JPH0660812A - Black matrix forming method for color cathode-ray tube - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To obtain a method for forming a black matrix of a color cathode ray tube capable of forming a black matrix with high accuracy by suppressing a decrease in the temperature of the etching solution during etching. To aim. A resist film having a predetermined pattern shape is formed on the inner wall surface of the glass panel 1, and a graphite film is further formed on the entire inner wall surface of the glass panel 1. Then, the glass panel 1 is mounted on the panel carrier 5, and while the glass panel 1 is rotated, the etching liquid 6 is injected into the inner surface of the glass panel 1, and then infrared rays (or far infrared rays) are irradiated by the lamp 8 to obtain the graphite film. Etching is performed. Then, after a lapse of a predetermined time, the etching solution 6 is discharged,
Water is sprayed onto the inner surface of the glass panel 1 by a high pressure spray to form a black matrix.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color cathode ray tube, and more particularly to a method for forming a black matrix of the color cathode ray tube.

[0002]

2. Description of the Related Art FIG. 3 is a process sectional view showing a conventional method for forming a black matrix of a color CRT, in which 1 is a glass panel of a color CRT, 2 is a photoresist film, and 3 is a black matrix constituent film. Graphite films 4 are black matrices formed on the inner wall surface of the glass panel 1.

Next, a conventional method for forming the above black matrix will be described. First, the glass panel 1 is washed in the panel washing step ((a) of FIG. 3). Next, a photoresist film 2 is formed on the inner wall surface of the glass panel 1 by a spin coating method using a photoresist having an ultraviolet-sensitive property ((b) of FIG. 3). Therefore, with a shadow mask attached to the glass panel 1, a point source of ultraviolet light is placed at the center of deflection of the electron beam for exposure, and then the shadow mask is removed and washed with water to form a resist pattern (see FIG. 3). (C)). At this time, the portion of the photoresist film 2 that is not irradiated with light is in an uncured state and is removed by washing with water, and only the portion of the photoresist film 2 that is cured by being irradiated with light remains.

Next, for example, a graphite liquid in which graphite particles are dispersed is injected into the glass panel 1 and dried by a heater at 40 to 50 ° C. to form a photoresist film 2 having a desired pattern on the glass panel 1. A graphite film 3 having a thickness of 0.5 μm is formed on the inner wall surface of the substrate ((d) of FIG. 3).

After that, an etching solution such as hydrogen peroxide is injected into the glass panel 1. This etching solution penetrates the photoresist film 2 through the graphite film 3 and acts to decompose the photoresist film 2. Then, after a lapse of a predetermined time, the etching liquid is discharged, the graphite film 3 on the photoresist film 2 is removed together with the photoresist film 2 decomposed by the high pressure spray, and the black matrix 4 having a desired pattern is formed in the glass panel 1. It is formed on the wall surface ((e) of FIG. 3).

Here, a method of etching the graphite film 3 will be described in detail with reference to FIG. First, a glass panel 1 having a photoresist film 2 having a desired pattern formed thereon and a graphite film 3 formed thereon is mounted on a panel carrier 5. Then, while driving the panel carrier 5 to rotate to rotate the glass panel 1 at 10 to 20 rpm, hydrogen peroxide solution (about 3%) heated to 50 to 60 ° C.
Etching solution 6 from the nozzle 7 to the glass panel 1
Inject into. Then, the glass panel 1 is left rotating for 2 to 3 minutes to remove the etching solution 6 from the graphite film 3
Permeate through the photoresist film 2 to decompose the photoresist film 2.

Next, the etching solution 6 is discharged, water is sprayed onto the inner surface of the glass panel 1 by high pressure spraying, and the decomposed photoresist film 2 and the graphite film 3 on the photoresist film 2 are removed. Graphite film 3
Etching is performed to form the black matrix 4 on the inner wall surface of the glass panel 1.

The glass panel 1 on which the black matrix 4 has been formed in this manner is subjected to the next step. In the next step, for example, a mixture of a red phosphor and a chemical that hardens when exposed to light and becomes insoluble in water is applied to the entire inner wall surface of the glass panel 1, and a red electron is attached with a shadow mask attached. When the point light source is placed at the deflection center of the beam and the light is exposed, the shadow mask is removed and developed, and the red phosphor remains only where the light hits. Similarly, by forming blue and green phosphors, a phosphor screen of a color CRT in which red, blue and green phosphors are formed is formed in the space of the black matrix 4.

[0009]

As described above, the conventional method for forming the black matrix of the color cathode ray tube is as follows.
Although the graphite film 3 is etched by injecting the etching solution 6 heated to 0 to 60 ° C. into the glass panel 1, the temperature of the glass panel 1 before the etching solution 6 is injected is 4
Since it is 0 to 50 ° C., which is lower than the temperature of the etching solution 6, the temperature of the injected etching solution 6 becomes lower with time as shown in FIG. There was a problem that the decomposition of the membrane 2 was insufficient.

Further, a method of increasing the liquid amount of the etching liquid 6 and suppressing a decrease in the liquid temperature of the etching liquid 6 can be used, but the amount of the etching liquid 6 used is greatly increased, and the etching liquid 6 is further increased. 6 Glass panel 1 before injection
It is possible to increase the temperature in advance to suppress the decrease in the temperature of the etching solution 6, but the graphite film 3 becomes stronger than necessary, and the etching solution 6
However, there is also a problem that it becomes difficult to permeate, resulting in defective etching.

The present invention has been made to solve the above-mentioned problems, and the liquid temperature of the etching liquid can be controlled without increasing the amount of the etching liquid used or without strengthening the black matrix constituent film. An object of the present invention is to obtain a method for forming a black matrix of a color cathode ray tube that can suppress the deterioration and can form a black matrix on a glass panel with high accuracy.

[0012]

A method for forming a black matrix of a color cathode ray tube according to the present invention comprises forming a resist film having a desired pattern on the inner wall surface of a glass panel of the color cathode ray tube, and then forming the inner wall surface of the glass panel. A black matrix forming film is formed on the inner surface of the glass panel, and then the heated etching solution is injected into the inner surface of the glass panel, and further infrared or far infrared rays are irradiated to keep the etching solution injected into the inner surface of the glass panel while maintaining the black matrix. The constituent film is etched.

[0013]

In the present invention, when the black matrix constituent film is etched, infrared rays or far infrared rays are radiated to keep the temperature of the etching liquid injected into the inner surface of the glass panel, so that the temperature of the etching liquid is set to a predetermined value. The temperature can be maintained, the deterioration of the etching efficiency can be suppressed, and the resist film can be sufficiently decomposed by the etching solution.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic cross-sectional view of an etching step in a method for forming a black matrix of a color CRT according to an embodiment of the present invention. In the method for forming a black matrix of a conventional color CRT shown in FIGS. The same or corresponding parts will be denoted by the same reference numerals and the description thereof will be omitted. In the figure, reference numeral 8 is an infrared or far infrared lamp disposed above the glass panel 1 during etching.

Next, a method of forming the black matrix of the color cathode ray tube of the above embodiment will be described. First, on the inner wall surface of the glass panel 1, similar to the conventional method,
A photoresist film 2 having a desired pattern shape is formed, and then a graphite film 3 is formed on the entire inner wall surface of the panel. Next, the glass panel 1 is mounted on the panel carrier 5, and the etching liquid 6 heated to 50 to 60 ° C. is injected into the inner surface of the glass panel 1 while rotating the glass panel 1 at 10 to 20 rpm.

Therefore, the lamp 8 is turned on to irradiate the glass panel 1 with infrared rays (or far infrared rays) to keep the temperature of the etching solution 6 during etching. Here, the liquid temperature of the etching liquid 6 during the etching is maintained at around 60 ° C. as shown in B of FIG. After a lapse of 2 to 3 minutes, the etching solution 6 is discharged, and water is sprayed on the inner surface of the glass panel 1 by a high pressure spray to remove the decomposed photoresist film 2 and the graphite film 3 on the photoresist film 2. Then, the graphite film 3 is etched to form the black matrix 4 on the inner wall surface of the glass panel 1.

As described above, according to the above-described embodiment, since the lamp 8 irradiates infrared rays (or far infrared rays) when the graphite film 3 is etched, the glass having a temperature lower than the liquid temperature of the etching liquid 6 is used. The amount of heat absorbed by the panel 1 is compensated for, the lowering of the liquid temperature of the etching liquid 6 is suppressed, the etching efficiency is not lowered, the photoresist film 2 is sufficiently decomposed, and the black matrix 4 is formed with high accuracy. You can

Further, since the amount of heat absorbed by the glass panel 1 is compensated by the irradiation of infrared rays (or far infrared rays), it is not necessary to increase the amount of the etching liquid 6 to be injected, and the amount of the etching liquid 5 used is increased. Can be suppressed, and the cost can be reduced.

Similarly, the glass panel 1 is previously prepared in advance.
Since it is not necessary to raise the temperature of, the graphite film 3 does not become stronger than necessary, the etching solution 6 permeates the graphite film 3, and the photoresist film 2 can be decomposed sufficiently.
The black matrix 4 can be formed with high accuracy.

In the above embodiment, the lamp 8 is used to radiate infrared rays (or far infrared rays). However, even if an infrared (or far infrared rays) heater is used,
Has the same effect.

In the above embodiment, the graphite film 3 is used as the black matrix forming film, but the present invention is not limited to the graphite film 3 and can form the black matrix 4. If

[0022]

As described above, according to the present invention, a resist film having a desired pattern shape is formed on the inner wall surface of a glass panel of a color CRT, and then a black matrix constituent film is formed on the inner wall surface of the glass panel. , Then inject the heated etchant into the inner surface of the glass panel,
Further, while irradiating infrared rays or far infrared rays to keep the etching liquid injected into the inner surface of the glass panel, the black matrix constituent film is etched,
Without increasing the amount of etching liquid and without raising the temperature of the glass panel in advance, the temperature of the etching liquid can be prevented from lowering and the resist film can be sufficiently decomposed, forming a black matrix on the inner wall surface of the glass panel with high precision. There is an effect that a method of forming a black matrix of a color CRT capable of being obtained can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of an etching step in a method for forming a black matrix of a color cathode ray tube showing an embodiment of the present invention.

FIG. 2 is a graph showing the change over time in the liquid temperature of the etching liquid injected into the glass panel according to the present invention.

FIG. 3 is a process sectional view showing an example of a method of forming a black matrix of a conventional color CRT.

FIG. 4 is a schematic cross-sectional view of an etching process in a conventional method for forming a black matrix of a color CRT.

[Explanation of symbols]

 1 glass panel 2 photoresist film 3 graphite film (black matrix constituent film) 4 black matrix 6 etching liquid 8 lamp

Claims (1)

[Claims] 1. A resist film having a desired pattern shape is formed on an inner wall surface of a glass panel of a color cathode ray tube,
Then, a black matrix constituting film is formed on the inner wall surface of the glass panel, and then the heated etching solution is injected into the inner surface of the glass panel, and further infrared rays or far infrared rays are irradiated to be injected into the inner surface of the glass panel. A method for forming a black matrix of a color cathode ray tube, wherein the black matrix constituent film is etched while keeping the etching solution warm.