JPH065747A - Mounting structure for semiconductor device - Google Patents

Abstract

(57) [Summary] [Object] To provide a mounting structure of a semiconductor device capable of suppressing heat generation of the semiconductor device at an extremely low cost. A circuit board 1 in which a plurality of conductor patterns 2 are laminated, a through hole 4 connected to each of the conductor patterns 2 and formed in the circuit board 1, and a circuit board in a state of facing the through hole 4 The semiconductor device 5 is mounted on the conductor pattern 2 of No. 1 and the resin material 7 having a high thermal conductivity is loaded in a state of being in contact with the lower surface 5a of the semiconductor device 5 and the conductor pattern 2 of the circuit board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting structure, and more particularly to a structure for suppressing heat generation of a semiconductor device mounted on a circuit board.

[0002]

2. Description of the Related Art FIG. 2 is a schematic side view showing a conventional structure. In the mounting structure of the semiconductor device shown in the figure, 50 is a semiconductor device, and an external lead 51 is implanted on the side portion of the semiconductor device 50. On the other hand, reference numeral 52 in the drawing denotes a circuit board, and a conductor pattern 53 is provided on the surface of the circuit board 52.
Are formed. Then, with respect to the circuit board 52, the semiconductor device 50 has the conductor pattern 5 via the external lead 51.
It is implemented on 3.

By the way, even in the circuits of various semiconductor devices,
In particular, in the case of the C (Complementary) MOS type, the amount of heat generated is small because the power consumption is small, and therefore, it has been said that a resin material is sufficient as the material of the package.

[0004]

However, in recent years, the number of gates of chips contained in a package has become enormous, and the amount of heat generated also increases due to the increase in power consumption, and the semiconductor device 50 is obtained only by the heat capacity of the resin package. It has become difficult to control the temperature rise in the. That is, in the above conventional mounting structure, the semiconductor device 50
In the case where is made up of a resin package, heat that cannot be absorbed by the heat capacity of the package is stored inside the semiconductor device 50, which causes the temperature of the semiconductor device 50 to rise.

Therefore, as a countermeasure against the above-mentioned problem, for example, a method of using a ceramic package for the semiconductor device 50 or connecting a heat sink to the semiconductor device 50 to improve the heat dissipation of the semiconductor device 50 can be considered. However, in the case of the former, the price of the semiconductor device will be greatly increased, and in the case of the latter, the entire circuit board becomes large, and the number of parts increases and the manufacturing process becomes complicated. This will lead to price increases.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a mounting structure of a semiconductor device which can suppress heat generation of the semiconductor device at a very low cost.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and a circuit board having a plurality of conductor patterns laminated thereon and a circuit board connected to each of the conductor patterns and drilled in the circuit board. And a semiconductor device mounted on the conductor pattern of the circuit board in a state of facing the through hole, in a state of being in contact with the lower surface of the semiconductor device and the conductor pattern of the circuit board. It is a mounting structure of a semiconductor device loaded with a resin material having high thermal conductivity.

[0008]

In the mounting structure of the present invention, the resin material having a high thermal conductivity is loaded in a state of contacting the lower surface of the semiconductor device and the conductor pattern of the circuit board, so that the semiconductor device and the circuit board are made of the resin material. The semiconductor device is thermally connected to the semiconductor device through the connection, so that the total heat capacity for heat generation of the semiconductor device is secured to be larger than the conventional one.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic side view showing an embodiment of the present invention. In the mounting structure of the illustrated semiconductor device, 1
Is a circuit board, and a plurality of (four in the illustrated example) conductor patterns 2 are laminated on the circuit board 1. The circuit board 1 includes, for example, a glass epoxy base material 3 and a conductor pattern 2.
And are sequentially laminated and integrated.

Through holes 4 are formed at predetermined positions on the circuit board 1 so as to be connected to the conductor patterns 2. Here, each conductor pattern 2 laminated on the circuit board 1
Is formed of a thin copper foil having a thickness of about 0.1 mm.
On the other hand, the hole walls of the through holes 4 are plated with copper, so that the conductor patterns 2 and the through holes 4 are electrically and thermally connected to each other.

With respect to the circuit board 1 having the above-described structure, the semiconductor device 5 is mounted on the conductor pattern 2 of the circuit board 1 through the external leads 6 implanted on the side thereof, and faces the through hole 4. It is placed in a state to do.

Under such a mounting state, in the mounting structure of this embodiment, the lower surface 5a of the semiconductor device 5 and the circuit board 1 are
The resin material 7 having high thermal conductivity is loaded so as to be in contact with the conductor pattern 2. Here, the resin material 7 having high thermal conductivity
For example, an epoxy-based thermally conductive resin to which silicon dioxide is added, or a metal powder (for example, Ag powder) or a ceramic powder having a high thermal conductivity is added.

As a method of loading the resin material 7, after mounting the semiconductor device 5 on the circuit board 1, the through hole 4 is formed.
A method of injecting the resin material 7 through the through-hole or a method of injecting the resin material 7 through the gap between the external leads 6 of the semiconductor device 5 can be considered. However, the latter is more preferable in consideration of the fact that the chip that is a heat source is arranged in the center of the semiconductor device 5 and the workability when the resin material 7 is injected.

In the mounting structure of this embodiment having the above structure, the resin material 7 having high thermal conductivity is loaded in a state of contacting the lower surface 5a of the semiconductor device 5 and the conductor pattern 2 of the circuit board 1, The semiconductor device 5 and the circuit board 1 are thermally connected via the resin material 7. That is, the semiconductor device 5
The heat generated in the package is transferred to the entire circuit board 1 through the resin material 7, the through holes 4, and the conductor pattern 2. As a result, the total heat capacity of the semiconductor device 5 for heat generation is the sum of the heat capacity of the semiconductor device 5 itself and the heat capacity of the entire circuit board 1,
The structure is remarkably large compared with the conventional structure, and the heat generation of the semiconductor device 5 is suppressed by this structure.

In the mounting structure shown in FIG. 1, the resin material 7 having a high thermal conductivity is filled up to the through hole 4, but the present invention is not limited to this, and the injection amount of the resin material 7 is a semiconductor. It is sufficient to fill the space between the lower surface 5a of the device 5 and the conductor pattern 2 of the circuit board 1. Because
This is because each conductor pattern 2 and the through hole 4 are thermally connected in advance by a conductor (copper in this example) having an extremely high thermal conductivity.

[0016]

As described above, according to the present invention,
Using a through hole formed in a normal circuit board manufacturing process, the semiconductor device and the circuit board are thermally insulated with a highly heat-conductive resin material that is in contact with the lower surface of the semiconductor device and the conductor pattern of the circuit board. By connecting to the semiconductor device, the overall heat capacity for heat generation of the semiconductor device can be ensured to be much larger than that of the conventional structure. As a result, the temperature rise of the semiconductor device can be suppressed at an extremely low cost by adopting a simple structural improvement without adopting a ceramic package for the semiconductor device or connecting a heat sink at the cost of a large price increase. Is possible.

[Brief description of drawings]

FIG. 1 is a schematic side view showing an embodiment of the present invention.

FIG. 2 is a schematic side view showing a conventional structure.

[Explanation of symbols]

 1 circuit board 2 conductor pattern 4 through hole 5 semiconductor device 5a lower surface 7 resin material

Claims (1)

[Claims] 1. A circuit board on which a plurality of conductor patterns are laminated, through holes formed in the circuit board by connecting to the conductor patterns, and conductors of the circuit board facing the through holes. A semiconductor device mounted on a pattern, wherein a resin material having high thermal conductivity is loaded in a state of being in contact with a lower surface of the semiconductor device and a conductor pattern of the circuit board. Implementation structure of.