JPH065321A - Ic clip - Google Patents

Abstract

PURPOSE:To restrict an inductance component of a probe grounding terminal at a low value by eliminating need of extending the grounding terminal long even when a probe contact is connected to any pin of an IC clip in the IC clip for connecting respective IC lead terminals to the probe. CONSTITUTION:Plural pins 12 are provided in parallel in accordance with lead terminals of an IC. A conductive member 13 which is electrically connected to only one specified pin of these pins is provided along the parallel disposition direction of the pins. In the case a forward end 74 of a probe is applied to contact one pin 12, the conductive member 13 always exists close to it, so a grounding wire 75 of the probe need only be fixed at a constant length.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an IC clip, and more particularly to an IC clip for electrically connecting a plurality of terminals of an integrated circuit device and a probe for observing each electric waveform of these terminals.

[0002]

2. Description of the Related Art FIGS. 5A and 5B are views showing the structure of a conventional example of this type of probe. FIG. 5A is a front view thereof and FIG. 5B is a side view thereof. This IC clip is a molded part 1 of insulator
1, a plurality of pins 12 arranged in parallel corresponding to a plurality of terminals of an IC (not shown), and a spring 51.

When using this IC clip, the IC
Since the lower end of each pin 12 comes into contact with the corresponding terminal (lead terminal) of the IC by sandwiching the end portion of the IC clip with each other, the portion exposed from the mold portion 11 at the upper end of the pin 12 is connected to the probe ( By contacting and probing with (not shown), the electrical waveform of the IC can be observed.

In this type of IC clip, a specific pin (generally a ground pin) is used as a reference in order to measure the potential of each pin 12, and the probe is connected to the specific pin by connecting the ground terminal of the probe. In this case, the probe shown in FIG. 6 is used because the distance between the specific pin and each measuring pin is different.

This probe comprises a probe main body 71, a ground wire 72, an alligator clip 73 attached to the tip of the ground wire, and a contactor 74 at the tip of the probe.

When the ground wire 72 of this probe is set to a certain length and the contactor 74 comes into contact with the pin to be measured, even if a specific pin such as a ground that is to be a reference is separated, The ground wire 72 facilitates the measurement.

However, when the long ground wire 72 is used for the probe, when measuring a signal having a frequency component above a certain level, the inductance component of this ground wire has an influence, and a correct measurement cannot be performed. .

In order to solve this drawback, a short bare wire 75 for ground is used instead of the ground wire as shown in FIG.
If a probe fixed and attached near the pin is used, the distance between the specific pin and the pin to be measured is all different, so that there is a drawback that the measurement is not easy and an erroneous contact is likely to occur.

[0009]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an IC clip which enables easy and reliable probe measurement even if the distance between a specific pin and the pin to be measured is different.

[0010]

According to the present invention, there is provided an IC clip for electrically connecting a plurality of terminals of an integrated circuit device and a probe for observing respective electric waveforms of these terminals, wherein each of the terminals is provided. A plurality of pins provided in parallel corresponding to each other, and a conductive member electrically connected to only a specific pin among these pins and provided along the juxtaposed direction of the pins. An IC clip characterized by the above is obtained.

[0011]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a partial front view showing an embodiment of the present invention. In this embodiment, for simplification, only one side (right side) of the IC clip is shown. Since the IC clip is symmetrical to the left and right as shown in the conventional example of FIG. 5, the left side portion is omitted in FIG. 1, but it has the same structure as the right side portion shown.

This IC clip is a molded part 1 of an insulator.
1 and a plurality of pins 12 arranged in parallel corresponding to lead terminals of an IC (not shown), and a conductive member electrically connected only to a specific pin (for example, a pin to be ground). 13 and 14 are included.

2 and 3 are views showing a specific structure of the specific pin 12 and the conductive members 13 and 14. FIG. 2 is a front view thereof, FIG. 3A is a perspective view thereof, and FIG. ) Is the top view.

The specific pin 12 and the conductive plate 14 are electrically connected to each other, and the conductive plate 14 is attached along the juxtaposed direction of the pins 12. A conductive probe ground contact terminal plate 13 is also mounted near the upper end of the conductive plate 14, and the terminal plate 13 is also mounted along the direction in which the pins 12 are arranged in parallel.

FIG. 4 is a view showing a state when the probe (probe shown in FIG. 7) is used for the IC clip according to the embodiment of the present invention.

No matter which pin the probe tip contactor 74 is in contact with, the terminal board 13 is at the same distance as all the pins 12, so the fixed ground bare wire 75 is indispensable. The terminal board 13 can be contacted, and as a result, the grounding bare wire 75 is electrically connected to the specific pin.

In the above embodiment, the specific pin is shown on the right side of the IC clip.
Similarly, the conductive plate 14 and the probe ground contact terminal plate 13 may be attached to the left side portion to add the function of electrically connecting the conductive plates on the left and right sides internally.

[0019]

As described above, according to the present invention, the conductive member connected to the specific pin is provided so as to have the same distance from all the pins along the direction in which the pins are juxtaposed.
The inductance of the ground wire of the probe can be made extremely small, and the erroneous connection can be prevented.

[Brief description of drawings]

FIG. 1 is a diagram showing a partial configuration of an embodiment of the present invention.

FIG. 2 is a diagram showing a part of the structure of FIG.

3A is a perspective view of FIG. 2, and FIG. 3B is a front view thereof.

FIG. 4 is a diagram showing a relationship with a probe when using the IC clip according to the embodiment of the present invention.

5A is a front view of a conventional IC clip, FIG.
Is a side view thereof.

FIG. 6 is a diagram showing an example of a probe.

FIG. 7 is a diagram showing another example of a probe.

[Explanation of symbols]

 11 Insulating Molded Part 12 Pins 13 Contact Terminal for Conductive Probe Ground 14 Conductive Plate 51 Spring 71 Probe Main Body 72 Ground Wire 73 Alligator Clip 74 Probe Tip Contact 75 Bare Ground Wire

Claims (2)

[Claims] 1. An IC clip for electrically connecting a plurality of terminals of an integrated circuit device and a probe for observing respective electric waveforms of these terminals, wherein the IC clips are arranged in parallel corresponding to each of the terminals. An IC, comprising: a plurality of pins that are installed and provided; and a conductive member that is electrically connected only to a specific pin among these pins and that is provided along the direction in which the pins are juxtaposed. clip. 2. The conductive member is provided at a position where it can come into contact with the ground terminal of the probe when the contact of the probe is connected to each of the pins. IC clip.