JPH06510564A - 取り外し可能なカソードを備えた回転マグネトロン - Google Patents
取り外し可能なカソードを備えた回転マグネトロンInfo
- Publication number
- JPH06510564A JPH06510564A JP3518370A JP51837091A JPH06510564A JP H06510564 A JPH06510564 A JP H06510564A JP 3518370 A JP3518370 A JP 3518370A JP 51837091 A JP51837091 A JP 51837091A JP H06510564 A JPH06510564 A JP H06510564A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- conduit
- drive shaft
- flange
- removably
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 30
- 239000012809 cooling fluid Substances 0.000 claims description 17
- 239000012530 fluid Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 238000012546 transfer Methods 0.000 description 11
- 239000007789 gas Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000013077 target material Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000006873 Coates reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000005328 architectural glass Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (28)
- 1.軸受ハウジングと、 前記軸受ハウジングに回転可能に装着され、真空にすることが可能な室の中まで 延びる端部を備えた駆動軸と、 前記駆動軸を前記軸受ハウジングに対してシールし、その内部を前記室から隔離 する真空シール手段と、 前記室中まで延びる駆動軸の端部にカソードを取り外し可能に装着し、前記軸受 ハウジングが所定位置に留まっている間に前記室から前記カソードを取り外すた めの手段と を備えた回転可能なマグネトロン装置。
- 2.前記駆動軸は中空でかつ少なくとも一端が開放されている請求項1に記載の 装置。
- 3.前記カソードに対して冷却流体を流出入させる手段をさらに含む請求項2に 記載の装置。
- 4.前記流体冷却手段は、前記駆動軸を通るように延びるとともに、その内部に 支持された第一の導管と、前記カソード中まで延びるとともに、その内部に装着 された第二の導管とを含み、前記第二の導管は前記第一の導管と連通するように 前記第一の導管に取り外し可能に装着され、かつ前記第二の導管は前記第一の導 管が駆動軸内に留まっている間に前記カソードから取り外し可能である請求項3 に記載の装置。
- 5.前記第二のカソードによって前記カソード内に支持された磁石アレイをさら に含む請求項4に記載の装置。
- 6.前記第二の導管は前記第一の導管への装着を容易にするため、その一端に外 径が縮小された部分を有する請求項4に記載の装置。
- 7.前記第一の導管を第二の導管に対してシールするシール手段をさらに含む請 求項6に記載の装置。
- 8.前記第二の導管は前記カソードの一端のプラグによって支持され、前記カソ ードが前記第二の導管の周りに回転し得る請求項7に記載の装置。
- 9.前記取り外し可能に装着する手段は前記カソードを前記駆動軸に取り外し可 能に固定するための装着部材を含み、その部材は前記カソードの一端に形成され ている請求項1または4に記載の装置。
- 10.前記装着部材は前駆駆動軸に固着されたフランジに取り外し可能に固定さ れている請求項9に記載の装置。
- 11.前記装着部材は前記カソードの前記一端に設けたプラグを含み、前記プラ グは前記フランジに取り外し可能に固定可能なフランジ部分を含む請求項10に 記載の装置。
- 12.前記フランジ部分と前記フランジとの間には真空シールを形成するための 装着用シールを含む請求項11に記載の装置。
- 13.前記装着用シールは少なくとも2つの真空シールを含み、それらは前記フ ランジにおいて対応する溝に配設されている請求項12に記載の装置。
- 14.前記取り外し可能に装着する手段を取り囲むとともに、それに取り外し可 能に固定された暗色空間シールド(dark space shield)をさ らに含む請求項9に記載の装置。
- 15.前記軸受ハウジングは前記室の側壁に装着されている請求項1に記載の装 置。
- 16.回転するマグネトロンを使用して基材に薄膜をスパッタリングする装置で あって、 真空にすることが可能なコーティング室と、前記コーティング室の側壁に装着さ れたカンチレバー装着ユニットと、前記装着ユニットは軸受ハウジングを含むこ とと、前記マグネトロンを回転するために前記軸受ハウジングに装着された駆動 軸と、前記軸受ハウジングの内部の少なくとも一部分を前記コーティング室から 隔離するための真空シール手段と、 前記コーティング室の内部において前記駆動軸の一端に前記マグネトロンのカソ ード本体を取り外し可能に装着し、それにより前記カソード本体を前記駆動軸か ら取り外し可能にするとともに前記コーティング室から取り外し可能にする手段 と、 前記マグネトロンを通過した基材を搬送する手段とを備えた装置。
- 17.前記取り外し可能に装着する手段は、前記カソード本体を前記駆動軸に取 り外し可能に固定するために、前記カソード本体の一端に形成された装着部材を 含む請求項16に記載の装置。
- 18.前記装着手段は前記駆動軸に固定されたフランジに取り外し可能に固定さ れている請求項17に記載の装置。
- 19.前記装着手段は前記カソード本体の一端に設けたプラグを含み、前記プラ グは前記フランジに取り外し可能に固定されるフランジ部分を含む請求項18に 記載の装置。
- 20.前記フランジ部分と前記フランジとの間には真空シールを形成するための 装着用シールを含む請求項19に記載の装置。
- 21.前記装着用シールは少なくとも2つの真空シールを含み、それらは前記フ ランジにおいて対応する溝に配設されている請求項20に記載の装置。
- 22.前記プラグ及び前記フランジを取り囲む暗色空間シールド(dark s pace shield)をさらに含む請求項19に記載の装置。
- 23.前記駆動軸は中空でかつ少なくとも一端が開放されている請求項19に記 載の装置。
- 24.前記カソード本体に対して冷却流体を流出入させる手段をさらに含む請求 項23に記載の装置。
- 25.前記流体冷却手段は、前記駆動軸を通るように延びるとともに、その内部 に支持された第一の導管と、前記カソード本体中まで延びるとともに、その内部 に装着された第二の導通とを含み、前記第二の導管は前記第一の導管と連通する ように前記第一の導管に取り外し可能に装着され、かつ前記第二の導管は前記第 一の導管が駆動軸内に留まっている間に前記カソード本体から取り外し可能であ る請求項24に記載の装置。
- 26.前記第二の導管は前記プラグによって支持され、前記カソード本体が前記 第二の導管の周りに回転し得る請求項25に記載の装置。
- 27.前記第二の導管は前記第一の導管への装着を容易にするため、その一端に 外径が縮小された部分を有する請求項25に記載の装置。
- 28.前記第二の導管に前記第一の導管を堅牢に固定するための真空シール手段 をさらに含む請求項27に記載の装置。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US600,203 | 1990-10-18 | ||
| US07/600,203 US5100527A (en) | 1990-10-18 | 1990-10-18 | Rotating magnetron incorporating a removable cathode |
| PCT/US1991/007500 WO1992007105A1 (en) | 1990-10-18 | 1991-10-17 | Rotating magnetron incorporating a removable cathode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06510564A true JPH06510564A (ja) | 1994-11-24 |
| JP3323495B2 JP3323495B2 (ja) | 2002-09-09 |
Family
ID=24402709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51837091A Expired - Lifetime JP3323495B2 (ja) | 1990-10-18 | 1991-10-17 | 取り外し可能なカソードを備えた回転マグネトロン |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5100527A (ja) |
| EP (1) | EP0554360A1 (ja) |
| JP (1) | JP3323495B2 (ja) |
| CA (1) | CA2094252C (ja) |
| WO (1) | WO1992007105A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014194086A (ja) * | 2004-10-18 | 2014-10-09 | Soleras Advanced Coatings Bvba | 回転可能なスパッタリングターゲットを支持する平面エンドブロック |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5200049A (en) * | 1990-08-10 | 1993-04-06 | Viratec Thin Films, Inc. | Cantilever mount for rotating cylindrical magnetrons |
| DE4117518C2 (de) * | 1991-05-29 | 2000-06-21 | Leybold Ag | Vorrichtung zum Sputtern mit bewegtem, insbesondere rotierendem Target |
| US5922176A (en) * | 1992-06-12 | 1999-07-13 | Donnelly Corporation | Spark eliminating sputtering target and method for using and making same |
| US5567289A (en) * | 1993-12-30 | 1996-10-22 | Viratec Thin Films, Inc. | Rotating floating magnetron dark-space shield and cone end |
| US5620577A (en) * | 1993-12-30 | 1997-04-15 | Viratec Thin Films, Inc. | Spring-loaded mount for a rotatable sputtering cathode |
| US5571393A (en) * | 1994-08-24 | 1996-11-05 | Viratec Thin Films, Inc. | Magnet housing for a sputtering cathode |
| US5445721A (en) * | 1994-08-25 | 1995-08-29 | The Boc Group, Inc. | Rotatable magnetron including a replacement target structure |
| US5518592A (en) * | 1994-08-25 | 1996-05-21 | The Boc Group, Inc. | Seal cartridge for a rotatable magnetron |
| US5812405A (en) * | 1995-05-23 | 1998-09-22 | Viratec Thin Films, Inc. | Three variable optimization system for thin film coating design |
| US5591314A (en) * | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
| GB9600210D0 (en) * | 1996-01-05 | 1996-03-06 | Vanderstraeten E Bvba | Improved sputtering targets and method for the preparation thereof |
| US6207026B1 (en) | 1999-10-13 | 2001-03-27 | Applied Materials, Inc. | Magnetron with cooling system for substrate processing system |
| DE19958666C2 (de) * | 1999-12-06 | 2003-10-30 | Heraeus Gmbh W C | Vorrichtung zur lösbaren Verbindung eines zylinderrohrförmigen Targetteiles mit einem Aufnahmeteil |
| SE521095C2 (sv) * | 2001-06-08 | 2003-09-30 | Cardinal Cg Co | Förfarande för reaktiv sputtring |
| US7399385B2 (en) * | 2001-06-14 | 2008-07-15 | Tru Vue, Inc. | Alternating current rotatable sputter cathode |
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| US20030173217A1 (en) * | 2002-03-14 | 2003-09-18 | Sputtering Components, Inc. | High-power ion sputtering magnetron |
| US20040129561A1 (en) * | 2003-01-07 | 2004-07-08 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron magnetic array mid span support |
| US20050051422A1 (en) * | 2003-02-21 | 2005-03-10 | Rietzel James G. | Cylindrical magnetron with self cleaning target |
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| US20050224343A1 (en) * | 2004-04-08 | 2005-10-13 | Richard Newcomb | Power coupling for high-power sputtering |
| US20060049043A1 (en) * | 2004-08-17 | 2006-03-09 | Matuska Neal W | Magnetron assembly |
| US20060065524A1 (en) * | 2004-09-30 | 2006-03-30 | Richard Newcomb | Non-bonded rotatable targets for sputtering |
| US20060096855A1 (en) * | 2004-11-05 | 2006-05-11 | Richard Newcomb | Cathode arrangement for atomizing a rotatable target pipe |
| US20060278519A1 (en) * | 2005-06-10 | 2006-12-14 | Leszek Malaszewski | Adaptable fixation for cylindrical magnetrons |
| US20060278524A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for modulating power signals to control sputtering |
| US20060278521A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for controlling ion density and energy using modulated power signals |
| US20070095281A1 (en) * | 2005-11-01 | 2007-05-03 | Stowell Michael W | System and method for power function ramping of microwave liner discharge sources |
| US8435388B2 (en) * | 2005-11-01 | 2013-05-07 | Cardinal Cg Company | Reactive sputter deposition processes and equipment |
| US7842355B2 (en) * | 2005-11-01 | 2010-11-30 | Applied Materials, Inc. | System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties |
| DE102008048785B4 (de) * | 2007-09-24 | 2014-04-17 | Von Ardenne Anlagentechnik Gmbh | Magnetronanordnung mit abgeschirmter Targethalterung |
| KR101309363B1 (ko) * | 2007-12-14 | 2013-09-17 | 가부시키가이샤 알박 | 챔버 및 성막 장치 |
| DE102008018609B4 (de) * | 2008-04-11 | 2012-01-19 | Von Ardenne Anlagentechnik Gmbh | Antriebsendblock für ein rotierendes Magnetron |
| US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
| US20120097526A1 (en) * | 2009-04-03 | 2012-04-26 | Madocks John E | Rotary magnetron |
| US9388490B2 (en) | 2009-10-26 | 2016-07-12 | General Plasma, Inc. | Rotary magnetron magnet bar and apparatus containing the same for high target utilization |
| CZ304905B6 (cs) | 2009-11-23 | 2015-01-14 | Shm, S.R.O. | Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu |
| CN101761635B (zh) * | 2009-12-23 | 2012-09-05 | 东莞宏威数码机械有限公司 | 真空传动装置 |
| EP2371992B1 (en) * | 2010-04-01 | 2013-06-05 | Applied Materials, Inc. | End-block and sputtering installation |
| EP2372744B1 (en) * | 2010-04-01 | 2016-01-13 | Applied Materials, Inc. | Device for supporting a rotatable target and sputtering installation |
| DE102010043114B4 (de) * | 2010-10-29 | 2015-02-12 | Von Ardenne Gmbh | Magnetroneinrichtung mit Rohrtarget |
| EP2640865B1 (en) * | 2010-11-17 | 2020-05-13 | Soleras Advanced Coatings bvba | Soft sputtering magnetron system |
| EP2482305A1 (en) * | 2011-01-28 | 2012-08-01 | Applied Materials, Inc. | Device for supporting a rotatable target and sputtering apparatus |
| US20130032476A1 (en) * | 2011-08-04 | 2013-02-07 | Sputtering Components, Inc. | Rotary cathodes for magnetron sputtering system |
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| DE102014101582B4 (de) * | 2014-02-07 | 2017-10-26 | Von Ardenne Gmbh | Lagervorrichtung |
| DE202014100594U1 (de) * | 2014-02-11 | 2014-03-10 | Von Ardenne Gmbh | Endblock-Anordnung |
| DE102014101830B4 (de) * | 2014-02-13 | 2015-10-08 | Von Ardenne Gmbh | Antriebs-Baugruppe, Prozessieranordnung, Verfahren zum Montieren einer Antriebs-Baugruppe und Verfahren zum Demontieren einer Antriebs-Baugruppe |
| DE102014019974B3 (de) | 2014-10-20 | 2022-08-25 | VON ARDENNE Asset GmbH & Co. KG | Endblock-Anordnung und Sockelanordnung |
| DE102014115282B4 (de) * | 2014-10-20 | 2019-10-02 | VON ARDENNE Asset GmbH & Co. KG | Sockelanordnung |
| CN106931147B (zh) * | 2017-04-27 | 2024-02-02 | 江阴天澄机械装备有限公司 | 用于齿轮箱输出轴的绝热结构 |
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-
1990
- 1990-10-18 US US07/600,203 patent/US5100527A/en not_active Expired - Lifetime
-
1991
- 1991-10-17 JP JP51837091A patent/JP3323495B2/ja not_active Expired - Lifetime
- 1991-10-17 CA CA002094252A patent/CA2094252C/en not_active Expired - Lifetime
- 1991-10-17 WO PCT/US1991/007500 patent/WO1992007105A1/en not_active Ceased
- 1991-10-17 EP EP91920086A patent/EP0554360A1/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014194086A (ja) * | 2004-10-18 | 2014-10-09 | Soleras Advanced Coatings Bvba | 回転可能なスパッタリングターゲットを支持する平面エンドブロック |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3323495B2 (ja) | 2002-09-09 |
| CA2094252A1 (en) | 1992-04-19 |
| US5100527A (en) | 1992-03-31 |
| EP0554360A4 (ja) | 1994-03-09 |
| EP0554360A1 (en) | 1993-08-11 |
| CA2094252C (en) | 2002-05-07 |
| WO1992007105A1 (en) | 1992-04-30 |
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