
And a mounting screw hole 25 corresponding to the mounting screw hole 14 are provided.

The base 1 shown in FIG. 3 and the measuring unit 2 shown in FIG. 5 are accurately brought into contact with the contact pad 12 and the contact pad 22 corresponding to the contact pad 12 with reference to the alignment holes 3 and 24. Then, the mounting screw holes 14 and 25 are fixed by the set screw 4, and the probe card shown in FIG. 1 is assembled.

FIG. 7 is a plan view of the wafer to be measured.

Next, the surface of the measurement pad 23 shown in FIG. 5 is directed to the surface of the wafer 31 shown in FIG. 7 and alignment is performed by the alignment holes 3 and 24, and the bumps 33 of the LSI 322 and the measurement pad 23 are aligned. When it matches, the LSI 32 is tested.

With such a configuration, it becomes possible to prepare various kinds of measurement units having measurement pads corresponding to the arrangement of the bumps of the LSI to be measured, and perform measurement of many types of LSI.

〔The invention's effect〕

As described above, the probe card of the present invention has the measurement pad and the measurement pad in the same arrangement as the bumps of the LSI on the substrate having the first contact pad connected to the connector pin for connection with the probe device. By fixing the measuring part having the second contact pad that comes into contact with the selected one of the connected first contact pads in an overlapping manner, the size and the size of each side are smaller than those of the conventional probe. There is an effect that it becomes possible to measure an LSI having bumps.

Further, even if the measuring portion becomes unusable due to damage or wear of the measuring pad, there is an effect that it can be easily replaced.

Further, by considering versatility in the arrangement of the contact pads on the base, there is an effect that it is possible to prepare a measurement unit having a different arrangement of the measurement pads and measure various kinds of LSIs.

[Brief description of drawings]

1 is a plan view of an embodiment of the present invention, FIG. 2 is a side view of the embodiment of FIG. 1, FIG. 3 is a plan view of the substrate of FIG. 1, and FIG.
FIG. 5 is a side view of the substrate shown in FIG. 3, FIG. 5 is a plan view of the measuring section shown in FIG. 1, FIG. 6 is a side view of the measuring section shown in FIG. 5, and FIG. 7 is a plan view of the wafer to be measured. FIG. 8 is a plan view of an example of a conventional probe card, and FIG. 9 is a side view of the probe card of FIG. 1 ... Substrate, 2 ... Measuring part, 3 ... Alignment hole, 4 ...
Set screw, 11 ... Ceramic substrate, 12 ... Contact pad, 13 ... Connection connector pin, 14 ... Mounting screw hole, 21 ... Ceramic substrate, 22 ... Contact pad,
23 ... Measuring pad, 24 ... Alignment hole, 25 ...
Mounting screw holes, 31 ... Wafer, 32 ... LSI, 3
3 ... Bump, 41 ... Ceramic substrate, 42 ... Probe, 43 ... Connector pin for connection.

Claims (1)

[Claims] 1. A multi-layered first ceramic substrate, a plurality of first contact pads provided on one surface of the first ceramic substrate, and a plurality of first contact pads provided on the other surface of the first ceramic substrate. A base having a plurality of connection connector pins connected to the first contact pads, a second ceramic substrate, and the first contact provided on one surface of the second ceramic substrate. A plurality of second contact pads that are respectively in contact with a plurality of selected first contact pads of the pad and a predetermined arrangement provided on the other surface of the second ceramic substrate. The second contact pad corresponding to each of the plurality of selected first contact pads, the measurement unit having a plurality of measurement pads connected to each of the two contact pads. And make contact with each other. Probe card, wherein the ceramic substrate be attached by the first ceramic substrate to the screw.