JPH066512Y2 - 集積回路パツケ−ジ - Google Patents

集積回路パツケ−ジ

Info

Publication number
JPH066512Y2
JPH066512Y2 JP1986053284U JP5328486U JPH066512Y2 JP H066512 Y2 JPH066512 Y2 JP H066512Y2 JP 1986053284 U JP1986053284 U JP 1986053284U JP 5328486 U JP5328486 U JP 5328486U JP H066512 Y2 JPH066512 Y2 JP H066512Y2
Authority
JP
Japan
Prior art keywords
conductor pattern
package
stud
outer peripheral
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986053284U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62163954U (2
Inventor
勇 ▲高▼野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1986053284U priority Critical patent/JPH066512Y2/ja
Publication of JPS62163954U publication Critical patent/JPS62163954U/ja
Application granted granted Critical
Publication of JPH066512Y2 publication Critical patent/JPH066512Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1986053284U 1986-04-09 1986-04-09 集積回路パツケ−ジ Expired - Lifetime JPH066512Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986053284U JPH066512Y2 (ja) 1986-04-09 1986-04-09 集積回路パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986053284U JPH066512Y2 (ja) 1986-04-09 1986-04-09 集積回路パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS62163954U JPS62163954U (2) 1987-10-17
JPH066512Y2 true JPH066512Y2 (ja) 1994-02-16

Family

ID=30879203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986053284U Expired - Lifetime JPH066512Y2 (ja) 1986-04-09 1986-04-09 集積回路パツケ−ジ

Country Status (1)

Country Link
JP (1) JPH066512Y2 (2)

Also Published As

Publication number Publication date
JPS62163954U (2) 1987-10-17

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