JPH0643485B2 - Sealing resin composition - Google Patents

Description

TECHNICAL FIELD The present invention relates to a resin composition for encapsulation. More specifically, the present invention relates to a new epoxy resin composition for encapsulation, which is useful for resin encapsulation of electric / electronic parts, semiconductor devices, etc. and has excellent low stress.

(Prior art) With the recent development of electrical and electronic technology, the trend of high density and high integration of electrical and electronic parts and semiconductor devices becomes more and more noticeable. For resin encapsulation of parts, semiconductor devices, and the like, encapsulating materials with even lower stress have been required.

In order to improve such low stress, there are roughly two elements, that is, low elastic modulus and low linear expansion coefficient.

Conventionally, addition of silicone oil or silicone elastomer or addition of a resin modified with these has been particularly aimed at improving the low elastic modulus, and for lowering the linear expansion coefficient, a means such as high filling of the filler has been used. Are responding by.

(Problems to be Solved by the Invention) However, although silicone oil and silicone elastomer have been blended by the means as described above to improve the low elastic modulus, a filler for lowering the linear expansion coefficient is used. The high filling rather increases the elastic modulus, and as a result, it is very difficult to balance the low stress property.

The present invention has been made in view of the above circumstances, eliminates the drawbacks of the conventional stress-reducing means for the sealing material, is rich in low stress, and is excellent in crack resistance and heat cycle resistance. It is intended to provide a new sealing resin composition.

(Means for Solving the Problems) In order to solve the above problems, the present invention provides the following components: (A) epoxy resin, (B) phenol resin, and (C) 0.1 to 10 weight% with respect to the total amount. % Organopolysiloxane having at least two vinyl groups in one molecule (D) Organopolysiloxane weight ratio 9/1 to
There is provided an epoxy resin composition for encapsulation, which comprises a peroxide (E) inorganic filler in a ratio of 199/1.

The epoxy resin as the component (A) is used as the main component of the encapsulating material, and conventionally known ones can be appropriately used, and the molecular structure, the molecular weight, etc. are not particularly limited. For example, a wide range of novolac type epoxy resins and modified resins thereof, bisphenol A type epoxy resins, bisphenol F type epoxy resins, alicyclic epoxy resins, halogenated epoxy resins and the like can be used.

The (B) phenol resin is used as a curing agent as such, and a novolac type phenol resin having a phenolic hydroxyl group, a modified resin thereof, or the like can be used.

Examples of the organopolysiloxane having at least two vinyl groups in one molecule of the component (C) include compounds represented by the following formula: (Wherein, R _1: -CH ₃ or _{-CH = CH 2, R 2:} -CH 3 or _{-C 6 H 5, R 3:} -C 6 H 5 R 4: -CH = CH 2 B 5: - shows a CH ₃ or -CH = CH _2.) represented by those can be exemplified by, a organopolysiloxane having at least two or more vinyl groups (-CH = CH ₂₎ in the molecule, Molecular weight of 500-100,000
The thing of a grade can be used preferably.

The amount of the organopolysiloxane compounded can be about 0.1 to 10% by weight based on the total amount of the resin.

As the peroxide as the component (D), various kinds of peroxides can be used, including conventionally known ones. _{(Wherein, R 6: -CH 3, -C} 6 H 5 R 7: -CH 3, -C 6 H 5, showing a.) Can be suitably used represented by those with. The amount of the peroxide used is preferably about (c) / (d) = 9/1 to 199/1 as a weight ratio with the organopolysiloxane as the component (C).

As the inorganic filler of the component (E), silica, alumina,
Appropriate ones such as talc can be used, but more preferably, silica is added in an amount of 50 to 90 with respect to the total amount of the resin composition.
It is blended in a ratio of about wt%.

Of course, in addition to these, desired additives can be blended. For example, as a curing aid, one or more phosphorus-based, tertiary amine-based, and imidazole-based compounds can be blended, and a flame retardant and the like. Can be blended appropriately.

(Function) In the resin composition having the composition of the present invention, unlike the conventional high filling of the filler, it is possible to improve the coefficient of linear expansion while lowering the coefficient of elasticity.

(Example) Hereinafter, an Example is shown and the resin composition for closure of this invention is demonstrated still in detail.

Examples 1 to 6 Epoxy resins obtained by mixing organopolysiloxane having at least two vinyl groups in one molecule with t-butylcumyl peroxide as a peroxide and heating and melting at a temperature of 140 to 150 ° C. 30 to phenol resin
Add over 40 minutes. At that time, the mixture is vigorously stirred and then stirred and dispersed for 2 hours. It is made into an elastomer by radical polymerization.

This allows the silicone to be modified into a phenolic resin or an epoxy resin.

The resin thus obtained is used as a curing agent in the case of a phenol resin and as a main agent in the case of an epoxy resin, and the resin composition as a whole is blended and mixed with a mixer, and further kneaded with a mixing roll. . Additives are blended appropriately at that time.

Table 1 shows the composition of these components. The characteristics of the obtained resin composition as a sealing resin were evaluated in terms of bending strength, bending elastic modulus, and linear expansion coefficient. The results are shown in Table 1.

At the same time, as is clear from the comparison with the comparative example shown in Table 1, in the examples of the present invention, the low stress property as the sealing resin was good.

Comparative Examples 1 to 3 The compositions shown in Table 1 were used as encapsulating resins without blending the organopolysiloxanes of Examples 1 to 6. When the characteristics of this product were evaluated, lowering of stress was not satisfactory.

Comparative Examples 4 to 5 In Examples 1 and 6, the properties of the encapsulating resin were similarly evaluated when the organopolysiloxane containing no peroxide was used.

The results are shown in Table 2.

The characteristics were not satisfactory.

(Effect of the Invention) According to the present invention, a resin composition for encapsulation, which has a low elastic modulus and a low linear expansion coefficient and is excellent in low stress, is provided.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location H01L 23/31 (56) Reference JP-A-2-170821 (JP, A) JP-A 61- 66712 (JP, A) JP 60-31523 (JP, A) JP 55-145724 (JP, A) JP 55-145725 (JP, A) JP 59-19358 (JP, A)

Claims (1)

[Claims] 1. The following components (A) epoxy resin (B) phenol resin (C) organopolysiloxane having at least two vinyl groups in one molecule in a proportion of 0.1 to 10% by weight based on the total amount. D) Weight ratio 9/1 to organopolysiloxane
An epoxy resin composition for encapsulation, comprising a peroxide (E) inorganic filler in a ratio of 199/1.