JPH0639471Y2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0639471Y2 JPH0639471Y2 JP1988166412U JP16641288U JPH0639471Y2 JP H0639471 Y2 JPH0639471 Y2 JP H0639471Y2 JP 1988166412 U JP1988166412 U JP 1988166412U JP 16641288 U JP16641288 U JP 16641288U JP H0639471 Y2 JPH0639471 Y2 JP H0639471Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring board
- printed wiring
- hole
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 25
- 239000002699 waste material Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は印刷配線板に関し、特に捨基板を有する印刷配
線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a printed wiring board, and more particularly to a printed wiring board having a waste substrate.
従来、この種の印刷配線板は、第２図に示すように、切
断分離の為のＶ溝３を介して連接された基板1aと捨基板
2aとから成り、左端辺６と下端辺（捨基板2a側の辺）７
と右端辺８からそれぞれ等しい距離、例えば5mm、に自
動実装用の貫通孔４と楕円型の貫通孔５を設け、貫通孔
4,5の孔壁が捨基板2aに含まれ、かつ、接しない状態で
近接した位置で、下端辺７に平行になるようＶ溝３を設
けた構造であった。Conventionally, this kind of the printed wiring board, as shown in FIG. 2, the substrate 1 a and捨基plate that is connected via a V-groove 3 for cutting and separating
It consists of 2 a and the left edge 6 and the lower edge (the edge on the side of the discarded board 2 a ) 7
And the right end side 8 are respectively equidistant from each other, for example, 5 mm, and a through hole 4 for automatic mounting and an oval through hole 5 are provided.
4 and 5 of the pore walls is included in捨基plate 2 a, and, at a position close with no contact was structure provided with V-grooves 3 so as to be parallel to the lower edge 7.
上述した従来の印刷配線板は、丸型及び楕円型の貫通孔
が捨基板内にあり、それらの孔壁に接しない状態で近接
した位置にＶ溝があるので、Ｖ溝で基板を切断した場
合、貫通孔の孔壁の残部のために切断後の基板端面に凹
凸部が発生しその端面を滑らからするための加工を施す
必要があり、加工に時間がかかり作業能率が低下してコ
スト高になるという欠点がある。In the above-mentioned conventional printed wiring board, round and elliptical through-holes are provided in the discarded substrate, and the V-grooves are located at positions close to each other without being in contact with the hole walls. Therefore, the substrate was cut by the V-grooves. In this case, due to the remaining part of the hole wall of the through hole, unevenness is generated on the end surface of the substrate after cutting, and it is necessary to perform processing to smooth the end surface, which takes time to process and reduces work efficiency, resulting in cost reduction. It has the drawback of becoming expensive.
本考案の構成は、基板と捨基板とがＶ型溝の部分で連接
されている印刷配線板において、前記捨基板の所定の位
置に丸型の貫通孔と楕円形の貫通孔とが形成されている
ことと、前記丸型と楕円形との貫通孔の孔壁はいずれ
も、前記Ｖ型溝に接していることを特徴とする。According to the configuration of the present invention, in a printed wiring board in which a substrate and a waste substrate are connected at a V-shaped groove portion, round through holes and elliptical through holes are formed at predetermined positions of the waste substrate. And the hole walls of the round-shaped and elliptical through-holes are both in contact with the V-shaped groove.
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本考案の一実施例の平面図である。FIG. 1 is a plan view of an embodiment of the present invention.
第１図に示すように、基板１と、基板１にＶ溝３を介し
て一体に連接される捨基板２とから成り、左端辺６と下
端辺（捨基板２の側）７と右端辺８とからそれぞれ等し
い距離、例えば5mm、に自動実装用の丸型の貫通孔４と
楕円型の貫通孔５が形成される。As shown in FIG. 1, a substrate 1 and a scrap substrate 2 integrally connected to the substrate 1 through a V groove 3 are provided, and a left end side 6, a lower end side (side of the scrap substrate 2) 7, and a right end side. A round through hole 4 and an elliptical through hole 5 for automatic mounting are formed at the same distance from each other, for example, 5 mm.
貫通孔4,5は捨基板２内に設けられ、かつ、貫通孔4,5の
孔壁の基板１側の外周に接してＶ溝３が形成される。The through holes 4,5 are provided in the waste substrate 2, and the V groove 3 is formed in contact with the outer periphery of the hole wall of the through holes 4,5 on the substrate 1 side.
このように構成することにより、Ｖ溝３で基板１と捨基
板２とを切断したとき、切断後の基板１の切断された端
面は大きな凹凸を発生しないので、端面の平滑仕上げが
短時間でできる。With this configuration, when the substrate 1 and the waste substrate 2 are cut by the V-groove 3, the cut end face of the substrate 1 after cutting does not generate large unevenness, so that the end face can be smoothly finished in a short time. it can.
以上説明したように本考案の印刷配線板は、捨基板に設
けた丸型と楕円型の貫通孔の孔壁に接するＶ溝を設ける
ことにより、基板と捨基板をＶ溝で切断した際に切断面
に貫通孔の孔壁部により発生する凹凸部は全て無くなる
ので、仕上げ加工の時間を短縮して作業能率を向上でき
る効果がある。さらに、本考案は、捨基板の貫通孔を開
孔する時に、Ｖ型溝が離断してしまうような事故がな
く、また貫通孔の位置を変更するだけで済むので、製造
方法上格別の変更をともなうことがないという効果があ
る。As described above, the printed wiring board of the present invention is provided with V-grooves that are in contact with the hole walls of the round and elliptical through-holes provided on the scrap substrate, so that when the board and the scrap substrate are cut by the V-grooves. Since all the uneven portions generated by the hole wall portion of the through hole on the cut surface are eliminated, there is an effect that the time of finishing processing can be shortened and the work efficiency can be improved. Further, according to the present invention, there is no accident such that the V-shaped groove is disconnected when the through hole of the waste substrate is opened, and the position of the through hole is simply changed, which is an exceptional manufacturing method. The effect is that no changes are made.
第１図は本考案の一実施例の平面図、第２図は従来の印
刷配線板の一例の平面図である。 1,1a……基板、2,2a……捨基板、３……Ｖ溝、4,5……
貫通孔、６……左端辺、７……下端辺、８……右端辺。FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a plan view of an example of a conventional printed wiring board. 1,1 a …… Substrate, 2,2 a …… Waste substrate, 3 …… V groove, 4,5 ……
Through hole, 6 ... left edge, 7 ... lower edge, 8 ... right edge.
Claims (1)
ている印刷配線板において、前記捨基板の所定の位置に
丸型の貫通孔と楕円形の貫通孔とが形成されていること
と、前記丸型と楕円形との貫通孔の孔壁はいずれも、前
記Ｖ型溝に接していることとを特徴とする印刷配線板。1. A printed wiring board in which a substrate and a scrap substrate are connected to each other at a V-shaped groove portion, wherein round through holes and elliptical through holes are formed at predetermined positions of the scrap substrate. And a hole wall of each of the round and elliptical through holes is in contact with the V-shaped groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166412U JPH0639471Y2 (en) | 1988-12-22 | 1988-12-22 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166412U JPH0639471Y2 (en) | 1988-12-22 | 1988-12-22 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286163U JPH0286163U (en) | 1990-07-09 |
| JPH0639471Y2 true JPH0639471Y2 (en) | 1994-10-12 |
Family
ID=31453769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988166412U Expired - Fee Related JPH0639471Y2 (en) | 1988-12-22 | 1988-12-22 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639471Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249161U (en) * | 1988-09-29 | 1990-04-05 |
-
1988
- 1988-12-22 JP JP1988166412U patent/JPH0639471Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0286163U (en) | 1990-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |