JPH0645397U - Shield plate fixed structure - Google Patents

Abstract

(57) [Abstract] [Purpose] It is an object to provide a shield plate fixing structure for an inexpensive package in which the shield plate can be removed, an adjustment window is not required, and the same shield can be used in the upper and lower parts. [Structure] A joint 10 configured to have an outward elastic force at a central portion and an inward elastic force at both end portions is fixed to a plurality of insertion holes 7a formed around a component mounting position on a substrate 1a. To do. Shield plate (a) 8 and shield plate (b)
9 is fixed by the elastic force of both ends of the joint 10. The joint 10 is made of a conductive material such as a spring material, and the shield plate and the earth pattern 5 on the substrate 1a are electrically connected via the joint 10.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a fixed structure of a shield plate attached to a substrate so as to surround a portion that is a source of noise with a conductive material such as metal in an electronic circuit package that constitutes an electronic device.

[0002]

[Prior art]

 Conventionally, as this type of structure, a structure example shown in a perspective view of FIG. 5 is known. FIG. 5 shows a state in which an electronic circuit component 4 is mounted on an electronic circuit package 1 which constitutes an electronic device. In order to suppress the influence of electron radiation noise generated from the electronic circuit component 4 and its peripheral pattern, and to protect the electronic circuit component and its peripheral pattern, which are vulnerable to external noise, from electromagnetic waves, electric fields, magnetic fields, etc. 4, a shield plate 2 and a shield plate 3 are mounted on the substrate 1a so as to surround the peripheral pattern 4 and the solder portion. FIG. 6 is a sectional view taken along the line BB '. As shown in the figure, the ground pattern 5 is arranged around the substrate 1a, and the ground lands 5a are provided around the plurality of insertion holes 7 on the substrate 1a so as to be electrically connected to the ground pattern 5. The protrusion 2a of the shield plate 2 is passed through some of the plurality of insertion holes 7. The protruding portion 2a is fixed to the earth land 5a by the solder 6, and the shield plate (upper) 2 is fixed to the substrate 1a. Similarly, the protruding portion 3a of the shield plate (lower) 3 is inserted into another insertion hole 7 from the back surface of the surface where the shield plate 2 is fixed, and is fixed to the substrate 1a. If there is an adjustment component 4a or the like that needs to be adjusted later on the electronic circuit package 1, a window 2b or the like is provided directly above the adjustment component 4a of the shield plate (upper) 2 so that it can be adjusted later. . After soldering the shield plate (top) 2, the shield plate (bottom) 3 is mounted so as to surround the soldered part of the shield plate (top) 2, so the size of the upper and lower shield plates, and The shapes are different. The shield plate (upper) 2 and the shield plate (lower) 3 are usually made of a conductive material such as metal, and are provided around the projection 2a of the shield plate fixed by the solder 6 and the insertion hole 7. The earth land 5a and the shield plate and the earth pattern 5 provided on the substrate 1a provide electrical conduction between the shield plate and the pattern.

[0003]

[Problems to be solved by the device]

 However, the shield plate mounting structure configured as described above has the following problems. (1) First, since the shield plate is fixed to the board with solder, it cannot be removed, and if there are adjustment parts that need to be adjusted later, it is necessary to provide a window for adjustment on the shield plate. is there. The presence of this window not only hinders noise shielding, but also increases the cost due to the increase in processing man-hours. (2) Further, since the upper and lower shield plates are different in size and shape as shown in FIG. 6, the shielding of noise is hindered and two types of shield plates are required, which is a cost increase.

The present invention has been made in view of the above problems of the prior art. The shield plate can be removed, no adjustment window is required, and the shield plates having the same upper and lower shapes are used. It is an object of the present invention to provide an inexpensive shield plate fixing structure that can be performed.

[0005]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the shield plate fixing structure according to the present invention is a shield plate fixing structure in which electronic circuit parts are mounted on a board and mounted so as to surround the parts. It is characterized by arranging multiple joints with elastic force around the center and both ends, and the elastic force fixes the joint to the substrate and the shield plate to the joint.

[0006]

[Action]

 According to the present invention, since the shield plate fixing structure using a plurality of conductive joints is used, the shield plate can be freely removed from the joint, and the shield plate is electrically connected to the ground pattern on the substrate through the joint. In addition, it is possible to use the same shield plate above and below.

[0007]

【Example】

 Hereinafter, embodiments will be described with reference to the drawings. 2 is a perspective view of a shield plate fixing structure according to the present invention, and FIG. 1 is a sectional view taken along the line AA '. The electronic circuit package 1 is equipped with an electronic circuit component 4 and an adjustment component 4a. A shield is provided in order to prevent radiation noise generated from the electronic circuit component 4 and its peripheral pattern 12 from affecting the outside and to protect the electronic circuit component 4 and its peripheral pattern 12 from electronic noise coming from the outside. I need. A ground pattern 5 is arranged on the substrate 1a so as to surround the electronic circuit component 4 and the peripheral pattern 12. A plurality of insertion holes 7 having earth lands 5a are arranged along the entire circumference of the earth pattern 5. Joints 10 each made of a spring material or the like are inserted into the insertion holes 7.

A metal shield plate (a) 8 and a shield plate (b) 9 cover the electronic circuit component 4, the peripheral pattern 12 and the solder portion that require shielding, and the joint 10 holds the ends. Are mounted on both sides of the substrate 1a. Since the earth pattern 5 provided around the electronic circuit component 4 and the peripheral pattern 12 is electrically connected to the earth land 5a, the shield plate (a) 8 and the shield plate (b) 9 are connected via the joint 10. As a result, conduction is established with the ground pattern 5 on the base plate 1a, and a noise shielding effect is exerted.

FIG. 3 is an enlarged view of the joint 10 of the present invention. The joint 10 is constructed by spot welding two metal plates (a) 10a and metal plates (b) 10b at upper and lower positions. Both end portions are shield plate holding portions 10c for holding the shield by the inward elastic force, and the ends thereof are opened so that the shield plate can be easily inserted. An insertion portion 10d fixed to the substrate by an outward elastic force is provided in the central portion. When the width of the insertion portion 10d is w1, the width of the shield plate holding portion 10c is w2, and the width of the insertion hole 7 of the substrate 1a is w3, there is a relationship of w2 <w3 <w1. As shown in FIG. 1, the joint 10 is inserted up to the insertion portion 10d into an insertion hole (through hole) 7a which is provided with a solder plating 5b which is electrically connected to the ground pattern 5.

The joint 10 is securely fixed to the insertion hole 7 by the outward elastic force of the insertion portion 10d. Further, the solder plating 5b and the insertion portion 10d of the joint 10 are in contact with each other at several places, so that the joint 10 can be electrically connected to the ground pattern 5. Further, the shield plate holding portions 10c located at both ends of the joint sandwich the shield plate end portion 8a and the shield plate end portion 9a in the mating portion of the springs 10a and 10b due to the inward elasticity, and by the pressure, the substrate 1a The shield plate 8 and the shield plate 9 are securely fixed to both sides of the structure so that electrical continuity can be obtained.

As shown in the second embodiment of FIG. 4, when the inside of the insertion hole is a non-through hole without solder plating, after inserting the joint 10 into the insertion hole 7b, the joint 10 and the earth land 5a of the board are inserted. It is necessary to fix the solder to the substrate 1a with the solder 11 to ensure the conduction.

[0012]

[Effect of device]

 As described in detail above, according to the present invention, the shield can be easily removed and the adjustment window need not be provided, so that the shielding effect can be surely obtained. Also, since the same shield can be used on the upper and lower sides, the number of processing steps is reduced, and an inexpensive shield plate fixing structure can be provided. Further, since the through holes can be reduced, the peripheral pattern can be easily arranged.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a shield plate fixing structure according to the present invention.

FIG. 2 is a perspective view showing an embodiment of a shield plate fixing structure according to the present invention.

[Fig. 3] Enlarged view of the joint of the present invention

FIG. 4 is a sectional view showing another embodiment of the shield plate fixing structure according to the present invention.

FIG. 5 is a perspective view showing a conventional configuration example.

6 is a sectional view taken along line BB ′ of FIG.

[Explanation of symbols]

 1 electronic circuit package 1a substrate 2 shield plate (upper) 2a protrusion 2b window 3 shield plate (lower) 3a protrusion 4 electronic circuit component 4a adjusting component 5 earth pattern 5a earth land 5b solder plating 6 solder 7 insertion hole 7a insertion hole (Through hole) 7b Insertion hole (non-through hole) 8 Shield plate (a) 8a Shield plate end 9 Shield plate (b) 9a Shield plate end 10 Joint 10a Metal plate (a) 10b Metal plate (b) 10c Shield Plate holding part 10d Insert part 11 Solder 12 Peripheral pattern

Claims (1)

[Scope of utility model registration request] 1. A shield plate fixing structure in which an electronic circuit component is mounted on a substrate and is mounted so as to surround the component. The shield plate fixing structure comprises a substrate having an insertion hole around a component mounting position, and a pair of metal plates facing each other. A joint inserted into the insertion hole, having a substrate fixing portion fixed to the substrate by an outward elastic force at a central portion and shield plate fixing portions for holding a shield plate by an inward elastic force at both ends. And a pair of shield plates fixed to both surfaces of the substrate by the shield plate fixing part.