JPH06507449A - 電気めっきのための非伝導性基体を製造するための改善された方法 - Google Patents
電気めっきのための非伝導性基体を製造するための改善された方法Info
- Publication number
- JPH06507449A JPH06507449A JP4511806A JP51180692A JPH06507449A JP H06507449 A JPH06507449 A JP H06507449A JP 4511806 A JP4511806 A JP 4511806A JP 51180692 A JP51180692 A JP 51180692A JP H06507449 A JPH06507449 A JP H06507449A
- Authority
- JP
- Japan
- Prior art keywords
- carbon black
- dispersion
- conductive
- liquid
- graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Paints Or Removers (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1)(a)非伝導性表面を、 (1)分散液中の約3.0ミクロン未満の平均粒径を有するカーボンブラック粒 子、 (2)該カーボンブラックと融和性である効果的分散量の界面活性剤、及び (3)第一液状分散媒体を含む液状カーボンブラック分散液と接触させ(ここで 、カーボンブラックの量は実質的にすべての該非伝導性表面をコートするのに十 分でありそして液状カーポンプラック分散液の約4重量%未満である) (b)実質的にすべての該第一液状分散媒体を該カーボンブラック粒子から分離 し(これによって、該粒子は実質的に連続的な層として該非伝導性表面の上に付 着させる)、並びに (c)該カーボンブラックコートされた非伝導性表面を、(1)分散液中の約1 .5ミクロン未満の平均粒径を有する伝導性グラファイト粒子、 (2)該伝導性グラファイトと融和性である効果的分散量の界面活性剤、及び (3)第二液状分散媒体を含む液状伝導性グラファイト分散液と接触させ(ここ で、伝導性グラファイトの量は液状伝導性グラファイト分散液の約4重量%未満 である) (d)実質的にすべての該第二液状分散媒体を該伝導性グラファイト粒子から分 離し(これによって、該粒子は該カーボンブラックコートされた非伝導性表面の 上に付着させる)、並びに (e)堆積したカーボンブラック層及び付着した伝導性グラファイト層及び該非 伝導性表面を覆って実質的に連続的な伝導性金属層を電気めっきするステップに よって特徴付けられる、非伝導性物質の表面に伝導性金属層を電気めっきするた めの方法。 2)該カーボンブラック粒子が約0.05〜約3.0ミクロンの平均径を有する ことを特徴とする、請求項1記載の方法。 3)該グラファイト粒子が約0.05〜約0.8ミクロンの平均粒径を有するこ とを特徴とする、請求項1記載の方法。 4)該接触させるステップ(a)及び(c)を、非伝導性物質をそれぞれ該液状 カーボンブラック分散液及び液状伝導性グラファイト分散液中に浸漬することに よって実施することを特徴とする、請求項1記載の方法。 5)該分離するステップ(b)及び(d)を付着した分散液を加熱することによ って実施することを特徴とする、請求項1記載の方法。 6)少なくとも二つの別々の伝導性金属層に積層された少なくとも一つの非伝導 性層から成る積層され印刷された配線基板中のスルーホールの壁を電気めっきす るための方法であって、 (a)該スルーホールを有する該印刷された配線基板を、 (1)分散液中の約3.0ミクロン未満の平均粒径を有するカーボンブラック粒 子、 (2)該カーボンブラックと融和性である効果的分散量の界面活性剤、及び (3)第一液状分散媒体を含む液状カーボンブラック分散液の浴中で接触させ( ここで、カーボンブラックの量は実質的にすべての該非伝導性表面をコートする のに十分でありそして液状カーボンブラック分散液の約4重量%未満である)( b)実質的にすべての液状分散媒体を該分散液から分離し、これによって該カー ボンブラック粒子を実質的に連続的な層として該ホールの壁の該非伝導性部分の 上に付着させ、並びに (c)該カーボンブラックコートされた印刷配線板を、(1)分散液中の約1. 5ミクロン未満の平均粒径を有する伝導性グラファイト粒子、 (2)該伝導性グラファイトと融和性である効果的分散量の界面活性剤、及び (3)第二液状分散媒体を含む液状伝導性グラファイト分散液と接触させ(ここ で、伝導性グラファイトの量は液状伝導性グラファイト分散液の約4重量%未満 である) (d)実質的にすべての該第二液状分散媒体を該伝導性グラファイト粒子から分 離し、これによって該粒子を該印刷配線板の上に付着させ、 (e)該印刷配線板の該金属層をマイクロエッチングしてそれらからあり得る付 着したカーボンブラック及びグラファイトを除去し、並びに (f)該ホールの壁の該非伝導性部分の上の付着したカーボンブラック層及び付 着した伝導性グラファイト層を覆って実質的に連続的な伝導性金属層を電気めっ きして、それによって該印刷配線板の該金属層を電気的に接続する ステップによって特徴付けられる方法。 7)該方法が、ステップ(a)の前に、該印刷配線板を清掃溶液及び調整剤溶液 と接触させることを更に含むことを特徴とする、請求項6記載の方法。 8)その上に約3.0ミクロン未満の平均粒径を有するカーボンブラックの実質 的に連続的な層の付着物及び該カーボンブラック付着物を覆って付着させた約1 .5ミクロン未満の平均粒径を有する伝導性グラファイトの層によって覆われた 非伝導性表面。 9)その上に約3.0ミクロン未満の平均粒径を有するカーボンブラックの実質 的に連続的な層の付着物及び該カーボンブラック付着物を覆って付着させた約1 .5ミクロン未満の平均粒径を有する伝導性グラファイトの層によって覆われそ してめっきされた金属を下に横たえる、金属めっきされた非伝導性表面。 10)該非伝導性表面が印刷配線板の少なくとも一つのスルーホールを含むこと を特徴とする、請求項8または9記載の金属めっきされた非伝導性表面。 11)非伝導性表面の電気めっきを増進する際の使用のために適切な液状分散液 であって、 (a)該分散液中の約1.5ミクロン未満の平均粒径を有する伝導性グラファイ ト粒子、 (b)該伝導性グラファイトと融和性である効果的分散量の界面活性剤、 (c)必要に応じて、該液状分散液のpHを約9〜14の範囲に上げるのに十分 な量の少なくとも一種のアルカリ性水酸化物、及び (d)液状分散媒体(ここで、伝導性グラファイトの量は、実質的にすべての該 非伝導性表面をコートするのに十分でありそして該液状分散液の約4重量%未満 であり、そしてここで、該液状分散液は約10重量%未満の固体成分を含む) によって特徴付けられる液状分散液。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69451791A | 1991-05-01 | 1991-05-01 | |
| US747,066 | 1991-08-19 | ||
| US694,517 | 1991-08-19 | ||
| US07/747,066 US5139642A (en) | 1991-05-01 | 1991-08-19 | Process for preparing a nonconductive substrate for electroplating |
| PCT/US1992/002063 WO1992019794A1 (en) | 1991-05-01 | 1992-03-16 | Improved process for preparing a nonconductive substrate for electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06507449A true JPH06507449A (ja) | 1994-08-25 |
| JP3135124B2 JP3135124B2 (ja) | 2001-02-13 |
Family
ID=27105399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04511806A Expired - Lifetime JP3135124B2 (ja) | 1991-05-01 | 1992-03-16 | 電気めっきのための非伝導性基体を製造するための改善された方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5139642A (ja) |
| EP (1) | EP0583426B2 (ja) |
| JP (1) | JP3135124B2 (ja) |
| AU (1) | AU2001692A (ja) |
| CA (1) | CA2103137A1 (ja) |
| DE (1) | DE69210818T3 (ja) |
| WO (1) | WO1992019794A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003519285A (ja) * | 2000-01-06 | 2003-06-17 | エレクトロケミカルズ インコーポレイティド | スルーホール及びガラスのコンディショニング |
| JP2012251211A (ja) * | 2011-06-03 | 2012-12-20 | Sumitomo Electric Ind Ltd | アルミニウム構造体の製造方法およびアルミニウム構造体 |
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| US4897164A (en) * | 1989-04-24 | 1990-01-30 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| US5015339A (en) * | 1990-03-26 | 1991-05-14 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
| US4964959A (en) * | 1990-04-12 | 1990-10-23 | Olin Hunt Specialty Products Inc. | Process for preparing a nonconductive substrate for electroplating |
| US4994153A (en) * | 1990-06-28 | 1991-02-19 | Olin Corporation | Process for preparing nonconductive substrates |
| EP0581816A1 (de) | 1991-04-22 | 1994-02-09 | ATOTECH Deutschland GmbH | Verfahren zur selektiven beschichtung von nichtleitern mit kohlenstoff-partikeln und die verwendung von kupferhaltigen lösungen im verfahren |
| JP6223976B2 (ja) | 2012-07-23 | 2017-11-01 | 富士通株式会社 | 表示制御プログラム、表示制御方法及び表示制御装置 |
| JP6350878B2 (ja) | 2015-08-27 | 2018-07-04 | 京セラドキュメントソリューションズ株式会社 | 画像読取装置、画像読取方法及び制御プログラム |
-
1991
- 1991-08-19 US US07/747,066 patent/US5139642A/en not_active Ceased
-
1992
- 1992-03-16 JP JP04511806A patent/JP3135124B2/ja not_active Expired - Lifetime
- 1992-03-16 EP EP92915309A patent/EP0583426B2/en not_active Expired - Lifetime
- 1992-03-16 WO PCT/US1992/002063 patent/WO1992019794A1/en not_active Ceased
- 1992-03-16 DE DE69210818T patent/DE69210818T3/de not_active Expired - Lifetime
- 1992-03-16 CA CA002103137A patent/CA2103137A1/en not_active Abandoned
- 1992-03-16 AU AU20016/92A patent/AU2001692A/en not_active Abandoned
-
1999
- 1999-02-22 US US09/255,491 patent/USRE37765E1/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003519285A (ja) * | 2000-01-06 | 2003-06-17 | エレクトロケミカルズ インコーポレイティド | スルーホール及びガラスのコンディショニング |
| JP2012251211A (ja) * | 2011-06-03 | 2012-12-20 | Sumitomo Electric Ind Ltd | アルミニウム構造体の製造方法およびアルミニウム構造体 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69210818D1 (de) | 1996-06-20 |
| WO1992019794A1 (en) | 1992-11-12 |
| EP0583426A4 (en) | 1994-10-12 |
| DE69210818T2 (de) | 1996-10-31 |
| EP0583426B1 (en) | 1996-05-15 |
| DE69210818T3 (de) | 2000-11-16 |
| US5139642A (en) | 1992-08-18 |
| CA2103137A1 (en) | 1992-11-02 |
| USRE37765E1 (en) | 2002-06-25 |
| EP0583426A1 (en) | 1994-02-23 |
| JP3135124B2 (ja) | 2001-02-13 |
| EP0583426B2 (en) | 2000-03-29 |
| AU2001692A (en) | 1992-12-21 |
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