JPH0645385A - Resin sealing device for sealing semiconductor element - Google Patents

Abstract

(57) [Summary] [Object] To shorten the curing time of a resin in a semiconductor element sealing resin sealing apparatus and contribute to improvement of throughput in semiconductor device manufacturing. [Structure] The mold 1 (2) is small enough to accommodate a resin tablet 8 having a diameter such that the curing time of the resin can be made substantially equal to the time required for lead frame alignment, tablet alignment, and cull removal. With a pot 6 of

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation apparatus for encapsulating a semiconductor element, and more particularly, a novel resin for encapsulating a semiconductor element capable of contributing to an improvement in throughput in manufacturing a semiconductor device by shortening the curing time of the resin. The present invention relates to a sealing device.

[0002]

2. Description of the Related Art The resin sealing of a semiconductor element is performed by providing a plurality of pots each provided with a plunger for the purpose of improving the resin use efficiency and the uniformity of molding, and encapsulating each pot. In many cases, it is performed by a multi-plunger method in which the resin tablet of (1) is melt-pressed into the cavity through a short runner.

In this multi-plunger type resin sealing device, the mold is generally small, and molding is usually performed under the control of an automatic control system. By the way, the pellet-bonded and wire-bonded lead frames of the semiconductor element to be supplied to the resin sealing device are aligned before being supplied to the resin sealing device, and at the same time when they are aligned, they are aligned with the pot of the mold. Supply of resin tablets.

Further, the lead frame which has been resin-sealed is dropped. That is, the alignment of the lead frame, the supply of the resin tablet, the resin sealing by clamping the mold, and the removal of the cull are performed in a flowable manner. And 30 ~ 3 for lead frame alignment and resin tablet supply.
The time of 5 seconds, the mold clamping time was about 50 seconds, and the time required for removing the cull was 30 to 35 seconds.

[0005]

By the way, as described above, the work times of the three work operations that are performed in a flowable manner are not the same, but the mold clamping time is 50 seconds, and the other two work times are the same. The time for one operation is longer than 30 to 35 seconds, and therefore, the resin sealing cycle is limited by the mold clamping time, which is a long time, and in other words, the mold clamping time is required to improve mass productivity. Therefore, it is necessary to shorten the curing time of the resin. In particular, in the multi-plunger method, resin molding is performed using a small mold, and therefore the number of molded products taken is reduced to about 1/4 to 1/30 compared to the previous method, and mass productivity is improved. There is a problem of inferiority, and therefore it is urgent to shorten the curing time of the resin.

Therefore, in order to shorten the curing time of the resin, it has been attempted to preheat the resin tablets to be put in the pot. However, when the resin tablet is preheated, there is a problem that the resin tablet softens and loses its shape due to preheating, and it becomes difficult to put it in the pot properly, so the method of preheating the resin tablet cannot be adopted. It was

[0007] Therefore, the inventor of the present application conducted various experiments in order to seek a technique capable of shortening the curing time of the resin. One of the experiments was three resins with the same composition but different colors. One resin tablet is constructed and the resin is used to seal the resin. Specifically, this resin tablet is configured such that the upper part, the central part, and the lower part have different colors. The reason why we did such an experiment is that when the resin tablet put in the pot is melted by the heat of the mold and pressed into the cavity by the plunger,
This is for investigating which part of the resin tablet is melt-pressed first and which part is melt-pressed later.

As a result of this experiment, the following was found. The resin that is pressed into the cavity to seal the semiconductor element and most of the resin that remains in the runner is composed of the upper and lower resins in the height direction of the resin tablet, and most of the resin that remains in the pot is higher than the resin tablet. It is made of resin in the central portion in the vertical direction. This was analyzed by the inventor of the present application as follows. The upper and lower parts in the height direction of the resin tablet placed in the pot are more susceptible to the heat from the mold wall than the center part in the height direction, so that they melt faster and are pressed into the cavity or runner. In contrast, the central portion of the resin tablet in the height direction is delayed in melting due to heat, so that it is hard to be pressed into the cavity and remains in the pot.

From the analysis result, the inventor of the present application recognizes the importance of rapidly heat-melting any part of the resin tablet, and accordingly, the pot diameter of the mold is reduced, and accordingly the diameter of the resin tablet is reduced. The idea was to shorten the curing time of the resin by using a small resin. This is because if the diameter of the pot and the diameter of the resin tablet are reduced, the delay of heat melting at the center of the cross section of the resin tablet should be reduced. Therefore, the inventor of the present application examined the curing time required for good resin sealing by changing the pot diameter and the resin tablet. The present invention was born as a result.

That is, it is an object of the present invention to provide a novel resin encapsulation device for semiconductor element encapsulation, which can shorten the curing time of the resin and contribute to the improvement of the throughput in the production of semiconductor devices.

[0011]

In the resin encapsulating apparatus for encapsulating a semiconductor element according to the present invention, the mold can set the curing time of the resin substantially equal to the time required for lead frame alignment, tablet alignment, and time required for cull drop. It is characterized by having a pot having a small diameter suitable for storing a resin tablet having such a diameter.

[0012]

According to the resin encapsulating apparatus for encapsulating a semiconductor element of the present invention, the pot diameter is small, and therefore a small resin tablet can be heated from the mold wall to be melted and press-fitted, so that the entire resin tablet can be melted more quickly. . Therefore, the curing time of the resin can be shortened, and as shown in Table 1, the time required for the lead frame alignment, the tablet alignment, and the time required for removing the cull can be made substantially equal. Therefore, it is possible to shorten the curing time of the resin and contribute to the improvement of the throughput in the semiconductor device manufacturing.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The resin encapsulation device for encapsulating a semiconductor element of the present invention will be described in detail below with reference to the illustrated embodiments. FIG. 1 is a sectional view showing a main part of a mold showing one embodiment of a resin sealing device for sealing a semiconductor element of the present invention, FIG. 2 is a schematic explanatory view of a resin sealing operation, and Table 1 is a pot diameter and a resin. It shows the relationship between the tablet diameter and the curing time (cure time) of the resin. The present invention is a resin encapsulation device for encapsulating a semiconductor element in which the present invention is applied to a resin encapsulation device for encapsulating a semiconductor element of a multi-plunger system. In FIG. 1, only a die for one plunger is shown. ing. In the drawings, 1 is a lower mold, 2 is an upper mold, 3 is a cavity, 4 is a gate, 5 is a runner, 5 is a cull, 6 is a pot for holding a resin tablet, 7 is a plunger for pushing the resin tablet, and 8 is It is a resin tablet.

In this resin encapsulation device for encapsulating semiconductor elements, the diameter of the pot 6 is 12 mm or less, for example 1
The diameter of the resin tablet 8 charged into the pot 6 is 11 mm or less, for example, 9 mm.
It is 8 mm. The pot diameter and the resin tablet diameter are selected in this way by the inventor of the present invention.
The curing time of the resin was set to 3 as shown in Table 1 below, which was obtained by repeated experiments on the relationship between the curing time (the curing time of the resin).
This is because it can be set to 5 seconds.

The time of 35 seconds is approximately the same as the time required for aligning the lead frame, supplying the resin tablets, and removing the cull, and therefore, the work time of the three operations that are performed in a line work manner. Is a time period in which the mold clamping of the molds 1 and 2 does not prevent the resin molding cycle time from being shortened. That is, this is a time in which waiting time does not occur in the lead frame alignment, the resin tablet supply work, and the cull drop work.

[0016]

[Table 1]

That is, as is apparent from Table 1, for example, focusing on the package type A, the conventional pot diameter is 13.
6 mm diameter, 13 mm diameter, 3.4 g resin tablet was used, pot diameter was 12 mm, 11 mm
By using a resin tablet having a diameter of 3.1 g, the curing time, which was 50 seconds in the past, can be reduced to 35 seconds. Focusing on another type B of the package, the pot diameter is 11 mm, and the resin tablet is 9.8 mm in diameter and 1.6 g.
By using the ones arranged vertically, the curing time of the resin can be shortened from the conventional 55 seconds to 35 seconds.

Further, paying attention to another type of package C, by using a pot diameter of 11 mm and a resin tablet of 9.8 diameter and 2.1 g (one), the curing time of the resin is 50 times that of the conventional one. It can be reduced from seconds to 35 seconds. By thus shortening the curing time of the resin, the throughput of resin molding can be improved.

If the diameter of the resin tablet used is made smaller and the pot diameter is made smaller, the curing time of the resin can be further shortened. However, even if the curing time of the resin is shortened, it is difficult to find the significance of further shortening the curing time of the resin unless the time required for aligning the lead frame, supplying the resin tablet and the time required for removing the curls is shortened. In addition, if the curing time of the resin is set too short, good resin sealing may not be achieved, that is, moldability may deteriorate. Therefore, the curing time of the resin is 35
It can be said that it is preferable to set it to about a second.

The sealing operation by the semiconductor element sealing resin sealing device will be briefly described with reference to FIG.
Reference numeral 9 denotes a lead frame preheat table, in which the lead frames 10, 10, ... Are preheated. 2 shows a state in which the lead frames 10 and 10 are pulled up from the table 9 by the robot hand 11.

A robot hand 11 picks up the lead frames 10, 10, ... From the preheat table 9 and conveys them onto the lower mold 1 of the mold, and at the same time, the resin tablet 8
It also carries and plays a role of putting it in the pot 6. Reference numeral 12 is a pusher for dropping the resin tablet 8, 13 is a sensed member attached to the pusher 12, and 14 is a pusher 2 contacted by the sensed member when the pusher 2 descends to the lower mold limit point. It is a sensor that detects that it has descended to a point.

The robot hand 11 opens the molds 1 and 2 and then moves forward to enter between the lower mold 1 and the upper mold 2 to place the lead frames 10 and 10 on the lower mold 1 and drop the resin tablet. The resin tablet 8 is dropped into the pot 6 by the mechanism. After that, the robot hand 11 retracts to the original position, receives the next supply of the resin tablet 8, and waits for the lead frame 10 newly set on the lead frame preheat table 9 to be conveyed.

On the other hand, the opened molds 1 and 2 are clamped when the robot hand 11 retracts, and the plunger 7
Thus, the resin tablet 8 is pressed to seal the resin. This mold clamping time is 35 seconds. When the resin sealing is completed, the molds 1 and 2 are opened, and the lead frame after the resin sealing is carried away by another robot hand (not shown), and the cull is dropped there. Then, the time for aligning and conveying the lead frames 10 and 10, the time for dropping the resin tablet 8, the time for dropping the cull, and the mold clamping time for the molds 1 and 2 are set to about the same 35 seconds.

[0024]

In the resin encapsulating apparatus for encapsulating a semiconductor element of the present invention, the mold has a diameter such that the curing time of the resin can be made substantially equal to the time required for lead frame alignment, tablet alignment, and cull drop time. It is characterized by having a pot having a small diameter suitable for storing a resin tablet. Therefore, according to the resin encapsulating device for encapsulating a semiconductor element of the present invention, a small resin tablet having a small pot diameter can be heated from the mold wall to be melted and press-fitted, so that the entire resin tablet can be melted more quickly. Therefore, the curing time of the resin can be shortened, and as shown in Table 1, the time required for lead frame alignment, tablet alignment and cull drop can be made substantially equal. Therefore, it is possible to shorten the curing time of the resin and contribute to the improvement of the throughput in the semiconductor device manufacturing.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of one embodiment of a semiconductor element sealing resin sealing device of the present invention.

FIG. 2 is a sectional view illustrating an operation.

[Explanation of symbols]

 1, 2 Mold 6 Pot 7 Plunger 8 Resin tablet

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Claims (1)

[Claims] 1. A pot having a small diameter suitable for accommodating a resin tablet having a diameter such that a mold curing time of the resin is approximately equal to a time required for lead frame alignment, a tablet alignment, and a time required for cull drop. Resin encapsulation device for semiconductor element encapsulation